TWM346266U - Heat dissipation fin and heat dissipation module having the same - Google Patents

Heat dissipation fin and heat dissipation module having the same Download PDF

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Publication number
TWM346266U
TWM346266U TW097208684U TW97208684U TWM346266U TW M346266 U TWM346266 U TW M346266U TW 097208684 U TW097208684 U TW 097208684U TW 97208684 U TW97208684 U TW 97208684U TW M346266 U TWM346266 U TW M346266U
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TW
Taiwan
Prior art keywords
heat
heat dissipation
plate body
guiding
dissipating
Prior art date
Application number
TW097208684U
Other languages
Chinese (zh)
Inventor
Zhi-Ming Chen
Original Assignee
Asia Vital Components Co Ltd
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Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW097208684U priority Critical patent/TWM346266U/en
Priority to US12/288,523 priority patent/US20090283246A1/en
Publication of TWM346266U publication Critical patent/TWM346266U/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M346266 八、新型說明： 【新型所屬之技術領域】 本創作係關於—種散熱鰭片結構及其散熱模組，特別是-種具有 能導引並針《缝的散朗片結觀其散熱模組。 【先前技術】 按’電子貧tfl產品（例如：電腦等）之使用日趨普及且顧更 為廣泛，由於需求帶動電子資訊產業技術發展迅速，促使電子資訊 朝執行運算速度提升、躲容量增加之趨勢發展，導致在前述電子 資訊產品中之零組件於高速運作時常伴隨產生高熱。 以電腦主機為例，其内料央處理單元（GPU)所產生之孰量 佔大部分’此外’巾域理單元當歸逐齡高會造成執行效能降 低，且當熱罝累積雨於其容許限度時，將會迫使電腦當機，嚴重者 更可能會造献損縣；並且，鱗決電磁波骑之問題，通常係 以機箱殼體來賴該電齡機，峨如何射央處料元及其它發 熱零組件（或稱元件）之熱能快速導出，成為—重要課題。 而一般中央處理單元用轉決散熱的方式所採取的係在其上 方設置-散熱ϋ (heat Sink)’該散熱器之—侧構置有若干鰭片， 以:述散熱器之另-侧（未具有鰭片）之表面直接接觸前述中央處 理單元以令熱能_導至上賴“，簡由_散熱或配合增設 一風扇強制驅動氣流來使熱能迅速散逸； 請參閱第la、lb、lc圖所示，如圖所示習知散熱鰭片結構， 及政熱縛片la係為一片體，並於兩侧邊彎折形成一指邊Η，並相 6 M346266 互堆疊形成一散熱鰭片組1，前述該等每-散熱鰭片la間具有-散 熱· na，前述散_片組！係可與一散熱基座2、及至少一熱 導管3搭配組成一散熱模組4;習知散熱模組4係透過前述散孰基 座/之下端面21與—發熱單元（圖中未表示）接觸傳導熱源Γ前 述政熱=2將_傳導至前频導f 3，再透導管3將熱源 傳遞至别述散熱鰭片組！以輻射方式散熱向外擴散，或再增設一散 熱風扇（圖中未表示）強制驅動氣流來辅助散熱，因前述該等散数 則13結構外型係為一平整片體，在單位空間中僅只有上下兩端 平面作為放熱σ卩’散熱面積狹小，故散熱效能有限，朗該等散 :、=去 1間之散熱空間山相當窄小’且無法賴述散熱風扇 127义不）所產生之辅助散熱氣流5順暢流動，故當前述散埶 氣流5大量進入前述散熱雜lla時，容易於窄小朗中総 於前述散熱空間⑸亂竄，甚至向_摺杨處流動，並由= =向外軸，輪咖_議5，令賴風扇（圖中 .、不)所舒之散熱效果大打折扣，甚至制反效果之情事發 ，故習知散熱模組具有下列缺點： I散熱效果不佳； 2·無法確實引導散熱氣流； 3·無法集中散熱氣流； 4·散熱面積過小。 财緣ί ’有鑑於上述習用品所街生的各項缺點，本案之創作人遂 ^〜’潛心研究加以創新改良’終於成功研發完成本件「散熱 7 M346266 案，實為一具功效增進之創作。 鰭片結構及其散熱模組」 【新型内容】 本：另=:供種種增加散—_構。 導_熱_二=熱二表_之流體M346266 VIII, new description: [New technology field] This creation is about a kind of heat sink fin structure and its heat dissipation module, especially the kind of can group. [Prior Art] According to the use of 'electronic lean tfl products (such as: computers, etc.), the use of electronic information industry is rapidly expanding, and the trend of electronic information is increasing and the capacity of hiding is increasing. The development has led to the high heat generated by the components in the aforementioned electronic information products when operating at high speed. Taking the computer mainframe as an example, the amount of sputum generated by the central processing unit (GPU) accounts for the majority of the 'other' area, and the high degree of dynasty will result in lower performance, and when the enthusiasm accumulates rain, its allowable limit At the time, the computer will be forced to crash, and in serious cases, it will be more likely to cause damage to the county; and the problem of riding the scales is usually based on the chassis to rely on the electric machine, how to shoot the central unit and other The rapid release of the thermal energy of the heating components (or components) has become an important issue. In general, the central processing unit adopts a method of turning off the heat dissipation, and a heat sink is disposed on the side of the heat sink. The side of the heat sink is configured with a plurality of fins to describe the other side of the heat sink ( The surface without the fins directly contacts the central processing unit to cause the thermal energy to be “up to the top”. The heat is forced to drive the airflow to quickly dissipate the heat. See the la, lb, and lc diagrams. As shown in the figure, the conventional heat sink fin structure, and the political heat seal sheet la is a body, and is bent at both sides to form a finger edge, and 6 M346266 are stacked on each other to form a heat sink fin group 1 The heat dissipation fins and the heat dissipation bases 2 are combined with a heat dissipation base 2 and at least one heat pipe 3 to form a heat dissipation module 4; The group 4 transmits the heat source through the aforementioned heat sink unit/lower end surface 21 and the heat generating unit (not shown), and the heat source is transmitted to the front frequency guide f3. To the heat sink fin group! radiate heat to spread out, or add another The fan (not shown) forcibly drives the airflow to assist in heat dissipation. Because of the above-mentioned number of 13, the structural appearance is a flat piece. In the unit space, only the upper and lower ends are flat as the heat release σ卩' the heat dissipation area is small. Therefore, the heat dissipation performance is limited, and the distribution of the heat dissipation space is relatively narrow, and the auxiliary heat dissipation airflow 5 generated by the cooling air fan is smoothly flowed, so that the above-mentioned divergent airflow 5 When entering a large amount of the above-mentioned heat-dissipating lla, it is easy to narrow in the narrow space of the aforementioned heat-dissipating space (5), even flowing to the _-Yang Yang, and by = = outward axis, the wheel coffee _ _ 5, let Lai fan ( In the figure, no, the heat dissipation effect of the Shu is greatly reduced, and even the anti-effect effect is caused. Therefore, the conventional heat dissipation module has the following disadvantages: I. The heat dissipation effect is not good; 2. The heat dissipation airflow cannot be reliably guided; Cooling airflow; 4·The heat dissipation area is too small. Caiyuan ί 'In view of the shortcomings of the above-mentioned school supplies, the creator of this case 遂^~'s research and innovation has finally succeeded in research and development of this piece "heat dissipation 7 M346266 The case is actually an effect-enhancing creation. Fin structure and its heat-dissipation module" [New content] This: Another =: for various kinds of increased dispersion - _ structure. _热_二=热二表_的流体

導散熱流_絲_結·魏目触触—種具有引 % 述之目的本創作係提供—種散熱別結構及其散熱模 引/If 1 片結構包含一板體、一第一導弓|部及一第二導 延#⑴述第導引部、第二導引部分別從前述板體兩侧 〜所形成，該第-、二導引部相對該板體分別具有一第 、二夾角’前述散熱鰭片係可相互堆疊搭配組合，且另 :〜、導&、基座、及風扇搭配組成一散熱模組，並藉由前 :散_片結構之第—導引部及第二㈣部引導前述風扇 所產生之流體向前述板體處集中以令前述流體流動順暢 大幅提升散熱效率；故本創作具有下列優點·· 1·可引導氣流提升散熱效率； 2·具有較大的散熱面積及散熱空間； 3·流體於散熱空間中流動順暢； 4·有效集中散熱流體； 5·具有較佳之熱交換效率。 【實施方式】 8 M346266 本創作之上述目較其結_魏上的概，驗騎附圖式 之較佳實施例予以說明。 請參閱第2a、2b圖所示，一散熱，鰭片6a包含一板體61、一第 V引4 62、及一第二導引部63，前述第—導引部及 前述第二導引部63分別從前述板體61之兩舰伸形成， ΐ前，：導引部62係與前述第二導引部63相互對應， 前述第一導引部62相對前述板體61傾斜且具有一第一夾 角621，前述第二導引部63相對前述板體6ι傾斜且具有 一第二夾角631，並前述板體61與前述第一引導部⑽及 第二導引部63共同界定形成一凹槽。 —月|j述第一導引部62向相反前述板體61方向延伸形成 第U 622 ’刖述第二導引部向相反前述板體η 方向延伸形成第二散熱部咖，該第…二散熱部⑵分 別叹有-第-摺邊623及-第二摺邊633，並設有至少一 穿孔64供熱導管穿設（圖中未表示 續如第3圖所示’前述散熱鰭片⑪係可彼此相最 構形成-散熱鰭片組6，且每—散減片6a之第一、: 摺邊623、633貼觸另_散熱鰭片，使在相鄰的兩散熱 鰭片6a間形成一通道ββ。 復爹第2b圖及參照第4a、仆圖所示，前述散熱韓片如 之板體61相對前述第-導引部62及―第二導引部μ 一夾角621及第二夾角| w —, b31為大於9〇度（如第2b圖所 示）；或者等於90度（如楚，门 —、 第4a圖所示）；或者小於9〇声 (如第4b圖所示）。 度 -M346266 續參第5、6圖所示，將前述散熱縛片組6與至少4 導管8及-基座9a組合構成—散熱器9,前述基座此上且 有-凸座9卜並該凸座91 —側面他上開設有至少一孔口 9ιι並 貫穿該凸座91，且該孔口 911向前述基座此周沿處延伸設有一溝 槽912 ’…另前述基座9a具有-下端面_，該下端面可與至少 -發熱單元（®中未表示）接觸作熱源傳導。 前述熱導管8具有至少一吸熱部81及至少-導熱部82，該吸敎 部81係穿設於前職座9a之孔σ 911，並同時容設於前述溝槽912 ’中。 …前述散_片^之第—散熱部奶及第二散熱部_ 係藉由二上所汉之牙孔64 _設於熱導管8之導熱部犯，並與 該導熱官8結合，故當前述基座9將熱源傳至前述熱導管 8之吸熱邛81日寸’可藉由前述熱導管8之導熱部82將熱 源傳遞、、、口串叹於其上之散熱韓片組6，並透過前述散熱縛 片組6將熱源對外擴散散熱。 | 够閱第7、8、9圖所示，前述散熱器9對接—風扇7組合成 -散熱模組10，前述風扇7相對前述散_片組6 一侧，更詳言之 風扇7，對前述散熱鰭片之板體61及第-、二導引部62、63及 第^、，一政熱部622、632，故當前述風扇7強制將散熱流體71導 入:述通道66中時’可透過前述第—導引部62及第二導引部⑹ 將刖=政^^體71引導向前述板體61處集中，令前述輔助散熱流 體71可非$流暢且具有規律性的在前述通道66中流動，並集中前 述政熱氣机71 ’使該散熱氣流71不致向第一、二摺邊623、 處D大巾^升如述散熱模組1〇之散熱效能。 M346266 績參閱第10圖所示，前述散熱鰭片6a之第一散熱部6烈及第 二散熱部632的相反兩侧分設至少一第一扣結部624 邛’並前述第一扣結部及第二扣結部咖可相對勾扣於位 於前端之另一散熱鰭片6的第一扣詰部624及第二扣結部6科:八 則述政熱鰭片6a可相互作堆疊組合，藉以組成前述散熱鰭片組6， 此，變化亦不超脫本案申料利顧，並且於前述實施相同具有增 加散熱面積並導引流體往散熱鰭片6a表面中央集中流出。 故藉由前述散熱鰭片組6之凹槽65不僅增大前述散熱鰭片組6 之政熱面積，且可引導並集中前述風扇γ所產生之散熱流體71進 订散熱，令散熱模組1〇整體之散熱效能大幅提升並解決習知技術 所衍生之種種缺失。 舄陳月者，以上所述僅為本案之較佳實施例，並非用以限制本 創作，右依本創作之構想所作之改變，在不脫離本創作精神範圍 内例如·對於構形或佈置型態加以變換，對於各種變化，修飾與 w用所產生4效作用，均應包含於本案之權利範圍内，合予陳明。 、一、斤过本創作之散熱籍片結構及其散熱模組於使用時，為 ，實月b達到其功效及目的，故本創作誠為一實用性優異之創作，為 符口新型專利之申請要件，爰依法提出申請，盼料早日賜准本 ^ X保障創作人之辛苦創作，倘$釣局審委有任何稽疑，請不 吝來函心7F，創作人定當竭力配合，實感德便。 【圖式簡單說明】 第la圖係為習知散熱鰭片立體圖。 第lb圖係為習知㈣鰭片組立體分解圖。 11 M346266 第lc圖係為習知散熱模組立體組合圖。 第Id圖係為習知狀態示意圖。 第2a圖係為本創作實施例之散熱鰭片立體圖。 第2b圖係為本創作實施例之散熱鰭片組正視圖。 第3圖係為本創作實施例之散熱鰭片組立體圖。 第4a圖係為本創作另一實施例之散熱鰭片正視圖。 第4b圖係為本創作另一實施例之散熱鰭片正視圖。 第5圖係為本創作實施例之散熱模組之立體分解圖。 第6圖係為本創作實施例之散熱模組之立體組合圖。 第7圖係為本創作另一實施例之散熱模組立體組合圖。 第8圖係為本創作另一實施例之散熱模組狀態示意圖。 第9圖係為本創作另一實施例之散熱模組狀態示意圖。 第10圖係為本創作另—實施例之散熱鰭片組立體分解圖。 【主要元件符號說明】 • 散熱鰭片組6 - 散熱鰭片6a - 板體61 第一導引部62 第一夾角621 第一散熱部622 第一摺邊623 第一扣結部624 第二導引部63 12 M346266 第二夾角631 第二散熱部632 第二摺邊633 第二扣結部634 穿孔64 凹槽65 通道66 風扇7 *獅《流體71 熱導管8 吸熱部81 導熱部82 散熱器9a 基座9 凸座91 φ 侧面91a - 下端面91b ^ 孔口 911 溝槽912 散熱模組10The heat dissipation flow _ wire _ knot · Wei eyes touch - the kind of the purpose of the introduction of the description of the purpose of this creation provides a kind of heat dissipation structure and its heat dissipation mode / If 1 piece structure contains a plate body, a first guide bow | The second guiding portion and the second guiding portion are respectively formed from the two sides of the plate body, and the first and second guiding portions respectively have a first and second angles with respect to the plate body. The aforementioned heat-dissipating fins can be stacked and combined with each other, and another: ~, guide & pedestal, and fan are combined to form a heat-dissipating module, and by the front: the first part of the scatter-sheet structure The second (four) portion guides the fluid generated by the fan to concentrate on the plate body to smooth the fluid flow and greatly improve the heat dissipation efficiency; therefore, the creation has the following advantages: 1. The airflow can be guided to improve the heat dissipation efficiency; Heat dissipation area and heat dissipation space; 3. Fluid flow smoothly in the heat dissipation space; 4. Effectively concentrate heat dissipation fluid; 5. Have better heat exchange efficiency. [Embodiment] 8 M346266 The above-mentioned objects of the present invention are described in comparison with the preferred embodiment of the present invention. As shown in FIGS. 2a and 2b, the fin 6a includes a plate body 61, a V-th guide 4 62, and a second guiding portion 63, the first guiding portion and the second guiding portion. The portions 63 are respectively formed from the two ships of the plate body 61. The front portion of the guide portion 62 corresponds to the second guiding portion 63. The first guiding portion 62 is inclined with respect to the plate body 61 and has a a first angle 621, the second guiding portion 63 is inclined with respect to the plate body 6ι and has a second angle 631, and the plate body 61 and the first guiding portion (10) and the second guiding portion 63 are jointly defined to form a concave portion. groove. —月|j The first guiding portion 62 extends in the opposite direction of the plate body 61 to form a U 622 ′. The second guiding portion extends in the opposite direction of the plate body η to form a second heat dissipating portion. The heat dissipating portion (2) respectively has a first-folded edge 623 and a second folded edge 633, and at least one through hole 64 is provided for the heat pipe to pass through (the figure is not shown in FIG. 3). The heat dissipating fin group 6 can be formed in the same manner as each other, and the first one of each of the diffusing fins 6a: the folded edges 623, 633 are in contact with the other heat sinking fins, so as to be between the adjacent two heat radiating fins 6a Forming a channel ββ. The reticle 2b and the reference 4a and the servant diagram show that the heat sink Korean sheet 61 is at an angle 621 with respect to the first guide portion 62 and the second guide portion μ. Two angles | w —, b31 is greater than 9 degrees (as shown in Figure 2b); or equal to 90 degrees (such as Chu, door -, Figure 4a); or less than 9 inches (as in Figure 4b) Illustratively shown in Figures 5 and 6, the heat-dissipating die set 6 is combined with at least four conduits 8 and - pedestals 9a to form a heat sink 9, the base having a - boss 9 Bu And the protrusion 91 is provided with at least one opening 9 151 and extending through the protrusion 91, and the opening 911 extends to the periphery of the base to provide a groove 912 ′. a lower end surface _, the lower end surface being in contact with at least a heat generating unit (not shown) for heat source conduction. The heat pipe 8 has at least one heat absorbing portion 81 and at least a heat conducting portion 82, and the suction portion 81 is passed through The hole σ 911 in the front seat 9a is also accommodated in the groove 912 '. The first part of the scatter piece _ the heat-dissipating part milk and the second heat-dissipating part _ 64 _ is disposed in the heat conducting portion of the heat pipe 8 and is combined with the heat conducting member 8, so that the heat transfer from the susceptor 9 to the heat pipe 8 of the heat pipe 8 can be conducted by the heat pipe 8 The portion 82 transmits the heat source to the heat-dissipating Korean group 6 on which the string is smothered, and the heat source is diffused and dissipated through the heat-dissipating block group 6. The heat dissipation is shown in Figures 7, 8, and 9. The docking-fan 7 of the device 9 is combined into a heat-dissipating module 10, and the fan 7 is opposite to the side of the scattered-chip group 6, more specifically, the fan 7, The heat dissipation fin plate 61 and the first and second guiding portions 62 and 63 and the first and second heat regulating portions 622 and 632, when the fan 7 forcibly introduces the heat dissipation fluid 71 into the channel 66. The first guiding portion 62 and the second guiding portion (6) can guide the 刖=zheng body 71 to the front plate 61, so that the auxiliary heat dissipating fluid 71 can be non-fluent and regular in the foregoing. The flow in the passage 66 and the concentration of the aforementioned hot air compressor 71' causes the heat dissipation airflow 71 to not cause the heat dissipation performance of the heat dissipation module 1 to the first and second flanges 623 and the D. As shown in FIG. 10, the first heat dissipating portion 6 of the heat dissipating fin 6a and the opposite sides of the second heat dissipating portion 632 are respectively provided with at least one first fastening portion 624 邛 ' and the first fastening portion. And the second fastening portion can be hooked to the first fastening portion 624 and the second fastening portion 6 of the other heat dissipation fin 6 at the front end: the eight-section hot fin 6a can be stacked on each other Therefore, the heat dissipating fin group 6 is formed, and the change does not exceed the application of the present invention, and the same as the foregoing embodiment, the heat dissipating area is increased and the fluid is directed to flow out toward the center of the surface of the heat dissipating fin 6a. Therefore, the recess 65 of the heat dissipation fin group 6 not only increases the thermal area of the heat dissipation fin group 6, but also guides and concentrates the heat dissipation fluid 71 generated by the fan γ to heat the heat, so that the heat dissipation module 1 The overall heat dissipation performance has been greatly improved and the various shortcomings derived from the prior art have been solved.舄Chen Yue, the above is only the preferred embodiment of the case, and is not intended to limit the creation of this work. The changes made by the concept of the original creation are not within the scope of the spirit of the creation, for example, for the configuration or arrangement. The state is transformed. For the various changes, the four effects of the modification and the use of w should be included in the scope of the case and combined with Chen Ming. First, the design of the heat-dissipating film structure and the heat-dissipating module of this creation are used, and the real moon b achieves its efficacy and purpose. Therefore, this creation is a practical and excellent creation, and it is a new patent for Fukou. Apply for the requirements, and apply in accordance with the law, I hope that the author will give you the hard work of the creator as soon as possible. If there is any doubt in the fishing bureau, please don't hesitate to contact 7F. The creator will try his best to cooperate with him. [Simple description of the drawing] The first drawing is a perspective view of a conventional heat sink fin. The lb diagram is a three-dimensional exploded view of the conventional (four) fin group. 11 M346266 The lc diagram is a three-dimensional combination diagram of a conventional heat dissipation module. The first Id diagram is a schematic diagram of a conventional state. Fig. 2a is a perspective view of the heat sink fin of the present embodiment. Figure 2b is a front view of the heat sink fin set of the present embodiment. Fig. 3 is a perspective view of the heat sink fin group of the present embodiment. Figure 4a is a front view of a heat sink fin of another embodiment of the present invention. Figure 4b is a front view of a heat sink fin of another embodiment of the present invention. Figure 5 is a perspective exploded view of the heat dissipation module of the present embodiment. Figure 6 is a perspective assembled view of the heat dissipation module of the present embodiment. FIG. 7 is a perspective assembled view of a heat dissipation module according to another embodiment of the present invention. Figure 8 is a schematic view showing the state of the heat dissipation module of another embodiment of the present invention. FIG. 9 is a schematic diagram showing the state of a heat dissipation module according to another embodiment of the present invention. Figure 10 is a perspective exploded view of the heat sink fin set of the other embodiment. [Description of main component symbols] • Heat sink fin set 6 - Heat sink fin 6a - Plate body 61 First guide portion 62 First angle 621 First heat sink portion 622 First flange 623 First buckle portion 624 Second guide Leading portion 63 12 M346266 Second angle 631 Second heat sink 632 Second flange 633 Second buckle portion 634 Perforation 64 Groove 65 Channel 66 Fan 7 * Lion "Fluid 71 Heat pipe 8 Heat sink 81 Heat transfer portion 82 Heat sink 9a base 9 boss 91 φ side 91a - lower end 91b ^ orifice 911 groove 912 heat dissipation module 10

Claims (1)

M346266 九、申請專利範圍： 1· 一種散熱鰭片結構，係包含一板體 引部，前述第一、 -第-導弓丨部及1二、 導引部分別從板體延伸形成，▲〜v 導引部相對該板體具有一第一夾角，該第二導 邊第〜 板體具有一第二夾角。 4相對該 2·如申請專利範圍第1項所述之散熱鰭片結構，其中前、,、★ 引部相對前述板體傾斜，前述第二導弓丨部相二迷第〜導 斜。 w述板體傾 3·如申請專利範圍第1或2項所述之散熱鰭片結構，其、 一導引部及前述第二導引部分設於前述板體兩相中別迷第 4·如申請專利範圍第1項所述之散熱鰭片結構，其中前 引部延伸一第一散熱部，前述第二導引部延伸:述第一導 部。 第二散熱 5·如申請專利範圍第4項所述之散熱鰭片結構，其、 二散熱部設有至少一穿孔。 ^ 別迷第—、 ❿6·如申請專利範圍第1項所述之散熱鰭片結構，〜、 二夾角小於90或等於9〇度或大於9〇度。則迷第〜、 -7·如申請專利範圍第i或2項所述之散熱鰭片結構 體和前述第一、二導引部共同界定一凹槽。，、中前述板 8. —種散熱模組，係包含： 一基座； 部，該吸熱部係連結上 並串套於前述導熱部， -熱導管，具有至少1熱部及至少一導熱 述基座，·及 -散熱鰭#組’係由魏散熱鰭料疊構成， 14 :M346266 前述每一鰭片包含一板體、一第一導引部及一第二導引部， 前述第一、二導引部分別從板體延伸形成，該第一導引部 相對該板體具有一第一夾角，該第二導引部相對該板體具 有一第二夾角。 9. 如申請專利範圍第8項所述之散熱模組，其中前述第一導引部、 第二導引部相對前述板體傾斜，且第一導引部、第二導引 部並共同界定有一凹槽。 10. 如申請專利範圍第8項所述之散熱模組，其中前述第一導引部 ® 延伸一第一散熱部，前述第二導引部延伸一第二散熱部。 11. 如申請專利範圍第10項所述之散熱器，其中前述第一、二散熱 部設有至少一穿孔，前述穿孔相對串設於前述導熱部。 12. 如申請專利範圍第8項所述之散熱模組，其中前述第一、二夾 角小於90度或等於90度或大於90度。 13. 如申請專利範圍第8項所述之散熱模組，其中前述散熱鰭片組 之毗鄰鰭片間分具一通道。 _ 14.如申請專利範圍第8項所述之散熱模組，其中前述散熱鰭片組 對接有風扇，且相對前述板體及第一、二導引部。 15M346266 Nine, the scope of application for patents: 1 · A heat sink fin structure, comprising a plate body lead portion, the first, first - guide bow portion and 12, the guide portion respectively formed from the plate body, ▲ ~ v The guiding portion has a first angle with respect to the plate body, and the second leading edge plate body has a second angle. The heat-dissipating fin structure according to the first aspect of the invention, wherein the front portion, the front portion, the front portion, and the second guide portion are inclined to each other. The heat sink fin structure described in claim 1 or 2, wherein a guide portion and the second guide portion are disposed in the two phases of the board body. The heat dissipation fin structure of claim 1, wherein the front lead portion extends a first heat dissipation portion, and the second guide portion extends: the first guide portion. The heat dissipating fin structure of the fourth aspect of the invention, wherein the heat dissipating fins are provided with at least one perforation. ^ Don't be obsessed with -, ❿6· As claimed in the patent application scope 1 of the heat sink fin structure, ~, two angles less than 90 or equal to 9 degrees or greater than 9 degrees. The heat dissipating fin structure as described in claim i or 2, and the first and second guiding portions jointly define a groove. The heat dissipation module of the above-mentioned board 8 includes: a base; the heat absorption portion is coupled and sleeved on the heat conducting portion, the heat pipe has at least 1 heat portion and at least one heat conduction portion The pedestal, and the heat-dissipating fins #group' are composed of a stack of fins, 14: M346266, each of the fins includes a plate body, a first guiding portion and a second guiding portion, the first The two guiding portions are respectively formed from the plate body, the first guiding portion has a first angle with respect to the plate body, and the second guiding portion has a second angle with respect to the plate body. 9. The heat dissipation module of claim 8, wherein the first guiding portion and the second guiding portion are inclined with respect to the plate body, and the first guiding portion and the second guiding portion are jointly defined There is a groove. 10. The heat dissipation module of claim 8, wherein the first guiding portion ® extends a first heat dissipation portion, and the second guiding portion extends a second heat dissipation portion. 11. The heat sink according to claim 10, wherein the first and second heat dissipating portions are provided with at least one through hole, and the through holes are oppositely arranged in the heat conducting portion. 12. The heat dissipation module of claim 8, wherein the first and second angles are less than 90 degrees or equal to 90 degrees or greater than 90 degrees. 13. The heat dissipation module according to claim 8, wherein the adjacent fins of the heat dissipation fin group are divided into one channel. The heat dissipation module of claim 8, wherein the heat dissipation fin set is butted with a fan, and is opposite to the front plate body and the first and second guiding portions. 15
TW097208684U 2008-05-19 2008-05-19 Heat dissipation fin and heat dissipation module having the same TWM346266U (en)

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TW097208684U TWM346266U (en) 2008-05-19 2008-05-19 Heat dissipation fin and heat dissipation module having the same
US12/288,523 US20090283246A1 (en) 2008-05-19 2008-10-21 Cooling fin structure and heat-dissipating module thereof

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US20120261096A1 (en) * 2011-04-12 2012-10-18 Asia Vital Components Co., Ltd. Radiating fin structureand thermal module using same
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SG11201606735PA (en) 2014-02-18 2016-09-29 Forced Physics Llc Assembly and method for cooling
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US10542644B2 (en) 2016-12-14 2020-01-21 A.K. Stamping Company, Inc. Two-piece solderable shield

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