201104209 六、發明說明： 【發明所屬之技術領域】 本發明係提供一種利用散熱籍片夕a 同時產生橫向之氣流，以加速&熱冷卻^ ^形成之流道，即可 散熱冷卻效果之散熱器之散熱鰭片結構。政.、、、鰭片，並大幅提升 【先前技術】 按，現今科技產業的不斷進步，使得 不斷提昇，喊高性能、聽率的訴求下之性能及效率 運作速度，卻也使得電子元件之發熱量，電2件之 溫度又與其可靠度、使用壽命等息息‘ hi的操作 電子元件之散熱能力成了-侧鍵性的^題。b ’如何有效提昇 ===，持=以= 散熱器ΐ ==熱=f扇12，該 111間設有通道i i 2，並mi件===散脑片 一側端，^ όf 1 2係震設於散熱器11之 該散敎f予生流經該通道112之氣流，以使 於使用、增如=:111散熱冷卻;惟’該魏置1 0 1該散熱裝置10為了縮小體積，其散熱器工工之散熱籍片 1必須作密集的排列，而使各相鄰散埶 =12:r小’當風扇12產以 得氣流之麗力及_逐漸降低，而使得該散 之熱量_去，進而無法達 散熱111 1之散熱則1 1 1係作密集的排列，且僅最外 熱韓片1 η與外部之线接觸，而内側之各散熱錯 1不僅傳導之熱量較多，且與空氣接觸之部分較少， 2 201104209 進而，導致内部散熱鰭片1 1 1之熱量難以散去，進而影響散 熱冷卻之效果。 曰 請參閱第2、3圖所示，其係另一種習用之散熱裝置2 〇， 該散熱裝置2 0包括有散熱器21及風扇2 2，該散熱器2工係 於一底板21 1上設有複數個散熱鰭片2丄2，且於^目鄰之散 ，鰭片212間設有通道213，並使電子元件之熱量可傳導至 該散熱器21之底板21 1，再經由底板21 1傳導至各散熱鰭 片2 1 2 ’另該風扇2 2係裝設於散熱器2 1之上方，而利該 風扇12產生流入該散熱器2 χ之通道2 χ 3，以使該散熱^ ^ 21之散熱鰭片212散熱冷卻；惟，該散熱裝置2 〇於使用上 卻仍有如下之缺弊： 、 1 ·該散熱裝置2 0之風扇22所產生之氣流係由上往下流入散 熱器21之通道213，當氣流到達底板211時，其雖有 部份之氣流可由底部之二側流出，而將散熱鰭片212之熱 量帶離，以使散熱鰭片212散熱冷卻，然而，卻有另一^ 伤之氣流於底板211處反轉，而於各通道213内產生由 下往上之氣流，而該反轉之氣流將使風扇2 2所產生之氣流 難以平順的流入各通道213内’進而影響散埶冷卻之效 果。 * 鲁 2 ·該散熱裝置2 〇之風扇2 2所產生之氣流係由上往下流入散 熱器21之通道213，當氣流到達底板211時，即有部 份之氣流易於該通道213底部形成渦流，而使熱氣於通道 213旋轉流動，而無法將散熱鰭片212之熱量帶離，進 而大幅降低散熱冷卻之效果。 有鑑於此，本發明人遂以其多年從事相關行業的研發與製作 經驗，針對目前所面臨之問題深入研究，經過長期努力之研究與 試作，終究研創出一種可大幅提高散熱冷卻效果之散熱器之散熱 鰭片結構，並藉以大幅改善習式之缺弊，此即為本發明之設計宗 旨。 【發明内容】 201104209 埶薄夕·^勒缺ΐ要目的係提供一種散熱器之散熱鰭片結構，該散 骑二二係由複數個片體相互疊置排列組成，且於該相鄰 献旦有前、後縱向之通道，並使電子元件運作時所產生之 ΐ、里:散熱,鳍片之各片體上，該散熱錯片之前端裝設有風 :鰭i散埶ίί而ί:向流穿該散熱器各通道之氣流，以使各散 之穿槽，以於該編片上形成橫向且由外往内漸 v ，利職散熱則上橫向之流道，而於風扇之縱 ，即可使散熱器外部之空氣受到通道内 而沿著該流道進人散熱器内部，以同時 Ϊ氣該通道内縱向氣流之壓力及流速，使縱 道’以加速散熱冷卻散熱縛片，進而達到大 幅&升散熱冷邠效果之實用目的。 。本發明之另一目的係提供一種散熱器之散熱鰭片結哕 熱黄ί熱ϊ片係μ數個片體相互疊置排列組成，且於該二 熱韓片散熱冷卻；其中，該散埶’以使各散 作相對應湖之穿槽，以於該散齡片 =開向且 縮之流道；藉此，利用該散熱 向氣流流動經過該流道時，即可使散埶g 而於風扇之縱 逢.耔Θ之濟泣，甘俘牲兮、進入政熱器内部，以同時 產生才κ向之亂w並保持该通道内縱向氣流 ^ 向氣流平順流穿該通道，以加速散熱冷卻散縱 幅提升散熱冷卻效果之實用目的。 ”、、‘”、片進而達到大 【實施方式】 為使貴審查委員對本發明作更進一牛夕姑 施例並配合圖式，說明如后： γ '、，茲舉較佳實 請參閱第4、5、6圖所示，本發明散熱器之散朗片結構， 201104209 該散熱器3 0係於一底板31上裴設有散熱鰭片3 2，該散 片3 2麵複數個片體3 2 χ相互疊置排列組成， 3 21係概呈匸型，其頂部及底部分別向一側延伸設有折 11，並以該片體3 2丄之二折邊3 2丄i抵接於另一片體3 |_之另側以於各相鄰之片體3 2 1間設有前後縱向之通道3 1二並使電子S件運作時所產生之熱量可傳導至該底板3丄 、拍该底板31傳導至散熱鰭片3 2之各片體3 21上，另於兮 以？穿槽3? 1 2係作相對應排列，二吏外侧片體 穿槽3 212外徑依序大於内側相鄰另一片體3 1 卜徑，而於該散熱則3 2之中央及後段處形成橫 “有:，之流道3 ◦ 2 ;另於該散_片3 2之前側端 ’而以該風扇4〇產生由前而後縱向流動穿通於 5亥散^3〇之通道30 1内的氣流。 散轨^參ΐί 7圖所示，本發明之散熱11 3 0於進行電子元件之 電ΐ元件ΐί，散熱器3 〇之底板3 1接觸電子元件，以使該 板3 1傳導至3 1，再經由該底 盘生Sir流動穿襲散仏 片體3 $ Ί夕费圖所不，當該風扇4 〇產生之氣流流動經過該各 熱器3 〇夕卜部:巧0 2時，即使得該散 流動穿片2 器=之内部，以同時產生橫向 氣流，片3 2乱而利用該流道3 0 2内橫向之 縱向持該通道3 Q1内縱向氣流之壓力及流速，使 片以T=St301，且使該散_片32内部之各 達到大巾外部空氣，以加速散誠片之散熱冷卻，進而 升政熱冷卻效果之實用效益。 I閱第9、1 Q圖所示，本發明之另一實施例，該散熱器 201104209 係於-底板5 1上裝設有散絲片5 2，轨 由複數個片體5 2 1排列組成，其中，該片體5 ，，其近底板51之底部處開設有複數個穿孔5 2 ^ 片體5 2 i間設有上下縱向之通道5 〇 5 :電= 量:傳導至該底板51，再經由該底板51傳 舖片5 2之各片體5 2 1上，另於該散細片5 2 Κ Γ其係於該散細片5 2之各片體5 2 i ΐ ϊ:ί = J該各片體5 21之穿槽5 212係作相對 =歹^並使外側片體5 2 !之穿槽5 2 i 2外徑依序大於 ，鄰另-片體5 21之穿槽5 212外徑，而於該散哉縛片^ 2 上形成橫向且由外往内漸縮之流道5 Q 2 :另於該散熱鰭片 端裝設有風扇60，而以該風扇6〇產生由上而下 動穿^於該散熱器50之通道501内的氣流。 。於2圖所示’本發明另一實施例之散熱器5 =仃!子70件之散熱時，其係以該散熱器5 0之底板5 1接 件’贿該電子元件運作時職生之鮮可傳導至該底 板51，再經由該底板51傳導至散熱鰭片5 2之各片體5 j i、首◦產生由上而下縱向流動穿通於該散熱器5 0 二^ ? 1内之乳流，當該風扇6 Q產生之氣流流動經過該各片 51 R η 穿槽，2 1 2所形成之流道5 ° 2時’即使得該散熱 二J I*狀空氣党各通道5 0 1内上、下縱向氣流之吸引，而 j該流道502進人該散熱H50之内部，以同時產生橫向流 土穿，該散熱則5 2之氣流，而利用該流道5 q 2内橫向之氣 =:不僅可保持該通道5 01内縱向氣流之壓力及流速縱 平順流穿該通道5。1，且使該散熱鰭片5 2内部之各片 J5 21可接觸外部空氣，以加速散熱韓片5 2之散熱冷卻，另 备縱向氣流到達底板51時，即有部份之氣流由各通道5 〇 ^七側流動穿出，另有部份之氣流則糊該散熱鰭片5 2各片 體52 1底部之穿孔5 2 11流動穿出，其不僅可防止該由上而 下之縱向氣流碰到底板5 1後形成由下社之反向氣流，且可避 201104209 免於各通道5 01之底部處形成旋轉流動之渦流，以使該風扇6 〇產生之縱向氣流平順流穿該通道5 〇丄，以加速散熱鰭片5 2 之政熱冷卻’進而達到大幅提升散熱冷卻效果之實用效益。 綜上所述，本發明實深具實用性及進步性，然未見有相同之 品及刊物公開，從而允符發明專利申請要件，爰依法提 。 【圖式簡單說明】 第1圖：習用散熱器之使用示意圖。 苐2圖：另一習用散熱器之使用示意圖（一）。 第3圖：另一習用散熱器之使用示意圖（二）。201104209 VI. Description of the Invention: [Technical Field] The present invention provides a heat dissipation film that simultaneously generates a lateral airflow to accelerate and heat-cool the flow path formed by the heat dissipation cooling effect. Heat sink fin structure. Politics, and, fins, and greatly improved [previous technology] According to the continuous advancement of the technology industry today, the continuous improvement, the performance of high performance, listening rate and the speed of efficiency, but also the electronic components The heat generation, the temperature of the electric 2 pieces and its reliability, service life, etc. 'Hi's heat dissipation capability of the operating electronic components has become a side-key problem. b 'How to effectively improve ===, hold = to = radiator ΐ == heat = f fan 12, the 111 has channel ii 2, and mi === one side of the brain slice, ^ όf 1 2 The heat dissipation device 10 is disposed on the heat sink 11 to pre-produce the airflow flowing through the channel 112, so as to be cooled and cooled by using: 111:; The heat sink 1 of the radiator worker must be arranged in a dense arrangement, so that each adjacent divergence = 12: r is small 'when the fan 12 produces the air force and the _ gradually decreases, so that the scattered Heat _ go, and then can not reach the heat dissipation 111 1 heat dissipation is 1 1 1 is densely arranged, and only the outermost hot Korean film 1 η is in contact with the external line, and the inner heat dissipation error 1 not only conducts more heat And the part that is in contact with the air is less, 2 201104209 Further, the heat of the internal heat dissipation fins 1 1 1 is hard to be dissipated, thereby affecting the effect of heat dissipation and cooling.曰Please refer to the second and third figures, which is another conventional heat sink 2 〇, the heat sink 20 includes a heat sink 21 and a fan 22, and the heat sink 2 is disposed on a bottom plate 21 1 There are a plurality of heat dissipating fins 2丄2, and there is a channel 213 between the fins 212, and the heat of the electronic component can be transmitted to the bottom plate 211 of the heat sink 21, and then through the bottom plate 21 1 Conducted to each of the heat sink fins 2 1 2 'The fan 2 2 is mounted above the heat sink 2 1 , and the fan 12 generates a channel 2 χ 3 flowing into the heat sink 2 以 to enable the heat dissipation ^ ^ The heat sink fins 212 of the heat sink 2 are cooled and cooled; however, the heat sink 2 has the following disadvantages in use: 1. The airflow generated by the fan 22 of the heat sink 20 flows from the top to the bottom. When the airflow reaches the bottom plate 211, a part of the airflow may flow out from the two sides of the bottom portion, and the heat of the heat dissipation fins 212 is removed to cool the heat dissipation fins 212. However, there is The other airflow is reversed at the bottom plate 211, and a bottom-up airflow is generated in each of the channels 213, and the airflow is generated. The airflow will cause the rotation of the fan 22 is difficult to smooth the air flow generated by the respective inflow conduit 213 'thereby affecting the cooling effect of scattered shame. * Lu 2 · The airflow generated by the fan 2 2 of the heat sink 2 is the passage 213 flowing into the radiator 21 from the top to the bottom. When the airflow reaches the bottom plate 211, a part of the airflow is easy to form a vortex at the bottom of the passage 213. The hot air is caused to flow in the channel 213, and the heat of the heat dissipation fin 212 cannot be removed, thereby greatly reducing the effect of heat dissipation and cooling. In view of this, the inventor has been engaged in research and development and production experience of related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and research, he has finally developed a radiator that can greatly improve the cooling and cooling effect. The heat sink fin structure is used to greatly improve the shortcomings of the formula, which is the design tenet of the present invention. [Description of the Invention] 201104209 埶薄夕·^勒ΐ The main purpose is to provide a heat sink fin structure, which is composed of a plurality of sheets stacked on top of each other, and adjacent to the adjacent There are front and rear longitudinal passages, and the enthalpy and heat generated by the operation of the electronic components: heat dissipation, on each of the fins, the front end of the heat dissipation chip is provided with wind: fins are scattered ίίίί: Flowing through the air passages of the radiators so as to scatter the grooves so as to form a lateral direction on the slab and gradually v from the outside to the inside, and the heat dissipation is to the upper lateral flow path, and in the longitudinal direction of the fan, The air outside the radiator can be received in the passage and enter the inside of the radiator along the passage to simultaneously deflate the pressure and flow