CN102958326A - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN102958326A
CN102958326A CN2011102508397A CN201110250839A CN102958326A CN 102958326 A CN102958326 A CN 102958326A CN 2011102508397 A CN2011102508397 A CN 2011102508397A CN 201110250839 A CN201110250839 A CN 201110250839A CN 102958326 A CN102958326 A CN 102958326A
Authority
CN
China
Prior art keywords
fan
fixing hole
fin
heat abstractor
wind scooper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102508397A
Other languages
Chinese (zh)
Inventor
纪锦标
姚志江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN2011102508397A priority Critical patent/CN102958326A/en
Priority to TW100131593A priority patent/TW201309918A/en
Priority to US13/525,483 priority patent/US20130052937A1/en
Publication of CN102958326A publication Critical patent/CN102958326A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a radiating device. The radiating device comprises a radiator, a fan and a wind scooper, wherein the radiator comprises a heat conducting core and a fin group arranged around the heat conducting core; the middle part of the wind scooper is hollow and a wind guide hole is formed in the middle part; the fan comprises a lower plate; the lower plate is put on the radiator and enables the fan to be opposite to the fin group; the wind scooper is installed on the fan; the wind guide hole is opposite to blades of the fan; the fin group comprises a plurality of first fins; the free end of each first fin is provided with a first fixing hole; the lower plate is provided with a plurality of fan fixing holes; the first fixing holes are opposite to the fan fixing holes; and a plurality of first fixing parts are fixed in the first fixing holes and the fan fixing holes.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, the heat abstractor in espespecially a kind of electronic installation.
Background technology
The volume of SFF (Small Form Factor, little encapsulation technology) computer housing is little, and therefore the cooling system for central processing unit and voltage-regulation module has higher requirement.The computer main board of traditional SFF computer housing generally adopts BTX (Balanced Technology Extended, the balance expansion technique) framework, the radiator of the computer case cooling system of this framework has been installed fan usually, usually needs extra fixed structure that fan is fixed on the radiator.
Summary of the invention
In view of above content, be necessary to provide a kind of heat abstractor that makes things convenient for fan attachment.
A kind of heat abstractor, comprise a radiator, one fan and a wind scooper, described radiator comprises a heat conduction core and is arranged on the fins group of heat conduction core periphery, described wind scooper middle part is the air guide hole that forms of hollow, described fan comprises a lower plate, described lower plate is placed on the described radiator and makes described fan relative with described fins group, described wind scooper is installed on the described fan, described air guide hole is relative with the flabellum of described fan, described fins group comprises some the first fins, the free end of each the first fin is provided with one first fixing hole, described lower plate is provided with some fan fixing holes, described the first fixing hole is relative with the fan fixing hole, and some the first fixtures are fixed in described the first fixing hole and the fan fixing hole.
Compared to prior art, heat abstractor of the present invention can fix fan by the fixing hole on the fin, does not need extra fixture.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor one preferred embodiment of the present invention.
Fig. 2 is another three-dimensional exploded view of the heat abstractor of Fig. 1.
Fig. 3 is an assembly drawing of the heat abstractor of Fig. 1.
Fig. 4 is the heat abstractor of Fig. 3 and the stereogram of a circuit board.
The main element symbol description
Radiator 10
Heat conduction core 11
Fins group 12
The first fin 121
The second fin 123
The first fixing hole 124
The second fixing hole 125
Fan 20
Housing 21
Upper plate 23
The wind scooper fixing hole 231
Lower plate 24
The fan fixing hole 241
Wind scooper 30
Air guide hole 31
Fixed leg 32
Grab 34
Circuit board 50
Heater element 51
The radiator fixing hole 53
The second fixture 70
The first fixture 90
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, a preferred embodiment of heat abstractor of the present invention comprises a radiator 10, a fan 20 and a wind scooper 30.
This radiator 10 comprises a heat conduction core 11, the periphery of heat conduction core 11 is provided with the fins group 12 that is comprised of some lamellar radiating fins, these radiating fins are arc, this fins group 12 comprises four the first fins 121, these four the first fins 121 are attached at four sides of heat conduction core 11, and roughly be a right angle between the two first adjacent fins 121, the right side of each the first fin 121 is respectively equipped with one second fin 123; Each first fin 121 is all long and free end that protrude from these fins group 12, the first fins 121 is provided with one first fixing hole 124; Each second fin 123 is all grown and is made its free end protrude from fins group 12, and the second fin 123 to the first fins 121 are long, and the free end of each the second fin 123 is provided with one second fixing hole 125.
This fan 20 comprises that one is centered around a ring frame 21 of some flabellum peripheries of fan 20, housing 21 comprises a upper plate 23 and a lower plate 24, the first fixing hole 124 of four jiaos of corresponding radiators 10 of lower plate 24 is provided with four fan fixing holes 241, and four jiaos of upper plate 23 are provided with four wind scooper fixing holes 231.
This wind scooper 30 is roughly a square framework, and its middle part is the air guide hole 31 that forms of hollow, and this air guide hole 31 is square opening, and 30 4 jiaos of wind scoopers are respectively equipped with a fixed leg 32, and wind scooper 30 is respectively equipped with a grab 34 on each fixed leg 32 next door.
See also Fig. 1 to Fig. 3, when assembling this heat abstractor, the lower plate 24 of fan 20 is placed on the radiator 10, the fan fixing hole 241 of lower plate 24 is alignd with the first fixing hole 124 of radiator 10, some the first fixtures 90 are fixed in fan fixing hole 241 and the first fixing hole 124, thereby fan 20 is fixed in the radiator 10.
Then the fixed leg 32 with wind scooper 30 is fixed in the wind scooper fixing hole 231 of fan 20, the grab of fan 20 is buckled on the upper plate 23 of fan 20, thereby on wind scooper 30 fan attachments 20, herein, the square air guide hole 31 of wind scooper 30 is relative with the flabellum of fan 20.
See also Fig. 4, described heat abstractor can be installed on the circuit board 50, and described circuit board 50 is provided with a heater element 51, and described circuit board 50 is provided with four radiator fixing holes 53 at the periphery of described heater element 51.
When being installed on heat abstractor on the circuit board 50, the heat conduction core 11 of radiator 10 is contacted with heater element 51, the second fixing hole 125 of radiator 10 is alignd with radiator fixing hole 53, four the second fixtures 70 are fixed in the second fixing hole 125 and the radiator fixing hole 53, thereby heat abstractor is fixed on the circuit board 50, the heat that heater element 51 produces is sent on the heat conduction core 11, heat conduction core 11 sends heat to fins group 12, fan 20 rotates and drives air-flow and flow through fins group 12 from air guide hole 31, thereby takes away the heat on it.
The air guide hole 31 of the wind scooper 30 of above-mentioned heat abstractor has larger area for square, thereby can guide more air flow stream passing through fan 20, has improved the radiating efficiency of heat abstractor.

Claims (8)

1. heat abstractor, comprise a radiator, one fan and a wind scooper, described radiator comprises a heat conduction core and is arranged on the fins group of heat conduction core periphery, described wind scooper middle part is the air guide hole that forms of hollow, described fan comprises a lower plate, described lower plate is placed on the described radiator and makes described fan relative with described fins group, described wind scooper is installed on the described fan, described air guide hole is relative with the flabellum of described fan, it is characterized in that: described fins group comprises some the first fins, the free end of each the first fin is provided with one first fixing hole, described lower plate is provided with some fan fixing holes, described the first fixing hole is relative with the fan fixing hole, and some the first fixtures are fixed in described the first fixing hole and the fan fixing hole.
2. heat abstractor as claimed in claim 1, it is characterized in that: the free end of described the first fin protrudes from described fins group.
3. heat abstractor as claimed in claim 2 is characterized in that: roughly be a right angle between the two first adjacent fins.
4. heat abstractor as claimed in claim 2, it is characterized in that: a side of each the first fin is respectively equipped with one second fin, the second fin is longer than the first fin, and the free end of each the second fin is respectively equipped with one second fixing hole, and some the second fixtures can be fixed in the second fixing hole.
5. heat abstractor as claimed in claim 1, it is characterized in that: described air guide hole is square opening.
6. heat abstractor as claimed in claim 1 is characterized in that: four jiaos of described wind scoopers are respectively equipped with a fixed leg, and described fan comprises a upper plate, and described upper plate is provided with four wind scooper fixing holes, and described fixed leg is fixed in the described wind scooper fixing hole.
7. heat abstractor as claimed in claim 6 is characterized in that: described wind scooper is respectively equipped with a grab on each fixed leg next door, and described grab is buckled on the described upper plate.
8. heat abstractor as claimed in claim 1 is characterized in that: described fins group is comprised of some lamellar and curved radiating fins.
CN2011102508397A 2011-08-29 2011-08-29 Radiating device Pending CN102958326A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011102508397A CN102958326A (en) 2011-08-29 2011-08-29 Radiating device
TW100131593A TW201309918A (en) 2011-08-29 2011-09-02 Heat dissipation apparatus
US13/525,483 US20130052937A1 (en) 2011-08-29 2012-06-18 Heat dissipation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102508397A CN102958326A (en) 2011-08-29 2011-08-29 Radiating device

Publications (1)

Publication Number Publication Date
CN102958326A true CN102958326A (en) 2013-03-06

Family

ID=47744386

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102508397A Pending CN102958326A (en) 2011-08-29 2011-08-29 Radiating device

Country Status (3)

Country Link
US (1) US20130052937A1 (en)
CN (1) CN102958326A (en)
TW (1) TW201309918A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108803829A (en) * 2017-04-27 2018-11-13 鸿富锦精密工业(武汉)有限公司 Radiator

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM465602U (en) * 2013-05-22 2013-11-11 Tai Sol Electronics Co Ltd Heat dissipating apparatus
CN104602492B (en) * 2015-01-19 2017-12-22 佛山市顺德区容桂旭升电器实业有限公司 A kind of efficient aluminum profile heat radiator
CN106028742A (en) * 2016-05-10 2016-10-12 张立 Heat dissipation module for storage battery charger

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193524A (en) * 2006-11-24 2008-06-04 鈤新科技股份有限公司 Combination method of heat radiation body and thermal pipe and its combination structure
CN101377705A (en) * 2007-08-30 2009-03-04 鸿富锦精密工业（深圳）有限公司 Computer
CN201438286U (en) * 2009-06-18 2010-04-14 鸿富锦精密工业（深圳）有限公司 Foolproof device of heat radiation system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100499975C (en) * 2005-09-12 2009-06-10 富准精密工业(深圳)有限公司 Radiating device
CN201601122U (en) * 2009-12-17 2010-10-06 鸿富锦精密工业（深圳）有限公司 Radiating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193524A (en) * 2006-11-24 2008-06-04 鈤新科技股份有限公司 Combination method of heat radiation body and thermal pipe and its combination structure
CN101377705A (en) * 2007-08-30 2009-03-04 鸿富锦精密工业（深圳）有限公司 Computer
CN201438286U (en) * 2009-06-18 2010-04-14 鸿富锦精密工业（深圳）有限公司 Foolproof device of heat radiation system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108803829A (en) * 2017-04-27 2018-11-13 鸿富锦精密工业(武汉)有限公司 Radiator

Also Published As

Publication number Publication date
TW201309918A (en) 2013-03-01
US20130052937A1 (en) 2013-02-28

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130306