CN215582428U

CN215582428U - PCB circuit substrate of many interfaces

Info

Publication number: CN215582428U
Application number: CN202121786784.7U
Authority: CN
Inventors: 沈斌; 姚世荣; 程林海; 陈清秀
Original assignee: Kunshan Jinpeng Electron Co ltd
Current assignee: Kunshan Jinpeng Electron Co ltd
Priority date: 2021-08-03
Filing date: 2021-08-03
Publication date: 2022-01-18
Anticipated expiration: 2031-08-03

Abstract

The utility model relates to the technical field of circuit substrates, and discloses a multi-interface PCB circuit substrate, which comprises a heat dissipation device, a bearing plate, a circuit substrate body and a mounting bottom plate, wherein the heat dissipation device is arranged on the upper surface of the bearing plate, the circuit substrate body is arranged below the bearing plate, the lower surface of the bearing plate is provided with a plurality of groups of fixing columns, one end of each group of fixing columns is fixedly connected to the lower surface of the bearing plate, the other end of each group of fixing columns is fixedly connected to the upper surface of the circuit substrate body, the mounting bottom plate is arranged below the circuit substrate body, the utility model reduces the high temperature generated when a plurality of circuits are connected with a plurality of interfaces and run simultaneously by arranging the cooling fan, the condenser pipe and the cooling fins, the temperature is accelerated to be radiated, heat accumulation is reduced, the probability of damage of the electronic components of the multi-interface circuit substrate due to high temperature is reduced, and the service life of the electronic components is prolonged.

Description

PCB circuit substrate of many interfaces

Technical Field

The utility model relates to the technical field of circuit substrates, in particular to a multi-interface PCB circuit substrate.

Background

In general daily life and industrial application, various electronic devices are often used, the complexity of the internal structure of the electronic devices tends to increase along with the powerful and diversified functions, especially in the electronic devices, many different electronic components are arranged on the circuit substrate, and the electronic components and other elements are connected with each other mainly through the wiring on the circuit substrate or external wires, and various serial ports are needed for connection, however, in the circuit substrates, because various circuits are connected with a plurality of interfaces and run at the same time, higher temperature is generated, the heat dissipation capability of the existing multi-interface circuit substrate is poor, the temperature cannot be dissipated and accumulated, and the electronic components of the multi-interface circuit substrate are damaged due to high temperature, and the existing circuit substrate is directly fixed through bolts, and because some users lack of disassembling tools, when the circuit board needs to be repaired and replaced, the circuit substrate cannot be repaired and replaced quickly due to the lack of tools.

Therefore, a PCB circuit substrate with multiple interfaces is designed.

Disclosure of Invention

In view of the deficiencies of the prior art, the present invention provides a multi-interface PCB circuit substrate, which solves the problems set forth in the background art.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a PCB circuit substrate of many interfaces, includes heat abstractor, loading board, circuit substrate body and mounting plate, heat abstractor sets up in the loading board upper surface, and the loading board below is provided with the circuit substrate body, and the loading board lower surface is provided with a plurality of groups of fixed columns, and every group fixed column one end fixed connection is in the loading board lower surface, and every group fixed column other end fixed connection is in circuit substrate body upper surface, and circuit substrate body below is provided with mounting plate.

Furthermore, the heat dissipation device comprises two groups of heat dissipation fans, condenser pipes and heat dissipation fins, the condenser pipes are arranged below each group of heat dissipation fans, one side, far away from the heat dissipation fans, of each condenser pipe is arranged on the upper surfaces of the corresponding heat dissipation fins, and the lower surfaces of the heat dissipation fins are fixedly connected to the upper surfaces of the bearing plates.

Furthermore, the upper surface of the circuit substrate body is provided with an electronic component circuit and a plurality of groups of interfaces, the lower surface of the circuit substrate body is provided with a plurality of groups of connecting hooks, and the upper surfaces of the connecting hooks are fixedly connected to the lower surface of the circuit substrate body.

Further, a plurality of groups of connecting grooves are formed in the upper surface of the mounting base plate, a group of through holes are formed in two sides of the inner wall of each connecting groove respectively, a group of reset springs and a group of compression plates are arranged in each group of through holes, one ends of the reset springs are fixedly connected to the outer surface of the inner wall of each through hole, and the other ends of the reset springs are fixedly connected to the surfaces of the compression plates.

Furthermore, a plurality of groups of connecting pieces are arranged on two sides of the cooling fan, one end of each group of connecting pieces is fixedly connected to the side surface of the cooling fan, a threaded hole is formed in the upper surface of each group of connecting pieces, a bolt is arranged in each threaded hole, one end of each bolt penetrates through the threaded hole formed in the upper surface of each connecting piece and is connected to the upper surface of each cooling fin, and the bolts enable the cooling fan to be movably connected to the upper surface of the condensing pipe.

Furthermore, the condenser pipe outer surface cover is equipped with a plurality of groups of fixed buckles, and a plurality of groups of screw holes have been seted up to fixed buckle both sides upper surface, and the threaded hole inside is provided with the threaded rod, and threaded rod one end is passed the screw hole that fixed buckle upper surface was seted up and is connected in the loading board upper surface, and the threaded rod makes the condenser pipe connect in the radiating fin upper surface.

The utility model has the beneficial effects that: 1. the utility model discloses a, through being provided with radiator fan, condenser pipe and radiating fin, can produce higher temperature when effectual a plurality of interfaces of having solved multiple line connection move simultaneously, the relatively poor problem of current many interface circuit base plate heat-sinking capability for the temperature accelerates to give off speed, has reduced thermal piling up, has reduced the probability that leads to many interface circuit base plate electronic components to damage because of high temperature, has improved electronic components's life.

2. The utility model discloses a, through being provided with coupling hook, reset spring and compression plate, effectual solved current circuit substrate and directly fixed through the bolt, because partial user lacks extracting tool, when the circuit board need be maintained and changed, lack the problem that the instrument makes circuit substrate can't obtain quick maintenance and change.

Drawings

FIG. 1 is a schematic structural view of the present invention; FIG. 2 is a schematic view of the structure of the connecting hook, the return spring and the compression plate according to the present invention; FIG. 3 is a schematic structural view of the fixing clip of the present invention; fig. 4 is a schematic structural diagram of the heat dissipation device of the present invention.

In the figure: 1. a heat sink; 2. a carrier plate; 3. a circuit substrate body; 4. mounting a bottom plate; 5. fixing a column; 6. a heat radiation fan; 7. a condenser tube; 8. a heat dissipating fin; 9. a connecting hook; 10. a return spring; 11. a compression plate; 12. connecting sheets; 13. a bolt; 14. fixing the buckle; 15. a threaded rod; 16. a string interface.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to FIGS. 1-4: the utility model provides a PCB circuit substrate of many interfaces, including heat abstractor 1, loading board 2, circuit substrate body 3 and mounting plate 4, heat abstractor 1 sets up in loading board 2 upper surface, loading board 2 below is provided with circuit substrate body 3, loading board 2 lower surface is provided with a plurality of groups of

fixed column

5, 5 one end fixed connection in loading board 2 lower surface of every group fixed column, 5 other end fixed connection in circuit substrate body 3 upper surface of every group fixed column, 3 below of circuit substrate body are provided with mounting plate 4.

Wherein, heat abstractor 1 includes radiator fan 6, condenser pipe 7 and radiating fin 8, and radiator fan 6 is provided with two sets ofly, and every 6 below of radiator fan of group is provided with condenser pipe 7, and condenser pipe 7 is kept away from radiator fan 6 one side and is set up in radiating fin 8 upper surface, and radiating fin 8 lower fixed surface is connected in 2 upper surfaces of loading board, and radiating fin 8 adsorbs the produced high temperature of circuit substrate during operation, reaches radiating effect.

The upper surface of the circuit substrate body 3 is provided with an electronic component circuit and a plurality of groups of serial ports 16, the lower surface of the circuit substrate body 3 is provided with a plurality of groups of connecting hooks 9, and the upper surfaces of the connecting hooks 9 are fixedly connected to the lower surface of the circuit substrate body 3.

Wherein, a plurality of groups of spread grooves have been seted up to mounting plate 4 upper surface, a set of through-hole has been seted up respectively to spread groove inner wall both sides, inside a set of reset spring 10 and the a set of compression board 11 of being provided with of every group through-hole, reset spring 10 one end fixed connection in through-hole inner wall surface, reset spring 10 other end fixed connection is in the 11 side surfaces of compression board, when needing to take off circuit substrate body 3, remove circuit substrate along the spread groove, coupling hook 9 extrusion compression board 11, alright take off circuit substrate.

Wherein, the two sides of the heat radiation fan 6 are provided with a plurality of groups of connecting sheets 12, one end of each group of connecting sheets 12 is fixedly connected with the side surface of the heat radiation fan 6, the upper surface of each group of connecting sheets 12 is provided with a threaded hole, a bolt 13 is arranged in the threaded hole, one end of the bolt 13 passes through the threaded hole arranged on the upper surface of the connecting sheet 12 and is connected with the upper surface of the heat radiation fin 8, the bolt 13 enables the heat radiation fan 6 to be movably connected with the upper surface of the condensation pipe 7, the heat radiation speed is improved by starting the heat radiation fan 6, the accumulation of heat is reduced, the heat radiation fan 6 is common equipment in the prior art, the adopted models and the like can be customized according to the actual use requirements, and the power supply interface of the electric equipment in the utility model is connected with a power supply system through a switch (not shown in the figure) and a lead (not shown in the figure) so as to realize the control of the heat radiation fan, wherein the related circuits and the control are the prior art, as is well known in the art, no further description is provided herein.

Wherein, condenser pipe 7 surface cover is equipped with fixed buckle 14 of a plurality of groups, a plurality of groups screw hole have been seted up to fixed buckle 14 both sides upper surface, threaded hole inside is provided with threaded rod 15, threaded rod 15 one end is passed the screw hole that 14 upper surfaces of fixed buckle seted up and is connected in loading board 2 upper surface, threaded rod 15 makes condenser pipe 7 connect in radiating fin 8 upper surface, condenser pipe 7 lets in the condensate, takes away the produced heat of radiating fin 8 through the circulation of condensate.

In summary, when the multi-interface circuit substrate is used, the heat dissipation fan 6, the condenser tube 7 and the heat dissipation fins 8 are arranged, so that high temperature generated when multiple lines are connected with multiple series interfaces 16 and run simultaneously is reduced, the temperature is accelerated to be dissipated, heat accumulation is reduced, the probability of damage of electronic components of the multi-interface circuit substrate due to high temperature is reduced, the service life of the electronic components is prolonged, the existing circuit substrate is not only fixed through the bolts 13 through the connecting hooks 9, the reset springs 10 and the compression plates 11, and even if some users lack dismounting tools, when the circuit board needs to be repaired and replaced, the circuit substrate can be rapidly repaired and replaced.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a PCB circuit substrate of many interfaces, includes heat abstractor (1), loading board (2), circuit substrate body (3) and mounting plate (4), its characterized in that: the heat dissipation device (1) is arranged on the upper surface of the bearing plate (2), the circuit substrate body (3) is arranged below the bearing plate (2), a plurality of groups of fixing columns (5) are arranged on the lower surface of the bearing plate (2), one end of each group of fixing columns (5) is fixedly connected to the lower surface of the bearing plate (2), the other end of each group of fixing columns (5) is fixedly connected to the upper surface of the circuit substrate body (3), and the mounting base plate (4) is arranged below the circuit substrate body (3).

2. A multi-interface PCB circuit substrate of claim 1, wherein: the heat dissipation device (1) comprises heat dissipation fans (6), condensation pipes (7) and heat dissipation fins (8), wherein the heat dissipation fans (6) are provided with two groups, the condensation pipe (7) is arranged below each group of heat dissipation fans (6), one side, far away from the heat dissipation fans (6), of each condensation pipe (7) is arranged on the upper surfaces of the heat dissipation fins (8), and the lower surfaces of the heat dissipation fins (8) are fixedly connected to the upper surfaces of the bearing plates (2).

3. A multi-interface PCB circuit substrate of claim 1, wherein: the circuit board is characterized in that an electronic element circuit and a plurality of groups of serial ports (16) are arranged on the upper surface of the circuit board body (3), a plurality of groups of connecting hooks (9) are arranged on the lower surface of the circuit board body (3), and the upper surfaces of the connecting hooks (9) are fixedly connected to the lower surface of the circuit board body (3).

4. A multi-interface PCB circuit substrate of claim 1, wherein: a plurality of groups of connecting grooves have been seted up to mounting plate (4) upper surface, and a set of through-hole has been seted up respectively to connecting groove inner wall both sides, and every through-hole of group is inside to be provided with a set of reset spring (10) and a set of compression board (11), and reset spring (10) one end fixed connection is in through-hole inner wall surface, and reset spring (10) other end fixed connection is in compression board (11) side surface.

5. A multi-interface PCB circuit substrate of claim 2, wherein: radiator fan (6) both sides are provided with a plurality of groups connection piece (12), and every group connection piece (12) one end fixed connection is in radiator fan (6) side surface, and threaded hole has been seted up to every group connection piece (12) upper surface, and threaded hole inside is provided with bolt (13), and bolt (13) one end is passed the threaded hole that connection piece (12) upper surface was seted up and is connected in radiating fin (8) upper surface, and bolt (13) make radiator fan (6) swing joint in condenser pipe (7) upper surface.

6. A multi-interface PCB circuit substrate of claim 2, wherein: the condenser pipe is characterized in that a plurality of groups of fixed buckles (14) are sleeved on the outer surface of the condenser pipe (7), a plurality of groups of threaded holes are formed in the upper surfaces of two sides of the fixed buckles (14), threaded rods (15) are arranged in the threaded holes, one end of each threaded rod (15) penetrates through the corresponding threaded hole formed in the upper surface of the corresponding fixed buckle (14) to be connected to the upper surface of the corresponding bearing plate (2), and the condenser pipe (7) is connected to the upper surface of the corresponding radiating fin (8) through the corresponding threaded rod (15).