CN215499721U - Circuit board with good heat dissipation performance - Google Patents
Circuit board with good heat dissipation performance Download PDFInfo
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- CN215499721U CN215499721U CN202121844661.4U CN202121844661U CN215499721U CN 215499721 U CN215499721 U CN 215499721U CN 202121844661 U CN202121844661 U CN 202121844661U CN 215499721 U CN215499721 U CN 215499721U
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- circuit board
- board main
- heat dissipation
- radiator
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Abstract
The utility model discloses a circuit board with good heat dissipation performance, which comprises a circuit board main body, wherein a first radiator and a second radiator are respectively arranged at the middle position of the surface of the circuit board main body, a small-sized heat dissipation fan is arranged at the corner of the surface of the circuit board main body, a heat dissipation surface layer, a resin heat insulation layer and a copper foil sheet are arranged inside the circuit board main body, the heat dissipation surface layer is coated on the upper surface of the resin heat insulation layer, the copper foil sheet is coated on the lower surface of the resin heat insulation layer, a heat dissipation slotted hole is formed in the surface of the heat dissipation surface layer, and an integrated circuit module is arranged at the side edge of the circuit board main body. According to the utility model, the high-power device is arranged close to the edge of the circuit board as much as possible in the horizontal direction, so that the heat transfer path is shortened, the high-power device is aligned to the air outlet of the fan to accelerate the heat dissipation efficiency, the heat insulation protection design is adopted for the interior of the circuit board, the thickness of the heat conduction copper plate is reduced, and the thickness of the resin heat insulation layer is widened, so that a good heat insulation protection effect is achieved, and the heat conduction from the bottom to the surface of the circuit board is effectively reduced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with good heat dissipation performance.
Background
Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. First, a single panel, on the most basic PCB, the components are concentrated on one side and the wires are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.
The existing circuit board has poor heat dissipation performance, if the heat of the components is not dissipated in time, the temperature of the equipment is continuously increased, the components lose efficacy due to overheating, and the reliability of the electronic equipment is reduced. Therefore, the market is urgently required to develop a novel circuit board with good heat dissipation performance.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board with good heat dissipation performance, and aims to solve the problems that the existing circuit board in the background technology has poor heat dissipation performance, if the heat of components is not dissipated in time, equipment is heated continuously, the components fail due to overheating, and the reliability of electronic equipment is reduced.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a circuit board with good heat dissipation, includes circuit board main part, first radiator and second radiator are installed respectively to the surperficial intermediate position department of circuit board main part, and small-size radiator fan is installed to the surperficial corner of circuit board main part, the inside of circuit board main part is by cooling surface layer, resin insulating layer and copper foil piece, and the cladding of cooling surface layer is at the upper surface of resin insulating layer, and the cladding of copper foil piece is at the lower surface of resin insulating layer, and the surface of cooling surface layer is provided with the heat dissipation slotted hole, integrated circuit module is installed to the side department of circuit board main part.
Preferably, the first radiator is located on one side of the second radiator, and the first radiator and the second radiator are both fixed with the circuit board main body through screws.
Preferably, a power transistor, a capacitor module and a power consumption assembly are respectively mounted on the other side edge of the circuit board main body.
Preferably, the power transistor, the capacitor module and the power consumption component are located at the front end of an air outlet of the small heat dissipation fan.
Preferably, the thickness of the copper foil is 2mm, and the thickness of the resin heat insulation layer is 1 cm.
Preferably, four corners of the surface of the circuit board main body are provided with mounting holes.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the high-power device is arranged close to the edge of the circuit board as much as possible in the horizontal direction, so that the heat transfer path is shortened, the high-power device is aligned to the air outlet of the fan to accelerate the heat dissipation efficiency, the heat insulation protection design is adopted for the interior of the circuit board, the thickness of the heat conduction copper plate is reduced, and the thickness of the resin heat insulation layer is widened, so that a good heat insulation protection effect is achieved, and the heat conduction from the bottom to the surface of the circuit board is effectively reduced.
Description of the drawings
FIG. 1 is a schematic diagram of a main structure of a circuit board according to the present invention;
FIG. 2 is a schematic side view of the circuit board body according to the present invention;
fig. 3 is a schematic view of the internal structure of the circuit board main body according to the present invention.
