TW200906284A - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

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Publication number
TW200906284A
TW200906284A TW96127478A TW96127478A TW200906284A TW 200906284 A TW200906284 A TW 200906284A TW 96127478 A TW96127478 A TW 96127478A TW 96127478 A TW96127478 A TW 96127478A TW 200906284 A TW200906284 A TW 200906284A
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Taiwan
Prior art keywords
air
air inlet
fan
heat sink
hood
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TW96127478A
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Chinese (zh)
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TWI329490B (en
Inventor
Peng Liu
Jun Cao
Shi-Wen Zhou
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Foxconn Tech Co Ltd
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Publication of TWI329490B publication Critical patent/TWI329490B/en

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Abstract

A heat dissipating device for dissipating heat from an electronic component, includes a heat sink contacting the electronic component, a first fan mounted on the heat sink, and a fan duct attached to the heat sink for sandwiching the first fan between the heat sink and the fan duct. The fan duct has an outlet oriented to the heat sink, and an inlet away from the heat sink and oriented towards another electronic component. An airflow flowing through the inlet is oriented perpendicular to another airflow flowing through the outlet of the fan duct.

Description

200906284 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種散熱裝置,特別係指一種對電子元器 件散熱之散熱裝置。 【先前技術】 安裝於電腦主板上之電子元器件在運行時會產生大量 之熱量’該等熱量如果不能被有效地散去’將直接導致溫 度急劇上升,而嚴重影響到電子元器件之工作效率。為此, 通常在電子元器件上安裝一散熱裝置來進行散熱。 傳統之散熱裝置包括一安裝於中央處理器(CPU)上之 散熱器及固定於散熱器上之一風扇。為了提高風扇之氣流 效率,通常還在散熱器上加裝一導風罩。所述導風罩用於 將風扇所產生之氣流集中地引導至散熱器,使散熱器迅速 與外界換熱,進而使CPU能獲得較高之散熱效率。但是, 主板上還存在其他熱源,比如電壓調節模組(VRM),該種 散熱裝置導風罩所引導之氣流僅能對CPU進行散熱,而無 法吹至VRM,使其熱量得不到及時之散發,進而影響工作 效率。 【發明内容】 有鑒於此,有必要提供一能同時對多個電子元器件散 熱之散熱裝置。 一種散熱裝置,用於對電子元器件散熱,其包括一與 一電子元器件接觸之散熱器、一安裝於散熱器上之第一風 200906284 扇、及 ' 一導風罩,該缉_ )5i g门 ... v風罩固定於第一風扇上而將第一風 扇夾置於導風罩和散熱器之間,料風罩具有—出風口及 -進風口,該導風罩之出風口靠向散熱器,該導風罩之進 風口遠離散熱器且朝向另—带 σ ^安 乃 屯子兀斋件’該導風罩進風口 之進風方向垂直於出風口之出風方向。 a與習知技術相比’本發明散熱裝置之導風罩可將風扇 之氣流引導至同時對多個電子元器件進行散熱,使熱量得 到及時散m確保料電子元器狀正常運作。 【實施方式】 一。如圖1所示,本發明之散熱裝置用於同時對多個電子 儿器件進行散熱,纟包括—與中央處理器(圖未示)接觸 之散熱器10、安裝於散熱器10 一側之二風扇30、及一固 疋於風扇30上之導風罩40。所述中央處理器安裝於一具有 電壓調節模組(圖未示)之電路板(目未示)上,所述電 壓調節模組位於中央處理器附近。 如圖2所示,上述散熱器1〇安裝於中央處理器上,其 包括一基座14及一結合於基座14上之散熱體12。所述基 座14進一步包括一矩形板體14〇,其下表面與中央處理器 接觸而吸收其產生之熱量。該板體14〇下表面靠近四角處 向下垂直延伸出四扣腳142,其中每一扣腳1 42均開設有一 通孔(圖未示),供螺桿件20穿設而將基座14固定於電 路板上。所述散熱體12包括一長方體122及一矩形凸塊 124。所述凸塊124自長方體122背側面之下部垂直向外凸 200906284 出,從而與長方體122共同形成所述散熱體丨2之底面乂 和基座Η上表面接觸而將基座14所吸收之熱量傳二 個散熱器ίο。所述散熱體12之底面積小於基座14之面/ 從而使基座Μ之一部分延伸超出散熱體12之底面,以貝 風扇30和導風罩40放置於其上。八固定孔(圖未: 散熱體邊界開設於長方體122<前側面,用於鱼相應: 螺絲(圖未示)配合而將風扇3〇固定於散熱器1〇上广 —上述二風扇3G均為軸流風扇,其結合至散熱器⑺之 則側面:每-風扇30均呈矩形,其四角處均開設有四螺孔 32,該寻螺孔32與散熱器1〇上之固定孔相對應,從而使 螺絲能夠穿過該㈣孔32而螺鎖於散熱器、⑺之固定孔 内,進而將風扇30固定於散熱器1〇上。所述二風扇3〇相 互毗鄰’且沿散熱器1〇高度方向固定於散熱器⑺之前側 面,其中一風扇3(Η立於散熱器1〇下部區域且與散熱器ι〇 基座Η之上表面接觸,另—風扇%位於散熱器、上部區 域’該=風扇30之前表面處於同一平面。所述二風扇30 與,熱器1G間之接觸面積與散熱體12之前侧面面積大致 相等’從而使氣流能到達整個散熱器1〇。 ,上述導風罩40固定於二風扇3〇上從而將風扇3〇失置 於導j 40和散熱器1〇之間。該導風罩40包括-頂板 /則板44、一擋板46、及二側板48。所述頂板42呈 矩形、八平行於上述散熱器10之基座14。該頂板42兩側 區域分別開設二對稱之圓形通孔420,以方便對散熱器10 進行操作。該頂板42 之前端向下垂直延伸出一前板44,該 8 200906284 前板44平行於上述散熱器1〇之前側面,其尺寸與一相對 之風扇30大致相等,其中部區域開設出一第一進風口 440,,供風扇30之氣流垂直地通過。