CN210899802U - Circuit board structure convenient to maintain - Google Patents

Circuit board structure convenient to maintain Download PDF

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Publication number
CN210899802U
CN210899802U CN201921705939.2U CN201921705939U CN210899802U CN 210899802 U CN210899802 U CN 210899802U CN 201921705939 U CN201921705939 U CN 201921705939U CN 210899802 U CN210899802 U CN 210899802U
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CN
China
Prior art keywords
heat dissipation
mother
mother set
mother board
plate
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CN201921705939.2U
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Chinese (zh)
Inventor
夏善福
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Dongguan Hongyun Electronics Co ltd
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Dongguan Hongyun Electronics Co ltd
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Priority to CN201921705939.2U priority Critical patent/CN210899802U/en
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Abstract

The utility model discloses a circuit board structure convenient to maintain, including mother set one, mother set two, mother set three and mother set four, mother set one mother set two mother set three with mother set four is parallel structure, mother set one with one side of mother set four all is provided with a plurality of daughter boards respectively, mother set one mother set two mother set three with one side of mother set four all is provided with a plurality of electronic components respectively, mother set one with be provided with heating panel one between the mother set two, mother set three with be provided with heating panel two between the mother set four, mother set one the mother set two the mother set three the mother set four the heating panel one with the both ends of heating panel two are equal dead lever respectively. Has the advantages that: the circuit board is convenient to maintain, a multi-block circuit board superposition structure is adopted, wiring is less, processing and implementation are easy, disassembly and assembly are convenient, and meanwhile good heat dissipation performance is achieved.

