1291321 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種導風罩，更詳言之，係有關於一 •種用以將散熱風扇之氣流導引至發熱裝置之導風罩。 ‘【先前技術】 . 隨著電子科技不斷的進步與發展，電子設備已成為人 類生活中不可或缺的一部份，然而電子設備中又以電腦的 應用最為廣泛，且電腦中有許多主要電子組件，而眾多電 子組件中又以主機板設置的電子元件是最多的，隨著電子 設備之功能不斷地增加及提昇，其所裝設之電子元件亦越 來越多，然而，當該電子設備運作時，該電子組件及元件 亦會產生熱能，故，如何使該電子組件及元件在運作時所 產生之熱能能夠充分散熱，而使該電子組件及元件不會因 產生過熱而造成該電子設備運作不穩，是目前電子設ς所 面臨的棘手問題。 鲁應用於電子設備的散熱裝置絕大部份是裝設複數個 •風扇來對電子設備内部的電子組件及元件提供熱對流之 散熱效果，而電子設備的内部空間有限，亦無法裝設過多 -的風扇進行熱對流，且電子設備内部各組件及㈣配置相 •當密集’該對流空氣難以通過所有電子組件及元件，或是 通過各組件及元件的流量不一，導致部份組件及元件之散 熱效果不彰，特別是中央處理器及記憶體等高發執元件。 當電子設備全時工作下若未能提供足夠且連續的對流冷 空耽對而熱元件進行熱對流，易因上述高發熱元件過献而 19545 5 1291321 l成：令組件燒毁或者當機的情形。 元心閱第1圖’祠服器1中係具有接置於中央處理單 逸之散熱塊體10及記憶體單元11，而為了散 、处里早7L及記憶體單元u因運作 二Γ具有散熱風扇12其所產生的氣流=接 流動至。憶越過該散熱塊體 考量元及記憶體單元u於飼服器1中配置之 」要在於中央處理器為主要發熱裝置而該記憶體單 凡貝1為次發熱裝置，因此必須將主置㈢ 接近散熱風扇丨2之處以吉蛀姪& 嗌…、衣置δ又於取 熱氣流。接收風力最強且最低溫之散 ^ 4體早元u之發熱量雖不及於該巾央處理單 Γ且二 =Γ所產生的熱能亦十分可觀，當飼服器 ==間時，記憶體單元11所產生的熱能 為之飼服器時為厚度單位 象，熱氣流亦因二早二流不及的現 $^^ οσ _ t 内。卩王間的狹小而難以流動 己仏體早701卜因而容易使記憶體單元】1過熱。 气敎2??人t、.種罩覆該散熱塊體1〇之導風罩以將 哭1為乳机導引至该記憶體單元11，然而當饲服 :1為则服器時，中央處理單元上之散熱塊體1〇 :於該祠服器1之頂面而阻播了大部份的氣流，而所能流 動至記憶體單元11之氣流均為先行與該散熱塊體10上之 19545 6 1291321 月欠熱鰭片熱對流過後之咼溫氣流，因此該導風罩僅能略為 加強並集中散熱風扇之氣流而對於提升記憶體單元11之 散熱效果並無明顯功效。 另外，伺服器1中之記憶體單元u係為多條並列， 而‘致位方、中央區域的記憶體容易產生聚熱的現象，即使 散熱氣流可流動至該記憶體單元u，亦不易將記憶體單 元11中央區域之熱能散逸。 一因此，如何研發一種新的技術以改善上述缺點，實為 業界亟待克服之課題。 【發明内容】 鑒於以上所述習知技術之缺點，本發明之一目的在於 提供-種導風罩，俾使受主發熱裝置阻播之 具有良好的散熱效果。 … 。。本發明之次-目的在於提供—種導風罩，俾散逸記憶 體早元中央區域之熱能。 為達上述及其匕目的，本發明提供一種導風罩，係應 用於-内部至少具有呈縱向依序設置之散熱風扇、第一發 熱裝置以及第二發熱裝置之電子設備，其中該電子設備具 有一上蓋，該導風罩包括·一笔 ^ _ 匕括.盍板，至少蓋覆於該第一發 "、衣置，亚於對應該第—發熱裝置之位置設有-導風開 口’以及複數個側板，接置於該蓋板之相對兩側，鮮側 ?與：盍板構/ 一第-通道，該導風開口與該上蓋構成-運、亥放熱風扇之氣流係經由該第一通道而散逸該 弟一發熱裝置之熱能’該散熱風扇之氣流並可經由該第二 19545 7 1291321 通道導引至該第二發熱裳置，俾散逸該第二發熱裝置之教 •倉…、 該電子設備可為厚度單位為α之饲服器。該第一發 熱f置可為接置於中央處理器（cpu)上的散熱塊體，而 -“二發熱裝置則可為記憶體單元（RAM)。該導風罩於相 =兩端分別構成一入風口及一第一出風口，該入風口及該 第出風口刀別與该第一通道連通，俾使該導風罩以該入 =口將氣流導人該第—通道’並以該第―出風口將氣流導 ，出。 相較於習知技術中記憶體單元受至c p u的散熱塊體 阻技散熱氣流而有散熱效能不佳之缺點，本發明之導風罩 因具有導風開口而使得散熱氣流得以由該第二通道導引 至該第二發熱單元，使該第二發熱裝置因接收到足量且低 溫之氣流而可迅速地散逸熱量。 t該導解料㈣第:錢裝置及料之第二發熱 瞻衣置而4導風開口係至少涵蓋該第—發熱裝置，較佳地 開口係延伸至該第二發熱裝置上方。該蓋板復可設 一出風口之通風缺口，該通風缺口係至少 涵盍5亥弟二發熱裝置之中央區域以減少該中央區域之風 阻，俾使集中於該中央F η夕為& 域之熱能可迅速地散逸而出，- 般而吕，該第-出風口係接近電子設備後方之通風開口， 因此亦:藉由外部之冷空氣流入該通風缺口而進一步地 散逸该第二發熱裝置中央區域 t 憶體單元之中央區域容易』:：：。相較於習知技術記 易知…、的現象，本發明之導風罩因 19545 8 1291321 具有通風缺口而可快速地一 t ^ F ^ ^ ^ 字罘一叙熱裝置（記憶體單元）1291321 IX. Description of the Invention: [Technical Field] The present invention relates to an air hood, and more particularly to an air hood for guiding a flow of a cooling fan to a heat generating device . '[Prior Art]. With the continuous advancement and development of electronic technology, electronic devices have become an indispensable part of human life. However, computers are most widely used in electronic devices, and there are many major electronic devices in computers. Components, and among the many electronic components, the electronic components set by the motherboard are the most. As the functions of electronic devices continue to increase and increase, more and more electronic components are installed. However, when the electronic devices are In operation, the electronic components and components also generate thermal energy. Therefore, how to heat the electronic components and components during operation can be sufficiently dissipated, so that the electronic components and components are not caused by overheating. Unstable operation is a thorny issue facing electronic installations. The vast majority of Lu's heat sinks used in electronic equipment are equipped with a plurality of fans to provide heat dissipation to the electronic components and components inside the electronic equipment. The internal space of the electronic equipment is limited and cannot be installed too much - The fan performs thermal convection, and the internal components of the electronic device and (4) the configuration phase. When the convection air is difficult to pass through all the electronic components and components, or the flow rate of each component and component is different, resulting in some components and components. The heat dissipation effect is not good, especially the high-end components such as the central processing unit and the memory. When the electronic equipment is working full time, if sufficient and continuous convection cold space is not provided and the heat element is convected by heat, it is easy to contribute due to the above high heat element. 19545 5 1291321 l: The component is burned or crashed. situation. Yuan Xin read the first picture 'The server 1 has the heat dissipation block 10 and the memory unit 11 connected to the central processing unit, and the operation unit 2 The airflow generated by the cooling fan 12 is connected to the flow. It is recalled that the heat sink block and the memory unit u are disposed in the feeder 1 "the central processor is the main heat generating device and the memory single van 1 is the secondary heating device, so the main device must be placed (3) Near the cooling fan 丨2, the 衣 蛀姪 、 、 、 、 、 、 、 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣Receiving the strongest and lowest temperature of the wind, the heat of the body is not as good as that of the towel, and the heat generated by the second and the second is very considerable. When the feeder is ==, the memory unit The heat generated by 11 is the unit of thickness when feeding the device, and the hot air flow is also within the current $^^ οσ _ t due to the early second. The narrowness of the king is difficult to flow. It is easy to make the memory unit 1 overheat. a gas hood 2, a person covering the air hood of the heat-dissipating block body 1 to guide the crying 1 to the memory unit 11, but when the feeding machine: 1 is the server, The heat dissipating block body on the central processing unit is configured to block most of the airflow on the top surface of the server 1, and the airflow that can flow to the memory unit 11 is preceded by the heat sink block 10 On the 19545 6 1291321 month, the hot fins owe the hot air flow after the heat convection, so the air hood can only slightly strengthen and concentrate the airflow of the cooling fan, and has no obvious effect on improving the heat dissipation effect of the memory unit 11. In addition, the memory unit u in the server 1 is a plurality of parallel lines, and the memory of the “location side and the central area is prone to heat accumulation. Even if the heat dissipation airflow can flow to the memory unit u, it is not easy to The thermal energy in the central region of the memory unit 11 is dissipated. Therefore, how to develop a new technology to improve the above shortcomings is an urgent problem to be overcome in the industry. SUMMARY OF THE INVENTION In view of the above-discussed shortcomings of the prior art, it is an object of the present invention to provide an air hood that has a good heat dissipation effect by the main heating device. ... . . The second aspect of the present invention is to provide an air hood that dissipates thermal energy in the central region of the early memory of the memory. In order to achieve the above and its object, the present invention