所述第一進風口 44〇 :形成-網狀結構442。該網狀結構442由複數相互等間隔 設,且内徑逐漸增大之環狀本體(圖未標)及複數連接該 等壞狀本體及第—進風口楊内緣之條狀本體(圖未標) 形成’其中内徑最小之環狀本體圍設出-圓形之通口 444。 所述條狀本體傾斜地結合至環狀本體而關於通口 444呈螺 旋式刀佈,其中每—條狀本體之—端結合至最内部之環狀 本體,另—端穿過其他之環狀本體而結合至第一進風口 44〇 之内緣’從而將環狀本體固定於導風罩4G上。該網狀結構 4=用於防止操作者因粗心、觸摸風扇3Q騎(圖未標)而 遭受到不必要之傷害。所述前板44向下傾斜地延伸而形成 上述控板46。該擋板46進一步包括一弧形止擋部462及-平板形止擋部464,該弧形止擋部462自前板44之下緣向 卜I伸而出,5亥平板形止擋部464平行於前板44向下延伸 且形成於上述弧形止擔部462之下緣,進而形成一内徑向 下逐漸增大之通風口。m述純42之兩側緣分別垂直向下 延伸出二相互平行之側板48,其中每—側板料均垂直於前 2 44和項板42,且與前板44和擒板46之相應側邊相結 合,從而一同構成上述導風罩4〇之大體框架。 ,、凊一併參閱圖3和圖4’所述二侧板48與頂板42共同 形成-矩形之出風σ ,該出風〇 48〇之出風方向垂直於 散熱器1〇之前側面且平行於第-進風口 440之進風方向; 200906284 板48與擋板46共同圍設出—位於散熱器Η)基座 14上敎矩形之第二進風口 _,該第二進風口糊之進 風方向垂直於頂板42和卜進風D44Q之進風方向。上述 弟一、第二進風口 440、偏及出風口彻相互連通,從而 分別形成供風扇3Q氣流穿過之二氣流通路。所述側板Μ =頂板42之邊緣垂直向内形成四左右對稱之片體482,該 寻片體482位於導風罩4〇之出風口 48〇,其中二片體術 形成於側板48之中部,另外二片體術形成於側板❹ 頂板42之連接處。該等片體奶通過膠合而固定至風扇川 之上部區域,其中每—片體482與位於風扇%上部之螺孔 32相互對應。二側板48之下部分別垂直向内彎折出二固定 部484’該二固定部揚位於導風罩*之出風口彻,且 與上述四片體482共面,其中每—固定部彻均開設一圓 孔486 °如圖2所不,二螺桿件6〇分別穿過該二圓孔彻 及位=風扇30下部之二螺孔32,再螺接於散熱器1〇相應 之固疋孔内,從而將導風罩4〇固定於風扇3〇上。此時導 風罩40之出風口 480靠向二風扇3〇,第一進風口 44〇遠離 上部之=扇30且相對設置於該風扇3〇之前方,第二進風 口 460遠離下部之風扇3〇且靠向電壓調節模組。 抑使用該散熱裝置時,散熱器10之基座14吸收中央處理 為所產生之熱量之後,將熱量散佈至整個散熱體12。由於 風扇30位於散熱器1〇上部,其產生之氣流穿過第一進風 口 440和出風口 480而直接吹至散熱器1〇上部區域。另_風 扇30由扇葉之旋轉而產生氣流;由於第二進風口 46〇靠向電 200906284 壓調節模組’這部分氣流可預先流經電壓調節模组而對其 進行散熱,之後再進人第:進心偏;然難導風罩化 擋板46所止擋而改變氣流方向’經由出風口彻流出而吹至 散熱器10下部區域,從而實現對中央處理器之散埶。掉 明之散熱裝置可同時對多個電子Μ件散熱,確㈣正^ 運作。 中 θ综上所述,本發明4已符合發明專利之要件,遂依法 提出專利中請。惟’以上所述者僅為本發明之較佳實施例, 自不能以此限制本案之中請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化 : 蓋於以下申請專利範圍内。 、叫 【圖式簡單說明】 圖1係本發明實施例之立體組裝圖。 圖2係圖1之立體分解圖。 圖3係圖1中導風罩之立體圖。 圖4係圖3之倒置圖。 【主要元件符號說明】 散熱器 10 散熱體 12 長方體 122 凸塊 124 基座 14 板體 140 扣腳 142 螺桿件 20、60 風扇 30 螺孔 32 導風罩 40 頂板 42 44200906284 通孔 420 前板 第一進風口 440 網狀結構 通口 444 擋板 第二進風口 460 弧形止擋部 平板形止擋部 464 侧板 出風口 480 片體 固定部 484 圓孔 442 46 462 48 482 486 12200906284 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] The electronic components mounted on the computer motherboard generate a large amount of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature, which will seriously affect the working efficiency of electronic components. . To this end, a heat sink is usually mounted on the electronic components for heat dissipation. A conventional heat sink includes a heat sink mounted on a central processing unit (CPU) and a fan fixed to the heat sink. In order to improve the airflow efficiency of the fan, an air hood is usually added to the radiator. The air hood is used to guide the airflow generated by the fan to the heat sink, so that the heat sink can quickly exchange heat with the outside, so that the CPU can obtain higher heat dissipation efficiency. However, there are other heat sources on the motherboard, such as a voltage regulation module (VRM). The airflow guided by the air duct of the heat sink can only dissipate heat to the CPU, but cannot be blown to the VRM, so that the heat cannot be obtained in time. Distribute, which in turn affects work efficiency. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink capable of dissipating heat to a plurality of electronic components at the same time. A heat dissipating device for dissipating heat from an electronic component, comprising: a heat sink in contact with an electronic component, a first wind 200906284 fan mounted on the heat sink, and an air deflector, the 缉 _ 5i g door... v hood is fixed on the first fan and the first fan is sandwiched between the air hood and the radiator. The hood has an air outlet and an air inlet, and the air outlet of the air hood Abutting against the radiator, the air inlet of the air hood is away from the radiator and faces the other side with the σ ^An Nai Zizi 兀 件 '''''''''''''' Compared with the prior art, the air hood of the heat dissipating device of the present invention can guide the airflow of the fan to simultaneously dissipate heat of a plurality of electronic components, so that the heat can be dissipated in time to ensure the normal operation of the material electronic device. [Embodiment] One. As shown in FIG. 1 , the heat dissipating device of the present invention is used for simultaneously dissipating heat from a plurality of electronic devices, and includes a heat sink 10 that is in contact with a central processing unit (not shown) and two sides mounted on the side of the heat sink 10 . The fan 30 and a windshield 40 fixed to the fan 30. The central processing unit is mounted on a circuit board (not shown) having a voltage regulating module (not shown), and the voltage regulating module is located near the central processing unit. As shown in FIG. 2, the heat sink 1 is mounted on a central processing unit, and includes a base 14 and a heat sink 12 coupled to the base 14. The base 14 further includes a rectangular plate body 14〇 whose lower surface is in contact with the central processing unit to absorb the heat generated therefrom. The lower surface of the lower surface of the plate body 14 extends downwardly from the four corners to extend downwardly from the four fastening legs 142. Each of the fastening legs 1 42 defines a through hole (not shown) for the screw member 20 to be worn to fix the base 14 On the board. The heat sink 12 includes a rectangular parallelepiped 122 and a rectangular bump 124. The bump 124 protrudes perpendicularly outward from the lower side of the back side of the rectangular parallelepiped 122, so as to form a heat with the bottom surface of the heat sink body 2 and the upper surface of the base cymbal to absorb the heat absorbed by the susceptor 14 . Pass two radiators ίο. The bottom surface of the heat sink 12 is smaller than the surface of the susceptor 14 so that a portion of the pedestal 延伸 extends beyond the bottom surface of the heat sink 12, and the beard fan 30 and the air hood 40 are placed thereon. Eight fixing holes (Fig. not: The heat sink boundary is opened on the rectangular parallelepiped 122< front side for fish corresponding: screw (not shown) fits the fan 3〇 to the radiator 1〇 wide--the above two fans 3G are The axial flow fan is coupled to the side surface of the heat sink (7): each fan 30 has a rectangular shape, and four screw holes 32 are defined at four corners thereof, and the screw holes 32 correspond to the fixing holes on the heat sink 1〇, Therefore, the screw can be screwed through the (four) hole 32 and screwed into the fixing hole of the heat sink (7), thereby fixing the fan 30 to the heat sink 1 。. The two fans 3 〇 are adjacent to each other and along the heat sink 1 The height direction is fixed to the front side of the heat sink (7), and a fan 3 (standing in the lower portion of the heat sink 1 and contacting the upper surface of the heat sink 〇 base ,, the other fan % is located in the heat sink, the upper region' = The front surface of the fan 30 is in the same plane. The contact area between the two fans 30 and the heater 1G is substantially equal to the area of the front side of the radiator 12 so that the airflow can reach the entire radiator 1 ,. Fixed to the second fan 3〇 to turn the fan 3 is lost between the guide j 40 and the heat sink 1 . The air hood 40 includes a top plate / a plate 44 , a baffle 46 , and two side plates 48. The top plate 42 is rectangular, eight parallel to the above a pedestal 14 of the heat sink 10. A symmetrical circular through hole 420 is defined in each of the two sides of the top plate 42 to facilitate operation of the heat sink 10. The front end of the top plate 42 extends vertically downward from a front plate 44. 8 200906284 The front plate 44 is parallel to the front side of the heat sink 1 , and has a size substantially equal to that of the opposite fan 30. The middle portion defines a first air inlet 440 for the airflow of the fan 30 to pass vertically. The first air inlet 44 〇 is formed into a mesh structure 442. The mesh structure 442 is formed by a plurality of annular bodies which are equally spaced apart from each other, and have an inner diameter gradually increasing (not shown) and a plurality of the bad bodies and The strip-shaped body of the inner edge of the first air inlet (not shown) forms an annular body with a smallest inner diameter enclosing a circular opening 444. The strip-shaped body is obliquely coupled to the annular body with respect to The port 444 is a spiral knife cloth, wherein the end of each strip body is coupled to The inner annular body is connected to the inner edge of the first air inlet 44〇 through the other annular body to fix the annular body to the air guiding cover 4G. The mesh structure 4=for Preventing the operator from suffering unnecessary damage due to carelessness, touching the fan 3Q ride (not shown). The front panel 44 extends obliquely downward to form the control panel 46. The shutter 46 further includes an arc stop a portion 462 and a flat-shaped stop portion 464 extending from the lower edge of the front plate 44 toward the lower edge of the front plate 44. The 5-inch flat-shaped stop portion 464 extends downwardly parallel to the front plate 44 and is formed on the portion The lower edge of the arcuate stop portion 462 further forms a vent opening whose inner diameter gradually increases downward. The two side edges of the m pure 42 extend vertically downwardly from the two mutually parallel side plates 48, wherein each of the side sheets is perpendicular to the front 2 44 and the panel 42 and corresponds to the respective sides of the front panel 44 and the seesaw 46. The combination is combined to form a general frame of the above-mentioned air hood 4 . Referring to FIG. 3 and FIG. 4', the two side plates 48 and the top plate 42 together form a rectangular air outlet σ, and the wind direction of the air outlet 48 is perpendicular to the front side of the radiator 1 and parallel. In the air inlet direction of the first air inlet 440; 200906284, the board 48 and the baffle 46 together define a second air inlet _ on the base 14 of the radiator Η, and the air inlet of the second air inlet paste The direction is perpendicular to the air inlet direction of the top plate 42 and the buffer wind D44Q. The first air inlet and the second air inlet 440 and the air outlets are completely connected to each other to form two air passages through which the airflow of the fan 3Q passes. The side plate Μ=the edge of the top plate 42 forms a vertically symmetrical piece 482 vertically inwardly, and the finder body 482 is located at the air outlet 48 of the air hood 4, wherein the two pieces are formed in the middle of the side plate 48. An additional two-piece technique is formed at the junction of the side panel 顶 top plate 42. The sheet of milk is fixed to the upper region of the fan by gluing, wherein each of the sheets 482 and the screw holes 32 at the upper portion of the fan correspond to each other. The lower portions of the two side plates 48 are respectively bent vertically inwardly to define two fixing portions 484'. The two fixing portions are located at the air outlet of the air guiding cover*, and are coplanar with the four-piece body 482, wherein each of the fixing portions is uniform Open a circular hole 486 ° as shown in Figure 2, the two screw members 6 穿过 pass through the two round holes and the position = the second screw hole 32 in the lower part of the fan 30, and then screwed into the corresponding fixed hole of the radiator 1 Thereby, the air hood 4 is fixed to the fan 3〇. At this time, the air outlet 480 of the air guiding hood 40 is directed to the two fans 3〇, the first air inlet 44 is away from the upper part=the fan 30 and is disposed opposite to the fan 3〇, and the second air inlet 460 is away from the lower fan 3 And lean against the voltage regulation module. When the heat sink is used, the susceptor 14 of the heat sink 10 absorbs the heat generated by the central processing, and then distributes the heat to the entire heat sink 12. Since the fan 30 is located at the upper portion of the radiator 1, the generated airflow passes through the first air inlet 440 and the air outlet 480 and is directly blown to the upper portion of the radiator 1. In addition, the fan 30 generates airflow by the rotation of the fan blade; since the second air inlet port 46 is pressed against the electric power supply system 200906284, the airflow can be pre-flowed through the voltage regulating module to dissipate heat, and then enter the air. No.: The core is deflected; however, it is difficult to guide the windshield baffle 46 to change the airflow direction. The airflow through the air outlet is blown to the lower region of the heat sink 10, thereby achieving divergence to the central processing unit. The heat dissipation device of the Ming can simultaneously dissipate heat from a plurality of electronic components, and surely (4) operate. In the above, the invention 4 has met the requirements of the invention patent, and the patent is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent in this case. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of an embodiment of the present invention. 2 is an exploded perspective view of FIG. 1. Figure 3 is a perspective view of the air hood of Figure 1. Figure 4 is an inverted view of Figure 3. [Main component symbol description] Heatsink 10 Heat sink 12 Rectangular body 122 Bump 124 Base 14 Plate 140 Fastener 142 Screw member 20, 60 Fan 30 Screw hole 32 Air hood 40 Top plate 42 44200906284 Through hole 420 Front plate first Air inlet 440 mesh structure port 444 baffle second air inlet 460 arc stop flat stop 464 side plate air outlet 480 body fixing portion 484 round hole 442 46 462 48 482 486 12

