CN219124423U

CN219124423U - High-softness rigid-flexible combined circuit board

Info

Publication number: CN219124423U
Application number: CN202223132950.9U
Authority: CN
Inventors: 张志强; 赵俊; 王东府
Original assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Current assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-06-02
Anticipated expiration: 2032-11-23

Abstract

The utility model discloses a high-softness rigid-flex circuit board which comprises a flexible circuit board, wherein protective layers are arranged at the upper end and the lower end of the flexible circuit board, rigid circuit boards are connected at the left end and the right end of the flexible circuit board, through holes are formed in the rear parts of the upper ends of the two rigid circuit boards, blind holes are formed in the front parts of the upper ends of the rigid circuit boards, mounting holes are formed in four corners of the upper ends of the rigid circuit boards, protective layers are coated on the surfaces of the rigid circuit boards, heat-conducting glue is arranged at the lower ends of the rigid circuit boards, and a heat dissipation part is arranged at the lower ends of the heat-conducting glue. According to the high-softness rigid-flex combined circuit board, the surface of the flexible circuit board can be protected by arranging the protective layer, so that the normal use of the flexible circuit board is ensured, the heat of the rigid circuit board can be rapidly led out by arranging the heat dissipation component, and the normal operation of the rigid circuit board is ensured.

Description

High-softness rigid-flexible combined circuit board

Technical Field

The utility model relates to the technical field of rigid-flex printed circuit boards, in particular to a high-softness rigid-flex printed circuit board.

Background

The flex-rigid board has the characteristics of being bendable and foldable, so that the flex-rigid board can be used for manufacturing a customized circuit, the indoor available space is utilized to the maximum extent, the space occupied by the whole system is reduced, the total cost of the flex-rigid board is relatively high, the flex-rigid board is provided with a rigid layer and a flexible layer, the flex-rigid board is a multilayer printed circuit board, a typical (four-layer) flex-rigid printed circuit board is provided with a polyimide core, copper foils are coated on the upper surface and the lower surface of the polyimide core, the external rigid layer is composed of single-sided FR4, and the single-sided FR4 is laminated on the two surfaces of the flexible core to form a multilayer PCB.

The prior art (publication number: CN 208971858U) discloses a high-softness rigid-flex circuit board, which comprises a rigid plate and a flexible plate, the flexible plate comprises a circuit strip and a fixing strip, one side of the fixing strip is connected with a hanging groove, one side of the circuit strip is connected with the hanging groove, one side of the circuit strip, which is far away from the hanging groove, is fixedly connected with the hanging groove, one side of the fixing strip is fixedly connected with the hanging groove, the rigid plate comprises a bottom plate, a circuit port is printed on the bottom plate, an insulating layer is sprayed on the circuit port, a top layer is sprayed on the insulating layer, slots corresponding to the circuit port are formed in the top of the bottom plate, limiting slots are formed in two sides of each slot, two ends of the fixing strip are connected with plugs, one side of the plug, which is far away from the circuit strip, is fixedly connected with a spring card, a conductive wire is penetrated in the circuit strip, and two ends of the conductive wire are connected with conductive spring plugs.

The above patent, while enhancing the strength of the flexible board while guaranteeing the softness of the flexible board, has the following drawbacks that the surface of the flexible circuit board lacks protection components, and the surface is easily scratched and damaged during use, thus affecting the use of the circuit board, increasing the use cost of the circuit board and requiring further improvement.

Disclosure of Invention

The utility model mainly aims to provide a high-softness rigid-flex circuit board which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a high softness just flexes and combines circuit board, includes flexible circuit board, flexible circuit board's upper end and lower extreme all are provided with the inoxidizing coating, flexible circuit board's left end and right-hand member all are connected with rigid circuit board, two the via hole has all been seted up at rigid circuit board's upper end rear portion, the blind hole has been seted up at rigid circuit board's upper end front portion, the mounting hole has been seted up in rigid circuit board's upper end four corners, rigid circuit board's surface coating has the protective layer, rigid circuit board's lower extreme is provided with heat conduction glue, heat dissipation part is provided with to heat conduction glue's lower extreme.

Preferably, the protective layer comprises two flexible heat conducting pads, the two flexible heat conducting pads are respectively arranged at the lower end and the upper end of the flexible circuit board, and the two ends, far away from each other, of the two flexible heat conducting pads are respectively provided with a metal woven net.

Preferably, the heat dissipation part comprises a heat dissipation plate, the heat dissipation plate is arranged at the lower end of the heat conduction glue, a heat dissipation plate is arranged at the lower end of the heat dissipation plate, a rectangular through groove is formed in the front end of the heat dissipation plate, and graphene heat radiation coatings are coated on the surfaces of the heat dissipation plate and the heat dissipation plate.

Preferably, the protective layer comprises an insulating waterproof coating layer, the insulating waterproof coating layer is arranged at the upper end of the rigid circuit board, and an electromagnetic shielding coating layer is arranged at the upper end of the insulating waterproof coating layer.

Preferably, the graphene thermal radiation coating has a thickness of 16-30 μm.

Preferably, the flexible circuit board is electrically connected with the rigid circuit board.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the high-softness rigid-flexible combined circuit board, the surface of the flexible circuit board can be protected by arranging the protective layer, when the circuit board is used, the metal woven mesh has good hardness and toughness, external objects can be prevented from scratching the surface of the flexible circuit board, the flexible circuit board is protected, the maintenance cost is reduced, meanwhile, the flexible heat conducting pad has elasticity and heat conductivity, heat generated by the flexible circuit board can be transferred to the metal woven mesh for heat dissipation, heat accumulation in the flexible circuit board is avoided, and normal use of the flexible circuit board is ensured;

2. according to the high-softness rigid-flexible combined circuit board, the heat of the rigid circuit board can be rapidly led out through the heat radiating component, when the circuit board is used, the heat of the rigid circuit board is transferred to the heat radiating plate and the heat radiating fins through the heat conducting glue, and the rectangular through grooves are formed, so that air can conveniently enter the heat radiating fins, the heat is rapidly radiated by the heat radiating fins, meanwhile, the graphene heat radiation coating has the high-emissivity characteristic, the heat radiating capacity of the heat radiating plate and the heat radiating fins can be improved, the effect of rapid cooling is achieved, and the normal operation of the rigid circuit board is ensured.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a high-softness rigid-flex circuit board according to the present utility model;

fig. 2 is a schematic diagram of the overall structure of a heat dissipating component of a high-softness rigid-flex circuit board according to the present utility model;

FIG. 3 is a schematic diagram of the overall structure of a protective layer of a high-softness rigid-flex circuit board according to the present utility model;

fig. 4 is a schematic diagram of the overall structure of a protective layer of a high-softness rigid-flex circuit board according to the present utility model.

In the figure: 1. a rigid circuit board; 2. a protective layer; 3. a mounting hole; 4. a via hole; 5. a blind hole; 6. a protective layer; 7. a flexible wiring board; 8. a heat-conducting adhesive; 9. a heat radiating member; 91. a heat dissipation plate; 92. a graphene thermal radiation coating; 93. a heat sink; 94. rectangular through grooves; 61. a flexible thermal pad; 62. a metal woven mesh; 21. an insulating waterproof coating; 22. an electromagnetic shielding coating.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a high-softness rigid-flex circuit board comprises a flexible circuit board 7, wherein protective layers 6 are respectively arranged at the upper end and the lower end of the flexible circuit board 7, the left end and the right end of the flexible circuit board 7 are respectively connected with a rigid circuit board 1, through holes 4 are respectively formed in the rear parts of the upper ends of the two rigid circuit boards 1, blind holes 5 are formed in the front parts of the upper ends of the rigid circuit boards 1, mounting holes 3 are formed in four corners of the upper ends of the rigid circuit boards 1, a protective layer 2 is coated on the surface of the rigid circuit boards 1, heat-conducting glue 8 is arranged at the lower end of the rigid circuit boards 1, and heat-radiating components 9 are arranged at the lower ends of the heat-conducting glue 8.

The protective layer 6 comprises two flexible heat conducting pads 61, the two flexible heat conducting pads 61 are arranged at the lower end and the upper end of the flexible circuit board 7 respectively, metal woven meshes 62 are arranged at the ends, away from each other, of the two flexible heat conducting pads 61, and the metal woven meshes 62 are formed by weaving copper wires.

