CN221202844U - Printed circuit board and electronic device - Google Patents
Printed circuit board and electronic device Download PDFInfo
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- CN221202844U CN221202844U CN202322829863.7U CN202322829863U CN221202844U CN 221202844 U CN221202844 U CN 221202844U CN 202322829863 U CN202322829863 U CN 202322829863U CN 221202844 U CN221202844 U CN 221202844U
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- layer
- printed circuit
- circuit board
- insulating substrate
- grooves
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- 239000000758 substrate Substances 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 230000000694 effects Effects 0.000 abstract description 12
- 238000012546 transfer Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application belongs to the technical field of printed circuit boards, and provides a printed circuit board and electronic equipment, wherein the printed circuit board comprises: the device comprises an insulating substrate, at least one inner circuit layer, at least one surface circuit layer and at least one groove, wherein the inner circuit layer is arranged in the insulating substrate, and the surface circuit layer is arranged on the surface of the insulating substrate; wherein, internal circuit layer and surface circuit layer are the copper foil, and the inner wall of recess covers first heat conduction layer, and contacts with internal circuit layer through first heat conduction layer for the inside circuit layer of insulating substrate can pass through recess and air direct contact, need not to pass through insulating substrate with heat transfer to its top layer or bottom, thereby reduced thermal resistance, accelerated radiating efficiency, promoted the radiating effect of printed circuit board.
Description
Technical Field
The application belongs to the technical field of printed circuit boards, and particularly relates to a printed circuit board and electronic equipment.
Background
The PCB circuit board (printed circuit board), also called printed circuit board, printed circuit board for short, english PCB (printed circuit board) or PWB (PRINTED WIRING board) is cut into a certain size by using insulating board as base material and copper foil adhered on the surface or inside of insulating board as electric or heat conducting material, and at least one electric conductive pattern is attached on the insulating board and holes (such as element holes, fastening holes, metallized holes, etc.) are distributed on the insulating board to realize interconnection between electronic components. Such boards are known as "printed circuit boards" because they are made using electronic printing.
With the miniaturization of electronic products and the more functionality being incorporated into smaller devices, the heat dissipation requirements of these devices and products have increased. This is especially true for PCBs operating at high currents, particularly heavy duty power supply systems, where power management systems integrated on the PCB are required, as well as high current drive circuits, where heat dissipation is a significant concern, and where strategies need to be implemented to manage the heat generated in the high current PCB.
Disclosure of utility model
In order to solve the technical problems, the embodiment of the application provides a printed circuit board and electronic equipment, and aims to solve the problem of low heat dissipation efficiency of the conventional printed circuit board.
A first aspect of an embodiment of the present application provides a printed circuit board, including:
An insulating substrate;
at least one internal circuit layer arranged in the insulating substrate;
At least one surface circuit layer arranged on the surface of the insulating substrate; wherein the inner circuit layer and the surface circuit layer are both copper foils;
and the inner wall of the groove is covered with a first heat conduction layer, and the first heat conduction layer is in contact with the inner circuit layer.
In one embodiment, the grooves extend through opposite sides of the insulating substrate.
In one embodiment, the number of the grooves is multiple, and the grooves are uniformly distributed on the insulating substrate.
In one embodiment, the number of the grooves is a plurality, the grooves are strip-shaped, and the grooves are arranged in parallel.
In one embodiment, the surface of the first heat conducting layer is provided with a plurality of protruding structures.
In one embodiment, the surface of the first heat conducting layer is a saw tooth structure.
In one embodiment, the width of the groove is 5mm-15mm.
In one embodiment, the first thermally conductive layer has a thickness of 1-3mm.
In one embodiment, the shape of the groove is polygonal.
A second aspect of the embodiments of the present application also provides an electronic device comprising a printed circuit board according to any of the embodiments described above.
The embodiment of the application has the beneficial effects that: the internal circuit layer of the printed circuit board is arranged in the insulating substrate, and the surface circuit layer is arranged on the surface of the insulating substrate; wherein, internal circuit layer and surface circuit layer are the copper foil, and the inner wall of recess covers first heat conduction layer, and contacts with internal circuit layer through first heat conduction layer for the inside circuit layer of insulating substrate can pass through recess and air direct contact, need not to pass through insulating substrate with heat transfer to its top layer or bottom, thereby reduced thermal resistance, accelerated radiating efficiency, promoted the radiating effect of printed circuit board.
