CN210670733U - Microwave high-frequency printed board - Google Patents
Microwave high-frequency printed board Download PDFInfo
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- CN210670733U CN210670733U CN201921666708.5U CN201921666708U CN210670733U CN 210670733 U CN210670733 U CN 210670733U CN 201921666708 U CN201921666708 U CN 201921666708U CN 210670733 U CN210670733 U CN 210670733U
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- printing
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Abstract
The utility model discloses a microwave high frequency printed board, including the printing board body, printing board body from the top down includes circuit layer, dielectric layer, metal substrate, tin layer and insulating layer in proper order, still includes the louvre, and the louvre runs through the printing board body, and circuit layer upper surface is provided with hinders the solder printing ink layer, be provided with one deck heat-conducting glue layer on the pore wall of louvre, there is one deck metal foil layer at the inside embedding of heat-conducting glue layer. The heat-conducting glue can form a good insulating effect, can conduct heat, is beneficial to rapidly guiding out the heat in the printed board, has certain toughness, can still seal the side walls of the heat dissipation holes when the printed board deforms, and prevents external fine metal particles from entering the printed board to contact with a circuit. In addition, the heat-conducting glue can also fix the metal foil layer, and the metal foil layer can shield external signals, so that the interference to the internal signals is reduced.
Description
Technical Field
The utility model relates to a technical field is made to the printing board, concretely relates to microwave high frequency printing board.
Background
The microwave circuit is a circuit with the wavelength of 10m-1cm in the working frequency band, and also has millimeter wave (30-300GHz) and sub-millimeter wave (150GHz-3000GHz), and has unique characteristics compared with a common low-frequency circuit and a digital circuit in the aspects of the structure, the circuit form and the like of a PCB substrate because the working frequency of the microwave circuit is higher. With the rapid development of large-scale integrated circuit technology, the working virtual degree of the current chip exceeds 1GHz, and the structures of some microwave circuit PCBs have important influence on the transmission of the whole signals.
The existing microwave high-frequency printed board is generally added with a heat dissipation layer for heat dissipation, however, the cost of the whole board is greatly increased due to the fact that the heat dissipation layer is added, the heat dissipation holes are formed in the other printed boards for heat dissipation, when the microwave high-frequency printed board works in the environment with higher temperature, the printed boards can be bent and deformed, cracks between layers are caused, and fine metal particles can enter the printed board from the cracks at the positions of the heat dissipation holes to cause a short circuit phenomenon. And external signals can also interfere with signals in the board through the heat dissipation holes.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to solve above-mentioned prior art not enough, provide a microwave high frequency printing board.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a microwave high frequency printed board, includes the printed board body, the printed board body from the top down includes circuit layer, dielectric layer, metal substrate, tin layer and insulating layer in proper order, still includes the louvre, and the louvre runs through the printed board body, and circuit layer upper surface is provided with hinders and welds the printing ink layer, be provided with one deck heat-conducting glue layer on the pore wall of louvre, there is one deck metal foil layer at the inside embedding of heat-conducting glue layer.
Furthermore, a groove is formed in the edge of the printed board body, an insulating coating is arranged on the side wall of the groove, and a tin spraying layer is arranged in the groove to form a metallization groove.
Furthermore, the insulating layer is an insulating glass glue layer.
Furthermore, the printed board body is also provided with a positioning hole, and a metal foil layer is also arranged on the hole wall of the positioning hole.
According to the above technical scheme, the utility model has the advantages of it is following: the heat-conducting glue can form a good insulating effect, can conduct heat, is beneficial to rapidly guiding out the heat in the printed board, has certain toughness, can still seal the side walls of the heat dissipation holes when the printed board deforms, and prevents external fine metal particles from entering the printed board to contact with a circuit. In addition, the heat-conducting glue can also fix the metal foil layer, and the metal foil layer can shield external signals, so that the interference to the internal signals is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention
Detailed Description
The following description will specifically explain embodiments of the present invention with reference to the accompanying drawings.
As shown in fig. 1, the microwave high-frequency printed board of the present invention includes a printed board body, which includes a circuit layer 1, a dielectric layer 2, a metal substrate 3, a tin layer 4 and an insulating layer 5 from top to bottom. And a solder resist ink layer is arranged on the upper surface of the circuit layer. The insulating layer can adopt an insulating glass glue layer.
Furthermore, the utility model discloses still set up a plurality of louvres 8, louvre 8 runs through the printing board body, be provided with one deck heat-conducting glue film 9 on the pore wall of louvre, there is one deck metal foil layer 10 in the inside embedding of heat-conducting glue film 9. The copper foil is preferably adopted in the metal foil layer, the copper foil not only has good shielding effect but also has good heat conduction effect, and the part of the copper foil obstructs the heat dissipation of the heat conduction glue. The heat-conducting glue can form good insulation effect, can conduct heat, is beneficial to quickly guiding out heat in the plate, can fix the metal foil layer, can shield external signals and reduce interference to the internal signals,
a groove 6 is further formed in the edge of the printed board body, an insulating coating 7 is arranged on the side wall of the groove, and a tin spraying layer is arranged in the groove to form a metallization groove. When the printed board works in a high-temperature environment, the printed board can be bent and deformed, the internal circuit of the printed board can be deviated, and the insulating coating is arranged to prevent the tin-spraying layer from contacting with the generated circuit to form a short circuit.
The printed board body is also provided with a positioning hole, the positioning hole is arranged on a diagonal line of the printed board body, and a metal foil layer is also arranged on the hole wall of the positioning hole.
Claims (4)
1. The utility model provides a microwave high frequency printing board, includes the printing board body, the printing board body from the top down includes line layer, dielectric layer, metal substrate, tin layer and insulating layer in proper order, still includes the louvre, and the louvre runs through the printing board body, and the upper surface is provided with on the line layer hinders and welds printing ink layer, its characterized in that: the hole wall of the heat dissipation hole is provided with a heat conduction adhesive layer, and a metal foil layer is embedded in the heat conduction adhesive layer.
2. The microwave high-frequency printed board according to claim 1, characterized in that: the edge of the printed board body is also provided with a groove, the side wall of the groove is provided with an insulating coating, and a tin spraying layer is arranged in the groove to form a metallization groove.
3. The microwave high-frequency printed board according to claim 1, characterized in that: the insulating layer is an insulating glass glue layer.
4. The microwave high-frequency printed board according to claim 1, characterized in that: the printed board body is further provided with a positioning hole, and a metal foil layer is also arranged on the hole wall of the positioning hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921666708.5U CN210670733U (en) | 2019-09-30 | 2019-09-30 | Microwave high-frequency printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921666708.5U CN210670733U (en) | 2019-09-30 | 2019-09-30 | Microwave high-frequency printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210670733U true CN210670733U (en) | 2020-06-02 |
Family
ID=70814685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921666708.5U Active CN210670733U (en) | 2019-09-30 | 2019-09-30 | Microwave high-frequency printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210670733U (en) |
-
2019
- 2019-09-30 CN CN201921666708.5U patent/CN210670733U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |