M399590 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種散熱器改良，旨在提供一種可提升散 熱效率之散熱器改良。 【先前技術】 , 各項電機、電子設備在運作時，其内部之元件會開始發 鲁=，而該熱量必須加以散失，才能確保該發熱元件的運作正 苇，且不會因運作溫度過高而導致損壞。以電腦的中央處理 器為例其處理-貝料的速度極快，而其所產生的高熱必須迅 ，的加以散失，才不會導致電腦當機。因此，該電機、電子 设備皆另設置有散熱器，以對該發熱元件進行散熱的工作。 ^ =第一圖所示即為一種發熱元件普遍習用的散熱器，此 散熱器10係可單獨或搭配一溫控風扇（圖略）運作。該散熱器 1〇係將複數散熱鰭片Π疊設在一起，相鄰的兩散熱鰭片11 間肜成有氣體流道12 ’發熱元件運轉時所產生的熱源被傳 v至各散熱韓片u上，再透過外界空氣對流與散熱縛片u =間產生熱能交換的熱對流作用，加速散熱鰭片u的熱能排 方，以期能夠持續與發熱元件之間發生熱傳導作用，進而達 到對熱源體降溫之目的。 人，而，各散熱鰭片u以單一方向排列地相互堆疊而結 熱鳍片組，形成互不相通的氣體流道12構造，因此外 鄰;Γ體吹入至各氣體流道12時，冷氣體僅能被侷限於兩相 月·，、、鰭片11之間流動，無法流通於各散熱鰭片u之間， 3 M399590 大大地限制了整體散熱效率。 【新型内容】 f鑑^ ’本創作即在提供—種可提升散 态改良，為其主要目的者。 干又… 為達上揭目的，本創作之散熱器 ==數間隔排列之散熱雜片，：二= 猶g流道；其中，各散熱㈣並設有至少一副 道，該副氣體流道係、貫穿各散錢片並與該氣體流道 行散熱時，外界氣體可自由流動於各散顏片之間， 曰加乳體的流動多向性而能提升整體散熱效率。 【實施方式】 t本創作之特點，可參閱本案圖式及實施例之詳細說明而 獲得清楚地瞭解。 本創作「散熱器改良」’如第二圖之第一實施例所示，本 創作之散熱器2係設有一散熱基座21，該散熱基座21為由導熱籲 性良好的材質所製成的板體，其可由金屬材質製成，例如銅、· =等，但不以此些材質為限，而該散熱基座21上設有複數間 隔排列之散熱鰭片22，相鄰的兩散熱鰭片22之間形成有氣體 流道23。 本創作之重點在於.各散熱鶴片2 2並設有至少一副氣體 流道24，該副氣體流道24係貫穿各散熱鰭片22並與該氣體流 道23相通，該氣體流道23與副氣體流道24係垂直相交，如圖 所示之實施例中，係設有二個副氣體流道24，且將該散熱鰭 4 M399590 片22平均分成三個散熱部22卜請同時參閱第三圖所示，而使 各散熱部221之寬度相同。 當然，該散熱器亦可為不同實施例，例如：可設有η個副 氣體流道（其中η>1)，如第四圖之第二實施例所示，可設有 二個副氣體流道24，且將該散熱鰭片分成寬度不相同之三個 散熱部221。 ' 或者，該副氣體流道24可以為上寬下窄之形式，如第五 、圖之第三實施例所示；亦或者，該副氣體流道24可以為下寬 籲上窄之形式，如第六圖之第四實施例所示；再者，該氣體流 道23與副氣體流道24係非垂直相交，如第七圖之第五實施例 所示。 使用本創作時，該散熱基座21會熱接觸發熱元件並將傳 導熱量至各散熱鰭片22，外界冷氣體吹拂各散熱鰭片22並帶 走熱量，藉以冷卻熱源，而氣體吹拂該各散熱鰭片22時，氣 體會流入該等氣體流道23中，且氣體會通過各副氣體流道24 而流竄於該等氣體流道23之間，因為該散熱基座21傳導熱量 春至該等散熱鰭片22為不平均，則氣體的流動多向性增加，即 氣體在該等氣體流道23之間流竄，可更均勻地帶走該等散熱 鰭片22上的熱量，如此則能提升散熱效果。 綜上所述，本創作提供一較佳可行之散熱器改良，爰依 法提呈新型專利之申請；本創作之技術内容及技術特點巳揭 示如上，然而熟悉本項技術之人士仍可能基於本創作之揭示 而作各種不背離本案創作精神之替換及修飾。因此，本創作 之保護範圍應不限於實施例所揭示者，而應包括各種不背離 本創作之替換及修飾，並為以下之申請專利範圍所涵蓋。 5 MS99590 【圖式簡單說明】 第一圖係為一習用散熱器之外觀立體圖。 紅圖係為本創針散熱器第—實施例之結構立體圖。 第三圖係為本創作中散熱器第一實施例之結構示意圖。 第四圖係為本創作中散熱器第二實施例之結構示意圖。 第五圖係為本創作中散熱器第三實施例之結構示意圖。 第六圖係為本創作中散熱器第四實施例之結構示意圖。 第七圖係為本創作中散熱器第五實施例之結構立體圖。 【主要元件符號說明】 散熱器10 散熱鰭片11 氣體流道12 散熱器2 散熱基座21 散熱鰭片22 散熱部221 氣體流道23 副氣體流道24M399590 V. New Description: [New Technology Field] This creation is about a radiator improvement, which aims to provide a heat sink improvement that can improve the heat dissipation efficiency. [Prior Art] When the various motors and electronic devices are in operation, the internal components will start to blaze, and the heat must be dissipated to ensure that the heating components are operating correctly and not because the operating temperature is too high. And cause damage. Take the computer's central processor as an example. The processing of the material is extremely fast, and the high heat generated by it must be quickly dissipated, so that it will not cause the computer to crash. Therefore, the motor and the electronic device are each provided with a heat sink to dissipate heat from the heat generating component. ^ = The first figure shows a heat sink commonly used in heating elements. This radiator 10 can be operated alone or in combination with a temperature-controlled fan (not shown). The heat sink 1 is formed by stacking a plurality of heat radiating fins, and the adjacent heat radiating fins 11 are formed with a gas flow path 12. The heat source generated when the heating element is operated is transmitted to each of the heat sinking films. On the u, through the external air convection and heat dissipation slab u = heat convection between the heat exchange, accelerate the heat dissipation fins of the heat sink fins, in order to continue the heat conduction between the heat-generating components, and then to the heat source body The purpose of cooling. And the heat dissipating fins u are stacked on each other in a single direction to form a heat fin group, forming a gas flow channel 12 structure that is not connected to each other, so that the outer side; when the body is blown into each gas flow path 12, The cold gas can only be confined to the two phases, and the fins 11 flow between the fins 11 and cannot flow between the fins u. 3 M399590 greatly limits the overall heat dissipation efficiency. [New content] f鉴^ ‘This creation is to provide a kind of improvement that can improve the dispersion and its main purpose. Dry and... In order to achieve the goal, the radiator of this creation == a number of spaced heat dissipating chips, two: a g-flow channel; wherein each heat dissipation (four) is provided with at least one auxiliary channel, the auxiliary gas flow path When the cigarette pieces are passed through and scattered with the gas flow path, the outside air can flow freely between the individual sheets, and the flow multi-directionality of the emulsion can be increased to improve the overall heat dissipation efficiency. [Embodiment] The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the embodiments. The "heat sink improvement" of the present invention is as shown in the first embodiment of the second figure. The heat sink 2 of the present invention is provided with a heat dissipation base 21 which is made of a material having good thermal conductivity. The plate body can be made of a metal material, such as copper, ·=, etc., but not limited to the materials, and the heat dissipation base 21 is provided with a plurality of fins 22 arranged at intervals, and two adjacent heat sinks A gas flow path 23 is formed between the fins 22. The focus of this creation is that each of the heat dissipating fins 2 2 is provided with at least one gas flow passage 24 that penetrates through the heat dissipating fins 22 and communicates with the gas flow passage 23, the gas flow passage 23 The sub-gas flow passage 24 intersects perpendicularly. In the embodiment shown in the figure, two auxiliary gas flow passages 24 are provided, and the heat dissipation fin 4 M399590 piece 22 is equally divided into three heat dissipation portions 22. As shown in the third figure, the widths of the heat dissipation portions 221 are the same. Of course, the heat sink can also be different embodiments. For example, n auxiliary gas flow paths (where η>1) can be provided. As shown in the second embodiment of the fourth figure, two auxiliary gas flows can be provided. The track 24 is divided into three heat dissipating portions 221 having different widths. Alternatively, the auxiliary gas flow passage 24 may be in the form of an upper width and a lower width, as shown in the fifth embodiment of the fifth embodiment; or alternatively, the auxiliary gas flow passage 24 may be in the form of a lower width and a narrower width. As shown in the fourth embodiment of the sixth figure; further, the gas flow path 23 and the sub gas flow path 24 are non-perpendicularly intersected, as shown in the fifth embodiment of the seventh figure. When the present invention is used, the heat dissipation base 21 thermally contacts the heat generating component and conducts heat to the heat sink fins 22, and the outside cold air blows the heat sink fins 22 and removes heat, thereby cooling the heat source, and the gas blows the heat sinks. In the case of the fins 22, gas flows into the gas channels 23, and the gas flows between the gas channels 23 through the respective sub-gas passages 24, because the heat-dissipating susceptor 21 conducts heat to such a spring. If the heat dissipating fins 22 are not uniform, the flow omnidirectionality of the gas increases, that is, the gas flows between the gas flow channels 23, and the heat on the heat dissipating fins 22 can be more evenly removed, thereby improving heat radiation. In summary, the present invention provides a better and feasible heat sink improvement, and the application for a new patent is submitted according to law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still be based on the present creation. The disclosure reveals various substitutions and modifications that do not depart from the spirit of the creation of the case. Therefore, the scope of the present invention should not be limited by the scope of the present invention, but should be included in the following claims. 5 MS99590 [Simple description of the diagram] The first diagram is a perspective view of the appearance of a conventional radiator. The red figure is a perspective view of the structure of the first embodiment of the wound heat sink. The third figure is a schematic structural view of the first embodiment of the heat sink in the present creation. The fourth figure is a schematic structural view of the second embodiment of the heat sink in the present creation. The fifth figure is a schematic structural view of the third embodiment of the heat sink in the present creation. The sixth figure is a schematic structural view of the fourth embodiment of the heat sink in the present creation. The seventh figure is a perspective view of the structure of the fifth embodiment of the heat sink in the present invention. [Description of main component symbols] Heat sink 10 Heat sink fins 11 Gas flow path 12 Heat sink 2 Heat sink base 21 Heat sink fins 22 Heat sink 221 Gas flow path 23 Secondary gas flow path 24