1305572 九、發明說明： 【發明所屬之技術領域】 . 本發明係關於-種散熱裝置’尤指—種具較高散熱效 率之散熱器。 【先前技術】 —隨著積體電路製造技術日新月異之發展，電子元件朝 更快之運算速度邁進。由於電子元件之運算速度愈來愈 籲快，其局速運作過程中伴隨產生之熱量亦愈來愈多。若電 子几件産生之熱量不被及時導出，將會導致電子元件之溫 度持續升高’進而影響其運行之穩定性，嚴重時會使電子 凡件燒毀。爲此，業界通常在產生熱量較多之電子元件頂 面裝設一散熱器，再透過系統風扇之協助排出熱量。 ,請一併參閱圖1及圖2,習知技術散熱器1〇包括一方 形底座12及複數自該底ai2之頂部延伸之散熱縛片14。 當該散熱器10裝設於電腦主板之某一電子元件上時，該電 搴子元件即爲發熱源，該發熱源位於該底座12底部之中^位 .置。 、 4於該散熱器U) -定距離處設置—風扇（圖未示）協耳 散熱時，該風扇産生之風流進入該散熱器10之一端爲進刀 端13 ;該風流流出該散熱器1〇之一端爲出風端⑴、該^ 流包括一流向該散熱器1〇之散熱鰭片14上部之第一風刀 no、一流向該散熱鰭片14中部之第二風流112及一^ 該底座12頂部與該散熱鰭片14底部之間之第三 114。由於每一散熱鰭片14面向該進風蠕13之侧面 1305572 直於該風流之流動方向，此時該第一風流11〇、該第二風 流112及該第三風流114在流至該散熱器1〇之每一散熱鰭 片14時均文阻最大並產生回流，故使得該氣流之流動不順 暢，進而增加該氣流進入該散熱器1〇之風阻，降低了散熱 效率。 因疋，實有必要對習知之散熱器進行改良，以消除上 述缺失。 【發明内容】 於上述内容，有必要提供一種可提高散熱效率之散 埶器。1305572 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, particularly a heat dissipating device having a high heat dissipation efficiency. [Prior Art] - With the rapid development of integrated circuit manufacturing technology, electronic components are moving toward faster computing speeds. As the speed of operation of electronic components is becoming more and more fast, the amount of heat that comes with the speed of the local speed is increasing. If the heat generated by several pieces of electronic components is not exported in time, the temperature of the electronic components will continue to rise, which will affect the stability of its operation. In severe cases, the electronic components will burn out. To this end, the industry usually installs a heat sink on the top of the electronic components that generate more heat, and then dissipates heat through the system fan. Referring to FIG. 1 and FIG. 2 together, the conventional heat sink 1 includes a one-piece base 12 and a plurality of heat-dissipating fins 14 extending from the top of the bottom ai2. When the heat sink 10 is mounted on an electronic component of the motherboard of the computer, the electrical component is a heat source, and the heat source is located in the bottom of the base 12. 4, when the heat sink U) is disposed at a fixed distance, the fan (not shown) cools the ear, and the wind generated by the fan enters one end of the heat sink 10 as the feed end 13; the wind flows out of the heat sink 1 One end of the crucible is an air outlet end (1), and the current flow includes a first air knife no that is first-stage to the upper portion of the heat dissipation fin 14 of the heat sink 1 , a second air flow 112 that is first-class to the middle portion of the heat dissipation fin 14 , and a A third 114 between the top of the base 12 and the bottom of the heat sink fin 14. Since the side surface 1305572 of each of the heat dissipation fins 14 facing the wind creep 13 is straight to the flow direction of the wind flow, the first air flow 11 , the second air flow 112 and the third air flow 114 are flowing to the heat sink. Each of the fins 14 has a maximum resistance and reflow, so that the flow of the airflow is not smooth, thereby increasing the wind resistance of the airflow into the heat sink, thereby reducing heat dissipation efficiency. Because of this, it is necessary to improve the conventional radiator to eliminate the above-mentioned missing. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a diffuser that can improve heat dissipation efficiency.
”、、XIXJ 本發明提供一種散熱器，包括複數散熱鰭片，該散熱 有一=風端及一出風端，每一散熱鰭片之上表面自中 I5刀另J向罪近該進風端及出風端之方向呈流線型降低。 相較習知技術’該散熱鰭片之上表面自中部分別向靠 2進風端及出風端之方向呈流線型降低，故使得進風風 鲁抓机經進風端時與每一散熱鰭片之相應側端面不垂直，增 0了進風端氣流之流人量’從而提高了系統整體之散熱效 率 〇 【實施方式】 明一併參閱圖3及圖4,本發明散熱器2〇之較佳實施 :包括—底座22、複數自該底座22之上表面向上延伸 =散熱韓片24。於該散熱器2Q_歧離處設置—風扇（圖 :協助散熱時，該風扇産生之風流進入該散熱器2〇 之一端爲進風端23;風流流出該散熱器2〇之一端爲出風 1305572 :5。母一散熱鰭月24之上表面自尹部分別向該進風端 3及出風端25之方向呈流線型降低直至與該底座22 相對側邊相交。在本較佳實施方式中，每κ 之上表面之中部係—凸起之平坦部，該等散熱鰭片、Μ之上 表面自其平坦部兩端之底部分別向該進風端23及出風端 25方向之底座22呈流線型延伸。每一散熱鰭片24靠近該 進風端23及出風端25處之側端面均係平滑弧面。需要說"", XIXJ The present invention provides a heat sink comprising a plurality of heat sink fins, the heat sink has a wind end and an air outlet end, and the upper surface of each heat sink fin is from the middle I5 knife to the sin near the air inlet end. And the direction of the outlet end is streamlined. Compared with the prior art, the upper surface of the fin has a streamlined shape from the central portion to the inlet and outlet ends of the air inlet and outlet, so that the wind and wind are caught. When passing through the air inlet end, it is not perpendicular to the corresponding side end surface of each heat radiating fin, and the flow amount of the air flow at the air inlet end is increased by 0, thereby improving the heat dissipation efficiency of the whole system. [Embodiment] See Figure 3 for details. 4, a preferred embodiment of the heat sink 2 of the present invention includes: a base 22, a plurality of upwardly extending from the upper surface of the base 22 = a heat sink Korean sheet 24. A fan is disposed at the heat sink 2Q_disambiguation (Fig. When assisting in heat dissipation, the wind generated by the fan enters one end of the heat sink 2 as the air inlet end 23; the wind flow out of the heat sink 2 is one end of the heat sink 1305572: 5. The mother heat sinks the top surface of the moon 24 from the Yin The portion is streamlined downward toward the air inlet end 3 and the air outlet end 25, respectively. Up to the opposite side of the base 22. In the preferred embodiment, each of the upper surfaces of the κ upper surface is a flat portion of the convex portion, and the upper surfaces of the heat dissipation fins and the top surface of the crucible are from both ends of the flat portion. The base 22 extending toward the air inlet end 23 and the air outlet end 25 is streamlined. The side end faces of each of the heat dissipation fins 24 adjacent to the air inlet end 23 and the air outlet end 25 are smooth curved surfaces.
