TWI377333B - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TWI377333B
TWI377333B TW098103668A TW98103668A TWI377333B TW I377333 B TWI377333 B TW I377333B TW 098103668 A TW098103668 A TW 098103668A TW 98103668 A TW98103668 A TW 98103668A TW I377333 B TWI377333 B TW I377333B
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Taiwan
Prior art keywords
heat
wind
heat sink
heat dissipation
fins
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TW098103668A
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Chinese (zh)
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TW201030307A (en
Inventor
Chuan Yi Liang
Ming Chang Wu
Chih An Liao
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Wistron Corp
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Priority to TW098103668A priority Critical patent/TWI377333B/en
Priority to US12/534,846 priority patent/US20100193162A1/en
Publication of TW201030307A publication Critical patent/TW201030307A/en
Application granted granted Critical
Publication of TWI377333B publication Critical patent/TWI377333B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

PWHQ-MI-0230-TWXX 29708twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置’且特別是有關於一種 對散熱鰭片之結構進行設計’喊生所需散減流場的散 熱裝置。 【先前技術】 一般來說’電腦主機内部的電路板上會設有許多電子 元件，其中部分的電子元件，例如中央處理單元(Central Processing Unit，CPU)、脈衝寬度調變器（pulse WidthPWHQ-MI-0230-TWXX 29708twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and in particular to a design for the structure of a heat dissipating fin The heat sink required to dissipate the flow field. [Prior Art] Generally, there are many electronic components on the circuit board inside the computer mainframe, some of which are electronic components such as a central processing unit (CPU) and a pulse width modulator (pulse Width).

Modulation，PWM)及北橋晶片（north bridge)等在運作時會 產生大量的熱能。因此，如果未能及時移除這些熱能而使 其持續地累積在電子元件上，電子元件的溫度將會逐漸上 升並超過其正常工作溫度。如此一來，可能會造成電子元 件無法穩定運作，進而導致電腦主機當機(crash)。另外， 若是溫度太高，電子元件更可能會產生損壞而造成永久性 的失效。 一般而言，習知散熱裝置包括散熱座、風扇、鰭片與 導流板。當風扇運轉時’風扇所產生的氣流可經由散熱座 的進風口進入散熱座内，並經由散熱座的出風口排出，以 對電子元件進行散熱。此外，設置在鰭片下方的導流板更 可引導部分氣流朝向電路板表面流動，以對散熱座周圍的 電子元件進行散熱。 然而’在此種散熱裝置中，風扇所產生的氣流必須藉 由結合於散熱座的導流板引導，才能對電路板表面上的電 PWHQ-MI^SO-TWXX 29708twf.d〇c/n 子元件政熱。因此’此種散熱裝置 者，散熱座與導流板需要藉由額二c為複雜。再 此此種散熱裝置不僅製作成本較件進行組裝，因 為製造工差或組裝時的組裝公差：降低7靠度也可能會因 【發明内容】 - 本發明提供一種散熱裝置， 散熱氣流場’以對發熱元件提供優異的際需求的 本發明提出一種散熱裝置，其適」發 =散，携一基座以及，片：:基= 、發…、兀件的上方。散熱_片組配置於基座上並由多個相 互平行的㈣所構成。散熱鰭片組具有相對的—入風側與 一出風側，且該入風側或該出風側的至少一部分鰭片或孔 洞在一側形成一擾流結構。 曰 θ在本發明之一實施例中，上述這些鰭片或孔洞的數量 疋位於散熱鰭片組之中心線之一側，並沿著接近或遠離發 熱元件的方向遞增。 在本發明之一實施例中，上述擾流結構係藉由縮減至 少一部分的這些鰭片在出風側之面積所形成。 在本發明之一實施例中，上述擾流結構包括位於這些 鰭片表面的多個凸起或凹陷。 在本發明之一實施例中’上述擾流結構係藉由縮減至 少一部分的這些鰭片在出風側之向下打折所形成。 在本發明之一實施例中，該些鰭片或孔洞的數量是位 於該散熱鰭片組之中間高度線之下方均勻分佈。 1377333 PWHQ-MI-0230-TWXX 29708twf.doc/n ^本剌之-實關巾，流結構包括位於這些 鰭片表面的多個凸起或凹陷。 在本發明之-實施例中，上述擾流結構係藉由縮減至 >、-部分的這些韓片在出風側之向下打折所形成。Modulation, PWM) and north bridges generate a lot of heat during operation. Therefore, if the thermal energy is not removed in time to accumulate on the electronic component, the temperature of the electronic component will gradually rise and exceed its normal operating temperature. As a result, the electronic components may not operate stably, which may cause the computer to crash. In addition, if the temperature is too high, the electronic components are more likely to cause damage and cause permanent failure. In general, conventional heat sinks include a heat sink, a fan, a fin, and a baffle. When the fan is running, the airflow generated by the fan can enter the heat sink through the air inlet of the heat sink and is discharged through the air outlet of the heat sink to dissipate the electronic components. In addition, the baffles disposed below the fins direct a portion of the airflow toward the surface of the board to dissipate heat from the electronics surrounding the heat sink. However, in this type of heat sink, the airflow generated by the fan must be guided by the baffle combined with the heat sink to power the PWHQ-MI^SO-TWXX 29708twf.d〇c/n on the surface of the board. Component politics. Therefore, in such a heat sink, the heat sink and the baffle need to be complicated by the amount of c. In addition, the heat dissipating device is not only cost-effective to assemble, but also because of manufacturing defects or assembly tolerances during assembly: the reduction of 7 degrees may also be due to the invention - the present invention provides a heat dissipating device, the cooling airflow field The present invention provides an excellent heat dissipation device that provides a heat dissipating device that is adapted to "send", carry a pedestal, and: a substrate: a base, a hair, and a top member. The heat dissipation sheet is disposed on the base and is composed of a plurality of parallel (four). The heat sink fin set has opposite air inlet sides and an air outlet side, and at least a portion of the fins or holes of the air inlet side or the air outlet side form a spoiler structure on one side.曰 θ In one embodiment of the invention, the number of fins or holes 上述 is located on one side of the center line of the heat sink fin group and increases in a direction approaching or away from the heat generating element. In one embodiment of the invention, the spoiler structure is formed by reducing the area of the fins on the air outlet side to at least a portion. In one embodiment of the invention, the spoiler structure includes a plurality of projections or depressions on the surface of the fins. In one embodiment of the invention, the spoiler structure is formed by reducing the fins of at least a portion of the fins down on the wind side. In one embodiment of the invention, the number of fins or holes is evenly distributed below the intermediate height line of the heat sink fin set. 1377333 PWHQ-MI-0230-TWXX 29708twf.doc/n ^This is a solid-cut towel, and the flow structure includes a plurality of protrusions or depressions on the surface of these fins. In the embodiment of the present invention, the above-described spoiler structure is formed by down-cutting of the Korean sheets which are reduced to >, - portions on the air outlet side.

基於上述，本發明藉由擾流結構的設計可改變流經 政熱裝置之軋流的流向，進而可冷卻位於散熱裝置下方與 出風侧的發熱元件。此外，擾流結構更可增:氣流於出風 側/入風側之縱向紊流強度，並改變縱向壓力梯度，以使散 熱裝置具有更佳的散熱效果。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】Based on the above, the present invention can change the flow direction of the flow through the thermal device by the design of the spoiler structure, thereby cooling the heating elements located below the heat sink and on the wind side. In addition, the spoiler structure can be increased: the longitudinal turbulence intensity of the airflow on the wind side/air inlet side, and the longitudinal pressure gradient is changed, so that the heat sink has better heat dissipation effect. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment]

圖1是依照本發明一貫施例之一種散熱裝置配置於電 路板的示意圖。圖2為圖1之散熱裝置配置於電路板之上 視圖。請參考圖1與圖2，散熱裝置1〇〇包括一基座Η〇、 一散熱籍片組120以及一風扇130。基座11〇配置於電路 板10上且位於發熱元件190的上方。在本實施例中，電路 板10例如是主機板，而發熱元件190例如是中央處理單元 (Central Processing Unit，CPU)。 散熱韓片組120配置於基座11〇並由多個相互平行的 鰭片120a所組成。散熱鰭片組120具有一入風側122以及 一相對於入風側122的出風侧124。風扇130配置於散熱 縛片組120的入風側122。當風扇130轉動時’風扇13〇 驅使氣流自入風側122進入散熱鰭片組120，再經由出風 5 PWHQ-MI-0230-TWXX 29708twf.doc/n 侧124離開散熱鰭片組120。此外，為了控制流經散熱鰭 片組120之氣流的流場，本實施例更進一步在散熱鰭片組 120的出風侧124形成一擾流結構126,因此當氣流流經散 熱鰭片組120的出風側124時，會同時流經擾流結構126。 圖3是本發明之一實施例之散熱鰭片組配置於電路板 的示意圖。圖4為圖3之散熱鰭片組於其出風側之流場分 佈示意圖。請參考圖3與圖4，擾流結構226是形成於出 風側224的部分鰭片220a上。在本實施例中，一部分的鰭 片220a具有相同的構形，而其餘的鰭片220a形成擾流結 構226。更詳細地說，本實施例藉由縮減位於出風侧224 的部分鰭片220a之面積來形成擾流結構226。藉由擾流結 構226的設計，可改變氣流於出風侧之縱向紊流強度，並 改變縱向壓力梯度，流經擾流結構226的氣流會被擾動而 形成如圖4表示的流場分佈。 此外’本實施例用以形成擾流結構226的鰭片220a 鄰近於電路板20配置，並且其面積是沿著接近電路板20 的方向遞減。如此一來，氣流由出風側224離開散熱鰭片 組220時，因為受到擾流結構226的影響，可在出風側224 形成較強的縱向紊流強度，並改變縱向壓力梯度。所以， 氣流可被引導朝向電路板20表面流動，可有效地對電路板 20上的發熱元件290及發熱元件290周圍的其他元件散 熱。 圖5是本發明另一實施例之散熱鰭片組配置於電路板 的示意圖。圖6為圖5之散熱鰭片組於其出風侧之流場分 1377333 PWHQ-MI-0230-TWXX 29708twf.doc/n 佈之不意圖。請參考圖5與圖6，本實施例之散熱鰭片組 320包括一擾流結構326,並且擾流結構326是形成在出風 側324的部分鰭片320a上。詳細而言，擾流結構326包括 位於鰭片320a表面的多個孔洞326a。在本實施例中，孔 洞326a實作上例如是對鰭片32如進行沖壓所形成，且孔 洞326a的數量是沿著接近電路板30的方向遞增。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a heat sink disposed on a circuit board in accordance with a consistent embodiment of the present invention. 2 is a top view of the heat sink of FIG. 1 disposed on a circuit board. Referring to FIG. 1 and FIG. 2 , the heat sink 1 includes a base Η〇, a heat sink group 120 and a fan 130 . The susceptor 11 is disposed on the circuit board 10 and above the heat generating component 190. In the present embodiment, the circuit board 10 is, for example, a motherboard, and the heat generating component 190 is, for example, a central processing unit (CPU). The heat dissipation Korean chip group 120 is disposed on the susceptor 11 〇 and is composed of a plurality of mutually parallel fins 120a. The heat sink fin set 120 has an air inlet side 122 and an air outlet side 124 with respect to the wind inlet side 122. The fan 130 is disposed on the air inlet side 122 of the heat dissipation tab group 120. When the fan 130 rotates, the fan 13 drives the airflow from the wind inlet side 122 into the heat sink fin set 120, and then exits the heat sink fin set 120 via the air outlet 5 PWHQ-MI-0230-TWXX 29708twf.doc/n side 124. In addition, in order to control the flow field of the airflow flowing through the heat dissipation fin set 120, the present embodiment further forms a spoiler structure 126 on the air outlet side 124 of the heat dissipation fin group 120, so that when the airflow flows through the heat dissipation fin group 120 At the exit side 124, it will simultaneously flow through the spoiler structure 126. 3 is a schematic view showing a heat dissipating fin group disposed on a circuit board according to an embodiment of the present invention. 4 is a schematic view showing the flow field distribution of the heat dissipation fin group of FIG. 3 on the air outlet side thereof. Referring to Figures 3 and 4, the spoiler structure 226 is formed on a portion of the fin 220a of the air outlet side 224. In the present embodiment, a portion of the fins 220a have the same configuration, while the remaining fins 220a form a spoiler structure 226. In more detail, the present embodiment forms the spoiler structure 226 by reducing the area of the portion of the fins 220a located on the wind outlet side 224. By the design of the spoiler structure 226, the longitudinal turbulence intensity of the airflow on the wind side can be varied and the longitudinal pressure gradient can be varied, and the airflow flowing through the spoiler structure 226 can be disturbed to form a flow field distribution as shown in FIG. Further, the fin 220a of the present embodiment for forming the spoiler structure 226 is disposed adjacent to the circuit board 20, and its area is decreased in the direction approaching the circuit board 20. As a result, when the airflow exits the heat sink fin set 220 by the wind exit side 224, a strong longitudinal turbulence intensity can be formed on the wind exit side 224 due to the influence of the spoiler structure 226, and the longitudinal pressure gradient is changed. Therefore, the air flow can be directed toward the surface of the circuit board 20, effectively dissipating heat to the heat generating component 290 on the circuit board 20 and other components around the heat generating component 290. FIG. 5 is a schematic diagram of a heat dissipating fin set disposed on a circuit board according to another embodiment of the present invention. 6 is a schematic view of the flow field of the heat sink fin group of FIG. 5 on the air outlet side thereof, 1377333 PWHQ-MI-0230-TWXX 29708 twf.doc/n. Referring to FIG. 5 and FIG. 6, the heat dissipation fin assembly 320 of the present embodiment includes a spoiler structure 326, and the spoiler structure 326 is formed on a portion of the fins 320a of the air outlet side 324. In detail, the spoiler structure 326 includes a plurality of holes 326a on the surface of the fins 320a. In the present embodiment, the holes 326a are formed, for example, by stamping the fins 32, and the number of the holes 326a is increased in the direction approaching the circuit board 30.

如此一來，氣流會流經孔洞326a，再由出風側324離 開散熱鰭片組320’並往電路板30表面的方向流動。此擾 biL結構326可以改變氣流的流場方向，更可以增加縱向的 紊流強度，並改變縱向壓力梯度，以增強散熱鰭片組32〇 的散熱效果。As a result, the airflow will flow through the hole 326a, and then the air-dissipating side 324 will leave the heat-dissipating fin group 320' and flow toward the surface of the circuit board 30. The disturbing biL structure 326 can change the flow field direction of the airflow, and can increase the longitudinal turbulence intensity and change the longitudinal pressure gradient to enhance the heat dissipation effect of the heat dissipation fin group 32〇.

圖7是本發明再一實施例之散熱鰭片組配置於電路板 及其出風側之流％分佈之示意圖。請參考圖7，本實施例 之散熱鰭片組420與上述之散熱鰭片組32〇不同之處在 於’孔洞426a的數量是位於散熱鰭片組42〇之中心線之一 側’並沿著接近電路板40的方向遞減。換言之，在^實施 例中，孔洞426a的數量是位於散熱鰭片組42〇之中心^之 一側，並沿著遠離發熱元件490的方向遞增。 圖8是本發明又一實施例之散熱鰭片組配置於電路板 之及其出風側之流場分佈示意圖。請參考圖8，本實施例 之散熱鰭片組520與上述之散熱鰭片組42〇不同之處在 於’孔洞526a的數量在位於散熱鰭片組52〇之中心線之一 侧，並且接近電路板50的方向相同。 圖9疋本發明另一貫施例之散熱鰭片組配置於電路板 7 PWHQ-MI-0230-TWXX 29708twf.doc/n 的示意圖。請參相9，本實闕之散熱 ^實施例之散熱則組汹不同之處在於：擾流結構你 疋位於鰭片620a表面的多個彎折626a。在本實施例中， 彎折626a是藉由縮減至少一部分的缝# 62〇a在出風側 624之向下打折所形成，且彎折的數量是沿著接近電 路板60的方向遞減。另，f折論亦可為凸起所取代。 上述多個實施例揭露了藉由改變鰭片的面積以及在 韓片上形成凸起或孔洞等形成擾流結構的方法然其並非 用以限林發明。在可能的狀況下，本領域的技術人員更 可改變前述之擾流結構形成在鰭片上的位置、數量、分 變化或型態等，以符合實際的需求。 “就擾/’IL、.Ό構形成在鰭片上的位置而言，前述實施例僅 藉由部分㈣絲紐聽構，並紐流結_成在鄰近 ，機板的位置上。當然，本發明也可以選擇整體的韓片或 是其他位置上的鰭片進行設計來形成擾流結構。 ^就鰭片上所形成之用以構成擾流結構如凸起或孔洞 等結構而言，其數量、型態或分佈可以視需求改變。具體 而言，本發明不限定該些凸起或孔洞等結構的數量或尺寸 大小，孔洞也可以改為凹陷。此外，有別於前述凸起或孔 洞數量沿接近主機板方向逐漸遞減或遞增的分佈方式，本 發明亦可以視實際流場的需求來改變凸起或孔洞等結構的 分佈。 系示上所述，本發明藉由擾流結構的設計，可改變流經 散熱裝置之氣流的流向，進而可冷卻位於散熱裝置下方與 PWHQ-MI-0230-TWXX 29708twf.doc/n 出風側=、、、几件。此夕卜’擾流結構更可增加氣流於 側之縱向I流強度，並改變縱向壓力梯度，以使散 具有更佳的散熱效果。相較於習知技藝，本發明之^ 置可不需配置導流板，進而可節省生產成本。同時，由^ 不需配置導流板’散熱裝置的輯可較為簡化，因而具有 較高的可靠度。 八 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是依照本發明一實施例之一種散熱裝置配置於電 路板的示意圖。 圖2為圖1之散熱裝置配置於電路板之上視圖。 _圖3是本發明之一實施例之散熱鰭片組配置於電路板 的示意圖。 圖4為圖3之散熱雜片組於其出風側之流場分佈示意 圖。 一圖5是本發明另一實施例之散熱鰭片組配置於電路板 的示意圖。 - 圖6為圖5之散熱籍片组於其出風側之流場分佈之示 意圖。 圖7是本發明再一實施例之散熱鰭片組配置於電路板 的示意圖。 1377333 PWHQ-MI-0230-TWXX 29708twf.doc/n 圖8是本發明又一實施例之散熱鰭片組配置於電路板 的示意圖。 圖9是本發明另一實施例之散熱鰭片組配置於電路板 的示意圖。 【主要元件符號說明】Fig. 7 is a schematic view showing a flow distribution of a heat dissipating fin group disposed on a circuit board and an air outlet side according to still another embodiment of the present invention. Referring to FIG. 7 , the heat dissipation fin set 420 of the present embodiment is different from the heat dissipation fin set 32 在于 in that the number of the holes 426 a is located on one side of the center line of the heat dissipation fin group 42 并 and along The direction approaching the circuit board 40 is decreasing. In other words, in the embodiment, the number of the holes 426a is located on the side of the center of the heat radiating fin group 42 and increases in a direction away from the heat generating element 490. FIG. 8 is a schematic view showing a flow field distribution of a heat dissipating fin group disposed on a circuit board and an air outlet side thereof according to still another embodiment of the present invention. Referring to FIG. 8, the heat dissipation fin group 520 of the present embodiment is different from the heat dissipation fin group 42 described above in that the number of the holes 526a is on one side of the center line of the heat dissipation fin group 52, and is close to the circuit. The orientation