CN211457506U - High-efficient radiating double-deck circuit board structure - Google Patents
High-efficient radiating double-deck circuit board structure Download PDFInfo
- Publication number
- CN211457506U CN211457506U CN201922328592.0U CN201922328592U CN211457506U CN 211457506 U CN211457506 U CN 211457506U CN 201922328592 U CN201922328592 U CN 201922328592U CN 211457506 U CN211457506 U CN 211457506U
- Authority
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- China
- Prior art keywords
- layer
- circuit board
- plywood
- upper plate
- double
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011120 plywood Substances 0.000 claims abstract description 20
- 239000000428 dust Substances 0.000 claims abstract description 12
- 238000000926 separation method Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a pair of high-efficient radiating double-deck circuit board structure, which comprises a circuit board, the circuit board includes upper plate, lower plywood, the upper plate with be equipped with the fretwork layer between the plywood of lower floor, the upper plate with still be equipped with a plurality of reference columns between the plywood down, through bolt fixed connection between upper plate, reference column, the plywood of lower floor, be equipped with the confession in the reference column the through-hole that the bolt passed, the fretwork in situ is equipped with a plurality of radiator fan, fretwork layer edge still is equipped with the dust separation net, the dust separation net is fixed the upper plate with between the plywood of lower floor. The utility model discloses a double-deck circuit board structure, the radiating efficiency is high.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to high-efficient radiating double-deck circuit board structure.
Background
Circuit boards are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board is developed from a single layer to a double-sided board and a multi-layer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine wire, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance. In the prior art, a layer of prepreg is usually added between two layers of boards for fixing the two layers of boards, but the structure has poor heat conduction performance, and the circuit board is easy to generate heat.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a high-efficient radiating double-deck circuit board structure, the radiating efficiency is high.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a high-efficient radiating double-deck circuit board structure, includes the circuit board, the circuit board includes upper plate, lower plywood, the upper plate with be equipped with the fretwork layer between the plywood of lower floor, the upper plate with still be equipped with a plurality of reference columns between the plywood down, through bolt fixed connection between upper plate, reference column, the plywood of lower floor, be equipped with the confession in the reference column the through-hole that the bolt passed, be equipped with a plurality of radiator fan in the fretwork layer, fretwork layer edge still is equipped with the dust separation net, the dust separation net is fixed the upper plate with between the plywood of lower floor.
Specifically, the upper end of the upper layer plate is provided with an upper layer circuit layer, the lower end of the lower layer plate is provided with a lower layer circuit layer, and the upper layer circuit layer and the lower layer circuit layer are connected with copper wires.
Specifically, both ends weld with upper circuit layer, lower floor's circuit layer respectively about the copper line, the copper line outside still overlaps and is equipped with insulating protective layer, insulating protective layer is located the fretwork layer is inboard.
Specifically, a plurality of key mounting areas are further arranged at the upper end of the upper plate.
Specifically, a plurality of electronic components are welded at the lower end of the lower layer plate.
The utility model has the advantages that:
the utility model discloses a double-deck circuit board structure sets the fretwork layer to between upper plate and the lower floor's board to it is fixed through the reference column, replaced traditional prepreg, and increased radiator fan, improved the radiating efficiency of circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a high-efficiency heat-dissipating double-layer circuit board structure of the present invention.
Fig. 2 is a schematic structural diagram of a high-efficient heat-dissipating double-layer circuit board structure of the present invention.
Fig. 3 is a schematic structural diagram of the medium copper wire and the insulating protective layer of the present invention.
The reference signs are: the heat dissipation device comprises an upper plate 1, a lower plate 2, a hollow-out layer 3, a positioning column 4, a bolt 5, a cooling fan 6, a dust separation net 7, a copper wire 8, an insulating protective layer 9 and a key installation area 10.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1-3:
the utility model provides a high-efficient radiating double-deck circuit board structure, includes the circuit board, the circuit board includes upper plate 1, lower plywood 2, upper plate 1 with be equipped with fretwork layer 3 down between the plywood 2, upper plate 1 with still be equipped with a plurality of reference columns 4 down between the plywood 2, through bolt 5 fixed connection between upper plate 1, reference column 4, the plywood 2 down, be equipped with the confession in the reference column 4 the through-hole that bolt 5 passed, be equipped with a plurality of radiator fan 6 in the fretwork layer 3, fretwork layer 3 edge still is equipped with dust separation net 7, dust separation net 7 is fixed upper plate 1 with down between the plywood 2, dust separation net 7 can prevent that the dust from getting into fretwork layer 3 to prevent the inside laying dust of fretwork layer 3.
Preferably, 1 upper end of upper plate is equipped with upper circuit layer, 2 lower extremes of lower plate are equipped with lower floor's circuit layer, upper circuit layer with be connected with copper line 8 between the lower floor's circuit layer, realize the electric connection on upper circuit layer and lower floor's circuit layer through copper line 8.
Preferably, both ends weld with upper circuit layer, lower floor's circuit layer respectively about copper line 8, the copper line 8 outside is still overlapped and is equipped with insulating inoxidizing coating 9, insulating inoxidizing coating 9 is located 3 inboards on the fretwork layer, insulating inoxidizing coating 9 is used for protecting copper line 8, prevents that copper line 8 from weing or oxidizing.
Preferably, the upper end of the upper plate 1 is also provided with a plurality of key mounting areas 10, and the upper end is used for mounting keys, so that the circuit board can be suitable for equipment with keys, such as a gamepad and the like.
Preferably, a plurality of electronic components are welded at the lower end of the lower plate 2.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a high-efficient radiating double-deck circuit board structure, includes the circuit board, its characterized in that, the circuit board includes upper plate (1), lower plywood (2), upper plate (1) with be equipped with fretwork layer (3) down between plywood (2), upper plate (1) with still be equipped with a plurality of reference columns (4) down between plywood (2), pass through bolt (5) fixed connection between upper plate (1), reference column (4), lower plywood (2), be equipped with the confession in reference column (4) the through-hole that bolt (5) passed, be equipped with a plurality of radiator fan (6) in fretwork layer (3), fretwork layer (3) edge still is equipped with dust separation net (7), dust separation net (7) are fixed upper plate (1) with down between plywood (2).
2. The double-layer circuit board structure with high heat dissipation efficiency as claimed in claim 1, wherein an upper circuit layer is disposed at the upper end of the upper board (1), a lower circuit layer is disposed at the lower end of the lower board (2), and a copper wire (8) is connected between the upper circuit layer and the lower circuit layer.
3. The double-layer circuit board structure with the function of efficient heat dissipation according to claim 2, wherein the upper end and the lower end of the copper wire (8) are respectively welded with the upper circuit layer and the lower circuit layer, the outer side of the copper wire (8) is further sleeved with an insulating protective layer (9), and the insulating protective layer (9) is located on the inner side of the hollowed-out layer (3).
4. A high efficiency heat dissipating double layer circuit board structure as claimed in claim 1, wherein the upper end of the upper board (1) is further provided with a plurality of key mounting areas (10).
5. A high efficiency heat dissipating double layer circuit board structure as claimed in claim 1, wherein a plurality of electronic components are further soldered to the lower end of the lower board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922328592.0U CN211457506U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiating double-deck circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922328592.0U CN211457506U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiating double-deck circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211457506U true CN211457506U (en) | 2020-09-08 |
Family
ID=72299184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922328592.0U Expired - Fee Related CN211457506U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiating double-deck circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211457506U (en) |
-
2019
- 2019-12-23 CN CN201922328592.0U patent/CN211457506U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200908 |