CN210075680U - High-efficiency aluminum-based heat-conducting copper-clad plate - Google Patents
High-efficiency aluminum-based heat-conducting copper-clad plate Download PDFInfo
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- CN210075680U CN210075680U CN201822274030.8U CN201822274030U CN210075680U CN 210075680 U CN210075680 U CN 210075680U CN 201822274030 U CN201822274030 U CN 201822274030U CN 210075680 U CN210075680 U CN 210075680U
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- Prior art keywords
- heat
- conducting
- plate
- copper
- aluminum
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 70
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 239000000084 colloidal system Substances 0.000 claims abstract description 6
- 238000000926 separation method Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A high-efficiency aluminum-based heat-conducting copper-clad plate comprises a main conducting layer, a secondary conducting layer, a main conducting layer and a tail end conducting layer. The main conductive layer comprises a first conductive copper plate, a second conductive copper plate and a bonding insulating film, and the first conductive copper plate and the second conductive copper plate are respectively bonded on two opposite side surfaces of the bonding insulating film. The main heat conducting layer comprises an upper insulating heat absorbing sheet, a lower insulating heat absorbing sheet and a first heat conducting aluminum plate, the upper insulating heat absorbing sheet and the lower insulating heat absorbing sheet are respectively installed on two sides of the first heat conducting aluminum plate, a plurality of auxiliary heat conducting holes are formed in the first heat conducting aluminum plate, and semi-solidified heat absorbing colloid is filled in each auxiliary heat conducting hole. The secondary conductive layer is arranged on the lower insulating heat absorption sheet. The tail end conducting layer is arranged on the secondary conducting layer, and the heat guiding layer is arranged between the tail end conducting layer and the secondary conducting layer, so that the structure of the copper-clad plate is improved, the heat absorption part on the copper-clad plate is increased, the heat dissipation capacity of the copper-clad plate is improved, the heat dissipation performance of the copper-clad plate is improved, and the product manufacturing cost is further reduced.
Description
Technical Field
The utility model relates to a copper-clad plate especially relates to a high-efficient aluminium base heat conduction copper-clad plate.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED lighting products. The LED lamp has a front surface and a back surface, wherein the white surface is welded with an LED pin, and the other surface is in an aluminum natural color and is generally coated with heat conduction slurry and then contacted with a heat conduction part. There are also ceramic substrates and the like. The copper-clad plate is a basic material in the electronic industry, is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), and is widely applied to electronic products such as televisions, radios, computers, mobile communication and the like.
The copper-clad plate is one of raw materials for manufacturing a circuit board, and one of the important factors influencing the quality of the copper-clad plate is heat dissipation, the circuit board inevitably generates heat during operation, if the heat dissipation is not timely, electronic components such as resistors and capacitors on the circuit board are easily burnt out, and the circuit board is easily burnt out under a high-power working environment, so that in order to meet the working requirement of the circuit board, the method for solving the problem is to adopt the electronic components made of high-temperature-resistant materials or arrange an external heat dissipation device, however, the former needs to increase the manufacturing cost of the product, and the latter can increase the volume of the product and increase the power consumption of the product.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a high-efficient aluminium base heat conduction copper-clad plate, improving the structure of copper-clad plate, improving the heat dispersion of copper-clad plate, and then reduce product cost of manufacture.
The purpose of the utility model is realized through the following technical scheme:
a high-efficient aluminium base heat conduction copper-clad plate includes: a main conductive layer, a secondary conductive layer, a main heat-conducting layer and a tail end conductive layer;
the main conductive layer comprises a first conductive copper plate, a second conductive copper plate and a bonding insulating film, the first conductive copper plate and the second conductive copper plate are respectively bonded on two opposite side surfaces of the bonding insulating film, and the bonding insulating film is used for absorbing heat on the first conductive copper plate and the second conductive copper plate;
the main heat conducting layer comprises an upper insulating heat absorbing sheet, a lower insulating heat absorbing sheet and a first heat conducting aluminum plate, the upper insulating heat absorbing sheet is installed on a first side face of the first heat conducting aluminum plate, the lower insulating heat absorbing sheet is installed on a second side face of the first heat conducting aluminum plate, a plurality of auxiliary heat conducting holes are formed in the first heat conducting aluminum plate, the distance between every two adjacent auxiliary heat conducting holes is equal, and semi-solidified heat absorbing colloid is filled in each auxiliary heat conducting hole;
the secondary conductive layer is arranged on the side face, far away from the first heat conduction aluminum plate, of the lower insulating heat absorption sheet;
the tail end conducting layer is arranged on one side, away from the lower insulating heat absorption sheet, of the secondary conducting layer, and a heat guiding layer is arranged between the tail end conducting layer and the secondary conducting layer.