The radiating component 9 comprises a radiating plate 91, the radiating plate 91 is arranged at the lower end of the heat conducting glue 8, radiating fins 93 are arranged at the lower end of the radiating plate 91, as a specific implementation mode, the radiating fins 93 are provided with a plurality of rectangular through grooves 94, the surfaces of the radiating plate 91 and the radiating fins 93 are coated with graphene heat radiation coatings 92, and the radiating component 9 is used for rapidly guiding out heat of the rigid circuit board 1.

The protective layer 2 comprises an insulating waterproof coating 21, the insulating waterproof coating 21 is arranged at the upper end of the rigid circuit board 1, an electromagnetic shielding coating 22 is arranged at the upper end of the insulating waterproof coating 21, the insulating waterproof coating 21 is used for improving the waterproof property of the rigid circuit board 1, and the electromagnetic shielding coating 22 is used for improving the electromagnetic wave resistance of the rigid circuit board 1.

The graphene heat radiation coating 92 has a thickness of 16 μm to 30 μm, and the flexible wiring board 7 is electrically connected with the rigid wiring board 1.

It should be noted that, when the high-softness rigid-flex circuit board is used, the rigid circuit board 1 is installed at a designated position through the installation hole 3, the metal woven mesh 62 has good hardness and toughness, the external object can be prevented from scratching the surface of the flexible circuit board 7, the flexible circuit board 7 is protected, meanwhile, the flexible heat conducting pad 61 has elasticity and heat conductivity, the heat generated by the flexible circuit board 7 can be transferred to the metal woven mesh 62 for heat dissipation, when the rigid circuit board 1 generates heat, the heat conducting glue 8 transfers the heat of the rigid circuit board 1 to the heat dissipation plate 91 and the heat dissipation plate 93 for heat dissipation, the rectangular through grooves 94 are formed so that the air can conveniently enter the heat dissipation plate 93, the heat dissipation plate 93 can quickly dissipate the heat, and meanwhile, the graphene heat radiation coating 92 has the characteristic of high emissivity, and the heat dissipation capability of the heat dissipation plate 91 and the heat dissipation plate 93 can be improved.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high softness just flexes combination circuit board, includes flexible circuit board (7), its characterized in that: the flexible circuit board is characterized in that the upper end and the lower end of the flexible circuit board (7) are both provided with protective layers (6), the left end and the right end of the flexible circuit board (7) are both connected with the rigid circuit board (1), two through holes (4) are formed in the rear portion of the upper end of the rigid circuit board (1), blind holes (5) are formed in the front portion of the upper end of the rigid circuit board (1), mounting holes (3) are formed in four corners of the upper end of the rigid circuit board (1), a protective layer (2) is coated on the surface of the rigid circuit board (1), heat conducting glue (8) is arranged at the lower end of the rigid circuit board (1), and heat radiating components (9) are arranged at the lower end of the heat conducting glue (8).

2. The high-softness rigid-flex circuit board according to claim 1, wherein: the protective layer (6) comprises two flexible heat conducting pads (61), the two flexible heat conducting pads (61) are arranged at the lower end and the upper end of the flexible circuit board (7) respectively, and metal woven meshes (62) are arranged at the ends, far away from each other, of the two flexible heat conducting pads (61).

3. The high-softness rigid-flex circuit board according to claim 2, wherein: the heat dissipation component (9) comprises a heat dissipation plate (91), the heat dissipation plate (91) is arranged at the lower end of the heat conduction glue (8), the lower end of the heat dissipation plate (91) is provided with a heat dissipation plate (93), the front end of the heat dissipation plate (93) is provided with a rectangular through groove (94), and the surfaces of the heat dissipation plate (91) and the heat dissipation plate (93) are both coated with a graphene heat radiation coating (92).

4. A high softness flex-rigid wiring board according to claim 3, characterized in that: the protective layer (2) comprises an insulating waterproof coating (21), the insulating waterproof coating (21) is arranged at the upper end of the rigid circuit board (1), and an electromagnetic shielding coating (22) is arranged at the upper end of the insulating waterproof coating (21).

5. The high-softness rigid-flex circuit board according to claim 4, wherein: the graphene thermal radiation coating (92) has a thickness of 16-30 μm.

6. The high-softness rigid-flex circuit board according to claim 5, wherein: the flexible circuit board (7) is electrically connected with the rigid circuit board (1).