CN210432028U

CN210432028U - Printed circuit board with double-layer structure

Info

Publication number: CN210432028U
Application number: CN201920975195.XU
Authority: CN
Inventors: 李亮亮
Original assignee: Zhengzhou Zhitao Information Technology Co ltd
Current assignee: Putian xinhongyi Electronic Technology Co., Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2020-04-28
Anticipated expiration: 2029-06-26

Abstract

The utility model discloses a printed circuit board with double-layer structure, which comprises an insulating substrate, an upper conductive layer arranged on the upper side of the insulating substrate and a lower conductive layer arranged on the lower side of the insulating substrate, wherein the upper side of the upper conductive layer and the lower side of the lower conductive layer are both provided with a protective layer, the lateral side of the insulating substrate is provided with an opening, the inner side of the opening is provided with a heat conduction layer, the outer side of the heat conduction layer is equidistantly provided with heat conduction sheets in a penetrating way, the heat conduction sheets are vertically penetrated with a first radiating fin and a second radiating fin, when the printed circuit board is used, the heat generated when the corresponding upper conductive layer and the lower conductive layer run can be transmitted to the heat conduction sheets at the lateral side through the heat conduction layers, and the first radiating fin and the second radiating fin are penetrated at the inner side of the heat conduction sheets to form a corresponding grid-shaped radiating mechanism, thereby being capable, the structural design is compact and reasonable, has strong practicability and is suitable for popularization.

Description

Printed circuit board with double-layer structure

Technical Field

The utility model belongs to the technical field of printed circuit board, concretely relates to bilayer structure's printed circuit board.

Background

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the main advantages of using circuit boards are that wiring and assembly errors are greatly reduced, automation level and labor productivity are improved, and circuit boards can be classified into single-sided boards, double-sided boards, four-sided boards, six-sided boards and other multilayer circuit boards according to the number of layers of the circuit board, and since printed circuit boards are not general end products, they are somewhat confused in the definition of names, for example: although the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, the motherboard has a circuit board, but is different from the motherboard, so that the two boards cannot be said to be the same in the evaluation of the industry. Such "bridges" between circuits are called vias (via). The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. The double-sided board has an area twice as large as that of the single-sided board, so that the double-sided board solves the difficulty of wiring staggering in the single-sided board (the wiring can be led to the other side through the guide holes), and is more suitable for being used on a circuit more complicated than the single-sided board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a bilayer structure's printed circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a bilayer structure's printed circuit board, includes the last conducting layer that insulating substrate, insulating substrate upside set up and the lower conducting layer that the insulating substrate downside set up, the upside of going up the conducting layer, the downside of conducting layer down all are equipped with the inoxidizing coating, the opening has been seted up to insulating substrate's avris, the open-ended inboard is equipped with the heat-conducting layer, the equidistant cross-under in outside of heat-conducting layer has the heat-conducting strip, the vertical cross-under has first fin, second fin on the heat-conducting strip, the mounting hole has been seted up on the heat-conducting.

Preferably, the width of the insulating substrate is greater than the cross-sectional widths of the upper conductive layer and the lower conductive layer, and the specifications of the upper conductive layer and the lower conductive layer are consistent.

Preferably, the cross-sectional thickness of the insulating substrate is greater than the cross-sectional thicknesses of the upper conductive layer and the lower conductive layer.

Preferably, the height of the cross section of the heat-conducting fin is lower than that of the cross section of the opening, and the length of the heat-conducting fin is larger than that of the cross section of the opening.

Preferably, the first and second heat dissipation fins have the same specification, and the height of the first and second heat dissipation fins is lower than that of the heat conduction fin.

Preferably, the number of the mounting holes is two, and the two mounting holes are arranged corresponding to the first cooling fin and the second cooling fin.

The utility model discloses a technological effect and advantage: the utility model discloses a when using, the produced heat of corresponding last conducting layer, lower conducting layer when the operation can convey to the conducting strip of avris via the heat-conducting layer, and the inboard of conducting strip has worn first fin, second fin, forms the heat dissipation mechanism of corresponding grid form, can play higher heat conduction radiating effect from this for whole safety and stability more in the operation process, structural design is closely reasonable, has very strong practicality, is fit for promoting.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the heat conducting fin of the present invention;

fig. 3 is a schematic structural view of the heat conducting fin of the present invention.