In one embodiment, the terminal conductive layer includes an auxiliary heat absorbing aluminum plate and a terminal copper plate, the first side surface of the auxiliary heat absorbing aluminum plate is bonded to the secondary conductive layer, the terminal copper plate is disposed on the second side surface of the auxiliary heat absorbing aluminum plate, and an insulating bonding layer is disposed between the terminal copper plate and the auxiliary heat absorbing aluminum plate.
In one embodiment, the secondary conductive layer has an etched circuit disposed thereon.
In one embodiment, the adhesive insulating film has a thickness of 250 μm.
In one embodiment, the first conductive copper plate has a thickness equal to that of the second conductive copper plate.
In one embodiment, the thickness of the adhesive insulating film is smaller than that of the first conductive copper plate.
In one embodiment, the first heat conductive aluminum plate has a thickness 2 times that of the first electrically conductive copper plate.
In one embodiment, the main conductive layer further comprises a separation film attached to the side of the first conductive copper plate away from the adhesive insulating film.
In one embodiment, the thickness of the separation film is smaller than that of the first conductive copper plate.
In one of the embodiments, the edge of the separation membrane is provided with an extension.
Compared with the prior art, the utility model discloses at least, following advantage has:
according to the high-efficiency aluminum-based heat-conducting copper-clad plate, the main conducting layer, the secondary conducting layer and the tail end conducting layer are arranged, the structure of the copper-clad plate is improved, the heat absorption part on the copper-clad plate is increased, the heat dissipation capacity of the copper-clad plate is improved, the heat dissipation performance of the copper-clad plate is improved, and further the product manufacturing cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a high-efficiency aluminum-based heat-conducting copper-clad plate in an embodiment of the present invention;
fig. 2 is a schematic structural view of a first heat conductive aluminum plate in an embodiment of the invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a high-efficiency aluminum-based heat-conducting copper-clad plate 10 includes: the main conductive layer 100, the secondary conductive layer 200, the main heat conducting layer 300 and the terminal conductive layer 400 are main working parts of the high-efficiency aluminum-based heat-conducting copper-clad plate 10 and are used for laying a circuit, the main heat conducting layer 300 is arranged between the main conductive layer 100 and the secondary conductive layer 200, and the heat on the main conductive layer 100 and the secondary conductive layer 200 is absorbed by the main heat conducting layer 300 so as to improve the heat dissipation capacity of the copper-clad plate.
Referring to fig. 1, the main conductive layer 100 includes a first conductive copper plate 110, a second conductive copper plate 120 and an adhesive insulating film 130, the first conductive copper plate 110 and the second conductive copper plate 120 are respectively adhered to two opposite sides of the adhesive insulating film 130, and the adhesive insulating film 130 is used for absorbing heat on the first conductive copper plate 110 and the second conductive copper plate 120.
Referring to fig. 1, the first conductive copper plate 110 and the second conductive copper plate 120 are bonded by the bonding insulating film 130, and both the first conductive copper plate 110 and the second conductive copper plate 120 can be used for installing circuits, and the bonding insulating film 130 between the first conductive copper plate 110 and the second conductive copper plate 120 has good heat conductivity, can absorb heat generated by the first conductive copper plate 110 and the second conductive copper plate 120, and timely reduces the temperature of the first conductive copper plate 110 and the second conductive copper plate 120, thereby protecting the first conductive copper plate 110 and the second conductive copper plate 120.
