M289881 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種帶有導流罩的散熱裝置，尤其涉及一 ::以同時幫助中央處理器周邊的發熱電子元二 v有導流罩的散熱裝置。 【先前技術】 一般現今的電子襄置例 > 電腦内的中央冑理並 =主機板上的電子元件’在工作狀態下：量: :此:通常需要在中央處理器上加裝一散熱農置來進行里散 =广職置包括一散熱器及—裝設在該散熱 向設有若干散熱鰭片，氣流通過散 動，氣流並不吹過中央處理器周圍的 =兀件。但疋如果沒有氣流吹過中央處理器 二這些，而t?產生的熱量將聚積到使其超出正常工 作μ度，攸而導致電腦系統發生故障。因此，如 =裝置，能夠改變風扇吹出氣流 ：: =周圍的電子元件，協助這些電子元件散熱，: 述的：: = !:=國大陸專利第〇1_2.9號所 風扇所= 裝置”戶斤示，該散熱裝置在散熱 板路線中設有至少一導引板，該導引 Ϊ;有口，弧部，該散熱襞置下方設有-氣流通口，該氣 :::二 使，順著該彎弧部通過氣流通口 用於筆記型電腦所使用的散熱器:、、、而二= 5 M289881 (桌上型）電腦所用的散埶哭。 究並::學…可改善，乃特— 上述缺失之本創作。’、、、於提出一種設計合理且有效改善 【新型内容】 本創作的主要曰& 裝置，其可以同時幫助中=提供—種帶有導流罩的散熱 熱。 中央處理器周邊的發熱電子元件散 熱裝3:—上==提供-種帶有導流罩的散 括一基座及若干，：\ 風羽及一導流罩，該散熱器包 侧，氣流先二熱片\片門:風1是裝峨 再從該風扇背向散；器的二m穿，罩風扇後 扇背向散熱器—例， 人出5亥今^罩固定在該風 沿著氣流方向傾:向δ=罩上設有一導流板，該導流板 流動而吹拂周邊的發熱電子= 風扇吹出的氣流傾斜向下 發熱電子元件散熱，、具有;;=能同時辅助為周邊的 閱以步:編11作之特徵及技術内容，請參 供參考與說明用，並非用來對而所附圖式僅提 【實施方式】 用末對本創作加以限制者。 散熱裝置，包括-散熱器、i、一風扇固定架 ===:圖’本創作為-種帶有導流罩的 風扇3 6 M289881 及一導流罩4。 ，散熱器]是裝設在—t央處理器7的頂面為其散孰 ，该中央處理器7是裝設在—主機板6上，； (如為中央處理器供電的電容）。 該散熱器1包括一基座12、若 伸出的散熱鰭片14及兩根穿設在12向上犬 之問的办其彳,, 杧牙σ又在基座12與散熱鰭片14 7的頂：二J该散熱器1基座12的底面與中央處理器 到:上=而將中央處理器7產生的熱量傳導 有3=:散發到空氣中去。該基座咖 該主機板Ϊ上。，韻鎖固裝置18將該散熱器1鎖固到 熱為1上’其位於散熱器 ’並在該風槽2 2的四角 該風扇固定架2固定在該# 1 —側的框體中央設有一風槽2 各設有一螺孔24。 而3是—軸流式風扇，其中央設有-葉輪3卜 32:、=:對1、該風扇固定架2的螺孔24設有-通孔 的Γΐΐ: 3是通過使用四個螺絲34將其朝向散熱器1 的-侧固定貼接到風扇固定架2上。 a 罩4是固定在該風扇3背向散熱器1的一侧， 板上：；傾斜向下延伸的導流板42及分別由該導流 導、、q /白兩侧朝向風扇3彎折延伸出的兩側板52。該 法勺頂έ而朝向風扇3彎折延伸出一頂板44。該導 g 兩侧也朝向風扇3各垂直彎折延伸出一連 °亥連接板46的末端再進一步垂直向外彎折延伸 M289881 :二固疋板4δ，該固定板4δ上開設有—穿孔5〇 2穿過該導流罩4的穿孔5°和該風請通』 32後再螺鎖在該風扇固^架2上部的兩_孔％中 而將該導流罩4鎖固到該風扇3背向散熱器ι的一側。" 糾Γ風扇3是一吸風式風扇’冷卻氣流是先從散敲哭1 的n:”月向放熱為1的—側吹出，由於該導流罩4 戶、二ψ 著氣流方向傾斜向下延伸的，從而使風 ==氣Γ斜向下流動而吹拂周邊的發熱電子： 的上方Λ i 側板52分別包圍在氣流流動方向 的上方和左右兩侧，防止廣 證氣流都吹向下方幫摩；；元:及左:：側流出，保 聚積從而保證發熱電子元件62正常工：心，防止熱量 作帶有導流罩的散熱裝置不僅 為7散熱，還可以同眭結# & m s ~ T六/处埋 熱，具有雙重功效。 ^的發熱電子元件62散 侷限Ϊ =所Ϊ僅？本創作之較佳可行實施例，非因此即 内容所為之：：：耗圍，故舉凡運用本創作說明書及圖式 内，合;陳明效結構變化’均同理皆包含於本創作之範圍 【圖式簡單說明】 弟 ^疋本創作帶有導、、六罢ΑΑ也 發熱電子元件的示咅„ 、月熱1置的氣流吹拂周邊 第二圖是本創作帶有 罩的放熱裝置的立體分解圖。 M289881 第三圖是本創作帶有導流罩的散熱裝置的導流罩的立體 圖。 第四圖是本創作帶有導流罩的散熱裝置的立體組合圖。M289881 VIII. New Description: [New Technology Field] This creation involves a heat sink with a shroud, especially one: to help the heat-generating electronic component of the central processor at the same time. Device. [Prior Art] Generally, today's electronic devices> Central processing in the computer and = electronic components on the motherboard 'in the working state: Quantity: : This: usually need to install a cooling farm on the central processing unit Set up to carry out the scatter = wide position including a radiator and - installed in the heat dissipation direction with a number of fins, the air flow through the scattering, the air flow does not blow around the central processing unit = 兀. However, if there is no airflow blowing through the central processing unit 2, and the heat generated by t? will accumulate to exceed the normal working degree, causing the computer system to malfunction. Therefore, if the