provides an air hood for use in an electronic device having at least a heat dissipating fan disposed longitudinally, a first heat generating device, and a second heat generating device, wherein the electronic device has An upper cover, the air hood includes a ^ _ 匕 盍 盍 盍 盍 , , , , , , , , , , , , , , , , , , , , 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 、 、 、 、 And a plurality of side plates, which are disposed on opposite sides of the cover plate, and a fresh side and a: a slab structure/a first passage, wherein the air guiding opening and the upper cover constitute a flow of the heat fan Dissipating the heat of the heat-generating device of the younger one, and the airflow of the heat-dissipating fan can be guided to the second heat-dissipating skirt via the second 19545 7 1291321 channel, and the teaching and storage of the second heat-generating device are dissipated, The electronic device can be a feeding device having a thickness unit of α. The first heat generating f can be a heat sink block attached to the central processing unit (CPU), and the “second heat generating device can be a memory unit (RAM). The air guiding cover is respectively formed at the phase=the two ends. An air inlet and a first air outlet, the air inlet and the first air outlet knife are connected to the first passage, so that the air duct guides the airflow to the first passage by the inlet port and The first air outlet guides the airflow out. Compared with the conventional technology, the memory unit is subjected to the heat dissipation block of the cpu, and has the disadvantage of poor heat dissipation performance. The air duct of the present invention has an air guiding opening. The heat dissipation airflow is guided from the second passage to the second heat generating unit, so that the second heat generating device can quickly dissipate heat due to receiving a sufficient amount of low temperature airflow. t The guide material (4): money The second heat-producing device and the fourth air-conducting opening cover at least the first heat-generating device, and preferably the opening system extends above the second heat-generating device. The cover plate can be provided with a ventilation gap of the air outlet The ventilation gap is at least included in the 5 Haidi two heating device The central area reduces the wind resistance of the central area, so that the heat concentrated in the central area can be quickly dissipated, and the first air outlet is close to the ventilation opening behind the electronic device. Therefore, it is also easy to dissipate the central region of the second heat-generating device by the cold air flowing outside to the central region of the second heat-generating device, which is easy to be compared with the conventional technology. Phenomenon, the air hood of the present invention can quickly reach a heating device (memory unit) due to the ventilation gap of 19545 8 1291321.
〒夹&域之熱能散逸而出。 平J 另外，該導風罩復具有一 -通道之第二出風口，且V;對於该入風口且導通該第 u文熱塊體）旁復可設有子= 於該第一發熱裝置 一中央處理單元（em卜 其亦可為接置於 早兀（LPU)上之散熱塊體。 有知，本發明之導風罩可改善習知缺點，因此且 I有鬲度產業利用價值。 口此^、 【實施方式】 乂下係藉由特定的具體實例說明本發明之實施方 式，无、悉此技藝之人士可由本查 — 、一 ^ ^ n〇 ^ 况月曰所揭不之内容輕易地 瞭解本發明之其他優點與功效。 以下第Μ圖至第Μ圖係說明本發明之導風罩之一較 佳具體實施例。 請參閱第2A圖’本發明所提供之導風罩3係應用於 〉、具有呈縱向依序設置之散熱風扇20、第一發熱裝置 及弟了發熱裝置22之電子設備2，其中’該散熱風扇 糸用以散逸該第一、二發熱裝置所產生的熱能，本發 :之導風罩3係包括：蓋板3G，至少蓋覆於該第一發熱 裴置21，並於對應該第一發熱裝置21之位置設有一導風 開口 301 ;以及複數個側板33,接置於該蓋板3〇之相對 兩側，該些側板33與該蓋板30並構成一第一通道34。 。玄導風罩3於相對兩端分別具有一入風口 31及一第一出 風口 32，該入風口 31及該第一出風口 32分別與該第一 19545 9 1291321 通道34連通，俾使該導風罩3以該入風口 31將氣流導入 該第一通道35，並由該第一出風口 32將氣流導出，以散 逸該第一發熱裝置21之熱能。此外，該蓋板3〇於上方靠 近該導風開口 301之邊緣係設有氣密膠條3〇2。 该電子設備2可為厚度單位為iu之伺服器，該第一 發熱裝置21可為接置於中央處理單元（cpu)上之散熱塊 體，而該第二發熱裝置22則可為複數並列之記憶體單元 (RAM)。然而該電子設備2、第一發熱裝置21、以及第二 發熱裝置22並非以上所述者為限，而可加以變化，而該 等變化係為熟悉本發明領域者所能思及並加以應用，例如 該電子fHf 2可為刀鋒伺服器之刀鋒托架，㈣—發熱裝 置21可為硬碟模組，而該第二發熱裝置&可為工作晶片 電子設備2於該第一發熱農置21 (散熱塊 _方復可°又有一弟二發熱裝置23其亦可為接置於一中 圖未示）上之散熱塊體，即該電子設 =2可為一具有雙中央處理單元之㈣服器，因此該墓 風罩3復可設有另一相對於該 > …第二出風口 35,並使該第三發埶;二^ 該入風口 3 i及該第二出風口 3 5之門,二置2 3谷納於 之氣流亦可用於散逸使散熱風扇20 熱能。 編弟二發熱裝置23運轉時所產生的 t配合參閱第別圖，該電子設備2係具有… 弟一發熱裝置21係透過該導風開口州與該:蓋 10 19545 1291321 24構，成一第二通道36,使該散熱風扇20運轉所形成之氣 流A由該入風口 31進入第一通道34後分為吹拂於該第二 發熱襞置21之氣流A1及經由該第二通道36而導引至該 第二發熱裝置22之氣流A2。The heat of the 〒 clip & field is dissipated. In addition, the air hood has a second air outlet of a channel, and V; for the air inlet and the second heat block is turned on, a sub-substance is provided; The central processing unit (em may also be a heat dissipating block attached to the early stage (LPU). It is known that the air hood of the present invention can improve the conventional disadvantages, and therefore, I have the value of industrial use. This embodiment describes the embodiments of the present invention by a specific specific example, and those who do not have the skill can easily obtain the contents of the present-------------------- Other advantages and effects of the present invention are understood. The following figures to the drawings illustrate a preferred embodiment of the air hood of the present invention. Please refer to FIG. 2A for the present invention. The invention relates to an electronic device 2 having a heat dissipating fan 20 disposed in a longitudinal direction, a first heat generating device and a heat generating device 22, wherein the heat dissipating fan is used to dissipate heat generated by the first and second heat generating devices , the hair: the windshield 3 series includes: cover 3G, at least cover The first heat generating device 21 is provided with a wind guiding opening 301 at a position corresponding to the first heat generating device 21; and a plurality of side plates 33 are disposed on opposite sides of the cover plate 3, the side plates 33 The air inlet 31 and the first air outlet 32 respectively have an air inlet 31 and a first air outlet 32. The air inlet 31 and the first air outlet 32 respectively The first 19545 9 1291321 channel 34 is connected, so that the air hood 3 introduces the airflow into the first channel 35 by the air inlet 31, and the airflow is led out by the first air outlet 32 to dissipate the first heat generating device. In addition, the cover plate 3 is provided with an airtight adhesive strip 3〇2 at the edge of the upper side of the air guiding opening 301. The electronic device 2 can be a server having a thickness unit of iu, the first heat generation. The device 21 can be a heat sink block attached to a central processing unit (cpu), and the second heat generating device 22 can be a plurality of parallel memory units (RAM). However, the electronic device 2, the first heat generating device 21 And the second heat generating device 22 is not limited to the above, but can be changed And such changes are applicable to those skilled in the art, for example, the electronic fHf 2 can be a blade carrier of the blade server, (4) - the heating device 21 can be a hard disk module, and the second The heat generating device & can be the working chip electronic device 2 in the first heat-generating agricultural device 21 (heat-dissipating block _ Fang Fu can also have a second two heat-generating device 23, which can also