Drawings
FIG. 1 is a schematic diagram of a printed circuit board according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a printed circuit board according to an embodiment of the present application;
FIG. 3 is a schematic diagram III of a printed circuit board according to an embodiment of the present application;
fig. 4 is a schematic diagram of a printed circuit board according to an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is one or more than one unless specifically defined otherwise.
The key points of PCB heat dissipation are: 1. copper foil mass (copper thickness), 2. Convection (air flow velocity), 3. Air contact area. As electronic products continue to be miniaturized, the heat dissipation requirements of these systems have increased as more functionality has been incorporated into smaller devices. This is especially true for PCBs operating at high currents, particularly heavy duty power supply systems, where power management systems integrated on the PCB are required, as well as high current drive circuits, where heat dissipation is a significant concern, and where strategies need to be implemented to manage the heat generated in the high current PCB. In the general design scheme, the aperture of the through hole is very small, only plays the role of layer-to-layer electrical connection, has small contact area to air, and the heat of the inner layer of the printed circuit board can be contacted with the air only by transmitting the heat to the upper layer or the lower layer through the through hole VIA, so that the problem of lower heat dissipation efficiency exists.
In order to solve the above technical problems, an embodiment of the present application provides a printed circuit board, as shown in fig. 1, including: the insulation substrate 100, at least one inner circuit layer 220, at least one surface circuit layer 210 and at least one groove, wherein the inner circuit layer 220 is arranged in the insulation substrate 100, and the surface circuit layer 210 is arranged on the surface of the insulation substrate 100; wherein, the inner circuit layer 220 and the surface circuit layer 210 are both copper foils, the inner wall of the groove covers the first heat conduction layer 310 and contacts with the inner circuit layer 220 through the first heat conduction layer 310, so that the circuit layer inside the insulating substrate 100 can be directly contacted with air through the groove without transferring heat to the top layer or the bottom layer of the insulating substrate 100, thereby reducing thermal resistance, accelerating heat dissipation efficiency and improving heat dissipation effect of the printed circuit board.
In this embodiment, the copper foil of the printed circuit board itself is an excellent heat conductor, and the thermal conductivity of pure copper is as high as 401W/mK. Through slotting on the insulating substrate 100 to form the groove contacted with the inner circuit layer 220 and forming the first heat conducting layer 310 on the inner wall of the groove, the copper foil of the printed circuit board can be reasonably utilized or the heat conducting efficiency of the copper foil can be quickened, and the heat dissipation of components on the printed circuit board can be well assisted. According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is provided for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat. Meanwhile, the grooves etched in the method eat tin, the groove walls change from smooth to convex, the contact area of the grooves to air can be increased, and the grooves are helpful for heat dissipation.
In one embodiment, the surface wiring layer 210 includes a top layer of the insulating substrate 100 and a wiring layer underlying the top layer.
In this embodiment, the top layer and the bottom layer of the insulating substrate 100 are both provided with circuit layers, and the pattern of the circuit layers can be designed according to the user's requirements, and the pattern of the circuit layers can be any pattern.
The grooves on the insulating substrate 100 may be disposed on the top layer or the bottom layer of the insulating substrate 100, or the top layer and the bottom layer of the insulating substrate 100 are both provided with groove structures, and the top layer and the bottom layer of the insulating substrate 100 are opposite sides of the insulating substrate.
In one embodiment, the top layer and the bottom layer of the insulating substrate 100 are both provided with circuit layers, the grooves contacting with the internal circuit layer 220 are formed by grooving the insulating substrate 100, and the first heat conducting layer 310 is formed on the inner wall of each groove, so that the circuit layers on the top layer and the bottom layer of the insulating substrate 100 are contacted with the first heat conducting layer 310, the copper foil of the printed circuit board can be reasonably utilized or the heat conducting efficiency of the copper foil can be quickened, the heat of the internal circuit layer 220 is conducted to the surface of the insulating substrate 100 through the copper foil, the heat radiating area is increased, and the heat radiation of components on the printed circuit board can be well assisted. According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is available for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the groove and the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
In one embodiment, the first thermally conductive layer 310 may be a copper layer.
Copper foil of the printed circuit board is an excellent heat conductor, and the heat conductivity coefficient of pure copper is as high as 401W/mK. The copper foil of the printed circuit board is reasonably utilized or the heat conduction efficiency of the copper foil is quickened, so that the heat dissipation of components on the printed circuit board can be well assisted. According to the application, the opened grooves are contacted with the inner circuit layer 220, the first heat conduction layer 310 is arranged on the side wall of the grooves, and the copper layer is used as the heat conduction layer, so that the contact area between the top layer and the bottom layer is not only available for air, but also the inner circuit layer 220 can be directly contacted with the air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the grooves with the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
In some embodiments, the depth of the grooves is less than one half of the depth of the insulating substrate, and the grooves may be provided in predetermined areas on the top and bottom layers of the insulating substrate 100.
