CN221264317U - Heat pipe radiator - Google Patents

Abstract

The utility model discloses a heat pipe heat dissipation device, comprising: the heat radiator comprises a substrate, a radiator, a radiating pipe and a radiating fan; the radiator is arranged on the first surface of the base plate, and the radiating pipe is also arranged on the first surface of the base plate; the first surface of the base plate is provided with a groove for accommodating the radiating pipe so as to increase the contact area between the radiating pipe and the base plate. When the radiator is used, the bottom plate of the radiator absorbs the heat of the substrate and the FIN sheet absorbs the heat of the substrate, so that the substrate radiates and cools, and meanwhile, the radiating pipe absorbs the heat of the substrate and transmits upwards, so that the heat of the substrate can be absorbed by the FIN sheet on the side close to the substrate and the side far from the substrate, the radiating effect of the radiator on the side far from the substrate is ensured, and the integral radiating effect of the radiator is improved; meanwhile, the cooling fan is arranged corresponding to the cooling gap, the cooling fan accelerates airflow to flow through the cooling gap, the airflow contacts with the FIN sheet in the cooling gap, heat on the FIN sheet is taken away, and the cooling effect is improved as a whole.

Description

Heat pipe radiator

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a high-efficiency heat pipe heat dissipation device.

Background

The heat generated by the heating components is required to be absorbed by the radiator in the electronic product and the electronic equipment, so that the aim of rapid cooling is fulfilled, and the heating components are prevented from being burnt out due to overhigh temperature; the radiator commonly used in the prior art is a FIN-type radiator, a plurality of radiating FIN sheets are arranged on the FIN-type radiator, radiating gaps are formed between the adjacent radiating FIN sheets, when the air flows through the radiating gaps, the FIN sheets exchange heat with the radiating FIN sheets, the radiating FIN sheets absorb heat of heating components, and the air takes away the heat of the radiating FIN sheets, so that the purposes of cooling and radiating are achieved.

In order to meet the heat dissipation requirement of the high-power electronic device, the heat dissipation area of the FIN radiator needs to be increased, and considering that the area of the mounting surface of the heating element in the FIN radiator is generally fixed, the height of the FIN radiator is generally selected to be increased to increase the heat dissipation area; due to heat conduction and forced convection of the fan, the temperature difference between the root and the top of the FIN radiator is obviously large, so that the top of the FIN radiator cannot play a role in effective heat dissipation, and therefore, the heat dissipation requirement of the high-power electronic equipment cannot be met by only increasing the height of the FIN radiator.

Disclosure of utility model

In view of the above, the present utility model provides an improved efficient heat pipe heat dissipation device.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: a heat pipe heat sink, comprising: the heat radiator comprises a substrate, a radiator, a radiating pipe and a radiating fan; the radiator is arranged on the first surface of the base plate, and the radiating pipe is also arranged on the first surface of the base plate; the first surface of the base plate is provided with a groove for accommodating the radiating pipe so as to increase the contact area between the radiating pipe and the base plate.

As a preferable scheme of the utility model, six radiating pipes are arranged, and the diameter of each radiating pipe is 6mm.

In a preferred embodiment of the present utility model, the six heat dissipating pipes have different overall heights, and are arranged from high to low, and the heat dissipating pipe with low height is closest to the heat dissipating fan.

In a preferred aspect of the present utility model, the heat dissipation tube has at least two heat conduction sections extending horizontally and distributed in height, adjacent heat conduction sections are connected by a connection section, and both the heat conduction sections and the connection section are accommodated in the radiator.

In a preferred embodiment of the present utility model, the radiator is provided with a tank body for accommodating the radiating pipe.

As a preferred aspect of the present utility model, the heat sink includes: the bottom plate, the roof and connect a plurality of FIN pieces between bottom plate and the roof, a plurality of FIN pieces are parallel to each other, form the heat dissipation clearance with between the adjacent FIN piece, a plurality of heat dissipation clearance are parallel to each other.

In a preferred embodiment of the present utility model, the length direction of the heat dissipating tube is parallel to the arrangement direction of the heat dissipating gaps, so that the heat dissipating tube passes through the plurality of heat dissipating gaps.

As a preferable aspect of the present utility model, the heat dissipation gap is formed with an air intake side and an air outlet side, and the heat dissipation fan is disposed corresponding to the air intake side.

As a preferable mode of the present utility model, the substrate is a heat source board, or the second surface of the substrate is provided with a heat source.

As a preferable scheme of the utility model, the inner wall of the groove is arc-shaped.

Compared with the prior art, the utility model has the following beneficial technical effects: when the radiator is used, the bottom plate of the radiator absorbs the heat of the substrate and the FIN sheet absorbs the heat of the substrate, so that the substrate radiates and cools, and meanwhile, the radiating pipe absorbs the heat of the substrate and transmits upwards, so that the heat of the substrate can be absorbed by the FIN sheet on the side close to the substrate and the side far from the substrate, the radiating effect of the radiator on the side far from the substrate is ensured, and the integral radiating effect of the radiator is improved; meanwhile, a cooling fan is arranged corresponding to the cooling gap, the cooling fan accelerates airflow to flow through the cooling gap, the airflow contacts with the FIN sheet in the cooling gap, heat on the FIN sheet is taken away, and the cooling effect is improved as a whole;

The other beneficial technical effects of the utility model are embodied in the specific embodiments.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a heat pipe heat sink according to the present utility model;

FIG. 2 is a schematic diagram of a heat pipe heat dissipation device according to the present utility model in front view;

FIG. 3 is a schematic diagram of a side view of a heat pipe heat dissipation device according to the present utility model;

FIG. 4 is an exploded view of a heat pipe heat sink according to the present utility model;

Fig. 5 is a schematic diagram of a rear view angle of the heat pipe heat dissipating device of the present utility model.

Reference numerals illustrate:

A substrate 100; a first surface 101; a second surface 102; a groove 110; a heat sink 200; a heat dissipation gap 201; a base plate 210; a top plate 220; FIN patch 230; a radiating pipe 300; a heat conducting section 310; a heat conduction pipe 310a; a heat conduction pipe 310b; a connecting section 320; and a heat radiation fan 400.

Detailed Description

The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.

The radiator is a heat pipe radiating device commonly used in electronic equipment, a plurality of radiating FIN sheets are arranged on the radiator, the radiator absorbs heat generated by the heating element and conducts the heat through the radiating FIN sheets, so that when flowing air passes through gaps of the radiating FIN sheets, the air exchanges heat with the radiating FIN sheets, and heat on the radiating FIN sheets is taken away; the radiator achieves the cooling and heat dissipation effects on the heating components through the continuous heat conduction effect of the heat dissipation FIN and the flowing of air to take away heat. However, in the heat conduction process, the heat absorption quantity of the radiator close to the heat source side is large, and the heat absorption quantity of the radiator far away from the heat source side is small, so that the temperature difference between the radiator close to the heat source side and the radiator far away from the heat source side is large, and the performance of the radiator cannot be fully utilized.

Referring to fig. 1-4, a heat pipe heat dissipation device includes: a substrate 100, a heat sink 200, a heat radiating pipe 300, and a heat radiating fan 400; the heat sink 200 is mounted on the first surface 101 of the substrate 100, and the heat dissipating tube 300 is also mounted on the first surface 101 of the substrate 100; a groove 110 for accommodating the radiating pipe 300 is provided at the first surface 101 of the substrate 100 to increase the contact area between the radiating pipe 300 and the substrate 100.

Specifically, the substrate 100 may be understood as a heat source, or a carrier for mounting the heat source, for example, the substrate 100 is defined as a carrier for mounting the heat source in this embodiment, and the heat source refers to a heat-generating component with a large heat generation amount in the electronic device in this embodiment.

The heat sink 200 is mounted on the substrate 100, and can directly absorb heat on the substrate 100, and meanwhile, when the air flow flows through the heat sink 200, the heat on the heat sink 200 is absorbed, so as to achieve the purpose of cooling. In the heat dissipation of the high-power electronic device, the height of the heat sink 200 is generally selected to be increased to increase the air contact area, so as to further improve the heat exchange efficiency, but the height of the heat sink 200 is too high, which has a certain influence on the heat dissipation effect, and the temperature difference between the side of the heat sink 200 close to the substrate 100 and the side of the heat sink 200 far from the substrate 100 is obviously large, so that in the heat dissipation of the high-power electronic device, even if the height of the heat sink 200 is increased, the top of the heat sink 200 cannot play a role in effective heat dissipation;

Therefore, in this embodiment, the heat dissipating tube 300 is added to the heat sink 200, and the heat dissipating tube 300 can transfer the heat on the substrate 100 to the high position/top of the heat sink 200, so that the high position/top of the heat sink 200 can also effectively dissipate the heat, enhance the overall heat dissipation effect, and meet the heat dissipation requirements of high-power electronic devices or components such as the laser pump module and the high-power chip.

The heat dissipating tube 300 is installed in the groove 110 of the substrate 100 to increase the contact area between the heat dissipating tube 300 and the substrate 100, thereby better increasing the heat conduction efficiency.

The heat radiation pipe 300 directly contacts the substrate 100 instead of transferring heat to the heat radiation pipe 300 through the lower side of the heat sink 200, thereby accelerating and enhancing heat transfer efficiency.

Alternatively, the radiator 200 is generally made of aluminum material, and the radiating pipe 300 may be made of copper pipe, which has good heat conduction performance.

In one embodiment, as shown in fig. 2, six radiating pipes 300 are provided, and the diameter of the radiating pipe 300 is 6mm; the diameter of the radiating pipe 300 is obtained through multiple tests, and the radiating pipe has good heat conducting performance.

As shown in fig. 2, the six heat dissipating pipes 300 are different in overall height and are arranged from high to low, the heat dissipating pipe 300 with low height is closest to the heat dissipating fan 400, in fig. 2, the heat dissipating fan 400 drives the air flow to move from right to left, if the heat dissipating fan 400 is an exhaust fan, the air flow can be driven to move from left to right, but in general, the heat dissipating fan 400 blows, that is, the air flow is driven to move from right to left, so that the heat dissipating effect is enhanced.

Further, six heat radiating pipes 300 are arranged from high to low, so that six heat transmitting areas with different heights are formed on the heat radiator 200, and the six heat radiating pipes 300 transmit heat to the heat radiator 200 at different heights, so that heat transmission is more uniform.

In one embodiment, the heat dissipating tube 300 has at least two heat conducting sections 310 extending horizontally and distributed in height, the adjacent heat conducting sections 310 are connected by a connecting section 320, and the heat conducting sections 310 and the connecting section 320 are both accommodated in the heat sink 200;

As shown in fig. 4, the heat dissipating tube 300 has a U-shape and includes two horizontally extending heat conducting sections 310, wherein one of the heat conducting sections 310a is mounted on the substrate 100, the other heat conducting section 310b corresponds to the upper and lower positions of the heat conducting section 310a, the heat conducting section 310b is connected to the heat conducting section 310a through a connecting section 320, the heat conducting section 310a absorbs heat of the substrate 100 during heat conduction, and then the heat is transferred to the heat conducting section 310b through the connecting section 320, and both the heat conducting section 310b and the heat conducting section 310a are connected to the heat sink 200, thereby transferring the heat to the heat sink 200.

As shown in fig. 3, the heat conductive pipes 310a of the six heat dissipating pipes 300 are all mounted on the substrate 100, and the heat conductive pipes 310b of the six heat dissipating pipes 300 are arranged from bottom to top, so that six heat transfer areas with different heights are formed on the heat sink 200, as shown in fig. 3, six heat transfer areas a-f are formed, and heat is better transferred to different heights of the heat sink 200 through the heat dissipating pipes 300.

In addition, as shown in fig. 3, since the bottom of the heat sink 200 is close to the substrate 100, there is no need to provide the heat conduction pipe 310b in a distance h between the bottom of the heat sink 200 and the substrate 100, and good heat transfer can be obtained.

The heat radiation fan 300 performs better heat exchange with the heat sink 200 while pushing the air flow.

Further, as shown in fig. 4, the radiator 200 is provided with a tank body for accommodating the radiating pipe 300, and the radiating pipe 300 is accommodated in the tank body and can be in good contact with the radiator 200;

In one embodiment, the heat sink 200 includes: a bottom plate 210, a top plate 220, and a plurality of fin plates 230 connecting the bottom plate 210 and the top plate 220, the plurality of fin plates 230 are parallel to each other, a heat dissipation gap 201 is formed between adjacent fin plates 230, and the plurality of heat dissipation gaps 201 are parallel to each other.

The heat dissipation gap 201 is formed with an air intake side and an air outlet side, and the heat dissipation fan 400 is disposed corresponding to the air intake side.

The bottom plate 210 is to better contact with the substrate 100, the heat sink 200 is mounted on the substrate 100, the contact between the heat sink 200 and the substrate 100 is increased, the top plate 220 is corresponding to the bottom plate 210, FIN sheets 230 are arranged between the top plate 220 and the bottom plate 210, and a heat dissipation gap 201 is formed between adjacent FIN sheets 230, so that when blowing, air flow is limited to move from the air inlet side to the air outlet side of the heat dissipation gap 201, namely, the air flow direction in fig. 2 is from right to left, and the air flow in the direction in fig. 3 is expressed from inside to outside perpendicular to the paper surface and is vertically oriented to the reader.

As shown in fig. 5, six radiating pipes 300 and the outermost FIN sheet 230 form six crossing points on the outermost FIN sheet 230, and the six crossing points are diagonally distributed to better transfer heat to the FIN sheet 230; the intersection of the remaining FIN sheet 230 and the radiating pipe 300 is also substantially as shown in fig. 5.

Further, the length direction of the radiating pipe 300 is parallel to the arrangement direction of the radiating gaps 201, so that the radiating pipe 300 passes through the plurality of radiating gaps 201.

As shown in fig. 3, the FIN sheets 230 are arranged in a right-left direction, and the heat conductive segments 310 are also arranged in a right-left direction in the heat radiating pipe 300, i.e., each of the heat conductive segments 310 passes through a plurality of FIN sheets 230 to transfer heat to the FIN sheets 230.

Further, the substrate 100 is a heat source plate, or the second surface 102 of the substrate 100 is provided with a heat source, after the heat sink 200 is mounted on the substrate 100, the heat of the substrate 100 is absorbed, and the inner wall of the groove 100 provided on the substrate 100 is arc-shaped, so that the contact area between the heat dissipating tube 300 and the substrate 100 can be increased, and the heat of the substrate 100 is better absorbed and transferred upwards;

In order to further enhance the heat transfer effect, it is considered that a thermally conductive adhesive layer is provided between the substrate 100 and the radiating pipe 300, while enhancing the connection stability between the substrate 100 and the radiating pipe 300.

Further, the heat dissipation fan 400 is mounted at the edge of the substrate 100, and the heat dissipation fan 400 may be of a type commonly used in the market.

The use of the present product is further described below:

When the heat pipe radiator is used, the whole heat pipe radiator is arranged in the electronic equipment, and a heating element of the electronic equipment is arranged at the position of the substrate 100 and is in close contact with the substrate 100, and similarly, in order to further improve the heat absorption efficiency, a heat conduction bonding layer can be additionally arranged between the heating element and the substrate 100;

After the heat of the heating element is transferred to the substrate 100, part of the heat of the substrate 100 is directly absorbed by the radiator 200, part of the heat of the substrate 100 is absorbed by the radiating pipe 300, and is transferred to the high position in the radiator 200 through the radiating pipe 300, so that the heat is uniformly distributed on FIN sheets 230 of the radiator 200;

The cooling fan 400 operates to drive air to flow through the cooling gap 201 of the radiator 200, and the air flows to take away heat on the FIN 230, so that the purpose of rapid cooling is effectively achieved.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. A heat pipe heat sink, characterized in that: comprising the following steps: a substrate (100), a radiator (200), a radiating pipe (300), and a radiating fan (400); the radiator (200) is mounted on the first surface (101) of the substrate (100), and the radiating tube (300) is also mounted on the first surface (101) of the substrate (100); a groove (110) for accommodating the radiating pipe (300) is formed in the first surface (101) of the substrate (100) so as to increase the contact area between the radiating pipe (300) and the substrate (100); the radiating pipe (300) is provided with at least two sections of horizontally extending heat conducting sections (310) which are distributed in a high-low mode, the adjacent heat conducting sections (310) are connected through a connecting section (320), and the heat conducting sections (310) and the connecting section (320) are contained in the radiator (200).

2. A heat pipe heat sink as defined in claim 1, wherein: six radiating pipes (300) are arranged, and the diameter of each radiating pipe (300) is 6mm.

3. A heat pipe heat sink according to claim 2, wherein: the six radiating pipes (300) are different in overall height, and are arranged from high to low, and the radiating pipes (300) with low heights are closest to the radiating fan (400).

4. A heat pipe heat sink as defined in claim 1, wherein: the radiator (200) is provided with a groove body for accommodating the radiating pipe (300).

5. A heat pipe heat sink as defined in claim 1, wherein: the heat sink (200) includes: a bottom plate (210), a top plate (220), and a plurality of FIN sheets (230) connecting the bottom plate (210) and the top plate (220), wherein the FIN sheets (230) are parallel to each other, a heat dissipation gap (201) is formed between adjacent FIN sheets (230), and the FIN sheets (201) are parallel to each other.

6. A heat pipe heat sink as defined in claim 4, wherein: the length direction of the radiating pipe (300) is parallel to the arrangement direction of the radiating gaps (201), so that the radiating pipe (300) passes through the plurality of radiating gaps (201).

7. A heat pipe heat sink as defined in claim 5, wherein: the heat dissipation gap (201) is formed with an air inlet side and an air outlet side, and the heat dissipation fan (400) is arranged corresponding to the air inlet side.

8. A heat pipe heat sink as defined in claim 1, wherein: the substrate (100) is a heat source plate, or a heat source is mounted on the second surface (102) of the substrate (100).

9. A heat pipe heat sink as defined in claim 1, wherein: the inner wall of the groove (110) is arc-shaped.