Referring to fig. 1 and 2, the main heat conducting layer 300 includes an upper insulating heat sink 310, a lower insulating heat sink 320, and a first heat conducting aluminum plate 330, the upper insulating heat sink 310 is mounted on a first side surface of the first heat conducting aluminum plate 330, the lower insulating heat sink 320 is mounted on a second side surface of the first heat conducting aluminum plate 330, a plurality of auxiliary heat conducting holes are formed in the first heat conducting aluminum plate 330, intervals between every two adjacent auxiliary heat conducting holes are equal, and a semi-cured heat absorbing colloid 331 is filled in each auxiliary heat conducting hole. The main heat conducting layer 300 is made of an aluminum plate having a good heat conducting property, and an upper insulating heat sink 310 and a lower insulating heat sink 320 are disposed on two side surfaces of the first heat conducting aluminum plate 330, and are used for guiding heat on the main heat conducting layer 100, the secondary heat conducting layer 200, and the end heat conducting layer 400 to the first heat conducting aluminum plate 330.
Referring to fig. 1 and fig. 2, a plurality of auxiliary heat conduction holes are formed in the first heat conduction aluminum plate 330, and the auxiliary heat conduction holes are filled with semi-cured heat absorbing colloid 331, so that the heat absorbing capacity of the first heat conduction aluminum plate 330 is further improved by the semi-cured heat absorbing colloid 331, and the heat dissipation performance of the high-efficiency aluminum-based heat conduction copper-clad plate 10 is improved.
Referring to fig. 1 and 2, the secondary conductive layer 200 is disposed on a side of the lower insulating heat sink 320 away from the first aluminum heat conducting plate 330; the end conductive layer 400 is disposed on a side of the secondary conductive layer 200 away from the lower insulating heat sink, and a heat guiding layer 410 is disposed between the end conductive layer 400 and the secondary conductive layer 200.
Further, referring to fig. 1 and fig. 2, in order to improve the heat dissipation effect of the high efficiency aluminum-based heat-conducting copper-clad plate 10 at the terminal conductive layer 400, the terminal conductive layer 400 includes an auxiliary heat-absorbing aluminum plate 410 and a terminal copper plate 420, a first side surface of the auxiliary heat-absorbing aluminum plate 410 is bonded to the secondary conductive layer 200, the terminal copper plate 420 is disposed on a second side surface of the auxiliary heat-absorbing aluminum plate 410, and an insulating bonding layer 430 is disposed between the terminal copper plate 420 and the auxiliary heat-absorbing aluminum plate 410. Therefore, the auxiliary heat absorption aluminum plate 410 for heat dissipation is additionally arranged on the tail end conductive layer 400, so that heat generated when the tail end conductive layer 400 and the secondary conductive layer 200 work can be absorbed in time, the heat dissipation pressure of the main heat conduction layer 300 is shared, and the heat dissipation performance of the high-efficiency aluminum-based heat conduction copper-clad plate 10 is further improved.
Further, referring to fig. 1 and 2, the secondary conductive layer 200 is provided with an etching circuit, the thickness of the adhesive insulating film 130 is 250 μm, the thickness of the first conductive copper plate 110 is equal to the thickness of the second conductive copper plate 120, the thickness of the adhesive insulating film 130 is less than the thickness of the first conductive copper plate 110, and the thickness of the first conductive aluminum plate 330 is 2 times that of the first conductive copper plate 110.
Further, in order to protect the high-efficiency aluminum-based heat-conducting copper-clad plate 10 from being scratched, the main conductive layer 100 further comprises a separation film 140, the separation film 140 is attached to the side surface of the first conductive copper plate 110 far away from the bonding insulating film 130, the separation film 140 is located on the outermost side of the high-efficiency aluminum-based heat-conducting copper-clad plate 10, so that when the high-efficiency aluminum-based heat-conducting copper-clad plate 10 is carried, the first conductive copper plate 110 cannot be scratched, the thickness of the separation film 140 is smaller than that of the first conductive copper plate 110, an extension portion is arranged at the edge of the separation film 140, the extension portion is arranged at the edge of the separation film 140 so as to facilitate processing of the high-efficiency aluminum-based heat-conducting copper-clad plate 10 in a.
