CN212967672U - Power supply IC chip - Google Patents
Power supply IC chip Download PDFInfo
- Publication number
- CN212967672U CN212967672U CN202021464367.6U CN202021464367U CN212967672U CN 212967672 U CN212967672 U CN 212967672U CN 202021464367 U CN202021464367 U CN 202021464367U CN 212967672 U CN212967672 U CN 212967672U
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- chip
- shell
- heat dissipation
- sealing cover
- heat
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Abstract
The utility model discloses a power supply IC chip, which comprises a structure main body, the structure main body comprises a shell, a sealing cover arranged on the shell and a chip arranged in the shell, the chip is provided with a plurality of pins, the sealing cover is detachably connected with the shell, a square empty groove is arranged at the center of the sealing cover, a heat conducting fin for realizing the heat dissipation function is also arranged on the sealing cover, the heat conducting fin is contacted with the chip, a plurality of pin grooves for positioning the pins are arranged at the side edge of the shell, the bottom of the shell is also provided with a heat dissipation plate, a plurality of heat dissipation holes are arranged on the heat dissipation plate, a raised installation block is arranged on the sealing cover, a positioning hole is arranged at the edge of the sealing cover, a strip-shaped installation groove is arranged on the shell, a positioning column is arranged at the edge of the shell, the installation block is in interference connection with the installation groove, a locking block for realizing the fastening effect with the sealing cover, the side of the chip contacts with the inner wall of the heat dissipation plate, and the shape of the heat dissipation hole includes but is not limited to rectangle.
Description
Technical Field
The utility model relates to a power IC chip technical field specifically is a power IC chip.
Background
The power supply IC chip is pulse width control integration of a switching power supply, the power supply adjusts the stability of output voltage and current by means of the power supply, along with the development of electronic technology, particularly the popularization of current portable products and the advocation of energy conservation and environmental protection, the power supply IC chip plays a greater and greater role, but the heat dissipation performance of the existing power supply IC chip is poor, a positioning and limiting structure is not arranged aiming at pins of the power supply IC chip, the installation stability is poor, and the power supply IC chip is easy to cause signal transmission to be influenced due to poor contact.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art scheme, the utility model provides a power supply IC chip.
The utility model provides a technical scheme that its technical problem adopted is: a power supply IC chip comprises a structure body, wherein the structure body comprises a shell and a sealing cover arranged on the shell, the structure body also comprises a chip arranged in the shell, and the chip is provided with a plurality of pins;
the sealing cover is detachably connected with the shell, a square empty groove is formed in the center of the sealing cover, heat conducting fins for achieving a heat dissipation function are further arranged on the sealing cover and are in contact with the chip, a plurality of pin grooves used for positioning pins are formed in the side edge of the shell, a heat dissipation plate is further arranged at the bottom of the shell, and a plurality of heat dissipation holes are formed in the heat dissipation plate.
Preferably, the sealing cover is provided with a raised mounting block, a positioning hole is formed in the corner of the sealing cover, a strip-shaped mounting groove is formed in the shell, and a positioning column is arranged at the corner of the shell.
Preferably, the mounting block is in interference connection with the mounting groove.
Preferably, the side edge of the heat conducting strip is provided with a locking block which realizes the fastening effect with the sealing cover, and the heat conducting strip is arranged right below the empty groove.
Preferably, the heat dissipation plate is a rectangular frame with a groove in the center, and the side edge of the chip is in contact with the inner wall of the heat dissipation plate.
Preferably, the shape of the heat dissipation hole includes, but is not limited to, a rectangle.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model is provided with a shell for realizing the pin positioning function of the power supply IC chip and a sealing cover for realizing the limiting and radiating functions of the power supply IC chip, and the bottom of the shell is also provided with a radiating plate for improving the radiating effect of the power supply IC chip, thereby improving the service life of the power supply IC chip and the installation stability of the power supply IC chip, and ensuring the stability and the speed of signal transmission; the sealing cover is detachably connected with the shell, so that the later-stage maintenance or replacement of the power supply IC chip can be facilitated; the shell and the heat dissipation plate are rectangular frames with grooves in the centers, so that the connection of the power supply IC chip and the circuit board cannot be influenced, and the power supply IC chip can be effectively dissipated through the heat dissipation grooves and the heat dissipation holes; the heat conducting fins have the functions of heat dissipation and limiting, and are arranged right below the empty grooves, so that the heat conducting fins are directly contacted with air to improve the heat dissipation speed.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is another schematic structural diagram of the present invention;
FIG. 3 is a schematic structural view of the cover of the present invention;
fig. 4 is a schematic structural view of the heat dissipating plate of the present invention.
Reference numbers in the figures:
the heat dissipation plate comprises a shell 1, a pin groove 11, a positioning column 12, a mounting groove 13, a sealing cover 2, an empty groove 21, a heat conduction sheet 22, a locking block 23, a positioning hole 24, a mounting block 25, a heat dissipation plate 3, a heat dissipation hole 31, a groove 32 and a pin 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-4, the present invention provides a power IC chip, which comprises a main structure body, wherein the main structure body comprises a housing 1 and a cover 2 disposed on the housing 1, and the main structure body further comprises a chip mounted in the housing 1, and the chip is provided with a plurality of pins 4;
the sealing cover 2 is detachably connected with the shell 1, a square empty groove 21 is formed in the center of the sealing cover 2, a heat conducting sheet 22 for achieving a heat dissipation function is further arranged on the sealing cover 2, the heat conducting sheet 22 plays a role in limiting displacement of a power supply IC chip, the heat conducting sheet 22 is in contact with the chip, a plurality of pin grooves 11 for positioning the pins 4 are formed in the side edge of the shell 1, a heat dissipation plate 3 is further arranged at the bottom of the shell 1, and a plurality of heat dissipation holes 31 are formed in the heat dissipation plate 3;
the side of shell 1 still is equipped with multichannel bar radiating groove to the bottom of shell 1 is the rectangular frame of central band recess equally, consequently can not influence being connected of power IC chip and circuit board.
The sealing cover 2 is provided with a raised mounting block 25, a positioning hole 24 is formed in the corner of the sealing cover 2, a strip-shaped mounting groove 13 is formed in the shell 1, and a positioning column 12 is arranged at the corner of the shell 1.
The mounting block 25 is connected with the mounting groove 13 in an interference manner.
The side edge of the heat conducting strip 22 is provided with a locking block 23 which realizes the fastening effect with the sealing cover 2, and the heat conducting strip 22 is arranged right below the empty groove 21.
The heat dissipation plate 3 is a rectangular frame with a groove 32 in the center, and the side edge of the chip is in contact with the inner wall of the heat dissipation plate 3.
The shape of the heat dissipation hole 31 includes, but is not limited to, a rectangle.
The utility model is provided with a shell 1 for realizing the pin positioning function of the power supply IC chip and a seal cover 2 for realizing the limiting and radiating functions of the power supply IC chip, and the bottom of the shell 1 is also provided with a radiating plate 3 for improving the radiating effect of the power supply IC chip, thereby improving the service life of the power supply IC chip and the installation stability of the power supply IC chip, and ensuring the stability and the speed of signal transmission; the sealing cover 2 is detachably connected with the shell 1, so that the later maintenance or replacement of the power supply IC chip can be facilitated; the shell 1 and the heat dissipation plate 3 are both rectangular frames with grooves in the centers, so that the connection of the power supply IC chip and the circuit board cannot be influenced, and the power supply IC chip can be effectively dissipated through the heat dissipation grooves and the heat dissipation holes 31; the heat-conducting strip 22 has both heat dissipation and limiting functions, and the heat-conducting strip 22 is disposed right below the empty slot 21, so that the heat-conducting strip 22 directly contacts with air to increase the heat dissipation speed.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A power supply IC chip is characterized by comprising a structure body, wherein the structure body comprises a shell and a sealing cover arranged on the shell, the structure body also comprises a chip arranged in the shell, and the chip is provided with a plurality of pins;
the sealing cover is detachably connected with the shell, a square empty groove is formed in the center of the sealing cover, heat conducting fins for achieving a heat dissipation function are further arranged on the sealing cover and are in contact with the chip, a plurality of pin grooves used for positioning pins are formed in the side edge of the shell, a heat dissipation plate is further arranged at the bottom of the shell, and a plurality of heat dissipation holes are formed in the heat dissipation plate.
2. The power IC chip as claimed in claim 1, wherein the cover has a raised mounting block, and the cover has a positioning hole at its corner, the housing has a strip-shaped mounting groove, and the housing has a positioning post at its corner.
3. The power IC chip of claim 2, wherein the mounting block is in interference fit with the mounting slot.
4. The power IC chip of claim 1, wherein the side of the heat-conducting strip is provided with a locking block for fastening with the cover, and the heat-conducting strip is disposed right below the empty groove.
5. A power IC chip as claimed in claim 1, wherein said heat dissipating plate is a rectangular frame with a groove at the center, and the side of said chip is in contact with the inner wall of said heat dissipating plate.
6. The power IC chip of claim 1, wherein the heat dissipation hole has a shape including but not limited to a rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021464367.6U CN212967672U (en) | 2020-07-22 | 2020-07-22 | Power supply IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021464367.6U CN212967672U (en) | 2020-07-22 | 2020-07-22 | Power supply IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212967672U true CN212967672U (en) | 2021-04-13 |
Family
ID=75396561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021464367.6U Active CN212967672U (en) | 2020-07-22 | 2020-07-22 | Power supply IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212967672U (en) |
-
2020
- 2020-07-22 CN CN202021464367.6U patent/CN212967672U/en active Active
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