CN218336824U - Multilayer circuit board - Google Patents

Multilayer circuit board Download PDF

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Publication number
CN218336824U
CN218336824U CN202221797903.3U CN202221797903U CN218336824U CN 218336824 U CN218336824 U CN 218336824U CN 202221797903 U CN202221797903 U CN 202221797903U CN 218336824 U CN218336824 U CN 218336824U
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China
Prior art keywords
circuit board
heat dissipation
connecting screw
top surface
groove
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Active
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CN202221797903.3U
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Chinese (zh)
Inventor
曾洁
姚松泉
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Jiangsu Lante Circuit Board Co ltd
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Jiangsu Lante Circuit Board Co ltd
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Priority to CN202221797903.3U priority Critical patent/CN218336824U/en
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Abstract

The utility model belongs to the technical field of circuit boards, in particular to a multilayer circuit board, which comprises a base, a dust cover, a radiating net and a circuit board, wherein the top surface of the base is provided with a connecting frame internally provided with a return groove, and two side surfaces of the dust cover are provided with fixing screw holes with fixing screws; the top surface of the heat dissipation net is provided with a connecting screw hole for mounting a screw, two side surfaces of the heat dissipation net are provided with spring pieces with buttons, and the mounting screw penetrates through the connecting screw hole and is screwed on the top surface of the connecting screw; the top surface of the circuit board is provided with connecting screw holes, and the bottom surfaces of the connecting screws penetrate through the connecting screw holes on the circuit board and are screwed on the connecting screw holes arranged in the grooves; the circuit board can be connected by the connecting screw, the holes in the dust cover are small, the heat dissipation and dust prevention effects can be achieved, the heat dissipation net mainly plays a role in heat dissipation and circuit board protection, the screw enables the device to be easy to mount and convenient to clean, and the service life of the circuit board is prolonged.