be connected to a heat-dissipating device) The block, that is, the electronic device = 2 may be a (4) server having a dual central processing unit, so the tomb hood 3 may be provided with another relative to the second air outlet 35, and the first Three winds; two ^ the air inlet 3 i and the second air outlet 35 door, the second set 2 3 valley gas flow can also be used to dissipate the heat of the cooling fan 20 heat. The t generated by the editor 2 of the heat generating device 23 is referred to the first drawing. The electronic device 2 has a... The heat generating device 21 transmits through the wind deflecting state and the cover 10 19545 1291321 24 is formed into a second The air flow A formed by the operation of the cooling fan 20 is divided into the air flow A1 of the second heat generating device 21 and guided to the air flow A1 of the second heat generating device 21 through the air inlet 31. The air flow A2 of the second heat generating device 22.
相較於習知技術中記憶體單元受到cpu的散熱塊體 阻指政熱氣流而有散熱效能不佳之缺點，本發明之導風一罩 3因具有導風開口 301而使得氣流A2得以由該第二通道 36導引至該第二發熱裝置22以迅速散逸其產生之熱能。 该蓋板30係蓋覆該第一發熱襞置21並蓋覆部份之該 第二發熱裝置，且該導風開口 301係至少涵蓋該第一發熱 裝置21，較佳地該導風開口 3〇1可延伸至該第二發埶X裝、、 置22上方，以利於將氣流A2導引至該第二發熱裝X置、 此外，设於該盍板30上之氣密膠條3〇2係密接於哕 ，子設備2之上蓋24而使氣集中導引至㈣二發°熱 衣，22 ’以避免氣流A2散逸至電子設備2中而影響對於 該第二發熱裝置22之散熱效果。 覆請配合參閱第2C圖，由前述可知該電子設備2可 具有一設於該第一發熱裝置21旁的第三發熱裝置Μ豆 仰賴該散熱風扇20進行散熱，惟該第一 後 設有第二發熱裝置22，因此散熱風扇2。= 必須有較多的比例導引至該第一發熱装置21，是以可於 =㈣1方#近該人風口31處設有可將大部份散熱氣 kA導引至該第一發熱裝置21之導流板3〇3,而當電子 設備2未增設有第三發埶裝置2 ^主 衣置以可於該蓋板30下方 19545 11 1291321 $置-遮播才反304,該遮擔板3〇4係用以遮播第二出風口 35以使氣流A集中流向該第一 與散熱氣流A之行進方向可呈—斜自衣置121:亥遮擔板304 往該第-發熱裝置21方向導引二角 亚未完全將該第二出風口 35遮擒 部份的氣流Α由該第二出風口3二=留有空隙以供 口35外之工作晶片（圖未示）^動至位於該第二出風 =閱第3圖，係本發明之另—較佳具體實施例示音 圖，本貫施例與前述實施例係大致相同，而不同之^ 於本實施狀蓋板3〇設有連通於”—线通 缺口37。通風缺口37係至少涵蓋該第二發執裝置22之 中央區域以減少該中央區域之風阻，俾使集 速地散逸而出，—般而言，該第-出風: =二電：設備2後方之通風開口，因此亦可藉由外 w 99 , 37而進一步地散逸該第二發 熱22中央區域之熱能。相較於習知技術記憶體單元 之中央區域容易積熱的現象，本發明之導風罩3因具㈣ 風缺口 37而可將第二發熱裳置22 (記憶體單元）= 域之熱能迅速散逸。 、匕 由上可知，本發明之導風罩可改善習知缺點，因此呈 有高度產業利用價值。 〃 上述之實_僅為例㈣說日林發明之原理及其功 效’而非用於限制本發明。任何熟習此技藝之人士均可 不違背本發明之精神及範田壽下’對上述實施例進行㈣與 19545 12 1291321 應如後述之申請專 變化.。因此’本發明之權利保護範圍 利範圍所列。 【圖式簡單說明】Compared with the conventional technology, the memory unit is subjected to the heat dissipation block of the cpu and has the disadvantage of poor heat dissipation performance. The wind guide cover 3 of the present invention has the air flow opening 301 so that the air flow A2 can be The second passage 36 is directed to the second heat generating device 22 to quickly dissipate the heat energy it generates. The cover plate 30 covers the second heat generating device 21 and covers the second heat generating device, and the air guiding opening 301 covers at least the first heat generating device 21, preferably the air guiding opening 3 The crucible 1 can be extended to the second hairpin X and the upper portion 22 to facilitate guiding the airflow A2 to the second heat generating device X. Further, the airtight adhesive tape 3 disposed on the seesaw 30 The 2 series is in close contact with the cymbal, and the cover 24 of the sub-equipment 2 is used to guide the air to the (four) two-heating clothes, 22' to prevent the airflow A2 from being dissipated into the electronic device 2, thereby affecting the heat dissipation effect on the second heat-generating device 22. . Referring to FIG. 2C, it can be seen that the electronic device 2 can have a third heat-generating device disposed beside the first heat-generating device 21, and the heat-dissipating fan 20 relies on the heat-dissipating fan 20 for heat dissipation. The heat generating device 22 is