In this embodiment, the first heat conducting layer 310 is formed on the side wall of the groove, the circuit layers are disposed on the top layer and the bottom layer of the insulating substrate 100, the groove contacting with the internal circuit layer 220 is formed on the insulating substrate 100 by grooving, the depth of the groove is less than half of the depth of the insulating substrate, and the grooves can be disposed in preset areas on the top layer and the bottom layer of the insulating substrate 100, so that heat generated by the internal circuit layer 220 can be conducted to the surface of the insulating substrate 100 at the shortest heat dissipation distance, and the heat dissipation efficiency of the printed circuit board is improved.
In one embodiment, referring to fig. 2, grooves extend through opposite sides of the insulating substrate 100.
In this embodiment, the grooves may penetrate through the bottom layer and the top layer of the insulating substrate 100, and the top layer of the insulating substrate 100 is connected to the bottom layer of the insulating substrate 100 through the groove through holes, so that air on two sides of the insulating substrate 100 can be caused to perform convection, and the heat dissipation efficiency of the printed circuit board is increased.
In this embodiment, the grooves penetrate through the bottom layer and the top layer of the insulating substrate 100, the first heat conducting layer 310 is formed on the side wall of the groove, the circuit layers are disposed on the top layer and the bottom layer of the insulating substrate 100, the grooves contacting with the internal circuit layer 220 are formed on the insulating substrate 100 through grooves, the circuit layers on the top layer and the bottom layer of the insulating substrate 100 contact with the first heat conducting layer 310, so that air on two sides of the insulating substrate 100 can be convected, and the heat dissipation efficiency of the printed circuit board is increased.
According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is available for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the groove and the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
In some embodiments, the inside of the groove on the insulating substrate 100 may be formed with a copper layer through an electroplating process, and the copper layer is connected to the inner circuit layer 220 inside the insulating substrate 100, so as to achieve the purpose of heat dissipation of the inner circuit layer 200.
In some embodiments, a plurality of inner circuit layers 220 are disposed inside the insulating substrate 100, and distances between adjacent inner circuit layers 220 are equal.
The top layer of the insulating substrate 100 and the bottom layer thereof are both provided with circuit layers, grooves which are contacted with the inner circuit layers 220 are formed on the insulating substrate 100 through grooves, a first heat conduction layer 310 is formed on the inner wall of each groove, the top layer of the insulating substrate 100 and the circuit layers on the bottom layer thereof are contacted with the first heat conduction layer 310, a plurality of inner circuit layers 220 are contacted with the first heat conduction layer 310, copper foils of a printed circuit board can be reasonably utilized or the heat conduction efficiency of the copper foils can be quickened, heat of the inner circuit layers 220 is conducted to the surface of the insulating substrate 100 through the copper foils, the heat dissipation area is increased, and heat dissipation of components on the printed circuit board can be well assisted. According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is available for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the groove and the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
In one embodiment, referring to fig. 3, the number of grooves is plural, and the plural grooves are uniformly distributed on the insulating substrate 100.
In some embodiments, the power device is disposed on the insulating substrate 100, and the groove may be close to the power device, for example, the groove is disposed at a position within 2-5cm of the power device, so that heat generated by a large current on the power device can be better dissipated.
In one embodiment, as shown in fig. 3, the number of the grooves is plural, the grooves are stripe-shaped, and the plural grooves are arranged in parallel.
In some embodiments, the distances between adjacent grooves are equal.
In one embodiment, referring to fig. 4, the surface of the first heat conductive layer 310 is provided with a plurality of protruding structures.
In this embodiment, by disposing the protruding structures on the surface of the first heat conducting layer 310, not only the contact area between the first heat conducting layer 310 and the air in the groove can be increased, but also the friction coefficient of the inner wall of the groove can be increased, and the stability of the solder can be improved. On the other hand, in the other hand,
In some embodiments, the thickness of the raised structures of the surface of the first thermally conductive layer 310 is less than the thickness of the first thermally conductive layer 310.
In some embodiments, the distances between adjacent raised structures on the surface of the first thermally conductive layer 310 are equal.
In this embodiment, by making the walls of the grooves smooth to convex, the contact area with air can be increased, thereby achieving a better heat dissipation effect than a general through hole.
In one embodiment, the surface of the first heat conductive layer 310 is a saw tooth structure.
In one embodiment, the width of the groove is 5mm-15mm.
