TW201309918A - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

Info

Publication number
TW201309918A
TW201309918A TW100131593A TW100131593A TW201309918A TW 201309918 A TW201309918 A TW 201309918A TW 100131593 A TW100131593 A TW 100131593A TW 100131593 A TW100131593 A TW 100131593A TW 201309918 A TW201309918 A TW 201309918A
Authority
TW
Taiwan
Prior art keywords
fan
fin
fixing hole
fixing
air guiding
Prior art date
Application number
TW100131593A
Other languages
Chinese (zh)
Inventor
jin-biao Ji
Zhi-Jiang Yao
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201309918A publication Critical patent/TW201309918A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation apparatus includes a heat sink, a fan, and an air duct. The heat sink includes a core and a group of fins mounted on peripheral of the core. The air duct is hollow and defines an air ducting opening. The fan includes a bottom plate which is located on the heat sink to align the group of fin with the fan. The air duct is mounted on the fan and aligned to vanes of the fan. The group of fins includes a plurality of first fins. Free end of each first fin defines a first securing hole. The bottom plate defines a plurality of fan securing holes. The first securing holes are aligned to the fan securing holes. A plurality of first securing pins is mounted in the first securing holes and the fan securing holes.

Description

散熱裝置Heat sink

本發明涉及一種散熱裝置，尤指一種電子裝置中之散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device in an electronic device.

SFF(Small Form Factor，小封裝技術)電腦機箱之體積小，因此對於中央處理器與電壓調節模組之散熱系統具有更高之要求。傳統之SFF電腦機箱之電腦主機板一般採用BTX(Balanced Technology Extended，平衡擴展技術)架構，該種架構之電腦機箱散熱系統之散熱器通常安裝了風扇，通常需要額外之固定結構將風扇固定到散熱器上。The SFF (Small Form Factor) computer case is small in size, so it has higher requirements for the heat dissipation system of the central processing unit and the voltage regulation module. The computer motherboard of the traditional SFF computer chassis generally adopts the BTX (Balanced Technology Extended) architecture. The heat sink of the computer chassis cooling system of this architecture usually has a fan installed, and usually requires an additional fixed structure to fix the fan to the heat dissipation. On the device.

鑒於以上內容，有必要提供一種可方便固定風扇之散熱裝置。In view of the above, it is necessary to provide a heat sink that can easily fix a fan.

一種散熱裝置，包括一散熱器、一風扇與一導風罩，該散熱器包括一導熱芯與設定於導熱芯周邊之鰭片組，該導風罩中部為中空之而形成一導風口，該風扇包括一下板，該下板放置於該散熱器上並使該風扇與該鰭片組相對，該導風罩安裝於該風扇上，該導風口與該風扇之扇葉相對，該鰭片組包括複數第一鰭片，每一第一鰭片之自由端設有一第一固定孔，該下板設有複數風扇固定孔，該第一固定孔與風扇固定孔相對，複數第一固定件固定到該第一固定孔與風扇固定孔中。A heat dissipating device includes a heat sink, a fan and a wind deflector. The heat sink includes a heat conducting core and a fin set disposed around the heat conducting core, and the middle portion of the air guiding cover is hollow to form an air guiding port. The fan includes a lower plate, the lower plate is placed on the heat sink, and the fan is opposite to the fin set. The air guiding cover is mounted on the fan, and the air guiding port is opposite to the fan blade of the fan. The first fin has a first fixing hole, and the lower end of the first fin is provided with a first fixing hole. The lower plate is provided with a plurality of fan fixing holes. The first fixing hole is opposite to the fan fixing hole, and the plurality of first fixing members are fixed. Go to the first fixing hole and the fan fixing hole.

相較於習知技術，本發明散熱裝置藉由鰭片上之固定孔即可將風扇固定好，不需要額外之固定裝置。Compared with the prior art, the heat dissipating device of the present invention can fix the fan by the fixing holes on the fins, and no additional fixing device is needed.

請參閱圖1，本發明散熱裝置之一較佳實施例包括一散熱器10、一風扇20與一導風罩30。Referring to FIG. 1 , a preferred embodiment of the heat sink of the present invention includes a heat sink 10 , a fan 20 and an air duct 30 .