therefore the cooling fan 2. = a greater proportion must be directed to the first heat generating device 21, so that the majority of the heat radiating gas kA can be guided to the first heat generating device 21 at the vicinity of the person tuyere 31. The deflector 3〇3, and when the electronic device 2 is not provided with the third hairpin device 2^the main garment is disposed to be under the cover plate 30, 19545 11 1291321 $ 3〇4 is used to cover the second air outlet 35 so that the airflow A is concentrated to the direction of travel of the first and the heat dissipating airflow A, and the tilting plate 121: the cover plate 304 is directed to the first heat generating device 21 The direction guide two corners do not completely cover the airflow portion of the second air outlet 35 from the second air outlet 3 = a gap is left for the working wafer outside the port 35 (not shown) to The present invention is in the same manner as the foregoing embodiment, and the present embodiment is substantially the same as the foregoing embodiment, and the present embodiment is different from the previous embodiment. A communication line gap 37 is provided. The ventilation gap 37 covers at least the central area of the second issuing device 22 to reduce the wind resistance of the central area, and the speed is set. Dissipating, in general, the first-outlet: = two-electric: the ventilation opening behind the device 2, so that the thermal energy in the central region of the second heat-generating 22 can be further dissipated by the outer w 99 , 37 . Compared with the phenomenon that the central region of the conventional memory unit is easy to accumulate heat, the windshield 3 of the present invention can quickly heat the second heat generating body 22 (memory unit) = domain due to the (four) wind gap 37 As can be seen from the above, the air hood of the present invention can improve the conventional disadvantages, and thus has a high industrial utilization value. 〃 The above facts are only examples (4) saying that the principle and function of the invention are not used To limit the invention, anyone skilled in the art can refrain from the spirit of the invention and Fan Tianshou's application of the above-mentioned embodiment (4) and 19545 12 1291321 should be changed as described later. Therefore, the protection of the present invention The range of scope is listed. [Simple description]
第1圖係顯示一祠服器中關於散熱風扇以及 發熱裝置之示意圖； I 第2A圖至第2C圖係顯示本發明之導風 體實施例；以及 車父佳具Fig. 1 is a view showing a heat dissipating fan and a heat generating device in a server; I Figs. 2A to 2C are views showing an embodiment of the wind guiding body of the present invention;
第3 例 圖係顯示本發明之導風罩之另 —較佳具體實施 【主要元件符號說明】 1 伺服器 10 散熱塊體 11 記憶體單元 散熱風扇 2 電子設備 20 散熱風扇 21 第一發熱裝置 22 第二發熱裝置 23 第三發熱裝置 24 上蓋 3 導風罩 30蓋板 3 〇 1 通風開口 302 氣密膠條 19545 13 1291321 ^ 303 ,導流板 ’ 304 遮擋板 31 入風口 -32 第一出風口 • 33 侧板 34 第一通道 35 第二出風口 36 第二通道 •37 通風缺口 A 氣流 A1 氣流 A2 氣流The third example shows another embodiment of the air hood of the present invention. [Main component symbol description] 1 Server 10 Heat sink block 11 Memory unit Cooling fan 2 Electronic device 20 Cooling fan 21 First heat generating device 22 Second heat generating device 23 Third heat generating device 24 Upper cover 3 Air hood 30 cover plate 3 〇1 Ventilation opening 302 Airtight rubber strip 19545 13 1291321 ^ 303, deflector '304 shielding plate 31 air inlet -32 first air outlet • 33 side panels 34 first passage 35 second air outlet 36 second passage • 37 ventilation notch A air flow A1 air flow A2 air flow