CN213662053U - Circuit board easy to radiate heat during double-sided cloth - Google Patents
Circuit board easy to radiate heat during double-sided cloth Download PDFInfo
- Publication number
- CN213662053U CN213662053U CN202022826062.1U CN202022826062U CN213662053U CN 213662053 U CN213662053 U CN 213662053U CN 202022826062 U CN202022826062 U CN 202022826062U CN 213662053 U CN213662053 U CN 213662053U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- core
- heat dissipation
- board
- board main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses an easy radiating circuit board when two-sided cloth spare, including the circuit board main part, still including surrounding on and hugging closely the heating panel that circuit board main part side set up. The utility model discloses a set up the heating panel to the side of the circuit board main part, and this heating panel centers on and hugs closely circuit board main part side can effectively reduce module operating temperature to the life of extension module improves power density and reliability.
Description
Technical Field
The utility model relates to an electronic equipment field, concretely relates to easy radiating circuit board when two-sided cloth spare.
Background
A conventional circuit board, such as an aluminum substrate, is a single-sided board, and generally, the aluminum substrate is composed of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED (light emitting diode) lighting products, are used on circuit boards with through holes, or on circuit boards with lower device densities, and are not used substantially on HDI (high density interconnect) circuit boards.
With the development of electronic technology, the volume of electronic equipment is smaller and smaller, the density and difficulty of circuit wiring are higher and higher, and the integration level of a circuit board is higher and higher. In order to reduce the volume of the module and integrate more functions, a double-sided cloth piece is adopted. Taking the 5G (fifth generation mobile communications technology) module SIM8300-M2 as an example, the module uses a double-sided cloth, which has the advantage that the circuit board can accommodate more devices, so that the module integrates more functions, but also brings problems. The biggest problems are that: because the double-sided cloth piece is adopted, compared with a module of the single-sided cloth piece, one bottom surface capable of conducting heat is omitted, and the FR4 glass substrate is adopted as the board core, the heat dissipation performance of the glass substrate is poor, and the heat can be dissipated only through the surface and the interface of the device, so that the operating temperature of the circuit board cannot be effectively reduced, and the service life, the power density and the reliability of the circuit board are influenced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is that the unable radiating problem effectively of circuit board when overcoming among the prior art two-sided cloth spare provides a circuit board that easily dispels the heat when two-sided cloth spare.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
the utility model provides an easy radiating circuit board when two-sided cloth spare, including the circuit board main part, this circuit board still includes around and hugs closely the heating panel that circuit board main part side set up.
Preferably, the core of the circuit board main body is a metal core.
Preferably, the core is connected to the heat dissipation plate.
Preferably, the metal plate core is a composite metal plate core.
Preferably, the composite metal plate core is made of aluminum, silver and gold.
Preferably, the circuit board main body further includes:
the upper insulating layer is arranged on the top surface of the board core;
an upper circuit layer disposed on a top surface of the upper insulating layer;
the lower insulating layer is arranged on the bottom surface of the board core;
and the lower circuit layer is arranged on the bottom surface of the lower insulating layer.
Preferably, the height of the heat dissipation plate is greater than or equal to the thickness of the circuit board main body.
Preferably, the heat dissipation plate is a metal heat dissipation plate.
Preferably, the metal heat dissipation plate is a composite metal heat dissipation plate.
Preferably, the composite metal heat dissipation plate is made of aluminum, silver, and gold.
The utility model discloses an actively advance the effect and lie in:
the utility model provides an easy radiating circuit board when two-sided cloth spare centers on and hugs closely through the setting the heating panel of circuit board main part side increases the heat radiating area of circuit board, can promote the heat-sinking capability of circuit board, makes this circuit board can effectively reduce module operating temperature to the life of extension module improves power density and reliability.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board easy to dissipate heat when a double-sided fabric is used in a preferred embodiment of the present invention.
Detailed Description
The present invention is further illustrated by way of the following examples, which are not intended to limit the scope of the invention.
Examples
As shown in fig. 1, the present embodiment discloses a circuit board easy to dissipate heat when a double-sided cloth is used, which includes a circuit board main body 1, and the circuit board further includes a heat dissipation plate 2 surrounding the circuit board main body 1 and closely attached to the side surface of the circuit board main body 1. Through setting up this heating panel 2, increased the heat radiating area of circuit board, promoted the heat-sinking capability of circuit board, made this circuit board can effectively reduce module operating temperature to the life of extension module improves power density and reliability.
In the embodiment shown in fig. 1, the circuit board main body 1 is in the form of a double-sided cloth, and specifically, includes a board core 11, an upper insulating layer 12 disposed on the top surface of the board core 11; an upper circuit layer 13 disposed on a top surface of the upper insulating layer 12; a lower insulating layer 14 disposed on the bottom surface of the board core 11; and a lower circuit layer 15 disposed on the bottom surface of the lower insulating layer 14.
In a preferred embodiment, the core 11 of the circuit board body 1 is a metal core, and the heat sink 2 is a metal heat sink. Since the heat conduction speed of metal is much higher than that of nonmetal, when the core 11 and the heat dissipation plate 2 are made of metal, the heat dissipation capability of the circuit board can be further improved.
In a preferred embodiment, the core 11 is connected to the heat dissipation plate 2 to form an integral body, so as to accelerate the heat dissipation of the circuit board.
In a preferred embodiment, the metal plate core 11 is a composite metal plate core, and further preferably, the composite metal plate core is made of aluminum, silver and gold. The metal heat sink 2 is a composite metal heat sink, and further preferably, the composite metal heat sink is made of aluminum, silver, and gold.