Description

Circuit board structure convenient to maintain
Technical Field
The utility model relates to a circuit board technical field particularly, relates to a circuit board structure convenient to maintain.
Background
The mounting and dismounting of the circuit board affects the operational stability and reliability of the equipment using the circuit board, and affects the maintainability thereof. The installation of present circuit board often adopts single-layer construction to install in the erection column of circuit board through alternate, influence the overall structure of circuit board, a plurality of individual layers' circuit board need connect the combination through complicated cable when using moreover, use inconvenient, current circuit board heat dispersion is generally not good moreover.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem in the correlation technique, the utility model provides a circuit board structure convenient to maintain to overcome the above-mentioned technical problem that current correlation technique exists.
Therefore, the utility model discloses a specific technical scheme as follows:
a circuit board structure convenient to maintain comprises a first mother board, a second mother board, a third mother board and a fourth mother board, wherein the first mother board, the second mother board, the third mother board and the fourth mother board are of parallel structures, a plurality of daughter boards are respectively arranged on one sides of the first mother board and the fourth mother board, a plurality of electronic components are respectively arranged on one sides of the first mother board, the second mother board, the third mother board and the fourth mother board, a first heat dissipation plate is arranged between the first mother board and the second mother board, a second heat dissipation plate is arranged between the third mother board and the fourth mother board, a first heat dissipation fin is arranged at one end of the first heat dissipation plate and one end of the second heat dissipation plate, a second heat dissipation fin is arranged at the other end of the first heat dissipation plate and the second heat dissipation plate, fixing rods are respectively arranged at two ends of the first mother board, the second mother board, the third mother, and two ends of the fixing rod are fixed through nuts.
Furthermore, the daughter board is fixedly connected with the first mother board and the fourth mother board through fixing seats positioned on the first mother board and the fourth mother board, and one end of each fixing seat is provided with a plurality of metal contacts.
Furthermore, the two sides of the first heat dissipation plate and the two sides of the second heat dissipation plate are respectively provided with a casing matched with the electronic component, and heat-conducting silicone grease is filled in the casing.
Furthermore, one side of the casing is provided with a silica gel injection hole.
Furthermore, one end of the first heat dissipation plate is provided with a plurality of first heat dissipation fans, and one end of the second heat dissipation plate is provided with a second heat dissipation fan.
Furthermore, a plurality of radiating fins are arranged on one side of the first radiating plate and one side of the second radiating plate respectively.
Furthermore, a plurality of limiting sleeves matched with the second mother plate and the third mother plate are arranged in the middle of the fixing rod.
The utility model has the advantages that: through setting up by mother board one, mother board two, mother board three, mother board four, the daughter board, heating panel one, heating panel two, heat dissipation fin board one, heat dissipation fin board two, the dead lever, the nut, the cover shell, heat conduction silicone grease, the silica gel injection hole, cooling fan one, cooling fan two, the circuit board structure of being convenient for maintain that cooling fin and stop collar constitute, thereby be convenient for maintain the circuit board, adopt polylith circuit board stack structure, make the wiring few, easily processing and realization, the dismouting of being convenient for, better heat dispersion has simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board structure convenient for maintenance according to an embodiment of the present invention.
In the figure:
1. mother plate I; 2. a second mother plate; 3. mother set III; 4. mother set four; 5. a daughter board; 6. an electronic component; 7. a first heat dissipation plate; 8. a second heat dissipation plate; 9. a first radiating fin plate; 10. a second radiating fin plate; 11. fixing the rod; 12. a nut; 13. a fixed seat; 14. a metal contact; 15. a housing; 16. heat-conducting silicone grease; 17. a silica gel injection hole; 18. a first heat radiation fan; 19. a second heat radiation fan; 20. a heat dissipating fin; 21. a limiting sleeve.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides a circuit board structure convenient to maintain.
The first embodiment is as follows:
as shown in fig. 1, the circuit board structure convenient for maintenance according to the embodiment of the present invention includes a first mother board 1, a second mother board 2, a third mother board 3 and a fourth mother board 4, wherein the first mother board 1, the second mother board 2, the third mother board 3 and the fourth mother board 4 are parallel structures, a plurality of daughter boards 5 are respectively disposed on one sides of the first mother board 1 and the fourth mother board 4, a plurality of electronic components 6 are respectively disposed on one sides of the first mother board 1, the second mother board 2, the third mother board 3 and the fourth mother board 4, a first heat dissipation plate 7 is disposed between the first mother board 1 and the second mother board 2, a second heat dissipation plate 8 is disposed between the third mother board 3 and the fourth mother board 4, a first heat dissipation fin 9 is disposed on one end of the first heat dissipation plate 7 and the second heat dissipation plate 8, a second heat dissipation fin 10 is disposed on the other end of the first heat dissipation plate 7, two ends of the first mother board 1, the second mother board 2, the third mother board 3, the fourth mother board 4, the first heat dissipation board 7 and the second heat dissipation board 8 are respectively fixed with a fixing rod 11, and two ends of the fixing rod 11 are fixed through nuts 12.
By means of the technical scheme, the circuit board structure which is convenient to maintain and comprises the first mother board 1, the second mother board 2, the third mother board 3, the fourth mother board 4, the daughter board 5, the first heat dissipation board 7, the second heat dissipation board 8, the first heat dissipation fin 9, the second heat dissipation fin 10, the fixing rod 11, the nut 12, the casing 15, the heat conduction silicone grease 16, the silica gel injection hole 17, the first heat dissipation fan 18, the second heat dissipation fan 19, the heat dissipation fins 20 and the limiting sleeve 21 is arranged, so that the circuit board is convenient to maintain, a multi-circuit-board stacking structure is adopted, wiring is few, processing and implementation are easy, disassembly and assembly are convenient, and good heat dissipation performance is achieved.
Example two:
as shown in fig. 1, the daughter board 5 is fixedly connected with the first master 1 and the fourth master 4 through a fixing seat 13 located on the first master 1 and the fourth master 4, one end of the fixed seat 13 is provided with a plurality of metal contacts 14, two sides of the first heat dissipation plate 7 and the second heat dissipation plate 8 are respectively provided with a casing 15 matched with the electronic component 6, the interior of the casing 15 is filled with heat-conducting silicone grease 16, one side of the casing 15 is provided with a silicone injection hole 17, one end of the first heat dissipation plate 7 is provided with a plurality of first heat dissipation fans 18, one end of the second heat dissipation plate 8 is provided with a second heat dissipation fan 19, a plurality of radiating fins 20 are respectively arranged on one side of the first radiating plate 7 and one side of the second radiating plate 8, and a plurality of limiting sleeves 21 matched with the second mother set 2 and the third mother set 3 are arranged at the middle positions of the fixing rods 11.
As can be seen from fig. 1, both sides of the first heat dissipation plate 7 and the second heat dissipation plate 8 are respectively provided with a casing 15 matched with the electronic component 6, the interior of the casing 15 is filled with heat-conducting silicone grease 16, one side of the casing 15 is provided with a silicone injection hole 17, one end of the first heat dissipation plate 7 is provided with a plurality of first heat dissipation fans 18, one end of the second heat dissipation plate 8 is provided with a second heat dissipation fan 19, a plurality of radiating fins 20 are respectively arranged on one side of the first radiating plate 7 and one side of the second radiating plate 8, a plurality of limit sleeves 21 matched with the second mother set 2 and the third mother set 3 are arranged at the middle positions of the fixing rods 11, the design of the casing 15, the heat conductive silicone grease 16, the silicone injection hole 17, the first cooling fan 18, the second cooling fan 19, the cooling fins 20 and the stop collar 21 is conventional and will not be described in detail.
In conclusion, with the help of the above technical scheme of the utility model, through setting up by mother board 1, mother board two 2, three 3 of mother board, mother board four 4, daughter board 5, heating panel 7, heating panel two 8, heat dissipation fin one 9, two 10 of heat dissipation fin, dead lever 11, nut 12, cover shell 15, heat conduction silicone grease 16, silica gel injection hole 17, radiator fan 18, radiator fan two 19, the circuit board structure of being convenient for maintain that radiator fin 20 and stop collar 21 constitute, thereby be convenient for maintain the circuit board, adopt polylith circuit board stack structure, make the wiring few, easy to process and realize, the dismouting of being convenient for has better heat dispersion simultaneously.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A circuit board structure convenient to maintain is characterized by comprising a first mother board (1), a second mother board (2), a third mother board (3) and a fourth mother board (4), wherein the first mother board (1), the second mother board (2), the third mother board (3) and the fourth mother board (4) are of parallel structures, a plurality of daughter boards (5) are respectively arranged on one sides of the first mother board (1) and the fourth mother board (4), a first heat dissipation plate (7) is arranged between the first mother board (1) and the second mother board (2), a second heat dissipation plate (8) is arranged between the third mother board (3) and the fourth mother board (4), a first heat dissipation fin board (9) is arranged at one end of the first heat dissipation plate (7) and the second heat dissipation plate (8), the other end of the first heat dissipation plate (7) and the second heat dissipation plate (8) is provided with a second heat dissipation fin plate (10), the two ends of the first mother plate (1), the second mother plate (2), the third mother plate (3), the fourth mother plate (4), the first heat dissipation plate (7) and the second heat dissipation plate (8) are respectively fixed by fixing rods (11), and the two ends of each fixing rod (11) are fixed by nuts (12).
2. A circuit board structure convenient for maintenance according to claim 1, characterized in that the daughter board (5) is fixedly connected with the first motherboard (1) and the fourth motherboard (4) through a fixing seat (13) located on the first motherboard (1) and the fourth motherboard (4), and one end of the fixing seat (13) is provided with a plurality of metal contacts (14).
3. The circuit board structure convenient to maintain according to claim 1, wherein a casing (15) matched with the electronic component (6) is respectively arranged on both sides of the first heat dissipation plate (7) and the second heat dissipation plate (8), and heat-conducting silicone grease (16) is filled in the casing (15).
4. A circuit board structure convenient for maintenance according to claim 3, characterized in that one side of the casing (15) is provided with a silicone injection hole (17).
5. A circuit board structure convenient for maintenance according to claim 1, characterized in that one end of the first heat dissipation plate (7) is provided with a plurality of first heat dissipation fans (18), and one end of the second heat dissipation plate (8) is provided with a second heat dissipation fan (19).
6. A circuit board structure convenient for maintenance according to claim 1, characterized in that one side of the first heat dissipation plate (7) and one side of the second heat dissipation plate (8) are respectively provided with a plurality of heat dissipation fins (20).
7. A circuit board structure convenient for maintenance according to claim 1, characterized in that a plurality of position limiting sleeves (21) matched with the second mother plate (2) and the third mother plate (3) are arranged at the middle position of the fixing rod (11).
CN201921705939.2U 2019-10-12 2019-10-12 Circuit board structure convenient to maintain Active CN210899802U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921705939.2U CN210899802U (en) 2019-10-12 2019-10-12 Circuit board structure convenient to maintain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921705939.2U CN210899802U (en) 2019-10-12 2019-10-12 Circuit board structure convenient to maintain

Publications (1)

Publication Number Publication Date
CN210899802U true CN210899802U (en) 2020-06-30

Family

ID=71324173

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921705939.2U Active CN210899802U (en) 2019-10-12 2019-10-12 Circuit board structure convenient to maintain

Country Status (1)

Country Link
CN (1) CN210899802U (en)

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