In the figure: 1. an insulating substrate; 2. an upper conductive layer; 3. a lower conductive layer; 4. a protective layer; 5. an opening; 6. a heat conductive layer; 7. a heat conductive sheet; 8. a first heat sink; 9. a second heat sink; 10. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a bilayer structure's printed circuit board as shown in fig. 1-3, including last conducting layer 2 that insulating substrate 1, insulating substrate 1 upside set up and the lower conducting layer 3 that insulating substrate 1 downside set up, its characterized in that: the upside of going up conducting layer 2, the downside of lower conducting layer 3 all are equipped with inoxidizing coating 4, opening 5 has been seted up to the avris of insulating substrate 1, the inboard of opening 5 is equipped with heat-conducting layer 6, heat-conducting layer 6's the outside equidistance has worn to have connect heat-conducting strip 7, perpendicular cross-under has first fin 8, second fin 9 on the heat-conducting strip 7, mounting hole 10 has been seted up on the heat-conducting strip 7.

Specifically, the width of the insulating substrate 1 is greater than the cross-sectional widths of the upper conductive layer 2 and the lower conductive layer 3, and the specifications of the upper conductive layer 2 and the lower conductive layer 3 are consistent.

Specifically, the cross-sectional thickness of the insulating substrate 1 is greater than the cross-sectional thicknesses of the upper conductive layer 2 and the lower conductive layer 3.

Specifically, the height of the cross section of the heat-conducting fin 7 is lower than that of the opening 5, and the length of the heat-conducting fin 7 is greater than the depth of the cross section of the opening 5.

Specifically, the first heat sink 8 and the second heat sink 9 have the same specification, and the height of the first heat sink 8 and the height of the second heat sink 9 are lower than the height of the heat conductive fin 7.

Specifically, two mounting holes 10 are provided, and the two mounting holes 10 are arranged corresponding to the first cooling fin 8 and the second cooling fin 9.

The utility model discloses a when using, corresponding last conducting layer 2, the produced heat of conducting layer 3 can convey to the conducting strip 7 of avris via heat-conducting layer 6 when the operation down, and the inboard of conducting strip 7 has worn first fin 8, second fin 9, form the heat dissipation mechanism of corresponding grid form, can play higher heat conduction radiating effect from this for whole more safety and stability in the operation process, structural design is closely reasonable, has very strong practicality, and is suitable for promoting.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a bilayer structure's printed circuit board, includes lower conducting layer (3) that last conducting layer (2) and insulating substrate (1) downside that insulating substrate (1), insulating substrate (1) upside set up, its characterized in that: go up the upside of conducting layer (2), the downside of lower conducting layer (3) all is equipped with inoxidizing coating (4), opening (5) have been seted up to the avris of insulating substrate (1), the inboard of opening (5) is equipped with heat-conducting layer (6), heat-conducting plate (7) have been worn to connect in the outside equidistance of heat-conducting layer (6), perpendicular cross-under has first fin (8), second fin (9) on heat-conducting plate (7), mounting hole (10) have been seted up on heat-conducting plate (7).

2. The printed circuit board of claim 1, wherein: the width of the insulating substrate (1) is larger than the cross section widths of the upper conducting layer (2) and the lower conducting layer (3), and the specifications of the upper conducting layer (2) and the lower conducting layer (3) are consistent.

3. The printed circuit board of claim 1, wherein: the cross-sectional thickness of the insulating substrate (1) is larger than that of the upper conducting layer (2) and that of the lower conducting layer (3).

4. The printed circuit board of claim 1, wherein: the height of the cross section of the heat conducting fin (7) is lower than that of the cross section of the opening (5), and the length of the heat conducting fin (7) is larger than the depth of the cross section of the opening (5).

5. The printed circuit board of claim 1, wherein: the specifications of the first radiating fin (8) and the second radiating fin (9) are consistent, and the heights of the first radiating fin (8) and the second radiating fin (9) are lower than that of the heat conducting fin (7).

6. The printed circuit board of claim 5, wherein: the number of the mounting holes (10) is two, and the two mounting holes (10) are arranged corresponding to the first radiating fins (8) and the second radiating fins (9).