of the plates 50 is the same. Fig. 9 is a schematic view showing a heat sink fin group according to another embodiment of the present invention, which is disposed on a circuit board 7 PWHQ-MI-0230-TWXX 29708twf.doc/n. Please refer to phase 9, the heat dissipation of this embodiment. The heat dissipation of the embodiment is different in that the spoiler structure is a plurality of bends 626a on the surface of the fin 620a. In the present embodiment, the bend 626a is formed by tapering at least a portion of the slit #62〇a downwardly on the wind outlet side 624, and the amount of the bend is decreased in the direction approaching the circuit board 60. In addition, the f-deformation can also be replaced by a bump. The above various embodiments disclose a method of forming a spoiler structure by changing the area of the fins and forming protrusions or holes on the Korean sheet, which is not intended to limit the invention. Where possible, those skilled in the art can further change the position, number, variation or type of the aforementioned spoiler structure formed on the fin to meet actual needs. "In terms of the position where the interference / 'IL," is formed on the fin, the foregoing embodiment is only heard by the partial (four) wire, and the knot is placed adjacent to the position of the board. Of course, this The invention may also select an overall Korean film or fins at other locations to design a spoiler structure. ^The number of structures formed on the fins to form a spoiler structure such as a bump or a hole, The type or distribution may be changed as needed. Specifically, the present invention does not limit the number or size of the structures such as the protrusions or holes, and the holes may also be recessed. In addition, the number of protrusions or holes is different from the foregoing. The present invention can also change the distribution of structures such as protrusions or holes according to the requirements of the actual flow field. The present invention can be designed by the spoiler structure. Change the flow direction of the airflow flowing through the heat sink, and then cool down the heat sink below the PWHQ-MI-0230-TWXX 29708twf.doc/n wind side =,,, and several pieces. Airflow on the side I flow intensity and change the longitudinal pressure gradient to make the dispersion have better heat dissipation effect. Compared with the prior art, the present invention can eliminate the need to configure the baffle, thereby saving production cost. The arrangement of the baffle plate 'heat dissipating device can be simplified, and thus has high reliability. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any common knowledge in the technical field is known. The scope of protection of the present invention is defined by the scope of the appended patent application, without departing from the spirit and scope of the invention. 2 is a schematic view of a heat dissipating device disposed on a circuit board according to an embodiment of the present invention. FIG. 2 is a view of the heat dissipating device of FIG. 1 disposed on a circuit board. FIG. 3 is a heat dissipating fin group configuration according to an embodiment of the present invention. 4 is a schematic diagram of a flow field distribution of the heat dissipating chip group of FIG. 3 on the air outlet side thereof. FIG. 5 is a heat dissipating fin group disposed on a circuit board according to another embodiment of the present invention. Fig. 6 is a schematic view showing the flow field distribution of the heat radiating chip group of Fig. 5 on the air outlet side thereof. Fig. 7 is a schematic view showing a heat dissipating fin group disposed on a circuit board according to still another embodiment of the present invention. 1377333 PWHQ-MI -0230-TWXX 29708 twf.doc/n FIG. 8 is a schematic diagram of a heat dissipating fin group disposed on a circuit board according to another embodiment of the present invention. FIG. 9 is a schematic diagram of a heat dissipating fin group disposed on a circuit board according to another embodiment of the present invention. [Main component symbol description]

10、20、30、40、50、60 :電路板 100 :散熱裝置 110 :基座 120、220、320、420 ' 520、620 :散熱鰭片組 120a、220a、320a、420a、620a :鰭片 122 :入風側 124、224、324、624 :出風側 126、226、326、426、626 :擾流結構 130 :風扇 190、290、490 :發熱元件 326a、426a、526a :孔洞 626a :彎折10, 20, 30, 40, 50, 60: circuit board 100: heat sink 110: pedestal 120, 220, 320, 420 '520, 620: heat sink fin set 120a, 220a, 320a, 420a, 620a: fin 122: air inlet side 124, 224, 324, 624: air outlet side 126, 226, 326, 426, 626: spoiler structure 130: fan 190, 290, 490: heating element 326a, 426a, 526a: hole 626a: curved fold

Claims (1)

101-5-30 聲·身.(更)正替換頁 七、申請專利範圍·· 熱元件配置拓fl —發熱元件進行散熱，該發 -基座，配該散熱裝置包括： -散熱鰭片組：‘置上方；以及 鰭片所構成，該散敎鍵片相座上並由多個相互平行的 侧’且該出風侧的又的-入風側與-出風 -擾流結構，其中該此洞在，風側形成 方向排列，一氣丁該基座且沿遠離該基座的 流結構引導朝“電⑵該散賴片組時被該擾 •甘曰是位於該散熱鰭片組之中心線之-側了 3ί^ίΐ該發熱元件的方向遞增τ 積所形成。 邛刀的β亥·=·韓片在该出風側之面 、讀範圍第1項所述之散熱裝置，其中該擾 "ϋΐίϊί”面的多個凸起或凹陷。 泣鉍構得雜靶圍第1項所述之散熱裴置，其中該擾 少—部分的該些歸片在該出風側之向 泣申請專利範圍第6項所述之散熱裝置，其中該擾 構包括位於該些鰭片表面的多個凸起或凹陷。 士申清專利範圍第6項所述之散熱裝置，其中該擾 ΪΓ丁縮減至少-部分的該些韓片在該出風側之向101-5-30 Sound and body. (More) Replacement page VII. Patent application range··Hot component configuration extension fl—The heating element is used for heat dissipation. The hair-base is equipped with the heat sink including: - Heat sink fin set : 'above; and the fins are formed, the divergent key plate is seated on the seat and consists of a plurality of mutually parallel sides' and the wind-side side of the wind-side and the wind-spoke structure, wherein The hole is arranged in the direction of the wind side, and the susceptor is guided by the flow structure away from the pedestal toward the "electricity (2). The side of the center line is formed by the τ product of the direction of the heating element. The heat dissipation device of the first item in the reading range of the β Hai·=· Korean film of the boring tool, The turbulence "ϋΐίϊί" face of a plurality of protrusions or depressions. The heat-dissipating device described in item 1 of the miscellaneous target, wherein the disturbance is less--the portion of the heat-dissipating device described in claim 6 of the invention The disturbance includes a plurality of protrusions or depressions on the surface of the fins. The heat sink of the sixth aspect of the patent application, wherein the disturbance is reduced by at least a portion of the Korean pieces on the wind side
TW098103668A 2009-02-05 2009-02-05 Heat dissipation device TWI377333B (en)

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