CN211090357U - Heat dissipation type PCB rigid line way board - Google Patents
Heat dissipation type PCB rigid line way board Download PDFInfo
- Publication number
- CN211090357U CN211090357U CN201921198720.8U CN201921198720U CN211090357U CN 211090357 U CN211090357 U CN 211090357U CN 201921198720 U CN201921198720 U CN 201921198720U CN 211090357 U CN211090357 U CN 211090357U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat conduction
- heat
- circuit board
- installation shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000009434 installation Methods 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000009941 weaving Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation type PCB rigid circuit board in the technical field, which comprises a circuit board body, wherein a mounting shell is fixedly arranged at the bottom of the circuit board body, a heat conduction layer is arranged at the bottom of the circuit board body, a heat conduction plate is arranged at the bottom of the heat conduction layer, heat dissipation fins are inserted into the bottom of the heat conduction plate at uniform intervals, the bottoms of the heat dissipation fins are connected with the top of the heat conduction layer, and a heat dissipation fan is arranged on the inner wall of the mounting shell through a bracket. The installation shell convenient to detach conveniently maintains inside, guarantees its life.
Description
Technical Field
The utility model relates to the technical field, specifically be a heat dissipation type PCB rigid line way board.
Background
The PCB rigid circuit board enables a circuit to be visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, is poor in heat dissipation effect of the PCB rigid circuit board in the market, is easy to cause overhigh temperature after being used, is inconvenient to dissipate heat, and enables elements on the circuit board to be damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation type PCB rigid line board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation type PCB rigid line board, includes the circuit board body, the fixed installation shell that is provided with in circuit board body bottom, circuit board body bottom is provided with the heat-conducting layer, the heat-conducting layer bottom is provided with the heat-conducting plate, the even equidistance in heat-conducting plate bottom is pegged graft and is had heat radiation fins, heat radiation fins bottom is connected with the heat-conducting layer top, and evenly has seted up the louvre on the heat radiation fins, installation shell inner wall is provided with radiator fan through the support, and radiator fan is located heat radiation fins below, installation shell bottom is cavity, installation shell bottom transversely is provided with the dust screen spare, and the dust screen spare is.
Further, the dustproof net piece includes the framework that matches with the installation shell, the framework inner wall is provided with the dustproof net, the assembly groove similar with the framework outline is seted up to the dustproof net outer wall, and the assembly groove internal fixation is provided with the sealing strip.
Furthermore, the heat conduction layer is a mesh heat conduction layer formed by weaving a plurality of strands of heat conduction wires in a cross mode in the latitude direction and the longitude direction, and the heat conduction plate is a heat conduction silicone grease plate.
Further, the top of the outer wall of the left side and the top of the outer wall of the right side of the installation shell are both provided with extension edges, fixing screws are inserted into the bottoms of the extension edges, and the installation shell is fixedly connected with the circuit board body through the extension edges and the fixing screws.
Further, the left side and the right side of the top of the dustproof net piece are respectively provided with a cushion block in a laminating manner, and the left side cushion block and the right side cushion block are respectively welded with the bottom of the left side inner wall and the right side inner wall of the installation shell.
