CN216391500U - Double-layer PCB with high heat dissipation performance - Google Patents

Abstract

The utility model discloses a double-layer PCB board with high heat dissipation performance, which comprises: the electronic component mounting plate comprises a plate body, wherein a plurality of through holes capable of mounting electronic components or dissipating heat of the plate body are formed in the plate body; the heat dissipation mechanism is arranged at the position, where the plate body is positioned, of the through hole, so that heat in the plate body can exchange heat with air along with the heat dissipation mechanism.

Description

Double-layer PCB with high heat dissipation performance

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a double-layer PCB with high heat dissipation performance.

Background

The PCB printed board, also called printed circuit board, includes single layer printed board, double layer printed board and multilayer printed board, the double layer printed board is the double layer printed board, which is composed of connecting wire on the double layer insulation base board and the welding pad for assembling and welding electronic element, it has the function of conducting each layer circuit and insulating each other.

For electronic equipment, certain heat can be generated during working, so that the internal temperature of the equipment rises rapidly, if the heat is not dissipated timely, the equipment can be heated continuously, devices can lose efficacy due to overheating, the reliability of the electronic equipment can be reduced, the PCB board which is widely applied at present through heat dissipation of the PCB board body is a copper-clad/epoxy glass cloth substrate or a phenolic resin glass cloth substrate, and a small amount of used paper-based copper-clad boards are also provided. These substrates have excellent electrical properties and processability, but have poor heat dissipation properties, and heat dissipation from the surface of the element into the ambient air is hardly expected as a heat dissipation path for high-heat-generating elements because heat is conducted by the resin of the PCB itself. However, as electronic products have come to the age of miniaturization of parts, high-density mounting, and high-heat generation assembly, it is not enough to rely on the surface of a very small-surface-area component to dissipate heat. Meanwhile, because of the use of a large number of surface mount components such as QFPs and BGAs, the heat generated by the components is largely transferred to the PCB, so the best method for solving the problem of heat dissipation is to improve the self heat dissipation capability of the PCB directly contacting with the heating component, and to conduct or dissipate the heat through the PCB.

The existing mode of radiating through the PCB board itself mostly is that the copper sheet position of direct at the PCB board extends to the outside of PCB board, and the metal plane and the air heat exchange that the rethread outside extended, however, the area of contact of metal plane and outside air is limited, and the radiating effect is limited, and secondly, the copper sheet extends and receives the restriction of installing electronic components on the PCB board, need use the heat dissipation copper sheet of independent size to independent PCB board, and application scope is narrower. To this end, we propose a double-layer PCB having high heat dissipation performance.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a dual-layer PCB with high heat dissipation capability to solve the above-mentioned problems of the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: a double-layer PCB board with high heat dissipation performance, comprising:

the electronic component mounting plate comprises a plate body, wherein a plurality of through holes capable of mounting electronic components or dissipating heat of the plate body are formed in the plate body;

and the heat dissipation mechanism is arranged at the position of the plate body at the through hole, so that heat in the plate body can exchange heat with air along with the heat dissipation mechanism.

Preferably, the heat dissipation mechanism comprises a connecting cylinder which is arranged in the through hole and is in contact with the copper foil in the through hole, the top of the connecting cylinder is provided with a heat dissipation plate which can dissipate heat in the connecting cylinder, and the connecting cylinder is hollow.

Preferably, the bottom of connecting cylinder is equipped with the kicking block, through spring coupling between kicking block and the connecting cylinder, through the ejecting of kicking block for the bottom surface of connecting cylinder and plate body is relative locking.

Preferably, the closest distance between the heat dissipation plate and the plate body is greater than the maximum distance between the heat dissipation plate and the plate body, so that the heat dissipation plate and the electronic component are in a separated state.

Preferably, the top of the heat dissipation plate is further provided with an auxiliary plate capable of sliding on the surface of the heat dissipation plate, one side of the auxiliary plate is provided with a first limiting part, the outer side of the heat dissipation plate is provided with a second limiting part, and after the auxiliary plate is pulled away from the heat dissipation plate, the first limiting part limits the movement of the second limiting part, so that the auxiliary plate is not separated from the heat dissipation plate.