Compared with the prior art, the utility model discloses at least, following advantage has:
according to the high-efficiency aluminum-based heat-conducting copper-clad plate 10, the main heat-conducting layer 100, the secondary heat-conducting layer 200, the main heat-conducting layer 300 and the tail end heat-conducting layer 400 are arranged, so that the structure of the copper-clad plate is improved, heat absorption positions on the copper-clad plate are increased, the heat dissipation capacity of the copper-clad plate is improved, the heat dissipation performance of the copper-clad plate is improved, and.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a high-efficient aluminium base heat conduction copper-clad plate which characterized in that includes: a main conductive layer, a secondary conductive layer, a main heat-conducting layer and a tail end conductive layer;
the main conductive layer comprises a first conductive copper plate, a second conductive copper plate and a bonding insulating film, the first conductive copper plate and the second conductive copper plate are respectively bonded on two opposite side surfaces of the bonding insulating film, and the bonding insulating film is used for absorbing heat on the first conductive copper plate and the second conductive copper plate;
the main heat conducting layer comprises an upper insulating heat absorbing sheet, a lower insulating heat absorbing sheet and a first heat conducting aluminum plate, the upper insulating heat absorbing sheet is installed on a first side face of the first heat conducting aluminum plate, the lower insulating heat absorbing sheet is installed on a second side face of the first heat conducting aluminum plate, a plurality of auxiliary heat conducting holes are formed in the first heat conducting aluminum plate, the distance between every two adjacent auxiliary heat conducting holes is equal, and semi-solidified heat absorbing colloid is filled in each auxiliary heat conducting hole;
the secondary conductive layer is arranged on the side face, far away from the first heat conduction aluminum plate, of the lower insulating heat absorption sheet;
the tail end conducting layer is arranged on one side, away from the lower insulating heat absorption sheet, of the secondary conducting layer, and a heat guiding layer is arranged between the tail end conducting layer and the secondary conducting layer.
2. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 1, wherein the terminal conducting layer comprises an auxiliary heat-absorbing aluminum plate and a terminal copper plate, the first side surface of the auxiliary heat-absorbing aluminum plate is bonded with the secondary conducting layer, the terminal copper plate is arranged on the second side surface of the auxiliary heat-absorbing aluminum plate, and an insulating bonding layer is arranged between the terminal copper plate and the auxiliary heat-absorbing aluminum plate.
3. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 1, wherein an etching circuit is disposed on the secondary conductive layer.
4. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 1, wherein the thickness of the adhesive insulating film is 250 μm.
5. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 4, wherein the first conductive copper plate has a thickness equal to that of the second conductive copper plate.
6. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 5, wherein the thickness of the adhesive insulating film is smaller than that of the first conductive copper plate.
7. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 1, wherein the thickness of the first heat-conducting aluminum plate is 2 times that of the first electric-conducting copper plate.
8. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 1, wherein the main conductive layer further comprises a separation film, and the separation film is attached to the side surface of the first conductive copper plate away from the adhesive insulating film.
9. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 8, wherein the thickness of the separation film is less than that of the first conductive copper plate.
10. The high-efficiency aluminum-based heat-conducting copper-clad plate according to claim 8, wherein the edge of the separation membrane is provided with an extension.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822274030.8U CN210075680U (en) | 2018-12-29 | 2018-12-29 | High-efficiency aluminum-based heat-conducting copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822274030.8U CN210075680U (en) | 2018-12-29 | 2018-12-29 | High-efficiency aluminum-based heat-conducting copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210075680U true CN210075680U (en) | 2020-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822274030.8U Expired - Fee Related CN210075680U (en) | 2018-12-29 | 2018-12-29 | High-efficiency aluminum-based heat-conducting copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210075680U (en) |
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2018
- 2018-12-29 CN CN201822274030.8U patent/CN210075680U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 516006 No.1, Dongxiang South Road, Dongxing District, Dongjiang hi tech Industrial Park, Zhongkai hi tech Zone, Huizhou City, Guangdong Province Patentee after: Huizhou Yuxiang Technology Co.,Ltd. Address before: 516006 No.1, Dongxiang South Road, Dongxing District, Dongjiang hi tech Industrial Park, Zhongkai hi tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU YUXINDA TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 |