月的疋母政熱韓片24之上表面亦可呈一中間上凸单 滑弧面。 .W 本發明散熱器20之較佳實施方式在使用時固定於一 電腦主板之某-電子元件（圖未示）±，用於給該電子元 件散熱。該電子70件即發熱源位於該底座22底部之中央 置。 — 該風扇之風流包括一流經該散熱器20之散熱鰭片24 上部之第一風流210及一流經該散熱鰭片24中下部之第二 風流212。由於該等散熱鰭片24之上表面自中部分別向: 進風端23及出風端25之方向呈流線型降低，且於靠近該 進風端23及出風端25處與該底座22之兩相對侧邊相交/ 故該風流流向每一散熱鰭片24對應於進風端23之側端面 220時，由於在該進風端23處，該第一風流21〇及該第二 風流212與該侧端面22〇不垂直，故該第一風流21〇及該 第二風流212於該進風端23處之風阻大大降低，進而更好 的滿足了系統之散熱需求，提高了系統之整體散熱效率。 本發明散熱器之較佳實施方式之該等散熱鰭片24之 1305572 上表面自中部分別向該進風端23及出風端25之方向呈流 線型降低直至與該底座22於兩相對側彡處相交，可降低風 阻，提高了散熱系統之整體散熱效率。 _ 刹由Ϊ上所述’本發日月符合發明專利要件，爰依法提出專 1 ▲清。惟’以上所述者僅為本發明之較佳實施方式，兴 案技藝之人士，在爰依本發明精神所作之等效： ，良化，皆應涵蓋於以下之申請專利範圍内。The upper surface of the month's mother-in-law Korean film 24 may also have a convex upper curved surface. The preferred embodiment of the heat sink 20 of the present invention is fixed to an electronic component (not shown) ± of a computer motherboard for use in dissipating heat to the electronic component. The electronic component 70, that is, the heat source, is located at the center of the bottom of the base 22. - The wind flow of the fan comprises a first air flow 210 passing through the upper portion of the heat sink fin 24 of the heat sink 20 and a second air flow 212 passing through the lower middle portion of the heat radiating fin 24. The upper surface of the heat dissipation fins 24 is streamlined from the central portion to the air inlet end 23 and the air outlet end 25, and is adjacent to the air inlet end 23 and the air outlet end 25 and the base 22 When the airflow flows to each of the heat dissipation fins 24 corresponding to the side end surface 220 of the air inlet end 23, the first air flow 21 and the second air flow 212 are at the air inlet end 23 The side end surface 22〇 is not vertical, so the wind resistance of the first air flow 21〇 and the second air flow 212 at the air inlet end 23 is greatly reduced, thereby better satisfying the heat dissipation requirement of the system and improving the overall heat dissipation efficiency of the system. . In the preferred embodiment of the heat sink of the present invention, the upper surface of the 1305572 of the heat dissipation fins 24 is streamlined from the central portion to the air inlet end 23 and the air outlet end 25 until the opposite sides of the base 22 are opposite to each other. Intersection can reduce wind resistance and improve the overall heat dissipation efficiency of the heat dissipation system. _ 刹 Ϊ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ However, the above description is only the preferred embodiment of the present invention, and those skilled in the art of the present invention are equivalent to the spirit of the present invention.
【圖式簡單說明】 圖1係習知散熱器之立體圖。 圖2係圖1之主視圖。 圖3係本發明散熱器之較佳實施方式之立體圖 圖4係圖3之主視圖。 【主要元件符號說明】 [習知] 散熱器 10 進風端 13 出風端 15 弟一風流 112 [本發明] 散熱器 20 進風端 23 出風端 25 第—風流 212 底座 12 散熱鰭片 14 第一風流 110 第三風流 114 底座 22 散熱鰭片 24 第一風流 210 側端面 220、222BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional heat sink. Figure 2 is a front view of Figure 1. Figure 3 is a perspective view of a preferred embodiment of the heat sink of the present invention. Figure 4 is a front elevational view of Figure 3. [Main component symbol description] [General knowledge] Radiator 10 air inlet end 13 air outlet end 15 brother one wind flow 112 [Invention] Radiator 20 air inlet end 23 air outlet end 25 first - air flow 212 base 12 heat sink fin 14 First wind flow 110 third air flow 114 base 22 heat sink fins 24 first air flow 210 side end faces 220, 222