US20090151909A1 - Heat-Dissipating Unit - Google Patents
Heat-Dissipating Unit Download PDFInfo
- Publication number
- US20090151909A1 US20090151909A1 US12/082,706 US8270608A US2009151909A1 US 20090151909 A1 US20090151909 A1 US 20090151909A1 US 8270608 A US8270608 A US 8270608A US 2009151909 A1 US2009151909 A1 US 2009151909A1
- Authority
- US
- United States
- Prior art keywords
- heat
- generating source
- dissipating
- contact portion
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat-dissipating unit is provided. The heat-dissipating unit includes a board. The board is thermally conductive and includes a contact portion planar in shape. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thereby enhancing heat dissipation.
Description
- 1. Field of the Invention
- The present invention relates to a heat-dissipating unit and, more particularly, to application of a thermally conductive board highly efficient in heat transfer.
- 2. Description of the Prior Art
- Owing to rapid development of industrial sectors, such as information, communication, and optoelectronics, in recent years, the trend of electronic products is toward high levels and miniaturization. Given the demand for high-speed, high-frequency, and miniaturized electronic products, electronic components nowadays feature increasingly high heat-generation density. Hence, cooling efficiency has become an important factor in the stability of electronic products. Highly efficient in heat transfer, heat pipes and heat spreaders are thermally conductive components in wide use with electronic products. A heat pipe or a heat spreader comprises a sealed vacuum copper pipe or plate, wherein a capillary layer is sintered to the inner wall of the copper pipe or plate. A working fluid inside the copper pipe or plate is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary layer, thereby providing closed circulation.
- Referring to
FIG. 1 , which is a perspective view of a conventional heat-dissipating module, a heat-dissipating module 1 comprises a heat-dissipatingfin set 11 and aheat pipe 12. The heat-dissipatingfin set 11 is formed with at least one throughhole 112. The bottom of the heat-dissipatingfin set 11 is coupled to abase 111 and gains access to a heat-generatingsource 13 via thebase 111. Theheat pipe 12 penetrates the throughhole 112 of the heat-dissipatingfin set 11 and is coupled to thebase 111. Heat generated by the heat-generatingsource 13 is transferred to theheat pipe 12 via thebase 111. Afterward, theheat pipe 12 transfers the heat to the heat-dissipating fin set 11 for heat dissipation. - Nevertheless, the prior art illustrated with the heat-
dissipating module 1 is not free of any drawbacks. Theheat pipe 12 has to be coupled to the heat-dissipating fin set 11 before being coupled to thebase 111, otherwise thebase 111 cannot come into immediate contact with the heat-generatingsource 13, and the heat from the heat-generatingsource 13 cannot be transferred to theheat pipe 12 and dissipated at a remote end. Theheat pipe 12 is not in immediate contact with the heat-generatingsource 13; instead, theheat pipe 12 has to be coupled to thebase 111, because thebase 111 is indispensable to heat transfer, and theheat pipe 12 cannot work without thebase 111. A gap is likely to appear between theheat pipe 12 and thebase 111 despite firm adhesion or thermal grease therebetween, resulting in thermal resistance and great reduction of heat transfer. - Another conventional heat-dissipating module comprises a thermally conductive board for heat dissipation. The thermally conductive board is usually for use with a notebook computer or a compact device that requires heat dissipation. The thermally conductive board comprises two superimposed metal plates and is inwardly formed with channels and/or a capillary structure carrying a working fluid. The working fluid is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary structure. However, the thermally conductive board has a drawback, that is, a short path from the evaporator end to the condenser end, which accounts for inefficient heat dissipation of the thermally conductive board.
- Hence, the drawbacks of the prior art are as follows:
-
- 1. The coupling of the heat pipe and the base is compromised by a gap likely to appear therebetween, resulting in thermal resistance.
- 2. Bulky and space-consuming.
- 3. Inefficient heat dissipation.
- Accordingly, the inventor of this patent application and related manufacturers need urgent solution to overcome the drawbacks of the aforementioned prior art.
- Accordingly, to solve the drawbacks of the aforementioned prior art, it is a primary objective of the present invention to provide a heat-dissipating unit in immediate contact with a heat-generating source, capable of heat transfer, and comprising a branch portion extending outward from the body of the heat-dissipating unit, thereby transferring heat to a remote end for heat dissipation.
- Another objective of the present invention is to provide a heat-dissipating unit that is space-saving.
- Yet another objective of the present invention is to provide a heat-dissipating unit that is structurally simple and cost-saving.
- In order to achieve the above and other objectives, the present invention provides a heat-dissipating unit. The heat-dissipating unit comprises a board. The board is thermally conductive and defined with a plane functioning as a contact portion. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thus enabling heat dissipation.
- Accordingly, the present invention has the following advantages:
-
- 1. The board is in immediate contact with a heat-generating source, such that heat is transferred from the heat-generating source to a remote end via the branch portion, thus enabling efficient heat dissipation.
- 2. With the board being in immediate contact with the heat-generating source, thermal resistance never occurs.
- 3. The structure is simple enough to be space-saving.
- 4. The structure is simple enough to be time-saving and cost-saving as far as fabrication is concerned.
-
FIG. 1 (PRIOR ART) is a perspective view of a conventional heat-dissipating module; -
FIG. 2 is an exploded view of a preferred embodiment according to the present invention; -
FIG. 3 is a perspective view of the preferred embodiment according to the present invention; -
FIG. 4 is an exploded view of another preferred embodiment according to the present invention; -
FIG. 5 is a perspective view of the other preferred embodiment according to the present invention; and -
FIG. 6 is a perspective view of the other preferred embodiment according to the present invention. - In order to achieve the aforesaid objectives and advantages, the technical means employed, structure, features, and functions of the present invention are illustrated with the appended drawings and preferred embodiments.
- Referring to
FIGS. 2 and 3 , which are an exploded view and a perspective view of a preferred embodiment according to the present invention respectively, a heat-dissipating unit comprises aboard 2. Theboard 2 is thermally conductive and internally disposed with a working fluid and a capillary structure (with the same structure as a conventional heat pipe, heat plate, or heat spreader, and thus the description thereof is omitted herein). Theboard 2 is defined with a plane. Acontact portion 21 is formed on the plane. Thecontact portion 21 is in immediate contact with a heat-generatingsource 3. An integrally formedbranch portion 22 extends outward from at least one end of thecontact portion 21. With thecontact portion 21 being in immediate contact with the heat-generatingsource 3, heat is transferred from the heat-generating source to a remote end via thecontact portion 21 and thebranch portion 22 extending outward, thus enabling heat dissipation. With thecontact portion 21 and thebranch portion 22, the present invention improves a drawback of the prior art, that is, thermal resistance occurs to a conventional heat-dissipating module for transferring heat from a heat-generating source to a heat pipe via a base. - Referring to
FIGS. 4 and 5 , which are an exploded view and a perspective view of another preferred embodiment according to the present invention respectively, heat-dissipatingfins 4 penetrated by thebranch portion 22 allow thebranch portion 22 to dissipate heat rapidly to the surroundings via the heat-dissipatingfins 4. - Referring to
FIG. 6 , which is a perspective view of the other preferred embodiment according to the present invention, the heat-dissipatingfins 4 penetrated by thebranch portion 22 are further provided with afan 5 for cooling. Thecontact portion 21 of theboard 2 is in immediate contact with the heat-generatingsource 3, and thus heat is transferred from the heat-generatingsource 3 to thecontact portion 21, thebranch portion 22, and the heat-dissipatingfins 4 in sequence. Thefan 5 cools down the heat-dissipatingfins 4, and enhances heat dissipation performed by the heat-dissipatingfins 4. - The aforesaid embodiments merely serve as the preferred embodiments of the present invention but are not intended to limit the present invention. It will be apparent to those skilled in the art that all equivalent modifications or changes made, without departing from the spirit and the technical concepts disclosed by the present invention, should fall within the scope of the appended claims.
- Summarizing the above, the heat-dissipating unit of the present invention is efficacious, has high industrial applicability, and meets the conditions for patentability. Hence, the applicant files the application for a patent. The applicant would appreciate, if a patent is issued to the application. An examiner should not hesitate to write and instruct the applicant to answer a question about the application document, and the applicant will spare no effort to follow instructions given by the examiner.
Claims (3)
1. A heat-dissipating unit, comprising:
a board being thermally conductive and defined with a plane;
a contact portion formed on said plane of said board, said contact portion being in immediate contact with a heat-generating source; and
at least one branch portion extending outward from at least one end of said contact portion;
wherein heat is transferred to a remote end via said branch portion, thereby enabling heat dissipation.
2. The heat-dissipating unit of claim 1 , wherein said branch portion is coupled to heat-dissipating fins.
3. The heat-dissipating unit of claim 2 , wherein said heat-dissipating fins are further provided with a fan for cooling, to enhance heat dissipation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096221226U TWM339197U (en) | 2007-12-13 | 2007-12-13 | Heat dissipating unit |
TW096221226 | 2007-12-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090151909A1 true US20090151909A1 (en) | 2009-06-18 |
Family
ID=40751685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/082,706 Abandoned US20090151909A1 (en) | 2007-12-13 | 2008-04-11 | Heat-Dissipating Unit |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090151909A1 (en) |
TW (1) | TWM339197U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130133859A1 (en) * | 2011-11-30 | 2013-05-30 | International Business Machines Corporation | Heat sink with heat bus and fin structure |
US20220000191A1 (en) * | 2014-11-14 | 2022-01-06 | Gentherm Incorporated | Heating and cooling technologies |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI475951B (en) * | 2012-07-04 | 2015-03-01 | Acer Inc | Heat dissipation unit |
CN103547113B (en) * | 2012-07-10 | 2017-01-18 | 宏碁股份有限公司 | Heat radiation unit |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2984774A (en) * | 1956-10-01 | 1961-05-16 | Motorola Inc | Transistor heat sink assembly |
US3187812A (en) * | 1963-02-11 | 1965-06-08 | Staver Co | Heat dissipator for electronic circuitry |
US3213324A (en) * | 1962-09-12 | 1965-10-19 | Int Electronic Res Corp | Variable cooler unit |
US3212569A (en) * | 1961-06-26 | 1965-10-19 | Int Electronic Res Corp | Heat dissipator for electronic components |
US3416597A (en) * | 1967-06-15 | 1968-12-17 | Forbro Design Corp | Heat sink for forced air or convection cooling of semiconductors |
US4403102A (en) * | 1979-11-13 | 1983-09-06 | Thermalloy Incorporated | Heat sink mounting |
US5960871A (en) * | 1998-10-28 | 1999-10-05 | Chen; Ping-Chieh | Heat sink for a computer |
US6026895A (en) * | 1998-02-06 | 2000-02-22 | Fujitsu Limited | Flexible foil finned heatsink structure and method of making same |
US6234239B1 (en) * | 1996-06-27 | 2001-05-22 | Kaveh Azar | Segmented heat sink |
US6263959B1 (en) * | 1998-04-13 | 2001-07-24 | Furukawa Electric Co. Ltd. | Plate type heat pipe and cooling structure using it |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
US6938682B2 (en) * | 2003-10-18 | 2005-09-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
US6945319B1 (en) * | 2004-09-10 | 2005-09-20 | Datech Technology Co., Ltd. | Symmetrical heat sink module with a heat pipe for spreading of heat |
US7277285B2 (en) * | 2004-04-07 | 2007-10-02 | Delta Electronics, Inc. | Heat dissipation module |
-
2007
- 2007-12-13 TW TW096221226U patent/TWM339197U/en not_active IP Right Cessation
-
2008
- 2008-04-11 US US12/082,706 patent/US20090151909A1/en not_active Abandoned
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2984774A (en) * | 1956-10-01 | 1961-05-16 | Motorola Inc | Transistor heat sink assembly |
US3212569A (en) * | 1961-06-26 | 1965-10-19 | Int Electronic Res Corp | Heat dissipator for electronic components |
US3213324A (en) * | 1962-09-12 | 1965-10-19 | Int Electronic Res Corp | Variable cooler unit |
US3187812A (en) * | 1963-02-11 | 1965-06-08 | Staver Co | Heat dissipator for electronic circuitry |
US3416597A (en) * | 1967-06-15 | 1968-12-17 | Forbro Design Corp | Heat sink for forced air or convection cooling of semiconductors |
US4403102A (en) * | 1979-11-13 | 1983-09-06 | Thermalloy Incorporated | Heat sink mounting |
US6234239B1 (en) * | 1996-06-27 | 2001-05-22 | Kaveh Azar | Segmented heat sink |
US6026895A (en) * | 1998-02-06 | 2000-02-22 | Fujitsu Limited | Flexible foil finned heatsink structure and method of making same |
US6263959B1 (en) * | 1998-04-13 | 2001-07-24 | Furukawa Electric Co. Ltd. | Plate type heat pipe and cooling structure using it |
US5960871A (en) * | 1998-10-28 | 1999-10-05 | Chen; Ping-Chieh | Heat sink for a computer |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
US6938682B2 (en) * | 2003-10-18 | 2005-09-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
US7277285B2 (en) * | 2004-04-07 | 2007-10-02 | Delta Electronics, Inc. | Heat dissipation module |
US6945319B1 (en) * | 2004-09-10 | 2005-09-20 | Datech Technology Co., Ltd. | Symmetrical heat sink module with a heat pipe for spreading of heat |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130133859A1 (en) * | 2011-11-30 | 2013-05-30 | International Business Machines Corporation | Heat sink with heat bus and fin structure |
US20220000191A1 (en) * | 2014-11-14 | 2022-01-06 | Gentherm Incorporated | Heating and cooling technologies |
US11857004B2 (en) * | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
Also Published As
Publication number | Publication date |
---|---|
TWM339197U (en) | 2008-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, HSIUWEI;REEL/FRAME:020855/0835 Effective date: 20080321 |
|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, HSIUWEI;REEL/FRAME:020908/0746 Effective date: 20080321 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |