TWM294688U - Improved heatsink device structure - Google Patents

Description

M294688

[Technical field to which the new type belongs] This creation relates to a heat sink that is attached to a heat sink that is in contact with a heat source of an electronic device. [Prior Art] The industry's divergent side of electronic components ^ High heat transfer capability, fast material, high 孰 ^ ^ Use of hot officials = to transfer a large amount of heat and not consume power: into the cooling requirements of the seal And the heat pipe and the heat-conducting member: ΐ ΐ Lfi affects the heat transfer rate of the overall heat sink and the cable forming, = how to increase the joint sealing effect between the heat pipe and the heat-conducting member, has become an important subject of research in the industry. The structure of the divergence diffuser includes a heat conducting block, at least a heat pipe and a multi-media ra gland: a heat-conducting surface is coated on the top surface of the flat-plate copper heat-conducting block, and one end of the tube is disposed at the heat conducting The block is coated with a heat-conducting medium, and the heat pipe is welded and fixed to the heat-conducting block by heating and melting, and the heat-dissipating fins are sequentially stacked and connected to the heat pipe 1 to be combined into a heat-dissipating heat sink. structure. The above-mentioned conventional heat sink structure still has the second application in practical application. 1嘁, because the heat transfer path transmits heat to the heat conduction block to: 2, and the heat transfer rate of the general heat pipe is more than two times the heat transfer rate of the copper heat conductive block, thus the heat transfer rate of the heat pipe is fast. Can not be effectively played; in addition, the heat conduction between the heat-conducting block and the heat pipe needs to be transmitted again through the conduction of ', ', ' enamel, and the thermal medium under various objective conditions and cost considerations

M294688 IV. Creation instructions (2) Both use solder paste' and the thermal conductivity of the tin material is lower than the thermal conductivity of the copper material, so the heat transfer rate is once again reduced once; The heat transfer rate that can be achieved is considerably limited, and the heat transfer rate and heat dissipation of the overall heat sink are greatly reduced. / In view of the problems arising from the above-mentioned practices, the creators of this case have been engaged in the industry for many years of experience, and in the spirit of excellence, they have actively studied and improved, and have created the creation of the "heat sink structure improvement". [The new type of internal heat generation and the heat pipe and heat conduction speed for improvement, using the heat member and the base on the end of the non-opening open groove, the discharge medium connection capacity] as the main heat pipe of the heat pipe And lifting the above-mentioned cover to attach at least one heat pipe side, the central end portion of the groove is respectively provided with a hot end to pass over the cover and the cover, and the sealing heat effect at the end bottom edge is in the electronic ' Wherein, a through-contact connection is provided between the base body and the through-hole body formed by the through-hole body, and the heat-transducing member of the device of the present invention is provided with a through hole, and the heat-radiating structure of the heat pipe hole is improved, and the heat is improved. The surface of the source is provided with a heat sink for providing a heat sink structure, comprising a conductive body including a base and a connecting at least one non-opening groove, and a cover body corresponding to the non-heat collecting end and the heat absorbing end Through heat conduction [embodiment]

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The detailed description and technical contents of the present invention are to be construed as being limited by the description and description. If the drawing is not used for the creation, please refer to the first to fourth figures. This is the combination of the invented picture, the combined schematic picture and the second picture filled with the heat-conducting medium. The utility model provides a heat sink joint; the other comprises a heat conducting member 1〇 and at least one camp 2, the hot tank comprises a base η and a top body 12, wherein the base u can be heat conduction such as copper or aluminum. It is made in a good shape and has a near "u" shape. At least one non-nozzle 111 is opened on the base cymbal. This embodiment is composed of three parallel non-opening slots ,^ The through holes 11 2 are respectively formed in the center of the non-opening slots 111, and the plurality of connecting holes are respectively disposed on the top surfaces of the two side plates of the base 11 , and the connecting holes 113 can be screw holes or holes; The outer side of the side panel of the second side of the board has a plurality of protrusions 丨丨4; the cover body 丨2 can be made of heat conduction of copper or aluminum, and is made of a good material, which is corresponding to the base raft, and is also Near U" shape and extending horizontally outward at the tops of the left and right side panels A plurality of through holes 121 are respectively disposed at the left and right ends of each of the non-opening slots 111 of the flat plate 21 corresponding to the base cymbal, and are disposed at the top edge of the through holes 1 2 2 The chamfers 丨 2 3 are provided with positioning holes 124 ′ corresponding to the connecting holes 113 on the front and rear sides thereof, and at the bottom plate of the cover body 且 and corresponding to the spacing of the through holes 122 Parallel grooves 125. The number of the thermal officer 2_0 is completely determined by the heat of the heat source. The current embodiment is composed of three heat pipes, and the heat pipes 20 can be U-shaped.

M294688

Fourth, the creation instructions (4) tube, U-shaped elliptical tube, 11-shaped rectangular tube (the shape of the uniform temperature plate shape, which has a heat absorption end 21 and two different geometry 22 # wear on the fork fork heat release end 22' The venting end two ^: ^...1122, and the heat absorbing end 21 is transmitted through the guide cymbal; the mussel 30 is connected between the base n and the cover body 12. The ... ..., the thermal medium m of the material such as solder paste is poured during production Injected in the sputum and warmed up; 3 type 0 can evenly fill the base 11, cover 1 2 and heat pipe 2 a a) mussel 3 0

In the middle, it is cooled and cooled at room temperature. The hole f = is tightly connected between the base n and the cover body 12, T: makes the ί ΐ Γ 0 easy to inject and double work as a heating and hot melt supplement. 'In the combination of the base 11, the tube 20 and the heat transfer medium 30, the grinding machine or the abrasive cloth (paper) is processed by grinding, and the bottom edges of the base u and the heat member 20 are on the same plane. Please refer to the fifth figure, which is a schematic diagram of a combination of a heat sink group and a fan frame. The heat sink of the present invention may further include a heat sink group 40, which is composed of a plurality of heat sinks. 41 is stacked on top of each other to form a through hole μ corresponding to the same straight line, and the through hole 42 is connected to the heat releasing end 22 of each of the heat pipes 2 . In addition, a fan frame 50 is disposed around the outer portion of the heat pipe 20 and the heat sink group 40. The bottom of the fan frame 50 is recessed with a fixing plate 51. The fixing plate 51 is provided with a corresponding base 11 The holes of the bumps 114 are snap-fitted to the base 11. Please refer to the figure in the sixth figure, which is the use of the heat source for the creation. The state diagram can be installed with a first wind before and after the fan frame 5

Page 8 M294688 IV. Creation Instructions (5) — ................... ——^ Fan 60 and a second fan 61, and the radiator of this creation Is it set up in a heat source? Above the 〇 (such as the central processing unit), the heat source 70 will generate high heat during operation, and the heat will be directly transmitted from the surface of the heat source 7〇 to the heat absorbing end 21 and the base u of each heat pipe 20. And by the heat transfer mechanism of the vapor-liquid phase inside the heat pipe 2 及 and the heat conduction of the heat-conducting member ,, the heat is quickly led away, and the heat transfer is performed by the heat sink group 4 connected in series to each heat pipe 20 , the diffusion effect, and the forced air supply of each of the fans 61, 62, and the heat efficiency of the large radiator. The age t is known from the above description. The bottom edge of the heat-absorbing end 2 1 of the heat pipe 2 is directly in contact with the surface of the heat source 70 of the electronic device, and the heat pipe 2 is connected to the base 1 of the heat-conducting member 10 and the cover 12 The sealed connection between the two can greatly increase the heat transfer rate of the thermal heater and improve the heat dissipation performance. In summary, the "heat sink structure improvement" of the present invention can achieve the above-mentioned effects by the above-disclosed structure. And the application for this creation is not, and the publication has not been used publicly. Cheng has already met the novelty of the new patent: the special element. However, the drawings and descriptions disclosed above are merely examples of the present invention and are not intended to limit the embodiments of the present invention; those who are familiar with the art are otherwise characterized by the scope of their creation. Equivalent or modified 'should be covered by the following patents in this case. / >

M294688 Simple description of the schema [Simple description of the diagram] The first diagram is a three-dimensional exploded view of the creation. The second picture is a combination diagram of the creation. The third figure is a schematic diagram of the combination of the heat transfer medium in the second figure. The fourth figure is a schematic diagram of another perspective of the creation. The fifth figure is a combination diagram of the heat sink group and the fan frame. The sixth figure is the use state diagram of the creation of the heat source. [Main component symbol description] Thermal conductive member 10 Base 11 Non-opening slot 111 Through hole 11 2 Connecting hole 11 3 Bump 11 4 Cover body 12 Plate 121 Through hole 1 2 2 Chamfer 123 Positioning hole 124 Groove 125 Heat pipe 20 Heat absorbing end 21 Heat release end 22 Heat transfer medium 30 Heat sink set 40 Heat sink 41 Through hole 42 Frame 50 Fixing plate 51 First fan 6 0 Second fan 6 1

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Claims (1)

M294688 V. Patent Application No. 1 · A heat sink structure improvement comprising: a heat conducting member comprising a base and a cover body connected above the base, wherein the base is provided with at least one non-opening slot, and the non-opening a central through hole is formed with a through hole, and the cover body is respectively provided with a through hole at an end portion corresponding to the non-opening groove; and a heat pipe having a heat absorption end and a heat releasing end, the heat releasing end is passed out of the cover The through hole of the body is connected between the base and the cover through the heat conducting medium. ^ 2 · The heat sink structure improvement according to claim 1, wherein the base has a "u" shape, and a plurality of connecting holes are respectively arranged on the top surfaces of the two side plates, and the cover body is also The utility model is formed in a shape of a ru", and a flat plate is horizontally extended at an end of the two side plates, and a positioning hole corresponding to the connecting hole is arranged on the flat plate for fixing and fixing the fixing component. 3. In the improvement of the heat sink structure according to the second aspect of the patent application, the outer side surfaces of the two side plates of the base respectively protrude with a plurality of bumps. JL 4. The heat sink structure improvement according to claim 1, wherein the top edge of the through hole of the cover body is chamfered. The heat sink structure described in item 1 of the patent application scope is improved, and the heat officer system is any one of a U-shaped circular tube, a u-shaped elliptical tube or a u-shaped rectangular tube. 6. The heat sink structure improvement according to claim 1, wherein the base and the bottom edge of the heat pipe are on the same/plane. 7. The heat sink structure improvement according to claim 1, further comprising a heat sink group comprising a plurality of stacked on each other M294688, > Page 13