In the present embodiment, the composite metal plate core has high mechanical strength and toughness, which is not only good in heat dissipation but also can function as a shield plate. For example, when the circuit board is used in a 5G module, the whole electromagnetic compatibility problem of the circuit board becomes more and more serious due to the increase of the frequency of the 5G module, and the composite metal core board can play a role of shielding electromagnetic waves, so that the electromagnetic compatibility problems of the circuit board, such as EMC (electromagnetic induction coil), EMI (electromagnetic interference), and the like, are reduced, and the running stability of the circuit board is further improved. In addition, after the composite metal plate core is adopted, because the thermal expansion coefficient of metal is lower than that of a glass substrate, the warping degree of the circuit board is reduced, the flatness is improved, and the quality of the circuit board and the reliability in use are better guaranteed. Therefore, the circuit board not only improves the heat dissipation performance of the circuit board, but also improves the electromagnetic compatibility and the quality of the circuit board, and the overall performance of the circuit board is improved.
In a preferred embodiment, the height h1 of the heat dissipation plate 2 is greater than or equal to the thickness h2 of the circuit board main body 1, so as to achieve the best heat dissipation effect.
In addition, in this embodiment, an insulating cover (not shown) may be added to protect the circuit board. The insulating cover covers the circuit board, so that the circuit board is completely wrapped by the insulating cover, and the circuit board is insulated. When the circuit board is used with the insulating cover, the size and the arrangement position of the heat sink are considered. When the heat dissipation plate is arranged on the side surface of the circuit board main body, the maximum length of the size of the finally formed circuit board is smaller than the length of the insulation cover, the maximum width of the size of the circuit board is smaller than the width of the insulation cover, and the maximum height of the size of the circuit board is smaller than the height of the insulation cover.
The utility model discloses an easy radiating circuit board when two-sided cloth spare sets up the heating panel through the circuit board main part side at this circuit board, and this heating panel centers on and hugs closely circuit board main part side, this circuit board can effectively reduce module operating temperature to the life of extension module improves power density and reliability. In addition, the board core and the heat dissipation board of the circuit board main body adopt composite metal board cores, so that the heat dissipation effect of the circuit board can be further improved, and the operation temperature of the module can be effectively reduced, thereby prolonging the service life of the module and improving the power density and the reliability.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (10)
1. The circuit board easy to dissipate heat during double-sided cloth piece comprises a circuit board main body and is characterized by further comprising a heat dissipation plate which surrounds and clings to the side face of the circuit board main body.
2. The circuit board of claim 1, wherein the board core of the circuit board body is a metal board core.
3. The circuit board of claim 2, wherein the core is connected to the heat dissipation plate.
4. The circuit board of claim 2, wherein the metal plate core is a composite metal plate core.
5. The circuit board of claim 4, wherein the composite metal core is made of aluminum, silver, and gold.
6. The circuit board of claim 2, wherein the circuit board body further comprises:
the upper insulating layer is arranged on the top surface of the board core;
an upper circuit layer disposed on a top surface of the upper insulating layer;
the lower insulating layer is arranged on the bottom surface of the board core;
and the lower circuit layer is arranged on the bottom surface of the lower insulating layer.
7. The circuit board according to claim 1, wherein the height of the heat dissipation plate is greater than or equal to the thickness of the circuit board main body.
8. The circuit board of claim 1, wherein the heat sink is a metal heat sink.
9. The circuit board of claim 8, wherein the metal heat spreader plate is a composite metal heat spreader plate.
10. The circuit board of claim 9, wherein the composite metal heat dissipation plate is made of aluminum, silver, and gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022826062.1U CN213662053U (en) | 2020-11-30 | 2020-11-30 | Circuit board easy to radiate heat during double-sided cloth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022826062.1U CN213662053U (en) | 2020-11-30 | 2020-11-30 | Circuit board easy to radiate heat during double-sided cloth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213662053U true CN213662053U (en) | 2021-07-09 |
Family
ID=76689410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022826062.1U Active CN213662053U (en) | 2020-11-30 | 2020-11-30 | Circuit board easy to radiate heat during double-sided cloth |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213662053U (en) |
-
2020
- 2020-11-30 CN CN202022826062.1U patent/CN213662053U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102253473B1 (en) | Circuit board | |
| US20090207578A1 (en) | Apparatus for reducing electromagnetic interference and spreading heat | |
| CN108617082B (en) | Heat dissipation assembly and electronic device | |
| CN110996491B (en) | Circuit board device and electronic equipment | |
| CN207219146U (en) | Heat abstractor for heat dissipation for circuit board | |
| JP2008218618A (en) | Printed circuit board | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| KR20180016799A (en) | Printed circuit board assembly | |
| CN213662053U (en) | Circuit board easy to radiate heat during double-sided cloth | |
| CN202889779U (en) | Single side printed wiring board with superelevation heat-conducting property | |
| CN209767915U (en) | PCB board with rapid heat dissipation | |
| CN216600189U (en) | Multilayer circuit board structure with heat dissipation copper base plate | |
| JP2001272661A (en) | Method and device for stabilizing temperature for liquid crystal display | |
| CN113225913B (en) | PCB (printed circuit board) arrangement method for 5G wireless communication base station | |
| CN211352604U (en) | Heat dissipation optimization structure of circuit board | |
| CN107949156A (en) | A kind of double-sided wiring board | |
| CN207652764U (en) | A kind of double-sided wiring board | |
| CN215499721U (en) | Circuit board with good heat dissipation performance | |
| CN205051965U (en) | Compound heat conduction circuit board | |
| CN213603048U (en) | High-density multilayer ceramic circuit board | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN213340360U (en) | Heat radiation structure of power semiconductor device | |
| CN210670733U (en) | Microwave high-frequency printed board | |
| CN221930542U (en) | Electronic equipment | |
| CN216146505U (en) | Circuit structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |