TWM586460U - Heat dissipation apparatus - Google Patents

Abstract

This creation is a heat dissipation device, which includes a base plate, a heat dissipation fin group, and a heat pipe. The base plate includes a first plate body and a second plate body, which are made of different materials. The first plate body has grooves, and the grooves are far from the second plate body. A first opening is formed on one side of. The heat pipe has a first end and a second end. The second end of the heat pipe is penetrated in the perforation of the heat dissipation fin group. The heat dissipation fin group is arranged on the second plate body of the substrate. The first end of the heat pipe is penetrated in the groove. And the first end of the heat pipe exposes one side of the first plate through the first opening. Therefore, the cost can be reduced, and the first end of the heat pipe can directly contact the heat source, so as to achieve a better heat dissipation effect.

Description

Heat sink

This creation relates to a heat dissipation device, in particular to a heat dissipation device that can be used to assist the heat dissipation of heat sources such as electronic heating elements.

At present, the development of products in the technology industry tends to be more sophisticated. In addition to the compact design of devices such as integrated circuits or computers, the relative amount of heat generated has also increased significantly, so the heat generated during its operation is also considerable. Corresponding heat sinks or heat sinks are provided for various electronic heating components to maintain their normal operation at permitted temperatures. In addition, heat transfer through heat pipes is also an application of existing heat dissipation technologies.

The existing heat dissipation device includes a substrate and a heat dissipation fin group. The heat dissipation fin group includes a plurality of heat dissipation fins. The heat dissipation fins are disposed on the substrate, and the substrate can be used to contact an electronic heating element (such as a microprocessor). The heat generated during the operation of the electronic heating element can be transferred to the heat dissipation fin group through the substrate, so as to assist the heat dissipation by using the heat dissipation fin group. In addition, a heat pipe may be provided between the substrate and the heat dissipation fin group, so that the heat generated during the operation of the electronic heating element can be transferred to the heat dissipation fin group through the substrate and the heat pipe, and the heat is provided through the circulation change of the gas and liquid phases. Heat transfer function, thereby dissipating heat.

However, the substrate of the existing heat sink is a one-piece design, and the entire substrate is made of a metal material (such as copper) with good thermal conductivity, and the manufacturing cost is high. Furthermore, the heat pipe must be in contact with the electronic heating element through the substrate, which will also reduce the efficiency of heat conduction and further reduce the heat dissipation effect.

The technical problem to be solved by this creation is to provide a heat dissipation device for the deficiency of the existing technology, which can reduce the cost and achieve better heat dissipation effect.

In order to solve the above technical problems, the present invention provides a heat dissipation device including: a substrate, the substrate including a first plate body and a second plate body, the first plate body and the second plate body are made of different materials, The first plate body and the second plate body are overlapped and fixed with each other. The first plate body has a plurality of grooves, and a first opening is formed on each side of the grooves away from the second plate body. An opening extends along the length of the groove; a heat dissipation fin group, the heat dissipation fin group including a plurality of heat dissipation fins, each of which is provided with a plurality of perforations; and a plurality of heat pipes, the heat pipes Each has a first end and a second end, and the second ends of the heat pipes are respectively penetrated in the perforations of the heat dissipation fins, and the second ends of the heat pipes and the heat dissipation fin group are thermally conductive. The heat dissipation fin group is disposed on the second plate body of the substrate. The second plate body of the substrate and the heat dissipation fin group are connected in a thermally conductive manner, and the first ends of the heat pipes are respectively passed through. In the grooves, the first ends of the heat pipes and the substrate are thermally conductive. Connection, and the first end of the heat pipes are respectively transmitted through the plurality of openings expose the first side of the first plate.

In order to solve the above-mentioned technical problems, the present invention further provides a heat dissipation device, which includes a substrate including a first plate body and a second plate body, and the first plate body and the second plate body are made of different materials. The first plate body and the second plate body are overlapped and fixed with each other, and a groove is formed in the first plate body, and a side of the groove away from the second plate body forms a first opening, and the first opening Extending along the length of the trench; a heat dissipation fin group comprising a plurality of heat dissipation fins, each of which is provided with a perforation; and a heat pipe having a first end and A second end, the second end of the heat pipe is penetrated in the perforations of the heat dissipation fins, and the second end of the heat pipe and the heat dissipation fin group are connected in a thermally conductive manner, and the heat dissipation fin group is disposed at On the second plate body of the substrate, the second plate body of the substrate and the heat dissipation fin group are connected in a thermally conductive manner, a first end of the heat pipe is penetrated in the groove, and a first end of the heat pipe And the substrate are connected in a thermally conductive manner, and the first end of the heat pipe passes through the first Opening exposing the side of the first plate.