Preferably, a plurality of heat dissipation columns are arranged at the top of the auxiliary plate, and the cross sections of the heat dissipation columns are polygonal.

The utility model has at least the following beneficial effects:

the heat of the copper sheets in the plate body is conducted into the air from the plate body through the heat dissipation mechanism, the contact area between the air and the heat dissipation mechanism is large, compared with the prior art, the contact area between a metal plane and the outside air is limited, the heat dissipation effect is limited, secondly, the copper sheets extend to be limited by electronic components mounted on a PCB, the heat dissipation copper sheets with independent sizes are required to be used for the independent PCB, the application range is narrow, the heat dissipation mechanism is large in heat dissipation area, the contact area between the heat dissipation mechanism and the air is increased, the heat dissipation effect is good, the telescopic heat dissipation mechanism is suitable for heat dissipation of various plate bodies, and the application range is wide.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial cross-sectional view of the present invention;

fig. 3 is a partial cross-sectional view of the heat dissipation mechanism of the present invention.

In the figure: 1-a plate body; 2-a through hole; 3-a heat dissipation mechanism; 31-a connecting cylinder; 32-a heat sink; 33-a top block; 34-a spring; 35-an auxiliary plate; 36-a first limiting part; 37-a second limiting part; 38-heat sink column.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a double-layer PCB board with high heat dissipation performance, comprising:

the structure comprises a plate body 1, wherein a plurality of through holes 2 capable of installing electronic components or dissipating heat of the plate body 1 are formed in the plate body 1, pins of electronic components can be inserted into the through holes 2 and then welded by soldering, and heat in the plate body 1 can be dissipated;

the heat dissipation mechanism 3 is arranged at the position, located at the through hole 2, of the plate body 1, so that heat in the plate body 1 can be exchanged with air along with the heat dissipation mechanism 3, the heat dissipation mechanism 3 conducts heat between the heat in the plate body 1 and the air, and the heat dissipation of the plate body 1 is more convenient due to heat exchange between the outer side of the plate body 1 and the air.

The heat dissipation mechanism 3 comprises a connecting cylinder 31 which is arranged in the through hole 2 and is in contact with copper foil in the through hole 2, the connecting cylinder 31 is a copper cylinder, a heat dissipation plate 32 which can dissipate heat in the connecting cylinder 31 is arranged at the top of the connecting cylinder 31, the heat dissipation plate 32 is fixedly connected with the connecting cylinder 31, the heat dissipation plate 32 is a copper plate, the connecting cylinder 31 is hollow, when a copper sheet in the plate body 1 generates heat, the connecting cylinder 31 in contact with the copper sheet transfers the heat to the surface of the heat dissipation plate 32, and the heat dissipation plate 32 exchanges heat with air to dissipate the heat in the plate body 1 to the air.

The bottom of connecting cylinder 31 is equipped with kicking block 33, the jack has been seted up to the side of connecting cylinder 31, kicking block 33 and jack sliding connection, be connected through spring 34 between kicking block 33 and the connecting cylinder 31, the both ends of spring 34 respectively with kicking block 33 and connecting cylinder 31 fixed connection, insert the back at the connecting cylinder 31 from the plate body 1, spring 34 of kicking block 33 compresses earlier, back spring 34 is ejecting with kicking block 33, kicking block 33 is used in the bottom surface of plate body 1, connect connecting cylinder 31 on the plate body 1, ejection through kicking block 33, make connecting cylinder 31 and the relative locking of bottom surface of plate body 1, make things convenient for plate body 1 and heat dissipation mechanism 3 to be connected, heat dissipation mechanism 3 can rotate wantonly in through-hole 2 moreover, and then make things convenient for heat dissipation mechanism 3 not to hinder the maintenance and the installation of all the other electronic components.