Claims (1)

200906284 申請專利範圍: l一種散熱裝置,用於對電子元器件散熱,其包括—方 子元器件接觸之散熱器、一安裝於散熱器上二與-電 扇、及-導風罩’其改良在於·’該導風罩固定於从—風 扇上而將第一風扇夾置於導風罩和 、弟—風 罩具有-出風口及一進風口,該導風罩二”風 熱益’該導風罩之進風口遠離散熱器且朝向另政 器件’該導風罩進風口之進風方向垂直 口:: 方向。 、'^出風 2·如申請專利範圍第i項所述之散熱裝置,其中該散 逛包括安裝於第-風扇上方之第二風扇,該第二 第一風扇位於散熱器之同一侧。 羽契 3·如申請專利範圍第2項所述之散歸置,其中該散 之導風罩具有另—進風口,該另—進風口與上述進風口 和出風口相通且另一進風口之進風方向平行於該出風口 之出風方向。 W申請專利範圍第3項所述之散熱裝置,其中該導風罩進 -步包括-頂板、分別自頂板向下延伸之二侧板和一前 板、及形成於前板下部之一擋板。 5. ^申請專利範圍第4項所述之散熱裝置,其中該導風罩之 前板座落於頂板之前端’上述另一進風口開設於該前板 上且與上述第二風扇相對設置。 6. 如申請專利範圍第4項所述之散熱裝置,其中—網狀結構 13 200906284 .述Γ軍之進風°内,該網狀結構包括複數環 狀本體及硬數傾斜結合至該等環狀本體之條狀本體。 7 = 第4項所述之散熱裝置,其中該擋板包括 田°卩及一平板形止擋部,該弧形止擋部自上述 則板之下緣斜向向外延伸, 部下緣向下延伸。 。好板形止擋部自弧形止擋 範圍第4項所述之散熱裝置,其中該二侧板分 ;7、板之兩侧且連接前板和擋板,該前板盥-側 設出上述出風口,該撞板與二侧板共同圍= 上述進風口。 9.如申請專利範圍第 於所述前板,該二 10·如申請專利範圍第 和頂板之邊緣向内 體和結合部。 4項所述之散熱裝置,其中該頂板垂直 側板相互平行且垂直於頂板和側板。 4項所述之散熱裝置,其中該二側板 形成位於上述導風罩出風口之複數片 U: 一 f導風罩,用於引導風扇所產生之氣流,其改良在於: ^導風罩包括—頂板、自頂板前端向下延伸之一前板、 2二引板下糕之—擋板、及分別自頂板兩側向下延伸 且結合至前板及擋板之二側板’該前板開設-第—進風 口 網狀結構形成於該第 一進風口内。 12=請f利範圍第U項所述之導風罩,其中該網狀結構 ^稷文相互間隔之環狀本體及複數傾斜結合至該等環 狀本體之條狀本體,該等條狀本體螺旋式分佈於第一進 14 200906284 風口内。 13 ·如申請專刺%^ 月寻^圍弟U項所述之導風罩,其中該 側板共同圍今Φ , - …_ 固°又出—出風口,該擋板和二側板共同圍設出 一弟—進風口,該出風口之出風方向垂直於第二進風口 之進風方向。 凤 14. 如申請專利is _ @β 、寻扪乾圍弟13項所述之導風罩,其中該第—進風 之進風方向垂直於第二進風口之進風方向,且平行於 出風口之出風方向。 、 15. 如申凊專利範圍第13項所述之導風罩,其中該側板向外 傾斜延伸,上述第二進風口之内徑向外逐漸增大。 16. 如申請專利範圍第11項所述之導風罩,其中該等侧板相 互平行,且垂直於頂板及前板。 17. 如申請專利範圍第u項所述之導風罩,其中該二侧板和 頂板之邊緣向内形成位於導風罩出風口之複數片體和結 合部。200906284 Patent application scope: l A heat dissipating device for dissipating heat from electronic components, including: a radiator that contacts the square component, a heater mounted on the heat sink, a fan, and a windshield. The air hood is fixed on the fan and the first fan is placed on the air hood and the air hood has an air outlet and an air inlet. The air hood is provided with a wind hood. The air inlet is away from the radiator and faces the other device. The air inlet of the air duct is perpendicular to the air inlet direction:: direction. , '^出风2· The heat sink according to item i of the patent application scope, wherein The scatter includes a second fan mounted above the first fan, the second first fan being located on the same side of the heat sink. The feather 3 is as disclosed in claim 2, wherein the guide is The windshield has another air inlet, the other air inlet is connected to the air inlet and the air outlet, and the air inlet direction of the other air inlet is parallel to the air outlet direction of the air outlet. Heat sink, wherein the wind guide The step further comprises: a top plate, two side plates and a front plate respectively extending downward from the top plate, and a baffle formed on a lower portion of the front plate. 5. The heat dissipation device according to claim 4, wherein The air hood is located at the front end of the top plate. The other air inlet is formed on the front plate and is disposed opposite to the second fan. 6. The heat dissipation device according to claim 4, wherein Shape structure 13 200906284. In the inlet air of the Γ军, the mesh structure comprises a plurality of annular bodies and a strip-shaped body with a hard number obliquely coupled to the annular bodies. 7 = the heat sink according to item 4, Wherein the baffle comprises a field and a flat stop, the curved stop extends obliquely outward from the lower edge of the plate, and the lower edge extends downward. The good plate stop is from the arc The heat dissipating device of the fourth aspect of the invention, wherein the two side plates are divided; 7. the two sides of the board are connected with the front plate and the baffle, and the front plate is provided with the air outlet, and the collision plate is The two side panels are co-circumferential = the above air inlets. 9. If the patent application scope is on the front panel The heat dissipation device of the fourth aspect of the invention, wherein the vertical side plates of the top plate are parallel to each other and perpendicular to the top plate and the side plates. The two side plates form a plurality of U-shaped air vents located at the air outlet of the air hood to guide the airflow generated by the fan, and the improvement is as follows: the air hood includes a top plate and extends downward from the front end of the top plate. One of the front plates, the second and second guide plates, the baffles, and the two side plates extending downward from both sides of the top plate and coupled to the front plate and the baffle respectively. The front plate opening-first air inlet mesh structure is formed In the first air inlet, the windshield of the U-th aspect, wherein the mesh structure is spaced apart from each other and the plurality of inclined bodies are coupled to the strips of the annular body The body is spirally distributed in the first inlet 14 200906284 tuyere. 13 ·If you apply for special thorns%^ month to find the windshield mentioned in the U section of the U.S., the side panels are commonly surrounded by Φ, - ... _ solid and then the outlet, the baffle and the two side panels are co-enclosed A younger brother-inlet air outlet, the air outlet direction of the air outlet is perpendicular to the air inlet direction of the second air inlet. Feng 14. If applying for the patent is _ @β, looking for the windshield mentioned in 13 of the cadres, the direction of the air entering the first air inlet is perpendicular to the air inlet direction of the second air inlet, and parallel to the out The direction of the wind outlet. 15. The hood of claim 13, wherein the side panel extends obliquely outwardly, and the inner diameter of the second air inlet is gradually increased outward. 16. The hood of claim 11, wherein the side panels are parallel to one another and perpendicular to the top and front panels. 17. The air deflector of claim 5, wherein the edges of the two side panels and the top panel inwardly form a plurality of sheets and junctions at the air outlet of the air duct.
TW96127478A 2007-07-27 2007-07-27 Fan duct and heat dissipating device having the same TWI329490B (en)

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TWI400031B (en) * 2010-08-31 2013-06-21 Hon Hai Prec Ind Co Ltd Air duct
CN103809711B (en) 2012-11-12 2017-07-14 英业达科技有限公司 Electronic installation
TWI487474B (en) * 2012-11-19 2015-06-01 英業達股份有限公司 Electronic device

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