device is used, the fan can be used to change the airflow:: = surrounding electronic components to assist in the heat dissipation of these electronic components:: ::=::= Continental Patent No. 1_2.9 Fans = Devices According to the pin, the heat dissipating device is provided with at least one guiding plate in the heat dissipating plate route, and the guiding device has a mouth, an arc portion, and an air flow port is arranged below the heat dissipating device, the gas::: Follow the curved part through the airflow port for the heat sink used in the notebook computer: ,, and 2 = 5 M289881 (desktop type) computer used for the crying of the computer. Study:: Learn... can be improved, Naite - the above-mentioned missing creation. ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Heat. Heat-dissipating electronic components around the central processor. 3:—Up==Provided--a kind of pedestal with a shroud and several,:\ wind feather and a shroud, the radiator side , the air flow first two hot film \ film door: the wind 1 is mounted and then from the fan back to the bulk; The back fan of the cover fan is facing away from the radiator. For example, the cover is fixed at the wind and the wind is tilted along the direction of the airflow: a deflector is provided on the δ= cover, and the baffle flows to blow the surrounding heat-generating electrons. = The airflow blown by the fan is slanted downward to heat the electronic components, and has;;= can be assisted for the surrounding reading step by step: the characteristics and technical content of the editing, please refer to the reference and description, not used to The drawing only mentions [embodiment] The end of the creation is limited. The heat sink, including - radiator, i, a fan holder ===: Figure 'This creation is a fan with a shroud 3 6 M289881 and a shroud 4. The radiator is mounted on the top surface of the -t central processor 7 for its dissipation, and the central processing unit 7 is mounted on the motherboard 6; The capacitor for powering the central processing unit.) The heat sink 1 includes a base 12, if the protruding fins 14 and two of the dogs that are worn in the 12 upwards, the sputum is in the base. The top of the seat 12 and the heat sink fin 14 7: two J the bottom surface of the base plate 12 of the heat sink 1 and the central processor to: on the central processor 7 The raw heat conduction has 3=: it is emitted into the air. The pedestal is on the motherboard. The rhyme locking device 18 locks the heat sink 1 to the heat of 1 'it is located in the radiator' and The four corners of the air duct 22 are fixed to the center of the frame of the #1 - side, and a wind tunnel 2 is provided with a screw hole 24. Each of the three is an axial fan, and the center is provided with an impeller. 