In the figure: 1. a small-sized heat radiation fan; 2. a first heat sink; 3. an integrated circuit module; 4. a circuit board main body; 5. a second heat sink; 6. a power transistor; 7. a capacitive module; 8. a power consumption component; 9. mounting holes; 10. a heat dissipation surface layer; 11. a resin heat-insulating layer; 12. a heat dissipation slot; 13. a copper foil.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, an embodiment of the present invention is shown: the utility model provides a good heat dissipation's circuit board, including circuit board main part 4, first radiator 2 and second radiator 5 are installed respectively to the surperficial intermediate position department of circuit board main part 4, small-size radiator fan 1 is installed to the surperficial corner of circuit board main part 4, the inside of circuit board main part 4 is by cooling surface course 10, resin insulating layer 11 and copper foil 13, the upper surface of cooling surface course 10 cladding at resin insulating layer 11, the cladding of copper foil 13 is at the lower surface of resin insulating layer 11, the surface of cooling surface course 10 is provided with heat dissipation slotted hole 12, integrated circuit module 3 is installed to the side department of circuit board main part 4.
Further, the first heat sink 2 is located on one side of the second heat sink 5, and the first heat sink 2 and the second heat sink 5 are both fixed to the circuit board main body 4 by screws.
Further, a power transistor 6, a capacitor module 7 and a power consumption component 8 are respectively mounted on the other side of the circuit board main body 4.
Further, the power transistor 6, the capacitor module 7 and the power consumption component 8 are located at the front end of the air outlet of the small-sized heat dissipation fan 1.
Further, the thickness of the copper foil 13 was 2mm, and the thickness of the resin heat insulating layer 11 was 1 cm.
Further, four corners of the surface of the circuit board main body 4 are provided with mounting holes 9.
The working principle is as follows: when in use, the circuit board main body 4 is internally provided with a heat radiation surface layer 10, a resin heat insulation layer 11 and a copper foil 13, the thickness of the copper foil 13 is 2mm, the thickness of the resin heat insulation layer 11 is 1cm, the thickness of the heat conduction copper foil 13 is reduced and the thickness of the resin heat insulation layer 11 is widened by adopting the heat insulation protection design in the circuit board main body 4, thereby achieving good heat insulation protection effect, effectively reducing the bottom heat conduction to the surface of the circuit board main body 4, the middle position of the surface of the circuit board main body 4 is respectively provided with a first radiator 2 and a second radiator 5, the surface corner of the circuit board main body 4 is provided with a small-sized heat radiation fan 1, the other side edge of the circuit board main body 4 is respectively provided with a power transistor 6, a capacitance module 7 and a power consumption component 8, the power transistor 6, the capacitance module 7 and the power consumption component 8 are positioned at the front end position of an air outlet of the small-sized heat radiation fan 1, through in the horizontal direction, with high-power device such as power transistor 6, capacitance module 7 and power consumption subassembly 8 as far as possible close to the circuit board border and arrange to shorten heat transfer path, aim at small-size radiator fan 1 air outlet with it simultaneously and in order accelerating the radiating efficiency, through this overall arrangement mode, can play good radiating effect, guarantee circuit board electronic components's steady operation.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a circuit board with good heat dissipation performance, includes circuit board main part (4), its characterized in that, first radiator (2) and second radiator (5) are installed respectively to the surperficial intermediate position department of circuit board main part (4), and small-size radiator fan (1) are installed to the surperficial corner of circuit board main part (4), the inside of circuit board main part (4) is by cooling surface layer (10), resin insulating layer (11) and copper foil piece (13), and the upper surface of resin insulating layer (11) is wrapped in cooling surface layer (10), and copper foil piece (13) cladding is at the lower surface of resin insulating layer (11), and the surface of cooling surface layer (10) is provided with heat dissipation slotted hole (12), integrated circuit module (3) are installed to the side department of circuit board main part (4).
2. A heat dissipating circuit board according to claim 1, wherein: the first radiator (2) is located on one side of the second radiator (5), and the first radiator (2) and the second radiator (5) are fixed with the circuit board main body (4) through screws.
3. A heat dissipating circuit board according to claim 1, wherein: and a power transistor (6), a capacitor module (7) and a power consumption assembly (8) are respectively arranged at the other side edge of the circuit board main body (4).
4. A heat dissipating circuit board according to claim 3, wherein: the power transistor (6), the capacitor module (7) and the power consumption component (8) are positioned at the front end of an air outlet of the small-sized heat radiation fan (1).
5. A heat dissipating circuit board according to claim 1, wherein: the thickness of the copper foil (13) is 2mm, and the thickness of the resin heat insulation layer (11) is 1 cm.
6. A heat dissipating circuit board according to claim 1, wherein: four corners of the surface of the circuit board main body (4) are provided with mounting holes (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121844661.4U CN215499721U (en) | 2021-08-09 | 2021-08-09 | Circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121844661.4U CN215499721U (en) | 2021-08-09 | 2021-08-09 | Circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215499721U true CN215499721U (en) | 2022-01-11 |
Family
ID=79757221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121844661.4U Active CN215499721U (en) | 2021-08-09 | 2021-08-09 | Circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215499721U (en) |
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2021
- 2021-08-09 CN CN202121844661.4U patent/CN215499721U/en active Active
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