CN111263560A - Radiator of ultrasonic equipment and ultrasonic equipment - Google Patents
Radiator of ultrasonic equipment and ultrasonic equipment Download PDFInfo
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- CN111263560A CN111263560A CN201811457494.0A CN201811457494A CN111263560A CN 111263560 A CN111263560 A CN 111263560A CN 201811457494 A CN201811457494 A CN 201811457494A CN 111263560 A CN111263560 A CN 111263560A
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- heat
- pipe
- conducting block
- heat sink
- conducting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink and an ultrasonic apparatus. The radiator is provided with a heat conduction pipe, the first end of the heat conduction pipe is arranged on the heat dissipation substrate and is contacted with the heat dissipation substrate, and the second end of the heat conduction pipe is arranged on the heat dissipation substrate in a suspended mode. The heat conducting block of the radiator is contacted with the heat conducting pipe and is fixedly arranged on the suspended second end of the heat conducting pipe. The heat conducting block is used for being in contact with a heating component, can conduct heat energy to the heat conducting pipe, and then is transmitted to the heat radiating substrate through the heat conducting pipe, so that heat radiation is achieved. Because the heat conduction pipe has high heat conductivity coefficient, the heat conduction effect can be ensured. Simultaneously, the unsettled setting of second end of this heat pipe, including heat pipe material itself possess certain elastic deformation ability, when installing the heat conduction piece on the heat pipe second end and the part interference fit that generates heat, the second end of this heat pipe can warp to drive the heat conduction piece and remove to the direction of keeping away from the part that generates heat, under the circumstances of guaranteeing the abundant contact, reduce the part atress that generates heat, avoid causing the part damage that generates heat.
Description
Technical Field
The present application relates to an ultrasonic apparatus, and more particularly, to a heat dissipation structure in an ultrasonic apparatus.
Background
When designing a heat dissipation structure, a PC module (or called a computer module) of an ultrasound device (particularly, a portable ultrasound device) usually utilizes a heat sink to directly contact with a Central Processing Unit (CPU), and heat dissipation is achieved through heat conduction. The heat sink has a boss in direct contact with the CPU, the CPU of the PC module has a height tolerance, and the boss also has a height tolerance. In the final assembly process, the CPU and the boss often have a gap or form interference fit due to the tolerance problem, and if the gap exists between the boss and the CPU, the radiator cannot play a role in heat dissipation; if the heat radiator and the boss are in interference fit, after the heat radiator and the PC module are locked through the screws, the CPU is stressed excessively and damaged.
In order to solve the above problems, it is a common practice to design the boss as a floating structure, and the boss can float up and down within a certain range to change positions. In order to ensure heat conduction, heat conduction silicone grease is filled between the boss and the radiator, but the structure causes large heat conduction resistance and poor heat dissipation effect. The other method is that the radiator is composed of a fixed substrate and an integral floating radiating structure, floating distance and stress are achieved through spring screws, and the integral structure is complex and heavy.
Disclosure of Invention
The application mainly provides a radiator of ultrasonic equipment with simpler structure and better heat dissipation effect and ultrasonic equipment using the radiator.
An embodiment provides a heat sink of an ultrasound device, comprising:
a heat-dissipating substrate;
the heat conduction pipe is provided with a first end and a second end opposite to the first end, the first end is arranged on the heat dissipation substrate and is in contact with the heat dissipation substrate, and the second end is arranged above the heat dissipation substrate in a suspended mode;
and the heat conducting block is in contact with the heat conducting pipe and is fixedly arranged on the suspended second end of the heat conducting pipe.
In one embodiment, the heat dissipation device further comprises an elastic member, the elastic member is mounted on the heat dissipation substrate, and the elastic member provides an acting force for the heat conduction block to urge the heat conduction block to move away from the heat dissipation substrate and towards the direction of the heat generation component.
In one embodiment, a surface of the heat conducting block facing away from the heat dissipation substrate is used for contacting with a heat generating component, and at least a partial region of the heat conducting block protrudes from the heat dissipation substrate.
In one embodiment, the heat dissipation substrate has a heat pipe mounting groove and a heat conduction block mounting groove, the first end of the heat pipe is fixedly mounted in the heat pipe mounting groove, and the second ends of the heat conduction block and the heat pipe are suspended in the heat conduction block mounting groove.
In one embodiment, the elastic member is disposed between the bottom wall of the heat-conducting block mounting groove and the heat-conducting block.
In one embodiment, the heat-dissipating substrate has at least one positioning post, the heat-conducting block has a positioning hole matched with the positioning post, and the heat-conducting block is mounted on the positioning post in a manner of moving along the positioning post.
In one embodiment, the number of the positioning columns is four, and the four positioning columns are arranged in a square shape.
In one embodiment, the outer end of the positioning column is provided with a limiting part, the limiting part is fixedly connected with the positioning column, the limiting part is provided with a limiting part, and the outer diameter of the limiting part is larger than the aperture of the positioning hole of the heat conducting block, so as to limit the heat conducting block from the outer side of the heat conducting block and prevent the heat conducting block from being separated from the positioning column.
In one embodiment, the elastic member comprises a spring and/or a spring plate.
In one embodiment, the heat conducting pipes are distributed on the heat dissipation substrate in a serpentine arrangement.
In one embodiment, the number of the heat conduction pipes is more than two, and the heat conduction pipes are respectively arranged on two sides of the heat conduction block.
An embodiment provides an ultrasound device, further comprising a heat sink as described in any of the above.
In one embodiment, the ultrasound device includes a control circuit board having a central processing unit, the heat sink is disposed facing the central processing unit and is fixedly connected to the control circuit, and the heat conduction block of the heat sink is in contact with the central processing unit.
According to the heat sink of the above embodiment, the heat pipe has a first end mounted on the heat dissipating substrate and contacting the heat dissipating substrate, and a second end suspended above the heat dissipating substrate. The heat conducting block of the radiator is contacted with the heat conducting pipe and is fixedly arranged on the suspended second end of the heat conducting pipe. The heat conducting block is used for contacting with a heating component (such as a CPU), can conduct heat energy to the heat conducting pipe, and then is transferred to the heat radiating substrate through the heat conducting pipe, so that heat radiation is realized. Because the heat conduction pipe has high heat conductivity coefficient, the heat conduction effect can be ensured. Simultaneously, the unsettled setting of second end of this heat pipe, including heat pipe material itself possess certain elastic deformation ability, when installing the heat conduction piece on the heat pipe second end and the part interference fit that generates heat, the second end of this heat pipe can warp to drive the heat conduction piece and remove to the direction of keeping away from the part that generates heat, under the circumstances of guaranteeing the abundant contact, reduce the part atress that generates heat, avoid causing the part damage that generates heat.
Drawings
FIG. 1 is a schematic view of a heat sink according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of a heat sink in one embodiment of the present application;
FIG. 3 is a cross-sectional view of a mating structure of a positioning post and a heat conduction block in an embodiment of the present application;
FIG. 4 is a cross-sectional view of a heat sink and CPU assembled in one embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
Referring to fig. 1, in one embodiment, a heat sink 100 for an ultrasound device is provided. The heat sink 100 includes a heat dissipating substrate 110, a heat pipe 120, and a heat conductive block 130. The heat dissipation substrate 110 is made of a heat conductive material, and may have various shapes and structures for dissipating heat, for example, a plurality of heat dissipation fins 111 may be disposed. The heat pipe 120 is a pipe structure capable of conducting heat well. The heat conductive pipe 120 has a first end and a second end opposite to the first end. The first end is mounted on the heat dissipating substrate 110 and contacts the heat dissipating substrate 110, and the second end is suspended above the heat dissipating substrate 110.
Alternatively, the first end may be fixedly connected to the heat dissipation substrate 110, and the fixed connection may be a detachable fixed connection or a non-detachable fixed connection. For example, in one embodiment, the first end is soldered to the heat-dissipating substrate 110 by solder paste to ensure heat conduction efficiency.
Of course, the first end of the heat pipe 120 may be movably connected to the heat dissipating substrate 110, for example, by sliding connection or other connection methods, in case that the heat conduction efficiency can be ensured.
Referring to fig. 4, the heat conducting block 130 is used to contact with a heat generating component 200 (illustrated as a CPU), and the heat conducting block 130 is fixedly mounted on the suspended second end of the heat conducting pipe 120 so as to contact with the heat conducting pipe 120, so as to conduct the heat emitted from the heat generating component 200 to the heat conducting pipe 120. The heat generating component 200 may be a CPU on a motherboard, a Field-programmable gate Array (FPGA), or the like. The contact of the heat conductive block 130 with the heat generating component 200 includes direct contact with the heat generating component 200 and contact with a component in a heat conductive relationship with the heat generating component 200.
The heat conducting block 130 may be made of a heat conducting material such as copper block. The heat conducting block 130 can be fixedly connected to the second end of the heat conducting pipe 120 by welding or the like, for example, by soldering the second end of the heat conducting pipe 120 with solder paste, so as to ensure the heat conducting efficiency.
Since the heat pipe 120 has a high thermal conductivity, the heat of the heat conducting block 130 can be rapidly transferred to the heat dissipating substrate 110, thereby improving the heat dissipating effect. Meanwhile, the second end of the heat pipe 120 is suspended, and the material of the heat pipe 120 has a certain elastic deformation capability, so that when the heat conducting block 130 mounted on the second end of the heat pipe 120 is in interference fit with the heat generating component 200, the second end of the heat pipe 120 can be deformed, thereby driving the heat conducting block 130 to move in a direction away from the heat generating component 200, and reducing the stress on the heat generating component 200 and avoiding the damage to the heat generating component 200 under the condition of ensuring sufficient contact.
Further, when the heat sink 100 is assembled with the heat generating component 200, considering that the heat pipe may be permanently deformed in a deformed state for a long time, a size difference of the heat conducting block 130 is not expected, which may cause a fit gap between the heat conducting block 130 and a new heat generating component when the heat sink 100 is used again, and eventually the heat sink 100 loses its heat dissipating function. Referring to fig. 3, in one embodiment, the elastic member 400 is further included. The elastic member 400 is mounted on the heat dissipation substrate 110. The elastic member 400 provides a force to the heat conduction block 130 to urge the heat conduction block 130 to move away from the heat dissipation substrate 110 and toward the heat generating component 200. The elastic member 400 provides a certain elastic force to support the heat conducting block 130 when the heat generating component 200 presses the heat conducting block 130, and once the pressure applied by the heat generating component 200 is removed, the force of the elastic member 400 will cause the second ends of the heat conducting block 130 and the heat conducting pipe 120 to be reset, so that the heat sink 100 can be applied to a new heat generating component, and the dimensional change of the heat sink 100 can be controlled within a desired range.
Referring to fig. 3, the elastic member 400 is a spring. Of course, in other embodiments, the resilient member 400 may also take other forms of resilient structures, including springs and/or clips, for example.
Further, referring to fig. 1, in an embodiment, a surface of the heat conducting block 130 away from the heat dissipating substrate 110 is used for contacting with the heat generating component 200, and in order to facilitate the contact between the heat conducting block 130 and the heat generating component 200, at least a partial region 131 of the surface of the heat conducting block 130 away from the heat dissipating substrate 110 is protruded from the heat dissipating substrate 110.
Further, referring to fig. 1-3, in one embodiment, the heat dissipation substrate 110 has a heat pipe installation slot 112 and a heat conduction block installation slot 113. The heat pipe installation groove 112 and the heat conduction block installation groove 113 may be provided in communication or separately. The first end of the heat pipe 120 is fixedly installed in the heat pipe installation groove 112, and the heat conduction block 130 and the second end of the heat pipe 120 are suspended in the heat conduction block installation groove 113. The heat pipe installation groove 112 and the heat conducting block installation groove 113 are configured to enable at least a portion of the heat pipe 120 and the heat conducting block 130 to be located in the heat dissipation substrate 110, which is beneficial to reducing the overall height of the heat sink 100 and reducing the overall size of the heat sink 100. Besides the bottom wall, the side wall of the heat pipe 120 can also contact with the side wall of the heat pipe installation slot 112, so as to increase the contact area and facilitate the heat conduction.
In order to further increase the contact area between the heat pipes 120 and the heat dissipation substrate 110, referring to fig. 1, in one embodiment, the heat pipes 120 are distributed on the heat dissipation substrate 110 in a serpentine configuration. The serpentine arrangement means that the heat conducting pipes 120 are bent and extended on the heat dissipation substrate 110 so that more parts of the heat conducting pipes 120 are in contact with the heat dissipation substrate 110. Correspondingly, when the heat pipe installation groove 112 is provided, the heat pipe installation groove 112 may be provided on the heat dissipation substrate 110 in a meandering manner.
The heat conductive pipe 120 is at least one. Referring to fig. 1-3, in an embodiment, the number of the heat pipes 120 is two or more, and the heat pipes are respectively disposed on two sides of the heat-conducting block 130, so as to fully utilize the space on the heat-dissipating substrate 110, thereby further improving the heat-dissipating effect. The heat conductive pipes 120 may be symmetrically disposed on both sides of the heat conductive block 130, or irregularly disposed on both sides of the heat conductive block 130.
Further, referring to fig. 3, in an embodiment, the heat dissipation substrate 110 has at least one positioning pillar 114. The heat-conducting block 130 has a positioning hole matched with the positioning column 114. The heat-conducting block 130 is mounted on the positioning column 114 in a manner of being movable along the positioning column 114. The positioning posts 114 limit the heat-conducting block 130 to move up and down only along the positioning posts 114, so as to prevent the heat-conducting block 130 from being misplaced and being unable to contact with the corresponding heat-generating component 200.
There is at least one positioning post 114. Referring to fig. 1 and 3, in an embodiment, the number of the positioning pillars 114 is four, and four positioning pillars 114 are disposed in a square shape.
Further, referring to fig. 3, in an embodiment, a limiting member 115 is mounted at an outer end of the positioning pillar 114. The position-limiting element 115 is fixedly connected to the positioning pillar 114, and the position-limiting element 115 has a position-limiting portion. The outer diameter of the limiting portion is larger than the diameter of the positioning hole of the heat-conducting block 130, so as to limit the heat-conducting block 130 from the outer side of the heat-conducting block 130, and prevent the heat-conducting block 130 from separating from the positioning column 114. The position limiting element 115 can be a screw, which is screwed to the positioning pillar 114.
With continued reference to fig. 3, in one embodiment, the elastic member 400 is disposed between the bottom wall of the heat-conducting block mounting groove 113 and the heat-conducting block 130. For example, when the elastic member 400 is a spring, it can be sleeved on the positioning pillars 114 or the region between the positioning pillars 114. Besides, the elastic member 400 can be disposed at any position of the heat dissipating substrate 110.
In another aspect, an embodiment provides an ultrasound device including a heat sink 100 as described in any of the above embodiments. The heat sink 100 may be used on any heat generating component 200 of an ultrasound device, such as a CPU, FPGA, or the like.
Referring to fig. 4, in one embodiment, the ultrasound device includes a control circuit board 210. The control circuit board 210 has a Central Processing Unit (CPU)211, and the heat sink 100 is disposed facing the CPU 211 and fixedly connected to a control circuit. The heat-conducting block 130 of the heat sink 100 contacts the cpu 211, and further conducts heat of the cpu 211 to the heat-dissipating substrate 110, thereby cooling the cpu 211.
The present application has been described with reference to specific examples, which are provided only to aid understanding of the present application and are not intended to limit the present application. Variations of the above-described embodiments may occur to those of ordinary skill in the art in light of the teachings of this application.
Claims (13)
1. A heat sink for an ultrasound device, comprising:
a heat-dissipating substrate;
the heat conduction pipe is provided with a first end and a second end opposite to the first end, the first end is arranged on the heat dissipation substrate and is in contact with the heat dissipation substrate, and the second end is arranged above the heat dissipation substrate in a suspended mode;
and the heat conducting block is in contact with the heat conducting pipe and is fixedly arranged on the suspended second end of the heat conducting pipe.
2. The heat sink of claim 1, further comprising a resilient member mounted on the heat-dissipating substrate, the resilient member providing a force to the heat-conducting block to urge the heat-conducting block away from the heat-dissipating substrate and toward the heat-generating component.
3. The heat sink of claim 2, wherein a surface of the heat conducting block facing away from the heat dissipating substrate is configured to contact a heat generating component, and at least a portion of the area of the heat conducting block protrudes from the heat dissipating substrate.
4. The heat sink according to claim 2 or 3, wherein the heat dissipating substrate has a heat pipe mounting groove and a heat conducting block mounting groove, the first end of the heat pipe is fixedly mounted in the heat pipe mounting groove, and the second ends of the heat conducting block and the heat pipe are suspended in the heat conducting block mounting groove.
5. The heat sink of claim 4, wherein the elastic member is disposed between the bottom wall of the heat-conducting block mounting groove and the heat-conducting block.
6. The heat sink according to any one of claims 2-5, wherein the heat-dissipating substrate has at least one positioning post, the heat-conducting block has a positioning hole matching with the positioning post, and the heat-conducting block is mounted on the positioning post in a manner of being movable along the positioning post.
7. The heat sink as claimed in claim 6, wherein the number of the positioning posts is four, and four positioning posts are arranged in a square.
8. The heat sink as claimed in claim 6 or 7, wherein the positioning post has a limiting member mounted at an outer end thereof, the limiting member is fixedly connected to the positioning post, and the limiting member has a limiting portion having an outer diameter larger than an aperture of the positioning hole of the heat-conducting block for limiting the heat-conducting block from an outer side thereof to prevent the heat-conducting block from being separated from the positioning post.
9. The heat sink according to any of claims 2-8, wherein the elastic member comprises a spring and/or a leaf spring.
10. The heat sink according to any one of claims 1 to 9, wherein the heat conducting pipes are distributed in a serpentine arrangement on the heat dissipating substrate.
11. The heat sink according to any one of claims 1 to 10, wherein the heat conductive pipes are two or more, and are respectively provided on both sides of the heat conductive block.
12. An ultrasound device, further comprising a heat sink according to any one of claims 1-11.
13. The ultrasound device of claim 12, wherein the ultrasound device comprises a control circuit board having a central processing unit, wherein the heat sink is disposed facing the central processing unit and is fixedly connected to the control circuit, and wherein the heat-conducting block of the heat sink is in contact with the central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811457494.0A CN111263560A (en) | 2018-11-30 | 2018-11-30 | Radiator of ultrasonic equipment and ultrasonic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811457494.0A CN111263560A (en) | 2018-11-30 | 2018-11-30 | Radiator of ultrasonic equipment and ultrasonic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111263560A true CN111263560A (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811457494.0A Pending CN111263560A (en) | 2018-11-30 | 2018-11-30 | Radiator of ultrasonic equipment and ultrasonic equipment |
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| Country | Link |
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| CN (1) | CN111263560A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126329A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Heat dissipation assembly and automobile |
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| US20090223647A1 (en) * | 2008-03-05 | 2009-09-10 | Sinan Alousi | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
| CN201928573U (en) * | 2011-01-05 | 2011-08-10 | 广达电脑股份有限公司 | Heat-radiating module |
| US20130064512A1 (en) * | 2011-09-08 | 2013-03-14 | Nayana Ghantiwala | Cooling system for an optical module |
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Application publication date: 20200609 |