3 Bu 32:, =: Pair 1, the screw hole 24 of the fan holder 2 is provided with a through hole Γΐΐ: 3 is fixed to the fan by fixing it to the side of the heat sink 1 by using four screws 34 The cover 2 is fixed on the side of the fan 3 facing away from the heat sink 1, the plate: the deflector 42 extending obliquely downward and respectively guided by the guide, q / white sides The fan 3 bends the two side plates 52 that extend. The top of the spoon is bent toward the fan 3 to extend a top plate 44. The two sides of the guide g are also bent toward the vertical extension of the fan 3, and the end of the connecting plate 46 is further bent outwardly and extended to extend M289881: the two solid plates 4δ, the fixing plate 4δ is provided with a perforation 5〇 2, through the through hole 5 of the shroud 4 and the wind to pass through the 32, and then screwed into the two holes _ hole % of the upper portion of the fan holder 2 to lock the shroud 4 to the fan 3 Back to the side of the radiator ι. " The entangled fan 3 is a suction fan. The cooling airflow is first blown out from the n: "month to the heat release of 1", because the shroud is tilted by 4 households and 2 Extending downward, so that the wind == gas flows obliquely downward to blow the surrounding heat-generating electrons: the upper side i side plates 52 are respectively surrounded by the upper and left and right sides of the air flow direction, preventing the publicized airflow from blowing downward Help the MO;; Yuan: and left:: side outflow, ensure accumulation to ensure that the heating electronic component 62 is normal: heart, prevent heat as a heat sink with a shroud not only for 7 heat, but also with the knot # & Ms ~ T six / buried heat, has a dual effect. ^ Heated electronic components 62 scattered limit Ϊ = Ϊ ? ? 本 本 本 本 本 本 本 本 本 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳Use this creation manual and the drawings, and the combination of Chen Mingxiao's structural changes are all included in the scope of this creation. [Simple description of the schema] The brothers and sisters of this book are guided by the introduction, the six slams and the electronic components of the heat.咅„, the monthly heat 1 set of air blowing around the first FIG exothermic apparatus is an exploded view with the cap of the present writing. M289881 The third picture is a perspective view of the shroud of the heat sink with the shroud. The fourth figure is a three-dimensional combination of the heat sink with the shroud.
【主要元件符號說明】 1散熱器 12基座 14散熱鰭片 16熱管 18鎖固裝置 2風扇固定架 22風槽 24螺孔 3風扇 31葉輪 32通孔 34螺絲 4導流罩 4 2導流板 44頂板 46連接板 48固定板 50穿孔 52侧板 6主機板 62發熱電子元件 7中央處理器 9[Main component symbol description] 1 radiator 12 base 14 heat sink fin 16 heat pipe 18 locking device 2 fan holder 22 wind slot 24 screw hole 3 fan 31 impeller 32 through hole 34 screw 4 guide cover 4 2 deflector 44 top plate 46 connecting plate 48 fixing plate 50 perforation 52 side plate 6 main board 62 heating electronic components 7 central processing unit 9