In one embodiment, the first thermally conductive layer 310 has a thickness of 1-3mm.
In one embodiment, the shape of the recess is polygonal.
In this embodiment, the grooves may be configured as polygons, and the polygons may be sequentially configured according to the line with higher current in the internal line layer 220, for example, the smaller the distance between the line with higher current and the groove of the polygon, the larger the distance between the line with lower current and the groove of the polygon. In this way, the heat of the inner circuit layer 220 can be conducted to the first heat conducting layer 310 on the side wall of the groove at the fastest speed through the copper foil, and the heat is conducted to the surface of the insulating substrate 100 through the first heat conducting layer 310, so that the heat dissipation area is increased, and the heat dissipation of the components on the printed circuit board can be well assisted. According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is available for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the groove and the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
In some embodiments, in order to further improve the heat dissipation efficiency of the printed circuit board, the top layer and the bottom layer of the printed circuit board may be provided with heat dissipation fins, so that the heat dissipation area of the circuit layer of the top layer and the bottom layer of the printed circuit board is increased by the heat dissipation fins, and the heat dissipation efficiency is improved.
The embodiment of the application also provides electronic equipment, which comprises the printed circuit board according to any one of the embodiments.
In this embodiment, by adopting the printed circuit board in the above embodiment in the electronic device, the copper foil of the printed circuit board can be reasonably utilized or the heat conduction efficiency of the copper foil can be accelerated, and the heat dissipation of components on the printed circuit board can be well assisted. By conducting the heat of the internal circuit layer 220 to the surface of the insulating substrate 100 through the copper foil, the heat dissipation area is increased, and the heat dissipation of the components on the printed circuit board can be well assisted. According to the application, the grooves are contacted with the inner circuit layer 220, so that not only the contact area between the top layer and the bottom layer is available for air, but also the inner circuit layer 220 can be directly contacted with air through the grooves, and the heat dissipation area can be increased through the contact of the copper layer on the side wall of the groove and the circuit layer on the surface, thereby accelerating the heat conduction efficiency of the inner copper foil and achieving the effect that the inner layer can directly dissipate heat.
The embodiment of the application has the beneficial effects that: the internal circuit layer of the printed circuit board is arranged in the insulating substrate, and the surface circuit layer is arranged on the surface of the insulating substrate; wherein, internal circuit layer and surface circuit layer are the copper foil, and the inner wall of recess covers first heat conduction layer, and contacts with internal circuit layer through first heat conduction layer for the inside circuit layer of insulating substrate can pass through recess and air direct contact, need not to pass through insulating substrate with heat transfer to its top layer or bottom, thereby reduced thermal resistance, accelerated radiating efficiency, promoted the radiating effect of printed circuit board.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. A printed circuit board, the printed circuit board comprising:
An insulating substrate;
at least one internal circuit layer arranged in the insulating substrate;
At least one surface circuit layer arranged on the surface of the insulating substrate; wherein the inner circuit layer and the surface circuit layer are both copper foils;
and the inner wall of the groove is covered with a first heat conduction layer, and the first heat conduction layer is in contact with the inner circuit layer.
2. The printed circuit board of claim 1, wherein the grooves extend through opposite sides of the insulating substrate.
3. The printed circuit board of claim 1, wherein the number of grooves is a plurality, and the plurality of grooves are uniformly distributed on the insulating substrate.
4. The printed circuit board of claim 1, wherein the number of the grooves is plural, the grooves are stripe-shaped, and the plural grooves are arranged in parallel.
5. The printed circuit board of claim 1, wherein a surface of the first thermally conductive layer is provided with a plurality of raised structures.
6. The printed circuit board of claim 2, wherein a surface of the first thermally conductive layer is a saw tooth structure.
7. The printed circuit board of claim 4, wherein the width of the groove is 5mm-15mm.
8. The printed circuit board of claim 2, wherein the first thermally conductive layer has a thickness of 1-3mm.
9. The printed circuit board of claim 1, wherein the recess is polygonal in shape.
10. An electronic device comprising the printed circuit board of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322829863.7U CN221202844U (en) | 2023-10-20 | 2023-10-20 | Printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322829863.7U CN221202844U (en) | 2023-10-20 | 2023-10-20 | Printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221202844U true CN221202844U (en) | 2024-06-21 |
Family
ID=91490058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322829863.7U Active CN221202844U (en) | 2023-10-20 | 2023-10-20 | Printed circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221202844U (en) |
-
2023
- 2023-10-20 CN CN202322829863.7U patent/CN221202844U/en active Active
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