CN215818751U - High-efficient heat radiation structure of printed circuit board - Google Patents
High-efficient heat radiation structure of printed circuit board Download PDFInfo
- Publication number
- CN215818751U CN215818751U CN202122354469.3U CN202122354469U CN215818751U CN 215818751 U CN215818751 U CN 215818751U CN 202122354469 U CN202122354469 U CN 202122354469U CN 215818751 U CN215818751 U CN 215818751U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fixedly connected
- heat dissipation
- printed circuit
- efficient heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 3
- HYHJDTAYSGQLFB-UHFFFAOYSA-K [Pb+3].[O-]P([O-])([O-])=O Chemical compound [Pb+3].[O-]P([O-])([O-])=O HYHJDTAYSGQLFB-UHFFFAOYSA-K 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 13
- 238000009434 installation Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-efficiency heat dissipation structure of a printed circuit board, which comprises a circuit board, wherein a plurality of through holes are formed in the circuit board, and the inner side walls of the through holes are fixedly connected with heat conduction rings; the back four corners of circuit board all fixedly connected with lug, the other end fixedly connected with antiskid head of lug. According to the utility model, the lug and the anti-slip head are arranged, the lug and the anti-slip head are supported on the circuit board mounting bottom plate through mounting the circuit board, so that the circuit board and the mounting bottom plate are separated by a certain gap, the effective heat dissipation effect is facilitated, the pressure buffering of the circuit board can be carried out through the silica gel material adopted by the anti-slip head, and the quantitative protection of the circuit board can be realized by the silica gel material if the circuit board and the mounting bottom plate are impacted, so that the circuit board is prevented from being damaged.
Description
Technical Field
The utility model relates to the technical field of efficient heat dissipation of circuit boards, in particular to an efficient heat dissipation structure of a printed circuit board.
Background
At present, a large number of high-power devices are mature and applied to PCBs, and because the high-power devices generate a large amount of heat energy during working, the service life of the components can be shortened due to the fact that the temperature of the high-power devices is obviously increased. In order to solve the heat dissipation problem of the high power device, metal and printed circuit board with good heat dissipation performance are generally used as the mounting carrier of the high power device.
The circuit board among the prior art is convenient and not ideal at the heat dissipation, and its reason lies in that can't realize that the heat that the circuit board distributes circulates, leads to the circuit board to be burnt and is the condition often to traditional circuit board is comparatively single in the aspect of the heat dissipation, still needs further to solve perfectly.
When the applicant applies the utility model, through search, the applicant finds that a Chinese patent discloses a printed circuit board heat dissipation structure and a printed circuit board, the application number of which is '201921203990.3', the problem of reducing the temperature of the circuit board mainly through materials is more effective than the heat dissipation of the traditional circuit board, but the source problem cannot be solved only through the heat dissipation of the materials, and further improvement needs to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a high-efficiency heat dissipation structure of a printed circuit board.
In order to achieve the purpose, the utility model adopts the following technical scheme: a high-efficiency heat dissipation structure of a printed circuit board comprises a circuit board, wherein a plurality of through holes are formed in the circuit board, and the inner side walls of the through holes are fixedly connected with heat conduction rings;
the back four corners of circuit board all fixedly connected with lug, the other end fixedly connected with antiskid head of lug.
As a further description of the above technical solution: the upper end and the lower end of the circuit board are fixedly connected with radiating fins.
As a further description of the above technical solution: one end of the inner part of the radiating fin is fixedly connected with a high-temperature resistant film layer, and the high-temperature resistant film layer is made of phosphate lead powder.
As a further description of the above technical solution: the inside other end fixedly connected with cooling thin layer of fin, and the thin layer of just cooling adopts the olefine acid emulsion material.
As a further description of the above technical solution: and the middle part of the front surface of the circuit board is fixedly connected with a control block.
As a further description of the above technical solution: the antiskid head is made of silica gel antiskid materials.
The utility model has the following beneficial effects:
1. compared with the prior art, the anti-skid device is provided with the convex blocks and the anti-skid heads, the convex blocks at four corners of the back of the circuit board and the anti-skid heads are supported on the circuit board mounting bottom plate at first through the circuit board mounting, so that the circuit board and the mounting bottom plate are separated by a certain gap, the effective heat dissipation effect is facilitated, the pressure buffering of the circuit board can be carried out through the silica gel material adopted by the anti-skid heads, and the quantitative protection of the circuit board can be realized if the circuit board and the mounting bottom plate are impacted, and the damage is prevented.
2. Compared with the prior art, the heat dissipation device is provided with the through holes and the heat conduction rings, the through holes and the heat conduction rings are formed in the circuit board, so that air circulation is facilitated during heat dissipation, heat is facilitated to be dissipated, and external low temperature enters the circuit board to facilitate the heat dissipation function of the circuit board.
3. Compared with the prior art, the high-temperature-resistant cooling circuit board is provided with the high-temperature-resistant film layer and the cooling film layer, the high-temperature-resistant film layer and the cooling film layer are arranged inside the circuit board, the circuit board can be protected through the high-temperature-resistant film layer, the burning-out condition is prevented, the temperature of the cooling film layer can be reduced, and the high-temperature-resistant cooling circuit board is convenient to use normally.
Drawings
Fig. 1 is a schematic back perspective view of an efficient heat dissipation structure of a printed circuit board according to the present invention;
FIG. 2 is a perspective view of a through hole of a high-efficiency heat dissipation structure of a printed circuit board according to the present invention;
FIG. 3 is a cross-sectional side view of a printed circuit board with a high-efficiency heat dissipation structure according to the present invention;
fig. 4 is a schematic front perspective view of an efficient heat dissipation structure of a printed circuit board according to the present invention.
Illustration of the drawings:
1. a circuit board; 2. an anti-slip head; 3. a bump; 4. a through hole; 5. a heat sink; 6. a high temperature resistant film layer; 7. cooling the thin film layer; 8. a heat conducting ring; 9. a control block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, one embodiment of the present invention is provided: a high-efficiency heat dissipation structure of a printed circuit board comprises a circuit board 1, wherein a bottom plate for installing the circuit board 1 is supported on the circuit board 1 through installing the circuit board 1, firstly, four corner bumps 3 and an anti-slip head 2 on the back side of the circuit board 1, so that the circuit board 1 and the installation bottom plate are separated by a certain gap, an effective heat dissipation effect is facilitated, a plurality of through holes 4 are formed in the circuit board 1, heat conduction rings 8 are fixedly connected to the inner side walls of the through holes 4, a plurality of through holes 4 and the heat conduction rings 8 are formed in the circuit board 1, air circulation is facilitated during heat dissipation, heat is facilitated to be dissipated, the heat is led out through the heat conduction rings 8, the heat dissipation function of the circuit board 1 is facilitated by entering external low temperature, and a control block 9 is fixedly connected to the middle part of the front side of the circuit board 1;
the equal fixedly connected with lug 3 in back four corners of circuit board 1, the other end fixedly connected with antiskid head 2 of lug 3, antiskid head 2 adopts silica gel antiskid material, the silica gel material that antiskid head 2 adopted can carry out circuit board 1's pressure buffering, the silica gel material can realize the ration protection to circuit board 1 when the striking appears in the bottom plate of circuit board 1 and installation, the equal fixedly connected with fin 5 of upper end and lower extreme of circuit board 1, fin 5's inside one end fixedly connected with high temperature resistant membrane layer 6, and high temperature resistant membrane layer 6 adopts the lead powder material of phosphate, high temperature resistant membrane layer 6 protects circuit board 1, prevent the condition of burning out, fin 5's inside other end fixedly connected with cooling thin layer 7, and cooling thin layer 7 adopts the olefine acid emulsion material, cooling thin layer 7 can carry out the temperature decline, be convenient to normally use.
The working principle is as follows: when in use, the circuit board 1 is installed, firstly, the convex blocks 3 at the four corners of the back surface of the circuit board 1 and the anti-slip head 2 are supported on the bottom plate installed on the circuit board 1, the circuit board 1 and the installation bottom plate are separated by a certain gap, the effective heat dissipation effect is convenient, the pressure buffering of the circuit board 1 can be carried out by the silica gel material adopted by the anti-slip head 2, the circuit board 1 and the installed bottom plate can realize the quantitative protection of the circuit board 1 if the impact occurs, then, a plurality of through holes 4 and heat conducting rings 8 are arranged in the circuit board 1, the circulation of air is convenient during heat dissipation, the heat dissipation is facilitated, the heat is led out by the heat conducting rings 8, the external low temperature enters to more easily promote the heat dissipation function of the circuit board 1, the high temperature resistant film layer 6 and the cooling film layer 7 are arranged in the circuit board 1, and the circuit board 1 can be protected by the high temperature resistant film layer 6, the burning-out condition is prevented, and the temperature of the cooling film layer 7 can be reduced, so that the normal use is facilitated.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a high-efficient heat radiation structure of printed circuit board which characterized in that: the heat-conducting circuit board comprises a circuit board (1), wherein a plurality of through holes (4) are formed in the circuit board (1), and the inner side walls of the through holes (4) are fixedly connected with heat-conducting rings (8);
the anti-skid circuit board is characterized in that four corners of the back face of the circuit board (1) are fixedly connected with bumps (3), and the other ends of the bumps (3) are fixedly connected with anti-skid heads (2).
2. The efficient heat dissipation structure for printed circuit boards as claimed in claim 1, wherein: the upper end and the lower end of the circuit board (1) are fixedly connected with radiating fins (5).
3. The efficient heat dissipation structure for printed circuit boards as claimed in claim 2, wherein: one end of the inner part of the radiating fin (5) is fixedly connected with a high-temperature resistant film layer (6), and the high-temperature resistant film layer (6) is made of phosphate lead powder.
4. The efficient heat dissipation structure for printed circuit boards as claimed in claim 2, wherein: the other end of the inner part of the radiating fin (5) is fixedly connected with a cooling film layer (7), and the cooling film layer (7) is made of olefine acid emulsion.
5. The efficient heat dissipation structure for printed circuit boards as claimed in claim 1, wherein: the middle part of the front surface of the circuit board (1) is fixedly connected with a control block (9).
6. The efficient heat dissipation structure for printed circuit boards as claimed in claim 1, wherein: the antiskid head (2) is made of silica gel antiskid materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122354469.3U CN215818751U (en) | 2021-09-28 | 2021-09-28 | High-efficient heat radiation structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122354469.3U CN215818751U (en) | 2021-09-28 | 2021-09-28 | High-efficient heat radiation structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215818751U true CN215818751U (en) | 2022-02-11 |
Family
ID=80167462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122354469.3U Expired - Fee Related CN215818751U (en) | 2021-09-28 | 2021-09-28 | High-efficient heat radiation structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215818751U (en) |
-
2021
- 2021-09-28 CN CN202122354469.3U patent/CN215818751U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220211 |
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| CF01 | Termination of patent right due to non-payment of annual fee |