Description

Multilayer circuit board
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to multilayer circuit board.
Background
Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate.
With the continuous progress of electronic technology, most electronic products include a circuit board on which a plurality of electronic components are mounted to achieve an electronic control function.
However, the currently used electric board has a single function, a poor heat dissipation effect, and is inconvenient to clean, and cannot be better installed with external electronic components, so that a corresponding improvement needs to be made on the existing circuit board, and it is believed that the requirements of users can be better met through the improvement.
SUMMERY OF THE UTILITY MODEL
For solving the above-mentioned problem that exists among the prior art, the utility model provides a multilayer circuit board has the heat dissipation of being convenient for, and convenient cleanness is easily installed's characteristics.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer circuit board comprises a base, a dust cover, a radiating net and a circuit board, wherein a connecting frame with a return groove inside is mounted on the top surface of the base; two side surfaces of the dust cover are provided with fixing screw holes with fixing screws; the top surface of the heat dissipation net is provided with connecting screw holes for mounting screws, two side surfaces of the heat dissipation net are provided with spring pieces with buttons, and the mounting screws penetrate through the connecting screw holes and are screwed on the top surfaces of the connecting screws; the heat-conducting fin is installed to the top surface of circuit board, the top surface of circuit board has all been seted up the connecting screw hole, and the bottom surface of connecting screw passes the connecting screw hole screw thread on the circuit board and closes soon and connect on the connecting screw hole of seting up in the recess.
As a preferred technical scheme of the utility model, a multilayer circuit board, fixed screw hole has all been seted up in the four corners of base, the louvre has been seted up to the side of base, and the insulating piece is installed to the bottom surface of recess.
As an optimal technical scheme of the utility model, a multilayer circuit board, the width size of draw-in groove width size and button is equidimension to draw-in groove and button are in same vertical direction.
As an optimal technical solution of the present invention, the multilayer circuit board has a large area size of the circuit board and a large area size of the groove.
As a preferred technical scheme of the utility model, a multilayer circuit board, the position of louvre is in the depth dimension of recess.
As an optimal technical scheme of the utility model, a multilayer circuit board, the width size of radiator-grid wall thickness is less than the width size in time groove.
As an optimized technical scheme of the utility model, a multilayer circuit board, also utilize connecting screw thread to close soon between circuit board and the circuit board and be connected.
Compared with the prior art, the beneficial effects of the utility model are that: the device can be connected and used by the circuit board due to the use of the connecting screw, the service function of the device is seen more, the holes in the dust cover are too small, so that the effect of heat dissipation and dust prevention can be achieved, the internal heat dissipation net mainly plays a role in heat dissipation and circuit board protection, the device is easy to install due to the screw, the device is convenient to clean, the heat dissipation function is improved, and the service life of the circuit board is prolonged.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the dust cover of the present invention;
FIG. 2 is a schematic structural view of the heat dissipating net of the present invention;
FIG. 3 is a schematic view of the exploded structure of the present invention;
in the figure: 1. a base; 2. a dust cover; 3. fixing screw holes; 4. fixing screws; 5. heat dissipation holes; 6. a connecting frame; 7. a spring plate; 8. a button; 9. a heat-dissipating web; 10. mounting screws; 11. connecting screw holes; 12. a card slot; 13. a circular groove; 14. an insulating sheet; 15. a heat conductive sheet; 16. a circuit board; 17. a connecting screw; 18. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Examples
Referring to fig. 1-3, the present invention provides the following technical solutions: a multilayer circuit board comprises a base 1, a dust cover 2, a heat dissipation net 9 and a circuit board 16, wherein the top surface of the base 1 is provided with a connecting frame 6 with a return groove 13 formed inside, the outer side surface of the connecting frame 6 is provided with a clamping groove 12, the top surface of the base 1 is provided with a groove 18 with a connecting screw hole 11, and the mounting and dismounting are convenient; the two side surfaces of the dust cover 2 are respectively provided with a fixing screw hole 3 with a fixing screw 4, the dust cover 2 and the bottom plate can be fixed together by the fixing screws 4, and the dust cover 2 is provided with fine holes, so that dust is not easy to enter, and dust prevention and heat dissipation are easy; the top surface of the heat dissipation net 9 is provided with a connecting screw hole 11 of a mounting screw 10, two side surfaces of the heat dissipation net 9 are provided with spring pieces 7 with buttons 8, the buttons 8 are inserted into clamping grooves 12, the heat dissipation net 9 is conveniently and flexibly fixed and is convenient to disassemble, the mounting screw 10 penetrates through the connecting screw hole 11 and is screwed and connected to the top surface of a connecting screw 17, and the mounting screw 10 is used for fixing the heat dissipation net 9 and a circuit board 16, so that the mounting is convenient and the disassembly and cleaning are facilitated; the top surface of circuit board 16 is installed with conducting strip 15, prevents that circuit board 16 from overheated causing the damage, and connecting screw hole 11 has all been seted up to circuit board 16's top surface, and connecting screw 17's bottom surface passes connecting screw hole 11 screw thread on the circuit board 16 and closes soon and connect on the connecting screw hole 11 of seting up in recess 18, utilizes connecting screw 17 both can fixed circuit board 16, can connect circuit board 16 again, realizes multilayer circuit board.
Specifically, as shown in fig. 3, in the embodiment, the four corners of the base 1 are provided with the fixing screw holes 3, so that the dust cover 2 and the base 1 are conveniently fixed, the heat dissipation holes 5 are formed in the side surfaces of the base 1, the reduction of the heat on the circuit board 16 is facilitated, the circuit board 16 is prevented from being damaged, the insulation sheet 14 is installed on the bottom surface of the groove 18, the leakage of the circuit board 16 is prevented, and safety accidents are caused.
Specifically, as shown in fig. 2, in this embodiment, the width of the slot 12 and the width of the button 8 are equal, and the slot 12 and the button 8 are in the same vertical direction, so that the button 8 and the slot 12 can be accurately mounted together when the heat dissipation network 9 is conveniently mounted, and time and labor are saved.
Specifically, as shown in fig. 3, in the present embodiment, the area size of the circuit board 16 and the area size of the groove 18 are equal, and the groove 18 is used for mounting the circuit board 16, and is equal in size and convenient to mount.
Specifically, as shown in fig. 3, in the present embodiment, the position of the heat dissipation hole 5 is within the depth dimension of the groove 18, and the heat dissipation hole 5 mainly cools the circuit board 16 in the groove 18, so the position must be within the depth dimension of the groove 18 to improve the heat dissipation capability to the maximum extent.
Specifically, as shown in fig. 3, in this embodiment, the width of the wall thickness of the heat dissipation net 9 is smaller than the width of the return groove 13, so that the heat dissipation net 9 can be conveniently removed by operating the button, and a sufficient elastic space is left for the spring piece 7.
Specifically, as shown in fig. 3, in this embodiment, the circuit boards 16 are screwed to the circuit boards 16 by the connecting screws 17, so that the number of the circuit boards 16 can be overlapped as required, thereby meeting the requirement, facilitating the disassembly and assembly, and facilitating the cleaning and heat dissipation.
The utility model discloses a theory of operation and use flow: the utility model discloses in the device's base 1's top surface install inside link frame 6 of seting up back groove 13, draw-in groove 12 has been seted up to link frame 6's lateral surface, the recess 18 that has connecting screw hole 11 is seted up to the top surface, fixed screw hole 3 that has fixed screw 4 is all seted up to the both sides face of dust cover 2, the connecting screw hole 11 of installation screw 10 is seted up to the top surface of radiator-grid 9, two side-mounting of radiator-grid 9 have the spring leaf 7 that has button 8, button 8 injects in draw-in groove 12, circuit board 16 of installation is connected to inside useful connecting screw 17 of radiator-grid 9, there is conducting strip 15 on circuit board 16.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a multilayer circuit board, includes base (1), dust cover (2) and radiator-grid (9), its characterized in that: the novel LED lamp is characterized by further comprising a circuit board (16), wherein a connecting frame (6) with a return groove (13) formed inside is mounted on the top surface of the base (1), a clamping groove (12) is formed in the outer side surface of the connecting frame (6), and a groove (18) with a connecting screw hole (11) is formed in the top surface of the base (1); two side surfaces of the dust cover (2) are respectively provided with a fixed screw hole (3) with a fixed screw (4); the top surface of the heat dissipation net (9) is provided with a connecting screw hole (11) for mounting a screw (10), two side surfaces of the heat dissipation net (9) are provided with spring pieces (7) with buttons (8), and the mounting screw (10) penetrates through the connecting screw hole (11) and is screwed on the top surface of the connecting screw (17); the heat-conducting fin (15) are installed to the top surface of circuit board (16), connecting screw hole (11) have all been seted up to the top surface of circuit board (16), and the bottom surface of connecting screw (17) passes connecting screw hole (11) on circuit board (16) and screw thread closes on connecting screw hole (11) of seting up in recess (18).
2. A multilayer circuit board according to claim 1, wherein: fixed screw holes (3) are formed in four corners of the base (1), heat dissipation holes (5) are formed in the side face of the base (1), and insulation sheets (14) are mounted on the bottom face of the groove (18).
3. A multilayer circuit board according to claim 1, wherein: the width size of the clamping groove (12) and the width size of the button (8) are equal, and the clamping groove (12) and the button (8) are in the same vertical direction.
4. A multilayer circuit board according to claim 2, wherein: the area size of the circuit board (16) and the area size of the groove (18) are equal.
5. A multilayer circuit board according to claim 2, wherein: the position of the heat dissipation hole (5) is in the depth dimension of the groove (18).
6. A multilayer circuit board according to claim 1, wherein: the width dimension of the wall thickness of the heat dissipation net (9) is smaller than that of the return groove (13).
7. A multilayer circuit board according to claim 1, wherein: the circuit board (16) and the circuit board (16) are connected in a screwed mode through connecting screws (17).
CN202221797903.3U 2022-07-13 2022-07-13 Multilayer circuit board Active CN218336824U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221797903.3U CN218336824U (en) 2022-07-13 2022-07-13 Multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221797903.3U CN218336824U (en) 2022-07-13 2022-07-13 Multilayer circuit board

Publications (1)

Publication Number Publication Date
CN218336824U true CN218336824U (en) 2023-01-17

Family

ID=84871003

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221797903.3U Active CN218336824U (en) 2022-07-13 2022-07-13 Multilayer circuit board

Country Status (1)

Country Link
CN (1) CN218336824U (en)

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