1334529 _ 099年08月23日按正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤係指一種用於散發電子元 件熱量之散熱裝置。 【先前技術】 [0002] 隨著電子產業飛速發展，電子元件（如中央處理器）運 行速度之不斷提升，運行時產生大量熱量，使其本身及 系統溫度升高，繼而影響其系統之穩定性。為確保電子 元件能正常運行，通常在其上安裝散熱裝置，排出其所 產生之熱量。 [0003] 電子元件散熱問題之傳統解決方案通常係在每個發熱電 ' 子元件上安裝一散熱器，該散熱器包括與電子元件緊密 接觸之一底板、設於底板上之複數散熱鰭片。隨著電子 元件運算速度與曰倶增，為進一步滿足散熱需求，還可 在散熱器内穿設熱管、在其一側或頂部安裝一風扇以促 進空氣流動加快熱量散發，同時這樣之散熱裝置組合除 在散熱效率比原來散熱器基礎上極Λ提高外，尺寸體積 亦增加不少。但隨著數碼資訊時代之到來，輕薄短小成 為當前電子產品之主要趨勢，其製造工藝亦不斷朝高密 度封裝和多功能方向發展，各電子元件如晶片之距離越 來越小而發熱量越來越大。因此在實際應用中，當多個 發熱電子元件間距離很小而且高度不等時，如果分別採 用獨立之散熱裝置對其散熱以維持系統之正常運行，不 僅會使系統之散熱結構分散複雜造成系統空間浪費，而 且由於電子元件間之間距很小亦會限定單獨散熱裝置之 096121740 表單編號Α0101 第3頁/共17頁 0993299914-0 1334529 099年08月23日按正替換頁 尺寸，而影響散熱效率。例如，當今流行之雙CPU電腦就 係利用一個散熱器對兩CPU進行散熱，該散熱器包括一同 時與兩CPU接觸之底板戽複數沿底板長度方向分佈並平行 間隔之散熱鰭片，此外，還可在該散熱器一側設置一風 扇提供強制氣流或利用系統風扇產生之強制氣流從散熱 籍片間之流道一端入口進入，從而促進熱量散發。然而 ，該用於雙CPU之散熱器底板及散熱鰭片較長，使散熱鰭 片間形成之流道風阻較大，故，流道入口附近之風壓將 遠大於流道出口附近之風屋，使散熱縛片兩端之熱量散 發速度不一致，從而造成兩CPU散熱不均，進而影響它們 運行之穩定性。 【發明内容】 [0004] 本發明旨在提供一種可以同時適配兩個或多個電子元件 且散熱效果好之散熱裝置。 [0005] —種散熱裝置用於對兩個或多個電子元件散熱，其包括 一基板、一第一散熱片組、一第二散熱片組和夾設於所 述基板與所述兩散熱片組之間之至少一熱管，該第一及 第二散熱片組均包括複數散熱片，且第一及第二散熱片 組之相鄰兩散熱片間形成氣流通道，該第二散熱片組設 置有供氣流流向第一散熱片組之空氣流道，該空氣流道 之寬度較相鄰兩散熱片間之氣流通道大。 [0006] 上述散熱裝置之兩散熱片組中，有一散熱片組開設有利 於氣流通過之空氣流道，以減少氣流到達另第一散熱片 組之阻力並使氣流未經該第二散熱片組預熱而直接進入 另一散熱片組内，從而有效效除兩散熱片組由於相對氣 096121740 表單編號A0101 第4頁/共17頁 0993299914-0 1334529 _ 099年08月23日修正替換頁 流之空間位置差異而產生之溫差。 【實施方式】 [0007] 本發明散熱裝置係用來對多個發熱電子元件如CPU (圖未 示）等進行散熱。請參閱圖1至圖3，本發明一優選實施 例中之散熱裝置，其包括與二CPU接觸之一基板10、部分 嵌置在基板10内之一熱管組20、間隔排列在基板10及熱 管組20之上之第一散熱片組30和第二散熱片組40、位於 基板10及第二散熱片組40—側並通過熱管組20與基板10 導熱連接之第三散熱片組50。 [0008] 上述基板10為一矩形平板，其由導熱性能良好之金屬材 料如鋁、銅等澆鑄而成。該基:板10上表面開設有複數容 ' 置熱管組20之容置槽，在本實施例中包括一第一容置槽 12、一第二容置槽14及一第三容置槽16。該第一容置槽 12呈L形，其包括與基板10長邊緣垂直之一第一平行段 120及與該第一平行段120垂直並沿著，基板10之一長邊緣 延伸之一第一垂直段122。該第一平行.段120位於基板10 上正對一CPU及第一散熱片組30’中部之位置。該第二容置 槽14呈U形，其包括二平行段140及垂直並連接兩平行段 140之一第二垂直段142。該兩第二平行段140相互平行 間隔，且一第二平行段140緊挨並平行第一平行段120排 列，另一第二平行段140正對另一CPU及第二散熱片組40 ，該第二垂直段142平行並挨著第一垂直段122排列且垂 直連接兩第二平行段140。該第三容置槽16呈L形，其包 括一第三平行段160和與該第三平行段160垂直之一第三 垂直段162，該第三平行段160與第一平行段120及第二 096121740 表單編號A0101 第5頁/共17頁 0993299914-0 1334529 099年08月23日修正替換頁 平行段140平行且緊挨第二平行段140延伸，該第三垂直 段162與第一垂直段122平行且緊挨另一遠離第一垂直段 122之基板10長邊緣延伸。 [0009] 上述熱管組20包括複數均呈U形之扁平熱管，其包括一第 一熱管22、一第二熱管24和一第三熱管26。該第一熱管 22包括平行間隔之二第一平行部220和垂直連接兩第一平 行部220之一第一垂直部222，其中一第一平行部220容 置於基板10第一凹槽12對應之第一平行段120内，另一第 一平行部220位於基板10之一侧並插置於第三散熱片組50 内，該第一垂直部222較第一凹槽12之第一垂直段122長 ，其大部分容置於該第一垂直段122内，小部分向基板10 外側延伸而出並連接位於該基板10 —侧之另一第一平行 部220。該第二熱管24包括相互平行間隔二平行部240及 垂直連接該兩第二平行部240之一第二垂直部242，該兩 第二平行部240分別容置於對應之基板10第二凹槽14之兩 第二平行段140内，該第二垂直部242容置於對應之第二 凹槽14之第二垂直段142内。該第三熱>26包括平行間隔 之二第三平行部260和垂直連接兩第三平行部260之一第 三垂直部262，其中一第三平行部260容置於基板10第三 凹槽16之第三平行段160内，另一第三平行部260位於基 板10之一側並插置於第三散熱片組50内，該第三垂直部 222較第三凹槽16之第三垂直段162長，其大部分容置於 該第三垂直段162内，小部分向基板10外側延伸而出並連 接位於該基板10 —側之另一第三平行部260。可見這些第 一熱管22、第二熱管24和第三熱管26分別容置於基板10 096121740 表單編號A0101 第6頁/共17頁 0993299914-0 1334529 099年08月23日梭正替换頁 對應之第一容置槽12、第二容置槽14及第三容置槽16内 ，且該等熱管之頂面與基板10之頂面齊平而形成一與散 熱片組30、40接觸之平面。 [0010] 上述第一散熱片組30設置於基板10 —端上方，其包括複 數平行且等距間隔之第一散熱片32，每相鄰兩第一散熱 片32間形成有氣流通道，且每一第一散熱片32之底端邊 緣向一側垂直延伸有折邊320，所有該等折邊320緊靠在 一起形成與基座10及熱管組20頂面接觸之平面。該第二 散熱片組40設置於基座10另一端上方，其包括複數與第 一散熱片32結構相同之第二散熱片42，每相鄰兩第二散 熱片42間形成氣流通道，且每一第二散;熱片42底端邊緣 垂直延伸有折邊420，該第二散熱片組40在其中間位置並 沿第二散熱片42長度方向開設一空氣流道44，該空氣流 道44之寬度較兩相鄰第二散熱片42之間之氣流通道大， 以利於流向第一散熱片組30之氣流通過。該第一散熱片 組30與第二散熱片組40之間設有與空氪流道44垂直且連 · 之'- 通之通道（未標號）。該第三散熱片組50設置於基板10 靠近第二散熱片組40之一側，其包括複數平行間隔佈置 之第三散熱片52，每相鄰兩第三散熱片52間形成氣流通 道，該第三散熱片52之體積和數量均小於第二散熱片組 40，故該氣流通道之間隔大於第一散熱片組30及第二散 熱片組40氣流通道之間隔，以使第三散熱片組50具有更 小之空氣阻力，每一第三散熱片52開設兩間隔之穿孔520 ，該等穿孔520設置有垂直延伸之折邊（未標號），所有 第三散熱片52之穿孔520及其折邊共同形成兩容置空間而 096121740 表單編號A0101 第7頁/共17頁 0993299914-0 099年08月23日梭正替換頁 另】谷·置該第一熱管22 —平行部220及該第三熱管一第三 平订部260於其内。該第三散熱月組5〇中間形成有與第二 散熱片組40空氣流道44對應連通之空氣流道54，以利於 叫向第一散熱片組30之氣流通過，該第二散熱片組40與 宽： 二散熱片組50之間設有與空氣流道44及54垂直並連通 通道（未標號）。上述第一散熱片32、第二散熱片42 '第三散熱片52以及它們形成之氣流通道和空氣流道44 、54均與分別容置在基板10各凹槽12、14、16内之各熱 官22、24、26之平行部垂直。 [0011] 上述散熱裝置在使用時，該基板1〇之第一凹槽12、第二 凹槽14及第三凹槽16分別對應容置第一熱管22、第二熱 管24及第三熱管26，其中該第一熱管22之一第一平行部1334529 _August 23, 2010, according to the replacement page. 6. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of an electronic component. [Prior Art] [0002] With the rapid development of the electronics industry, the operating speed of electronic components (such as central processing units) continues to increase, generating a large amount of heat during operation, which increases the temperature of itself and the system, which in turn affects the stability of the system. . To ensure proper operation of the electronic components, a heat sink is usually installed on them to dissipate the heat generated. [0003] A conventional solution to the problem of heat dissipation of electronic components is usually to mount a heat sink on each of the heat generating electric sub-components, the heat sink comprising a bottom plate in close contact with the electronic components and a plurality of heat dissipating fins disposed on the bottom plate. In order to further meet the heat dissipation requirements, in order to further meet the heat dissipation requirements, a heat pipe may be disposed in the heat sink, and a fan may be installed on one side or the top to promote air flow to accelerate heat dissipation, and such a heat sink combination In addition to the extremely high heat dissipation efficiency than the original radiator, the size and volume have also increased a lot. However, with the advent of the digital information era, light and thin have become the main trend of current electronic products, and its manufacturing process has continued to develop toward high-density packaging and multi-functionality. The distance between various electronic components such as wafers is getting smaller and smaller, and the heat is getting hotter. The bigger. Therefore, in practical applications, when the distance between the plurality of heat-generating electronic components is small and the height is not equal, if the heat dissipation device is separately used to dissipate heat to maintain the normal operation of the system, not only the system's heat dissipation structure is dispersed and the system is complicated. Space is wasted, and because of the small distance between electronic components, the individual heat sinks are limited to 096121740. Form No. 1010101 Page 3/Total 17 Page 0993299914-0 1334529 On August 23, 2009, the page size is replaced, which affects the heat dissipation efficiency. . For example, today's popular dual-CPU computers use a heat sink to dissipate heat from two CPUs. The heat sink includes a bottom plate that is in contact with both CPUs, and a plurality of heat-dissipating fins that are distributed along the length of the bottom plate and are spaced apart in parallel. A fan may be provided on one side of the radiator to provide forced airflow or a forced airflow generated by the system fan to enter from the inlet of one end of the flow path between the heat radiating sheets, thereby promoting heat dissipation. However, the heat sink base plate and the heat dissipation fins for the dual CPU are long, so that the flow path formed between the heat dissipation fins is large, so the wind pressure near the inlet of the flow passage will be much larger than that of the wind house near the outlet of the flow passage. The heat dissipation speeds at both ends of the heat dissipation tab are inconsistent, resulting in uneven heat dissipation of the two CPUs, thereby affecting the stability of their operation. SUMMARY OF THE INVENTION [0004] The present invention is directed to a heat sink that can simultaneously adapt two or more electronic components and has a good heat dissipation effect. [0005] A heat dissipating device is configured to dissipate heat from two or more electronic components, including a substrate, a first heat sink group, a second heat sink group, and the substrate and the two heat sinks At least one heat pipe between the groups, the first and second heat sink groups each include a plurality of heat sinks, and an air flow channel is formed between two adjacent heat sinks of the first and second heat sink groups, and the second heat sink group is disposed There is an air flow path for the airflow to the first heat sink group, and the air flow path has a larger width than the air flow passage between the adjacent two heat sinks. [0006] In the two heat sink groups of the heat dissipating device, one fin group opens an air flow passage for facilitating airflow to reduce the resistance of the airflow to the other first fin group and prevent the airflow from being removed from the second fin group. Preheating and directly entering another heat sink group, effectively eliminating two heat sink groups due to relative gas 096121740 Form No. A0101 Page 4 / Total 17 Page 0993299914-0 1334529 _ 099 August 23 Revision Replacement Page Flow The temperature difference caused by the difference in spatial position. [Embodiment] The heat sink of the present invention is used to dissipate heat from a plurality of heat-generating electronic components such as a CPU (not shown). Referring to FIG. 1 to FIG. 3, a heat dissipating device according to a preferred embodiment of the present invention includes a substrate 10 in contact with two CPUs, a heat pipe group 20 partially embedded in the substrate 10, and a substrate 10 and a heat pipe spaced apart. The first heat sink group 30 and the second heat sink group 40 on the group 20, and the third heat sink group 50 on the substrate 10 and the second heat sink group 40 side and thermally connected to the substrate 10 through the heat pipe group 20 are disposed. The substrate 10 is a rectangular flat plate which is cast from a metal material having good thermal conductivity such as aluminum, copper or the like. The base: the upper surface of the plate 10 is provided with a plurality of accommodating grooves for the heat-dissipating tube group 20, and includes a first accommodating groove 12, a second accommodating groove 14 and a third accommodating groove 16 in this embodiment. . The first accommodating groove 12 has an L shape, and includes a first parallel segment 120 perpendicular to the long edge of the substrate 10 and perpendicular to the first parallel segment 120, and one of the long edges of the substrate 10 extends first. Vertical segment 122. The first parallel segment 120 is located on the substrate 10 opposite the center of a CPU and the first heat sink group 30'. The second receiving slot 14 is U-shaped and includes two parallel segments 140 and a second vertical segment 142 that is perpendicular and connects one of the two parallel segments 140. The two parallel segments 140 are parallel to each other, and one second parallel segment 140 is aligned next to the first parallel segment 120, and the other second parallel segment 140 is opposite to the other CPU and the second heat sink group 40. The second vertical segments 142 are parallel and aligned with the first vertical segments 122 and vertically connect the two second parallel segments 140. The third accommodating groove 16 has an L shape, and includes a third parallel segment 160 and a third vertical segment 162 perpendicular to the third parallel segment 160, the third parallel segment 160 and the first parallel segment 120 and the first Two 096121740 Form No. A0101 Page 5 of 17 0993299914-0 1334529 Correction of the replacement page Parallel section 140 extends parallel to and parallel to the second parallel section 140, the third vertical section 162 and the first vertical section 122 extends parallel to and adjacent to the long edge of the substrate 10 remote from the first vertical segment 122. [0009] The heat pipe group 20 includes a plurality of flat heat pipes each having a U shape, and includes a first heat pipe 22, a second heat pipe 24, and a third heat pipe 26. The first heat pipe 22 includes two first parallel portions 220 that are parallelly spaced apart and a first vertical portion 222 that vertically connects the two first parallel portions 220. One of the first parallel portions 220 is received in the first groove 12 of the substrate 10. The first parallel portion 120 is located on one side of the substrate 10 and is inserted into the third heat sink group 50. The first vertical portion 222 is smaller than the first vertical portion of the first recess 12 The 122 is long, most of which is accommodated in the first vertical section 122, and a small portion extends toward the outside of the substrate 10 and connects to the other first parallel portion 220 on the side of the substrate 10. The second heat pipe 24 includes two parallel portions 240 that are parallel to each other and a second vertical portion 242 that is perpendicularly connected to the two second parallel portions 240. The two second parallel portions 240 are respectively received in the corresponding second substrate of the substrate 10. The second vertical portion 242 is received in the second vertical section 142 of the corresponding second recess 14 in the second parallel section 140 of the two. The third heat > 26 includes two parallel parallel portions 260 and a third vertical portion 262 that vertically connects the two third parallel portions 260, wherein a third parallel portion 260 is received in the third recess of the substrate 10. In the third parallel segment 160 of the 16th, another third parallel portion 260 is located on one side of the substrate 10 and is inserted into the third heat sink group 50. The third vertical portion 222 is third perpendicular to the third recess 16 The segment 162 is long, most of which is accommodated in the third vertical segment 162, and a small portion extends toward the outside of the substrate 10 and connects to another third parallel portion 260 on the side of the substrate 10. It can be seen that the first heat pipe 22, the second heat pipe 24 and the third heat pipe 26 are respectively accommodated on the substrate 10 096121740. Form No. A0101 Page 6 / Total 17 pages 0993299914-0 1334529 On August 23, 2008, the corresponding page of the shuttle replacement page A receiving groove 12, a second receiving groove 14 and a third receiving groove 16 are formed, and the top surface of the heat pipes is flush with the top surface of the substrate 10 to form a plane in contact with the fin groups 30, 40. [0010] The first heat sink group 30 is disposed above the end of the substrate 10, and includes a plurality of parallel and equally spaced first heat sinks 32, and an air flow channel is formed between each adjacent first heat sink 32, and each A bottom edge of a first fin 32 extends vertically to a side with a flange 320, and all of the flanges 320 abut together to form a plane in contact with the top surface of the base 10 and the heat pipe group 20. The second heat sink group 40 is disposed above the other end of the base 10, and includes a plurality of second heat sinks 42 having the same structure as the first heat sink 32, and an air flow passage is formed between each adjacent two second heat sinks 42 and each a second scatter; a bottom edge of the heat sheet 42 extends vertically with a hem 420, and the second heat sink set 40 defines an air flow path 44 at a middle position thereof along the length of the second heat sink 42. The air flow path 44 The width is larger than the air flow passage between the two adjacent second fins 42 to facilitate the flow of air to the first fin group 30. A channel (not labeled) that is perpendicular to and connected to the open channel 44 is provided between the first fin group 30 and the second fin group 40. The third heat sink group 50 is disposed on one side of the substrate 10 adjacent to the second heat sink group 40, and includes a plurality of parallel fins 52 arranged in parallel, and an air flow channel is formed between each adjacent two third heat sinks 52. The volume and number of the third heat sink 52 are smaller than the second heat sink group 40. Therefore, the interval between the air flow channels is greater than the interval between the air flow channels of the first heat sink group 30 and the second heat sink group 40, so that the third heat sink group 50 has a smaller air resistance, and each of the third fins 52 defines two spaced perforations 520. The perforations 520 are provided with vertically extending hem (not numbered), and all of the third fins 52 have puncturing 520 and folds thereof. The two sides together form two accommodating spaces and 096121740 Form No. A0101 Page 7 / Total 17 pages 0993299914-0 On August 23, 2009, the shuttle is replacing the page. The valley is placed with the first heat pipe 22 - the parallel portion 220 and the third The heat pipe-third flat portion 260 is therein. An air flow passage 54 corresponding to the air passage 44 of the second heat sink group 40 is formed in the middle of the third heat dissipation group 5 to facilitate the airflow to the first heat sink group 30, and the second heat sink group 40 and Width: Two heat sink groups 50 are provided with vertical and communicating passages (not labeled) with the air flow passages 44 and 54. The first heat sink 32, the second heat sink 42', the third heat sink 52, and the air flow passages and air passages 44 and 54 formed therein are respectively accommodated in the respective recesses 12, 14, 16 of the substrate 10. The parallel portions of the heat officials 22, 24, 26 are vertical. [0011] When the heat dissipating device is in use, the first groove 12, the second groove 14 and the third groove 16 of the substrate 1 respectively receive the first heat pipe 22, the second heat pipe 24 and the third heat pipe 26 Where the first parallel portion of the first heat pipe 22
I 220及第三熱管μ之一第三平行260位於基板10 —側且穿 置在第三散熱片5〇内，該第一散熱片組30及第二散熱片 組40通過焊接等方式固定在基板1〇及熱管組2〇上。 [0012] 該散熱裝置在工作時，基板1〇底面吸收從兩CPU產生之熱 量，通過熱管組20將熱量均句傳送到各散熱片組30、40 、50上’而散發到周圍環境中。該散熱裝置所在之系統 提供之氣流經第三散熱片組50、第二散熱片組40進入第 一散熱片組30，該第二散熱片組30和第三散熱片組40中 間均設置有較相鄰兩第二、三散熱片42、52間之氣流通 道寬之空氣流道44，54，以減少氣流到達第一散熱片組 30之阻力並使氣流能不經預熱直接進入第一散熱片組30 。此外’該第二熱管24埋設在基板10内並將該第一散熱 片組30與第二散熱片組40通過導熱連接，該第一熱管22 096121740 表單編號A0101 第8頁/共17頁 0993299914-0 1334529 099年08月23日修正替換頁 和第三熱管26又將第三散熱片組50分別與第一散熱片組 30及第二散熱片組40導熱連接，從而消除各散熱片組30 、40及50間由於相對氣流之空間位置差異而產生之溫差 ，以同步並均勻地對兩CPU進行散熱。 [0013] 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0014] 圖1係本發明散熱裝置之一優選實施例之立體組合圖。 ... - ^ [0015] 圖2係圖1中散熱裝置之立體聲解異 [0016] 圖3係圖1中散熱裝置之俯視圖。 【主要元件符號說明】 [0017] 基板：10 [0018] 第一容置槽：12 [0019] 第一平行段：120 [0020] 第一垂直段：122 [0021] 第二容置槽：14 [0022] 第二平行段：140 [0023] 第二垂直段：142 [0024] 第三容置槽：16 [0025] 第三平行段：160 096121740 表單編號Α0101 第9頁/共17頁 0993299914-0 1334529 099年08月23日按正替換頁 [0026] 第三垂直段：162 [0027] 熱管組：20 [0028] 第一熱管：22 [0029] 第一平行部：2 2 0 [0030] 第一垂直部：222 [0031] 第二熱管：24 [0032] 第二平行部：240 [0033] 第二垂直部：242 [0034] 第三熱管：26 [0035] 第三平行部：260 [0036] 第三垂直部：262 [0037] 第一散熱片組：30 [0038] 第一散熱片：32 [0039] 折邊：320、420 [0040] 第二散熱片組：40 [0041] 第二散熱片：42 [0042] 空氣流道：44、54 [0043] 第三散熱片組：50 [0044] 第三散熱片：52 096121740 表單編號A0101 第10頁/共17頁 0993299914-0 1334529 [0045] 穿孔 520 099年08月23日核正替換頁 096121740 表單編號A0101 第11頁/共17頁 0993299914-0One of the first heat sinks 30 and the second heat sinks 40 are fixed to the first heat sink 5 and the second heat sink 5 The substrate 1 and the heat pipe group 2 are placed on top of each other. [0012] When the heat dissipating device is in operation, the bottom surface of the substrate 1 absorbs the heat generated from the two CPUs, and the heat pipe group 20 transfers the heat to the respective heat sink groups 30, 40, 50 and is distributed to the surrounding environment. The airflow provided by the system in which the heat sink is located enters the first heat sink group 30 through the third heat sink group 50 and the second heat sink group 40, and the second heat sink group 30 and the third heat sink group 40 are disposed in the middle. The air flow passages 44, 54 between the adjacent two second and third fins 42, 52 are arranged to reduce the resistance of the airflow to the first fin group 30 and allow the airflow to directly enter the first heat dissipation without preheating. Slice group 30. In addition, the second heat pipe 24 is embedded in the substrate 10 and connects the first heat sink group 30 and the second heat sink group 40 by heat conduction. The first heat pipe 22 096121740 Form No. A0101 Page 8 / 17 pages 0993299914- 0 1334529 A modified replacement page and a third heat pipe 26 on August 23, 099, respectively, thermally connect the third heat sink group 50 with the first heat sink group 30 and the second heat sink group 40, thereby eliminating each heat sink group 30, 40 and 50 temperature differences due to the difference in spatial position of the relative airflow to simultaneously and uniformly dissipate the two CPUs. [0013] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is a perspective assembled view of a preferred embodiment of a heat sink device of the present invention. [0015] FIG. 2 is a top view of the heat sink of FIG. 1 [0016] FIG. [Main component symbol description] [0017] Substrate: 10 [0018] First accommodating groove: 12 [0019] First parallel segment: 120 [0020] First vertical segment: 122 [0021] Second accommodating groove: 14 [0022] Second parallel segment: 140 [0023] Second vertical segment: 142 [0024] Third accommodating groove: 16 [0025] Third parallel segment: 160 096121740 Form number Α 0101 Page 9 / Total 17 page 0993299914- 0 1334529 On August 23, 099, press the replacement page [0026] The third vertical segment: 162 [0027] Heat pipe group: 20 [0028] First heat pipe: 22 [0029] First parallel portion: 2 2 0 [0030] First vertical portion: 222 [0031] second heat pipe: 24 [0032] second parallel portion: 240 [0033] second vertical portion: 242 [0034] third heat pipe: 26 [0035] third parallel portion: 260 [ 0036] Third vertical portion: 262 [0037] First heat sink group: 30 [0038] First heat sink: 32 [0039] Folding: 320, 420 [0040] Second heat sink group: 40 [0041] Two heat sinks: 42 [0042] Air flow channels: 44, 54 [0043] Third heat sink set: 50 [0044] Third heat sink: 52 096121740 Form No. A0101 Page 10 / Total 17 pages 0993299914-0 1334529 [ 0045] Perforation 520 09 On August 23, 9th, the nuclear replacement page 096121740 Form No. A0101 Page 11 of 17 0993299914-0