The beneficial effect of this creation is that the heat dissipation device provided by this creation includes a substrate, a fin group and a heat pipe. The substrate includes a first plate and a second plate. The first plate and the second plate are made of different materials. A groove is formed in the first plate body, and a first opening is formed on a side of the groove away from the second plate body. The second end of the heat pipe is penetrated in the perforation of the heat dissipation fin, the heat dissipation fin group is arranged on the second plate body of the substrate, the first end of the heat pipe is penetrated in the groove, and the first end of the heat pipe passes through the first The opening exposes one side of the first plate body. The first plate body of the substrate of the heat sink and the first end of the heat pipe can be used to contact a heat source. The heat generated during the operation of the heat source can be transferred to the heat sink fin group through the substrate, and the heat generated during the operation of the heat source can also be The heat pipe is transmitted to the radiating fin group, thereby dissipating heat, and effectively reducing the temperature of the heat source. The substrate of this creation includes a first plate body and a second plate body to form a composite material structure, which can reduce the cost, and the first end of the heat pipe can directly contact the heat source, so that it has better thermal conductivity and better heat dissipation. effect.

In order to better understand the features and technical contents of this creation, please refer to the following detailed description and drawings about this creation. However, the drawings provided are only for reference and explanation, and are not intended to limit this creation.

The following are specific implementation examples to explain the implementation of the present disclosure. Those skilled in the art can understand the advantages and effects of the present disclosure from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings of this creation are only for simple and schematic illustrations, and are not drawn in actual size, so stated in advance. The following embodiments will further describe the technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation.

[Example]

Please refer to FIG. 1 and FIG. 2. This creation provides a heat dissipation device including a substrate 1, a heat dissipation fin group 2 and a plurality of heat pipes 3. The substrate 1, the heat pipe 3, and the heat dissipation fin group 2 are emitted to achieve better heat dissipation efficiency.

The substrate 1 includes a first plate body 11 and a second plate body 12 (see FIGS. 3 to 6 again). The first plate body 11 and the second plate body 12 are made of a metal material with good thermal conductivity. The first plate body 11 and the second plate body 12 are different materials. The first plate body 11 and the second plate body 12 may be aluminum plates (aluminum materials, aluminum alloys) or copper plates (copper materials, copper alloys). In the example, the first plate body 11 is an aluminum plate, the second plate body 12 is a copper plate, the first plate body 11 and the second plate body 12 are overlapped with each other, and between the first plate body 11 and the second plate body 12 The first plate body 11 and the second plate body 12 can be fixed to each other by welding or gluing to form a composite material structure, which can be used as a bottom plate of a heat sink. The bottom plate (substrate 1) can be a stamped and formed structure of a copper-aluminum composite material, and the copper part of the bottom plate can also be made by copper extrusion.

The first plate body 11 and the second plate body 12 may be flat or uneven. In this embodiment, the first plate body 11 and the second plate body 12 are concave or convex. The first plate body 11 has a The base portion 111 and a convex portion 112 are protruded on the base portion 111, and the second plate body 12 covers the base portion 111 and the convex portion 112 of the first plate body 11.

The first plate body 11 has a plurality of grooves 113 therein, and the grooves 113 can extend to opposite ends of the first plate body 11 so that the first ends 31 of the heat pipes 3 can pass through. In this embodiment, the grooves 113 are disposed in the first plate body 11 at positions corresponding to the convex portions 112, so that the height of the grooves 113 can be increased. The shapes and structures of the grooves 113 are not limited, and may be appropriately changed according to needs.

A first opening 114 is formed on each of the grooves 113 away from the second plate body 12. The first opening 114 extends along the length of the groove 113. The first openings 114 can extend to the first plate body 11. The opposite ends of the heat pipes 3 allow the first ends 31 of the heat pipes 3 to respectively expose one side (bottom surface) of the first plate body 11 through the first openings 114.

Preferably, a second opening 115 may be formed on a side of the grooves 113 near the second plate body 12. The second opening 115 extends along the length of the groove 113. The opposite ends of a plate body 11 enable the first ends 31 of the heat pipes 3 to respectively expose the other surfaces (top surfaces) of the first plate body 11 through the second openings 115, so that the first ends of the heat pipes 3 The end 31 can also contact the second plate body 12 so as to have a better heat conduction effect.

The heat dissipation fin group 2 includes a plurality of heat dissipation fins 21. The heat dissipation fins 21 are made of a metal material with good thermal conductivity (for example, copper or aluminum). The heat dissipation fins 21 are stacked on each other. The fins 21 can also be combined with each other by means of buckling or the like, so that the radiating fins 21 are combined into a radiating fin group 2. Each of the heat dissipation fins 21 is provided with a plurality of perforations 211 for the heat pipe 3 to pass through. Since the heat dissipating fin group 2 is the prior art, and the type and structure of the heat dissipating fin group 2 are not limited in this creation, it will not be described again. In addition, a fan (not shown in the figure) can be further installed on the heat dissipation fin group 2 to assist the heat dissipation by air cooling.

The heat pipes 3 may be provided with a capillary structure, a working fluid, and the like. The capillary structure can use the capillary effect to achieve the effect of the working fluid adsorption cycle. The heat pipes 3 may be U-shaped or other shapes. The heat pipes 3 each have a first end 31 and a second end 32. Preferably, the first end 31 and a second end 32 are parallel to each other.

The second ends 32 of the heat pipes 3 pass through the through holes 211 of the heat radiating fins 21, respectively. The second ends 32 of the heat pipes 3 and the heat radiating fin group 2 can contact and adhere to each other, so that The second ends 32 of the heat pipes 3 and the heat dissipation fin group 2 are connected in a thermally conductive manner, so that heat is transferred to the heat dissipation fin group 2 through the heat pipes 3. Since the heat pipe 3 is the prior art, and the type and structure of the heat pipe 3 are not limited in this creation, it will not be described again.

The heat dissipation fin group 2 is disposed on the second plate body 12 of the substrate 1. The second plate body 12 of the substrate 1 and the heat dissipation fin group 2 are in contact with and adhered to each other, so that the second plate body 12 and The heat dissipation fin groups 2 are connected in a thermally conductive manner, so that heat is transferred to the heat dissipation fin groups 2 through the substrate 1. The first ends 31 of the heat pipes 3 pass through the grooves 113 of the substrate 1, respectively. The first ends 31 of the heat pipes 3 and the substrate 1 are in contact with each other and adhered to each other, so that the first ends 31 of the heat pipes 3 are in contact with each other. The one end 31 and the substrate 1 are connected in a thermally conductive manner. The first ends 31 of the heat pipes 3 respectively expose one side (bottom surface) of the first plate 11 through the first openings 114, so that the first ends 31 of the heat pipes 3 can directly contact the heat source, thereby having better heat conduction. effect.

The heat dissipation device can be used to assist the heat source (such as an electronic heating element) to dissipate heat. The first plate 11 of the substrate 1 and the first ends 31 of the heat pipes 3 can be used to contact the heat source (not shown). The heat source can be Various electronic heating elements (such as microprocessors), the heat generated during the operation of the heat source can be transferred to the heat sink fin group 2 through the substrate 1, and the heat generated during the operation of the heat source can also be transmitted through the heat pipes 3 For the heat dissipation fin group 2, the circulation change of the gas and liquid phases is provided to provide a heat transfer effect, thereby dissipating the heat and effectively reducing the temperature of the heat source to maintain the normal operation of the heat source.

The number of heat pipes 3 provided in the present invention is not limited, and may be appropriately increased or decreased according to needs. In another embodiment, only one heat pipe 3 may be provided, and a groove is provided in the corresponding first plate 11. 113. Each of the heat dissipation fins 21 is provided with a perforation 211. The first end 31 of the heat pipe 3 is penetrated in the groove 113 of the substrate 1. The first end 31 of the heat pipe 3 and the substrate 1 are thermally conductive. connection. The second end 32 of the heat pipe 3 passes through the through holes 211 of the heat dissipation fins 21, and the second end 32 of the heat pipe 3 and the heat dissipation fin group 2 are connected in a thermally conductive manner.

[Beneficial effects of this creation]

The beneficial effect of this creation is that the heat dissipation device of this creation includes a substrate, a fin group and a heat pipe. The substrate includes a first plate and a second plate. The first plate and the second plate are made of different materials. A groove is formed in the plate body, and a first opening is formed on a side of the groove away from the second plate body. The second end of the heat pipe is penetrated in the perforation of the heat dissipation fin, the heat dissipation fin group is arranged on the second plate body of the substrate, the first end of the heat pipe is penetrated in the groove, and the first end of the heat pipe passes through the first The opening exposes one side of the first plate body. The first plate body of the substrate of the heat sink and the first end of the heat pipe can be used to contact a heat source. The heat generated during the operation of the heat source can be transferred to the heat sink fin group through the substrate, and the heat generated during the operation of the heat source can also be The heat pipe is transmitted to the radiating fin group, thereby dissipating heat, and effectively reducing the temperature of the heat source. The substrate of this creation includes a first plate body and a second plate body to form a composite material structure, which can reduce the cost, and the first end of the heat pipe can directly contact the heat source, so that it has better thermal conductivity and better heat dissipation effect.

The content disclosed above is only the preferred and feasible embodiment of this creation, and therefore does not limit the scope of the patent application for this creation. Therefore, any equivalent technical changes made using this creation specification and diagram content are included in this creation application Within the scope of the patent.

1‧‧‧ substrate
11‧‧‧ the first plate
111‧‧‧ base
112‧‧‧ convex
113‧‧‧Groove
114‧‧‧First opening
115‧‧‧ second opening
12‧‧‧Second plate
2‧‧‧Cooling Fin Set
21‧‧‧Cooling Fin
211‧‧‧perforation
3‧‧‧ heat pipe
31‧‧‧ the first end
32‧‧‧ the second end

FIG. 1 is an exploded perspective view of the creative heat sink.

FIG. 2 is an exploded perspective view of the creative heat sink from another angle.

FIG. 3 is a perspective view of the creative heat sink.

FIG. 4 is a perspective view of the creative heat sink from another angle.

FIG. 5 is a front view of the creative heat sink.

FIG. 6 is a sectional view taken along the line VI-VI in FIG. 3.

Claims (10)

A heat dissipation device includes:
A substrate comprising a first plate body and a second plate body, the first plate body and the second plate body are of different materials, and the first plate body and the second plate body are superposed and fixed on each other A plurality of grooves are formed in the first plate body, a first opening is formed on each side of the grooves away from the second plate body, and the first opening extends along the length direction of the groove;
A heat dissipation fin group, which comprises a plurality of heat dissipation fins, each of which is provided with a plurality of perforations; and a plurality of heat pipes, each of which has a first end and a second end, The second ends of the heat pipes are respectively disposed in the perforations of the heat dissipation fins. The second ends of the heat pipes and the heat dissipation fin group are connected in a thermally conductive manner, and the heat dissipation fin group is disposed on the substrate. On the second plate body, the second plate body of the substrate and the heat dissipation fin group are connected in a thermally conductive manner, and the first ends of the heat pipes are respectively penetrated in the grooves. One end and the substrate are connected in a thermally conductive manner, and the first ends of the heat pipes respectively expose one side of the first plate body through the first openings. The heat dissipation device according to item 1 of the scope of patent application, wherein the first plate body is an aluminum plate or a copper plate, and the second plate body is a copper plate or an aluminum plate. The heat dissipation device according to item 1 of the scope of patent application, wherein the first plate body has a base portion and a convex portion, the convex portion is convexly disposed on the base portion, and the second plate body covers the first plate body. On the base portion and the convex portion, the grooves are disposed in the first plate body at positions corresponding to the convex portion. The heat dissipation device according to item 1 of the scope of patent application, wherein the grooves extend to opposite ends of the first plate. The heat dissipation device according to item 1 of the scope of patent application, wherein a side of each of the grooves near the second plate is formed with a second opening, and the second opening extends along the length of the groove. The first ends of the heat pipes respectively expose the other surfaces of the first plate through the second openings, so that the first ends of the heat pipes contact the second plate. The heat dissipation device according to item 1 of the scope of patent application, wherein the substrate is a stamped and formed structure of a copper-aluminum composite material. A heat dissipation device includes:
A substrate comprising a first plate body and a second plate body, the first plate body and the second plate body are of different materials, and the first plate body and the second plate body are superposed and fixed on each other A groove is formed in the first plate body, a first opening is formed on a side of the groove away from the second plate body, and the first opening extends along the length direction of the groove;
A heat dissipation fin group including a plurality of heat dissipation fins, each of which is provided with a perforation; and a heat pipe having a first end and a second end, and a second end of the heat pipe The end is penetrated in the perforations of the heat dissipation fins, and the second end of the heat pipe and the heat dissipation fin group are connected in a thermally conductive manner. The heat dissipation fin group is disposed on the second plate of the substrate. The second plate of the substrate is connected with the heat dissipation fin group in a thermally conductive manner. The first end of the heat pipe is penetrated in the groove. The first end of the heat pipe and the substrate are connected in a thermally conductive manner. And a first end of the heat pipe exposes a side of the first plate body through the first opening. The heat dissipation device according to item 7 of the scope of patent application, wherein the first plate body is an aluminum plate or a copper plate, and the second plate body is a copper plate or an aluminum plate. The heat dissipation device according to item 7 of the scope of patent application, wherein the first plate body has a base portion and a convex portion, the convex portion is protruded on the base portion, and the second plate body covers the first plate body. On the base portion and the convex portion, the groove is disposed in the first plate body at a position corresponding to the convex portion. The heat dissipation device according to item 7 of the scope of patent application, wherein the substrate is a stamped and formed structure of a copper-aluminum composite material.