velocity of the longitudinal airflow in the passage, so that the longitudinal passage 'cools the heat-dissipating block by accelerating heat dissipation, and further Achieve the practical purpose of large & . Another object of the present invention is to provide a heat sink fin and a heat ί ϊ ϊ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ ; ; ; ; 'In order to make the scattered corresponding to the trough of the lake, so that the scattered piece = open and contracted flow path; thereby, by using the heat dissipation to flow through the flow path through the air flow, the divergence g can be In the fan's hustle and bustle. The sorrowful sorrows, the sacred sacred sacred scorpion, enters the inside of the politician to simultaneously generate the κ ̄ ̄ ̄ w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w The purpose of heat dissipation and cooling of the longitudinal width enhances the cooling and cooling effect. ",,"", and then the film reaches a big [Embodiment] In order to make the reviewer make a more in-depth example of the present invention and cooperate with the schema, the description is as follows: γ ', for better, please refer to 4, 5, and 6 show the slab structure of the heat sink of the present invention, 201104209. The heat sink 30 is mounted on a bottom plate 31 with heat dissipating fins 3 2 , and the strips 3 2 face a plurality of sheets 3 2 χ χ χ χ 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 The other side of the other body 3 |_ is provided with a front and rear longitudinal passage 3 1 between the adjacent sheets 3 2 1 and the heat generated when the electronic S is operated can be transmitted to the bottom plate 3 The bottom plate 31 is conducted to the respective sheets 3 21 of the heat dissipation fins 3 2 , and The grooves 3? 1 2 are arranged correspondingly, and the outer diameter of the outer sheet passing groove 3 212 is sequentially larger than that of the other adjacent body 3 1 , and the heat dissipation is formed at the center and the rear portion of the 3 2 The horizontal "has:, the flow channel 3 ◦ 2; the other side of the front side of the scatter piece 3 2" and the fan 4 〇 is generated by the front and rear longitudinal flow through the channel 30 1 of the 5 散 ^ ^ 3 〇 The air flow. The heat dissipation of the present invention is shown in Fig. 7. The heat dissipation of the present invention is performed on the electronic component of the electronic component, and the bottom plate 31 of the heat sink 3 contacts the electronic component to conduct the plate 31 to 3. 1, through the chassis to generate Sir flow through the diffuse sheet 3 $ 费 费 费 图 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The diffusing flow passes through the inside of the device to generate a lateral air flow at the same time, and the sheet 3 2 is used to utilize the pressure and the flow velocity of the longitudinal airflow in the longitudinal direction of the channel 3 Q1 in the lateral direction of the flow channel 3 0 2 to make the sheet T = St 301, and the inside of the diffused film 32 reaches the outside air of the towel to accelerate the heat dissipation of the film, and further enhances the effect of the thermal cooling effect. According to another embodiment of the present invention, the heat sink 201104209 is attached to the bottom plate 5 1 with a loose wire sheet 5 2 , and the rail is composed of a plurality of sheets 5 2 1 Arrangement composition, wherein the sheet body 5, at the bottom of the bottom plate 51, is provided with a plurality of perforations 5 2 ^ sheets 5 2 i between the upper and lower longitudinal channels 5 〇 5: electricity = amount: conduction to the bottom plate 51, through the bottom plate 51, the respective sheets 5 2 1 of the sheet 5 2 are spread, and the loose sheets 5 2 Κ are attached to the respective sheets 5 2 i ΐ of the loose sheet 5 2 : ί = J The groove 5 212 of each piece 5 21 is opposite to 歹 ^ and the outer diameter of the groove 5 2 i 2 of the outer piece 5 2 is sequentially larger than that of the adjacent piece 5 21 The groove 5 212 has an outer diameter, and a flow path 5 Q 2 which is laterally and tapered from the outside to the inside is formed on the heat dissipation tab 2 2: a fan 60 is mounted on the heat dissipation fin end, and the fan 6 is mounted on the heat dissipation fin end. The flow of air flowing through the passage 501 of the heat sink 50 is generated from the top to the bottom. When the heat sink 5 of the other embodiment of the present invention is cooled by the heat sink 5 The bottom plate 5 of the radiator 50 is connected to the employee. Freshly conductive to the bottom plate 51, and then transmitted to the respective fins 5 ji of the heat dissipating fins 5 through the bottom plate 51, the first sputum generates milk flowing vertically from the top to the bottom through the heat sink 5 0 2 Flow, when the airflow generated by the fan 6 Q flows through the respective pieces 51 R η through the groove, the flow path formed by the 2 1 2 is 5 ° 2 'that makes the heat dissipation two JI*-shaped air party channels within 5 0 1 The upper and lower longitudinal airflow are attracted, and j the flow channel 502 enters the inside of the heat dissipation H50 to simultaneously generate a lateral flow, the heat dissipation is a gas flow of 5, and the lateral gas is utilized in the flow channel 5 q 2 =: not only can maintain the pressure and flow rate of the longitudinal airflow in the channel 5 01 through the channel 5.1, and the pieces J5 21 inside the heat dissipation fin 52 can contact the outside air to accelerate the heat dissipation of the film. 5 2 heat dissipation, when the vertical airflow reaches the bottom plate 51, part of the airflow flows through the sides of each channel 5, and the other airflow pastes the heat sink fins 5 2 52 1 The perforation of the bottom 5 2 11 flows out, which not only prevents the vertical airflow from the top to bottom from hitting the bottom plate 5 1 The reverse air flow, and avoids the formation of the vortex of the rotating flow at the bottom of each channel 5 01 so that the longitudinal airflow generated by the fan 6 平 flows smoothly through the channel 5 以 to accelerate the heat dissipation fins 5 2 The thermal cooling of the government has further improved the practical effect of cooling and cooling. In summary, the present invention has practical and progressive nature, but it has not been disclosed that the same products and publications are disclosed, thereby allowing the invention patent application requirements to be raised in accordance with the law. [Simple description of the diagram] Figure 1: Schematic diagram of the use of the conventional radiator.苐 2 picture: Another schematic diagram of the use of a conventional heat sink (1). Figure 3: Schematic diagram of the use of another conventional heat sink (2).
第4圖：本發明之分解示意圖。 第5圖：本發明之結構示意圖。 第6圖：本發明之剖視圖。 第7圖：本發明之使用示意圖（一）。 第8圖：本發明之使用示意圖（二）。 第9圖：本發明另一實施例之結構示意圖。 第10圖：本發明另一實施例之剖視圖。 第11圖：本發明另一實施例之使用示意圖（一）。 第12圖：本發明另一實施例之使用示意圖（二）。 【主要元件符號說明】 習式部分： 111:散熱鰭片 2 1 1 :底板 213:通道 1〇:散熱裴置 1 1 :散熱器 112:通道 1 2 :風扇 2 〇:散熱襞置 21:散熱器 212:散熱韓 2 2 :風扇 本發明部分： 3 〇:散熱器 201104209 3 01 :通道 3 0 2 :流道 3 1 :底板 3 2 :散熱鰭片 3 2 1 :片體 3 211 :折邊 3 212 :穿槽 4 0 :風扇 5 0 :散熱器 5 Ο 1 :通道 5 0 2 :流道 5 1 :底板 5 2 :散熱鰭片 • 5 2 1 :片體 5 212 :穿槽 5 2 1 1 :穿孔 6 0 :風扇Figure 4: An exploded schematic view of the invention. Figure 5: Schematic diagram of the structure of the present invention. Figure 6 is a cross-sectional view of the present invention. Figure 7: Schematic diagram of the use of the invention (I). Figure 8: Schematic diagram of the use of the present invention (2). Figure 9 is a schematic view showing the structure of another embodiment of the present invention. Figure 10 is a cross-sectional view showing another embodiment of the present invention. Figure 11 is a schematic view (1) of use of another embodiment of the present invention. Fig. 12 is a schematic view showing the use of another embodiment of the present invention (2). [Main component symbol description] Conventional part: 111: Heat sink fin 2 1 1 : Base plate 213: Channel 1 〇: Heat sink 1 1 : Heat sink 112: Channel 1 2: Fan 2 〇: Heat sink 21: Heat sink 212: Heat sink Han 2 2 : Fan Part of the invention: 3 〇: Heat sink 201104209 3 01 : Channel 3 0 2 : Flow path 3 1 : Base plate 3 2 : Heat sink fin 3 2 1 : Sheet 3 211 : Folding 3 212 : Through slot 4 0 : Fan 5 0 : Heat sink 5 Ο 1 : Channel 5 0 2 : Flow path 5 1 : Base plate 5 2 : Heat sink fins • 5 2 1 : Sheet 5 212 : Through slot 5 2 1 1 : perforation 6 0 : fan