The nearest distance of heating panel 32 and plate body 1 is greater than the maximum distance of installing electronic components on plate body 1 for heating panel 32 and electronic components are in the discrete state, and heating panel 32 and plate body 1 are in the discrete state, and then heating panel 32 is in unsettled state, thereby make things convenient for the both sides heat dissipation of heating panel 32, and the heat dissipation of heating panel 32 is comparatively comprehensive, and the normal use that all the other electronic components can not influenced in the rotation of heating panel 32 moreover.

The auxiliary plate 35 capable of sliding on the surface of the heat dissipation plate 32 is further arranged at the top of the heat dissipation plate 32, the auxiliary plate 35 is connected with the heat dissipation plate 32 in a sliding mode, a first limiting portion 36 is arranged on one side of the auxiliary plate 35 and integrally formed with the auxiliary plate 35, a second limiting portion 37 is arranged on the outer side of the heat dissipation plate 32 and integrally formed with the heat dissipation plate 32, and after the auxiliary plate 35 is pulled away from the heat dissipation plate 32, the first limiting portion 36 limits movement of the second limiting portion 37, so that the auxiliary plate 35 is not separated from the heat dissipation plate 32, when the plate body 1 with small electronic parts is used, the auxiliary plate 35 can be pulled away from the heat dissipation plate 32, the contact area between the heat dissipation mechanism 3 and air is further increased, the heat dissipation effect of the heat dissipation mechanism 3 is improved, and heat dissipation of the heat dissipation mechanism 3 is facilitated.

The top of the auxiliary plate 35 is provided with a plurality of heat dissipation columns 38, the cross sections of the heat dissipation columns 38 are polygonal, the contact area between the heat dissipation mechanism 3 and the air is further increased by the plurality of heat dissipation columns 38, and the contact area between the polygonal heat dissipation columns 38 and the air is further increased, so that the heat dissipation of the heat dissipation mechanism 3 is more convenient.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A double-layer PCB board with high heat dissipation performance, comprising:

the heat dissipation plate comprises a plate body (1), wherein a plurality of through holes (2) capable of mounting electronic components or dissipating heat of the plate body (1) are formed in the plate body (1);

the method is characterized in that:

the heat dissipation mechanism (3) is arranged at the position of the plate body (1) at the through hole (2) and can ensure that the heat in the plate body (1) exchanges heat with the air along with the heat dissipation mechanism (3),

the heat dissipation mechanism (3) comprises a connecting cylinder (31) which is arranged in the through hole (2) and is contacted with the copper foil in the through hole (2), the top of the connecting cylinder (31) is provided with a heat dissipation plate (32) which can dissipate the heat in the connecting cylinder (31), the connecting cylinder (31) is hollow,

the bottom of connecting cylinder (31) is equipped with kicking block (33), be connected through spring (34) between kicking block (33) and connecting cylinder (31), through the ejecting of kicking block (33), make the bottom surface of connecting cylinder (31) and plate body (1) relative locking.

2. The double-layer PCB board with high heat dissipation performance of claim 1, wherein: the nearest distance between the heat dissipation plate (32) and the plate body (1) is larger than the maximum distance for mounting the electronic components on the plate body (1), so that the heat dissipation plate (32) and the electronic components are in a separated state.

3. The double-layer PCB having high heat dissipation performance as recited in claim 2, wherein: the top of the heat dissipation plate (32) is further provided with an auxiliary plate (35) capable of sliding on the surface of the heat dissipation plate (32), one side of the auxiliary plate (35) is provided with a first limiting part (36), the outer side of the heat dissipation plate (32) is provided with a second limiting part (37), and after the auxiliary plate (35) is pulled away from the heat dissipation plate (32), the first limiting part (36) limits the movement of the second limiting part (37), so that the auxiliary plate (35) is not separated from the heat dissipation plate (32).

4. The double-layer PCB board with high heat dissipation performance of claim 3, wherein: the top of the auxiliary plate (35) is provided with a plurality of heat dissipation columns (38), and the cross sections of the heat dissipation columns (38) are polygonal.

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