該散熱器10包括一導熱芯11，導熱芯11之周邊設有由複數頁片狀之散熱鰭片組成之鰭片組12，該等散熱鰭片為弧形，該鰭片組12包括四個第一鰭片121，這四個第一鰭片121連結於導熱芯11之四側，且相鄰之兩第一鰭片121之間大致呈一直角，每一第一鰭片121之右側分別設有一第二鰭片123；每一第一鰭片121均較長而突出於該等鰭片組12，第一鰭片121之自由端設有一第一固定孔124；每一第二鰭片123均較長而使其自由端突出於鰭片組12，且第二鰭片123比第一鰭片121長，每一第二鰭片123之自由端設有一第二固定孔125。The heat sink 10 includes a heat conducting core 11 . The periphery of the heat conducting core 11 is provided with a fin set 12 composed of a plurality of sheet fins. The heat sink fins are curved, and the fin set 12 includes four. The first fins 121 are connected to the four sides of the heat conducting core 11 , and the adjacent first fins 121 are substantially at right angles, and the right sides of each of the first fins 121 are respectively A second fin 123 is disposed; each of the first fins 121 is longer and protrudes from the fin set 12, and a free end of the first fin 121 is provided with a first fixing hole 124; each second fin The second fins 123 are longer than the first fins 121 , and the second fins 123 are provided with a second fixing hole 125 at the free end of each of the second fins 123 .

該風扇20包括一圍繞於風扇20之複數扇葉周邊之一環形外框21，外框21包括一上板23與一下板24，下板24之四角對應散熱器10之第一固定孔124設有四個風扇固定孔241，上板23之四角設有四個導風罩固定孔231。The fan 20 includes an annular outer frame 21 surrounding a plurality of blades of the fan 20. The outer frame 21 includes an upper plate 23 and a lower plate 24. The four corners of the lower plate 24 correspond to the first fixing holes 124 of the heat sink 10. There are four fan fixing holes 241, and four air guiding cover fixing holes 231 are provided at four corners of the upper plate 23.

該導風罩30大致為一方形框體，其中部為中空之而形成一導風口31，該導風口31為方形之開口，導風罩30四角分別設有一固定柱32，導風罩30於每一固定柱32旁邊分別設有一卡鉤34。The air guiding cover 30 is substantially a square frame body, and a hollow portion thereof is formed to form a wind guiding opening 31. The air guiding opening 31 is a square opening. The four corners of the air guiding cover 30 are respectively provided with a fixing post 32, and the air guiding cover 30 is respectively A hook 34 is disposed beside each of the fixing posts 32.

請一併參閱圖1至圖3，組裝該散熱裝置時，將風扇20之下板24放置於散熱器10上，使下板24之風扇固定孔241與散熱器10之第一固定孔124對齊，複數第一固定件90固定到風扇固定孔241與第一固定孔124中，從而將風扇20固定到散熱器10中。Referring to FIG. 1 to FIG. 3 together, when the heat dissipating device is assembled, the lower plate 24 of the fan 20 is placed on the heat sink 10, and the fan fixing hole 241 of the lower plate 24 is aligned with the first fixing hole 124 of the heat sink 10. The plurality of first fixing members 90 are fixed to the fan fixing holes 241 and the first fixing holes 124, thereby fixing the fan 20 into the heat sink 10.

然後將導風罩30之固定柱32固定到風扇20之導風罩固定孔231中，將風扇20之卡鉤卡扣於風扇20之上板23上，從而將導風罩30固定風扇20上，於此處，導風罩30之方形之導風口31與風扇20之扇葉相對。Then, the fixing post 32 of the air guiding cover 30 is fixed to the air guiding cover fixing hole 231 of the fan 20, and the hook of the fan 20 is buckled on the upper plate 23 of the fan 20, thereby fixing the air guiding cover 30 to the fan 20. Here, the square air guiding port 31 of the air guiding hood 30 is opposed to the fan blade of the fan 20.

請參閱圖4，該散熱裝置可安裝於一電路板50上，該電路板50上設有一發熱元件51，該電路板50於該發熱元件51之周邊設有四個散熱器固定孔53。Referring to FIG. 4, the heat sink can be mounted on a circuit board 50. The circuit board 50 is provided with a heat generating component 51. The circuit board 50 is provided with four heat sink fixing holes 53 around the heat generating component 51.

將散熱裝置安裝於電路板50上時，將散熱器10之導熱芯11與發熱元件51相接觸，將散熱器10之第二固定孔125與散熱器固定孔53對齊，四個第二固定件70固定到第二固定孔125與散熱器固定孔53中，從而將散熱裝置固定到電路板50上，發熱元件51產生之熱量被傳送到導熱芯11上，導熱芯11將熱量傳送給鰭片組12，風扇20轉動而驅動氣流從導風口31流過鰭片組12，從而帶走其上之熱量。When the heat sink is mounted on the circuit board 50, the heat conducting core 11 of the heat sink 10 is in contact with the heat generating component 51, and the second fixing hole 125 of the heat sink 10 is aligned with the heat sink fixing hole 53, four second fixing members. 70 is fixed to the second fixing hole 125 and the heat sink fixing hole 53, thereby fixing the heat sink to the circuit board 50, heat generated by the heat generating component 51 is transmitted to the heat conducting core 11, and the heat conducting core 11 transfers heat to the fin In group 12, fan 20 rotates to drive airflow from air deflector 31 through fin set 12, thereby removing heat from it.

上述散熱裝置之導風罩30之導風口31為方形而具有較大之面積，從而可導引較多之氣流流過風扇20，提高了散熱裝置之散熱效率。The air guiding opening 31 of the air guiding cover 30 of the heat dissipating device has a square shape and a large area, so that more airflow can be guided to flow through the fan 20, thereby improving the heat dissipation efficiency of the heat dissipating device.

綜上所述，本發明係合乎發明專利申請條件，爰依法提出專利申請。惟，以上所述僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following claims.

10．．．散熱器10. . . heat sink

11．．．導熱芯11. . . Thermal core

12．．．鰭片組12. . . Fin set

121．．．第一鰭片121. . . First fin

123．．．第二鰭片123. . . Second fin

124．．．第一固定孔124. . . First fixing hole

125．．．第二固定孔125. . . Second fixing hole

20．．．風扇20. . . fan

21．．．外框twenty one. . . Outer frame

23．．．上板twenty three. . . On board

231．．．導風罩固定孔231. . . Air hood fixing hole

24．．．下板twenty four. . . Lower plate

241．．．風扇固定孔241. . . Fan fixing hole

30．．．導風罩30. . . Wind shield

31．．．導風口31. . . Air guide

32．．．固定柱32. . . Fixed column

34．．．卡鉤34. . . Hook

50．．．電路板50. . . Circuit board

51．．．發熱元件51. . . Heating element

53．．．散熱器固定孔53. . . Radiator fixing hole

70．．．第二固定件70. . . Second fixture

90．．．第一固定件90. . . First fixture

圖1係本發明散熱裝置一較佳實施例之立體分解圖。1 is a perspective exploded view of a preferred embodiment of a heat sink of the present invention.

圖2係圖1之散熱裝置之另一立體分解圖。2 is another perspective exploded view of the heat sink of FIG. 1.

圖3係圖1之散熱裝置之一組裝圖。Figure 3 is an assembled view of one of the heat sinks of Figure 1.

圖4係圖3之散熱裝置與一電路板之立體圖。4 is a perspective view of the heat sink and a circuit board of FIG. 3.

10．．．散熱器10. . . heat sink

11．．．導熱芯11. . . Thermal core

12．．．鰭片組12. . . Fin set

121．．．第一鰭片121. . . First fin

123．．．第二鰭片123. . . Second fin

124．．．第一固定孔124. . . First fixing hole

125．．．第二固定孔125. . . Second fixing hole

20．．．風扇20. . . fan

21．．．外框twenty one. . . Outer frame

23．．．上板twenty three. . . On board

231．．．導風罩固定孔231. . . Air hood fixing hole

24．．．下板twenty four. . . Lower plate

241．．．風扇固定孔241. . . Fan fixing hole

30．．．導風罩30. . . Wind shield

31．．．導風口31. . . Air guide

32．．．固定柱32. . . Fixed column

34．．．卡鉤34. . . Hook

70．．．第二固定件70. . . Second fixture

90．．．第一固定件90. . . First fixture

Claims (8)

一種散熱裝置，包括一散熱器、一風扇與一導風罩，該散熱器包括一導熱芯與設定於導熱芯周邊之鰭片組，該導風罩中部為中空之而形成一導風口，該風扇包括一下板，該下板放置於該散熱器上並使該風扇與該鰭片組相對，該導風罩安裝於該風扇上，該導風口與該風扇之扇葉相對，該鰭片組包括複數第一鰭片，每一第一鰭片之自由端設有一第一固定孔，該下板設有複數風扇固定孔，該第一固定孔與風扇固定孔相對，複數第一固定件固定到該第一固定孔與風扇固定孔中。A heat dissipating device includes a heat sink, a fan and a wind deflector. The heat sink includes a heat conducting core and a fin set disposed around the heat conducting core, and the middle portion of the air guiding cover is hollow to form an air guiding port. The fan includes a lower plate, the lower plate is placed on the heat sink, and the fan is opposite to the fin set. The air guiding cover is mounted on the fan, and the air guiding port is opposite to the fan blade of the fan. The first fin has a first fixing hole, and the lower end of the first fin is provided with a first fixing hole. The lower plate is provided with a plurality of fan fixing holes. The first fixing hole is opposite to the fan fixing hole, and the plurality of first fixing members are fixed. Go to the first fixing hole and the fan fixing hole. 如申請專利範圍第1項所述之散熱裝置，其中該第一鰭片之自由端突出於該鰭片組。The heat sink of claim 1, wherein the free end of the first fin protrudes from the fin set. 如申請專利範圍第2項所述之散熱裝置，其中相鄰之兩第一鰭片之間大致呈一直角。The heat dissipating device of claim 2, wherein the adjacent two first fins are substantially at right angles. 如申請專利範圍第2項所述之散熱裝置，其中每一第一鰭片之一側分別設有一第二鰭片，第二鰭片比第一鰭片長，每一第二鰭片之自由端分別設有一第二固定孔，複數第二固定件可固定於第二固定孔中。The heat dissipating device of claim 2, wherein one side of each of the first fins is respectively provided with a second fin, and the second fin is longer than the first fin, and the free end of each second fin A second fixing hole is respectively disposed, and the plurality of second fixing members can be fixed in the second fixing hole. 如申請專利範圍第1項所述之散熱裝置，其中該導風口為方形之開口。The heat dissipating device of claim 1, wherein the air guiding opening is a square opening. 如申請專利範圍第1項所述之散熱裝置，其中該導風罩四角分別設有一固定柱，該風扇包括一上板，該上板上設有四個導風罩固定孔，該固定柱固定到該導風罩固定孔中。The heat dissipating device of claim 1, wherein the air guiding hood is respectively provided with a fixing column, the fan comprises an upper plate, and the upper plate is provided with four air guiding cover fixing holes, and the fixing column is fixed. Go to the air hood fixing hole. 如申請專利範圍第6項所述之散熱裝置，其中該導風罩於每一固定柱旁邊分別設有一卡鉤，該卡鉤卡扣於該上板上。The heat dissipating device of claim 6, wherein the air guiding cover is respectively provided with a hook beside each fixing post, and the hook is fastened to the upper plate. 如申請專利範圍第1項所述之散熱裝置，其中該鰭片組由複數頁片狀且呈弧形之之散熱鰭片組成。The heat dissipating device of claim 1, wherein the fin group is composed of a plurality of fin-shaped and arc-shaped fins.
TW100131593A 2011-08-29 2011-09-02 Heat dissipation apparatus TW201309918A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102508397A CN102958326A (en) 2011-08-29 2011-08-29 Radiating device

Publications (1)

Publication Number Publication Date
TW201309918A true TW201309918A (en) 2013-03-01

Family

ID=47744386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100131593A TW201309918A (en) 2011-08-29 2011-09-02 Heat dissipation apparatus

Country Status (3)

Country Link
US (1) US20130052937A1 (en)
CN (1) CN102958326A (en)
TW (1) TW201309918A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM465602U (en) * 2013-05-22 2013-11-11 Tai Sol Electronics Co Ltd Heat dissipating apparatus
CN104602492B (en) * 2015-01-19 2017-12-22 佛山市顺德区容桂旭升电器实业有限公司 A kind of efficient aluminum profile heat radiator
CN106028742A (en) * 2016-05-10 2016-10-12 张立 Heat dissipation module for storage battery charger
CN108803829A (en) * 2017-04-27 2018-11-13 鸿富锦精密工业(武汉)有限公司 Radiator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100499975C (en) * 2005-09-12 2009-06-10 富准精密工业(深圳)有限公司 Radiating device
CN101193524B (en) * 2006-11-24 2010-05-12 鈤新科技股份有限公司 Combination method of heat radiation body and thermal pipe and its combination structure
CN101377705B (en) * 2007-08-30 2012-08-29 鸿富锦精密工业（深圳）有限公司 Computer
CN201438286U (en) * 2009-06-18 2010-04-14 鸿富锦精密工业（深圳）有限公司 Foolproof device of heat radiation system
CN201601122U (en) * 2009-12-17 2010-10-06 鸿富锦精密工业（深圳）有限公司 Radiating device

Also Published As

Publication number Publication date
CN102958326A (en) 2013-03-06
US20130052937A1 (en) 2013-02-28

Similar Documents

Publication Publication Date Title
TWI573519B (en) Portable electronic apparatus and thermal module tehreof
TWM472230U (en) Cooling device of interface card
TW201305794A (en) Electronic device
TW201314425A (en) Radiator device and electronic device using same
TW201443345A (en) Electronic device and air duct of the same
TW201309180A (en) Electronic device
TW201238455A (en) Dissipating heat system
TW201309918A (en) Heat dissipation apparatus
TWI487474B (en) Electronic device
TW201538063A (en) Electronic device and cooling fan thereof
TWI397369B (en) Heat dissipation device
TW201416822A (en) Heat dissipation apparatus assembly
CN101340795A (en) Heat radiating device
TW201248371A (en) Heat dissipating system for computer
TW201304671A (en) Heat sink assembly
CN210864590U (en) Supplementary heat dissipation formula all-in-one
TWI564699B (en) Heat sink assembly and graphics card module
TW200906284A (en) Heat dissipating device
TWI716739B (en) Power Supplier
TW201146152A (en) Air duct
TW201641825A (en) Fan and fan assembly
TWI811119B (en) Display device
KR200456335Y1 (en) cooling device of electronic equipment
TW201422126A (en) Circuit board module and electronic apparatus
TWI507862B (en) Electronic device and heat dissipation module thereof