Furthermore, the left end and the right end of the bottom of the dustproof net piece are provided with connecting screws, and the connecting screws are fixedly connected with the cushion blocks.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a have heat-conducting layer and heat-conducting plate can derive the heat that the circuit board body produced fast and give off through the fin, and then reduce the heat on the circuit board body, the component on the protection circuit board body does not receive the damage, make this circuit board body can permanent stable use, be provided with radiator fan simultaneously and cooperate, outwards derive the heat fast, avoid the heat gathering, add a radiating efficiency and radiating quality, be provided with the dust screen spare simultaneously, play dustproof effect, avoid the dust to influence radiator fan and radiating fin's use, guarantee long-term effectual radiating quality, dust screen spare convenient to detach simultaneously, installation shell convenient to detach, the convenience is maintained inside, guarantee its life.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the dust-proof net of the present invention;
in the figure: 1. a circuit board body; 2. mounting a shell; 21. an extension edge; 3. a heat conductive layer; 4. a heat conducting plate; 5. heat dissipation fins; 6. heat dissipation holes; 7. a heat radiation fan; 8. a dust screen member; 81. a frame body; 82. a dust screen; 83. a sealing strip; 9. a connecting screw; 10. cushion blocks; 11. and fixing the screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a heat dissipation type PCB rigid circuit board, please refer to fig. 1, includes a circuit board body 1, the circuit board body 1 is a PCB rigid circuit board, belongs to the prior art, and is not specifically described herein, the electrical element in the utility model can be connected with an external power supply through a wire;
referring to fig. 1, a mounting shell 2 is fixedly arranged at the bottom of a circuit board body 1, a heat conduction layer 3 is arranged at the bottom of the circuit board body 1, a heat conduction plate 4 is arranged at the bottom of the heat conduction layer 3, the heat conduction layer 3 and the heat conduction plate 4 are used for rapidly guiding out heat generated by the circuit board body 1 during use, and a certain gap is arranged between the heat conduction layer 3 and the heat conduction plate 4 and the inner wall of the mounting shell 2;
referring to fig. 1, heat dissipating fins 5 are uniformly inserted into the bottom of a heat conducting plate 4 at equal intervals, the bottom of each heat dissipating fin 5 is connected with the top of a heat conducting layer 3, heat dissipating holes 6 are uniformly formed in the heat dissipating fins 5, and the heat dissipating fins 5 and the heat dissipating holes 6 are used for dissipating heat outwards;
referring to fig. 1, the inner wall of the mounting case 2 is provided with a heat dissipation fan 7 through a bracket, the bracket is fixedly connected with the inner walls of the front and rear sides to support the heat dissipation fan 7, the heat dissipation fan 7 is located below the heat dissipation fins 5, and the heat dissipation fan 7 is used for assisting heat dissipation to improve heat dissipation efficiency and heat dissipation quality;
referring to fig. 1, the bottom of the mounting housing 2 is hollow, a dust-proof net 8 is transversely disposed at the bottom of the mounting housing 2, the dust-proof net 8 prevents dust from affecting the heat dissipation of the heat dissipation fins 5 or the heat dissipation fan 7, and the dust-proof net 8 is located below the heat dissipation fan 7.
As shown in fig. 2: the dustproof net piece 8 comprises a frame body 81 matched with the installation shell 2, a sealing strip 83 and a dustproof net 82 are convenient to install, the dustproof net 82 is arranged on the inner wall of the frame body 81 to play a dustproof role, an assembly groove with the outline similar to that of the frame body 81 is formed in the outer wall of the dustproof net 82, the sealing strip 83 is fixedly arranged in the assembly groove, the thickness of the sealing strip 83 is 2mm higher than the depth of the assembly groove, the sealing effect can be improved, the sealing performance between the frame body 81 and the inner wall of the installation shell 2 is guaranteed, the sealing strip 83 can be a polyethylene sealing strip, and the polyethylene sealing strip has the characteristics of high temperature resistance, wear resistance and the like and is beneficial;
as shown in fig. 1: the heat conducting layer 3 is a mesh heat conducting layer formed by weaving a plurality of strands of heat conducting wires in a cross mode in the latitude direction and the longitude direction, the strength and the toughness of the circuit board body 1 are improved, the heat conducting efficiency is also improved, the heat conducting plate 4 is a heat conducting silicone grease plate, and the heat conducting plate is convenient to cooperate with the heat conducting layer 3 to rapidly guide out heat generated by the circuit board body 1;
as shown in fig. 1: the top parts of the outer walls of the left side and the right side of the installation shell 2 are respectively provided with an extending edge 21, the extending edges 21 and the installation shell 2 are of an integrally formed structure, fixing screws 11 are inserted into the bottoms of the extending edges 21, and the installation shell 2 is fixedly connected with the circuit board body 1 through the extending edges 21 and the fixing screws 11, so that the installation shell is convenient to disassemble and maintain the inside;
as shown in fig. 1: the left side and the right side of the top of the dustproof net piece 8 are respectively provided with a cushion block 10 in a fitting manner, the left side cushion block 10 and the right side cushion block 10 are respectively welded with the bottoms of the inner walls of the left side and the right side of the mounting shell 2, the cushion blocks 10 and the mounting shell 2 are of an integrally formed structure, and the cushion blocks 10 play a limiting role;
as shown in fig. 1: the left end and the right end of the bottom of the dust screen 8 are both provided with a connecting screw 9, the connecting screw 9 is fixedly connected with a cushion block 10, and the dust screen 8 is convenient to mount and dismount.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat dissipation type PCB rigid line board, includes circuit board body (1), its characterized in that: the circuit board comprises a circuit board body (1) and is characterized in that an installation shell (2) is fixedly arranged at the bottom of the circuit board body (1), a heat conduction layer (3) is arranged at the bottom of the circuit board body (1), a heat conduction plate (4) is arranged at the bottom of the heat conduction plate (3), heat dissipation fins (5) are inserted into the heat conduction plate (4) at equal intervals, the bottoms of the heat dissipation fins (5) are connected with the top of the heat conduction layer (3), heat dissipation holes (6) are evenly formed in the heat dissipation fins (5), heat dissipation fans (7) are arranged on the inner wall of the installation shell (2) through supports, the heat dissipation fans (7) are located below the heat dissipation fins (5), the bottom of the installation shell (2) is hollow, a dustproof net piece (8) is transversely arranged at the bottom of the.
2. The heat dissipation type PCB rigid wiring board of claim 1, characterized in that: dustproof mesh spare (8) include with installation shell (2) assorted framework (81), framework (81) inner wall is provided with dustproof mesh (82), assembly groove similar with framework (81) outline is seted up to dustproof mesh (82) outer wall, and the assembly groove internal fixation is provided with sealing strip (83).
3. The heat dissipation type PCB rigid wiring board of claim 1, characterized in that: the heat conduction layer (3) is a net-shaped heat conduction layer formed by weaving a plurality of strands of heat conduction wires in a cross mode in the latitude direction and the longitude direction, and the heat conduction plate (4) is a heat conduction silicone grease plate.
4. The heat dissipation type PCB rigid wiring board of claim 1, characterized in that: the top of the outer wall of the left side and the right side of the installation shell (2) is provided with an extension edge (21), the bottom of the extension edge (21) is spliced with a fixing screw (11), and the installation shell (2) is fixedly connected with the circuit board body (1) through the extension edge (21) and the fixing screw (11).
5. The heat dissipation type PCB rigid wiring board of claim 1, characterized in that: the left side and the right side of the top of the dustproof net piece (8) are respectively provided with a cushion block (10) in a fitting manner, and the cushion blocks (10) on the left side and the right side are respectively welded with the bottoms of the left side inner wall and the right side inner wall of the mounting shell (2).
6. The heat dissipation type PCB rigid wiring board of claim 5, characterized in that: the left end and the right end of the bottom of the dustproof net piece (8) are respectively provided with a connecting screw (9), and the connecting screws (9) are fixedly connected with the cushion blocks (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921198720.8U CN211090357U (en) | 2019-07-29 | 2019-07-29 | Heat dissipation type PCB rigid line way board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921198720.8U CN211090357U (en) | 2019-07-29 | 2019-07-29 | Heat dissipation type PCB rigid line way board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090357U true CN211090357U (en) | 2020-07-24 |
Family
ID=71630569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921198720.8U Expired - Fee Related CN211090357U (en) | 2019-07-29 | 2019-07-29 | Heat dissipation type PCB rigid line way board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211090357U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885566A (en) * | 2022-05-25 | 2022-08-09 | 东莞市洪港电子有限公司 | Plastic-sealed waterproof single-sided circuit board with plug terminals |
| CN114916124A (en) * | 2022-04-19 | 2022-08-16 | 厦门新锐创意电子科技有限公司 | Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof |
-
2019
- 2019-07-29 CN CN201921198720.8U patent/CN211090357U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916124A (en) * | 2022-04-19 | 2022-08-16 | 厦门新锐创意电子科技有限公司 | Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof |
| CN114885566A (en) * | 2022-05-25 | 2022-08-09 | 东莞市洪港电子有限公司 | Plastic-sealed waterproof single-sided circuit board with plug terminals |
| CN114885566B (en) * | 2022-05-25 | 2024-02-20 | 东莞市洪港电子有限公司 | Plastic-sealed waterproof single-sided circuit board with plug-in terminals |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200724 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |