US6496368B2 - Heat-dissipating assembly having heat sink and dual hot-swapped fans - Google Patents

Heat-dissipating assembly having heat sink and dual hot-swapped fans Download PDF

Info

Publication number
US6496368B2
US6496368B2 US09/855,081 US85508101A US6496368B2 US 6496368 B2 US6496368 B2 US 6496368B2 US 85508101 A US85508101 A US 85508101A US 6496368 B2 US6496368 B2 US 6496368B2
Authority
US
United States
Prior art keywords
heat
fan
heat sink
dissipating assembly
assembly according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/855,081
Other versions
US20020167798A1 (en
Inventor
Hsu Jui-Yuan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US09/855,081 priority Critical patent/US6496368B2/en
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUI-YUAN, HSU
Publication of US20020167798A1 publication Critical patent/US20020167798A1/en
Application granted granted Critical
Publication of US6496368B2 publication Critical patent/US6496368B2/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating assembly for removing a portion of heat from a heat-generating device is provided. The heat-dissipating assembly includes a heat sink having a base in contact with a surface of the heat-generating device and a plurality of fins extending upwards from the base, and a first fan and a second fan respectively disposed on a first position and a second position of the heat sink, the first fan and the second fan being hot-swappable, wherein the portion of heat is conducted from the heat-generating device to the fins via the base, and further removed by a first action of the first fan and a second action of the second fan.

Description

FIELD OF THE INVENTION

The present invention relates to a heat-dissipating assembly, and ore particularly to a heat-dissipating assembly having a heat sink and dual hot-swapped fans.

BACKGROUND OF THE INVENTION

An integrated circuit chip is widely used in an electrical appliance such as a computer. When the electrical appliance operates, the chip generates energy in the form of heat. If the chip is unable to transfer enough heat to ambient air, the elevated operating temperature may result in damage of the chip or the breakdown of the whole appliance. In order to remove most heat generated from the chip, especially a CPU (central processing unit), an additional heat sink is usually attached on and spreads over the top surface thereof. The heat sink is made of a highly thermal conductive material and has a larger surface area than the attached CPU for improving heat transfer. In addition, the heat sink is frequently constructed with spaced fins in order to provide extra surface area. Furthermore, heat can quickly dissipate by improving the efficiency of the air circulation when a fan is disposed above/on the heat sink.

FIG. 1 is an exploded view showing a typical heat-dissipating assembly for a CPU 11. The heat-dissipating assembly includes a heat sink 12 made of a highly conductive material, for example aluminum, and a fan 13. The heat sink 12 includes a base 121 and a plurality of sheet-shaped fins 122. The base 121 is in contact with the top surface of the CPU chip 11. The fan 13 is engaged on the fins 122 by screws 16.

Although the heat-dissipating assembly can dissipate a lot of heat, it still has disadvantages as follows:

(1) The velocity of air flow introduced by the fan 13 is not uniformly distributed on each fin 122, for example the velocity under the hub 131 of the fan 13 is very low such that a portion of heat accumulates thereunder.

(2) If the fan 13 has a breakdown but is not replaced in a short time, the CPU chip 11 will be destroyed.

Therefore, the present invention provides an improved heat-dissipating assembly for overcoming the problems described above.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a heat-dissipating assembly having a heat sink and dual hot-swapped fans for enhancing efficacy and reliability of heat dissipation.

In accordance with an aspect of the present invention, there is provided a heat-dissipating assembly for removing a portion of heat from a heat-generating device. The heat-dissipating assembly includes a heat sink having a base in contact with a surface of the heat-generating device and a plurality of fins extending upwards from the base, and a first fan and a second fan respectively disposed on a first position and a second position of the heat sink, the first fan and the second fan being hot-swappable, wherein the portion of heat is conducted from the heat-generating device to the fins via the base, and further removed by a first action of the first fan and a second action of the second fan.

The heat-generating device is an electronic device in operation, and preferably a CPU (central processing unit).

Preferably, the first position and the second position are two selected from a first side surface, a second side surface and a top surface defined by the edges of the fins.

Preferably, the first action is one of attracting ambient air into the heat sink and exhausting hot air from the heat sink to environment.

Preferably, the second action is one of attracting ambient air into the heat sink and exhausting hot air from the heat sink to environment.

Preferably, the first fan is received within a first receptacle of a first frame coupled with the heat sink.

Preferably, the second fan is received within a second receptacle of a second frame coupled with the heat sink.

Preferably, each of the first frame and the second frame has hooks engaged with corresponding recesses of the heat sink.

In accordance with another aspect of the present invention, there is provided a heat-dissipating assembly for removing a portion of heat generated from a CPU (central processing unit). The heat-dissipating assembly includes a heat sink having a base in contact with a surface of the heat-generating device and a plurality of fins extending upwards from the base, and a first fan and a second fan respectively disposed on a first position and a second position of the heat sink, the first fan and the second fan being hot-swappable, the first position and the second position being two selected from a first side surface, a second side surface and a top surface defined by the edges of the fins, wherein the portion of heat is conducted from the heat-generating device to the fins via the base, and further removed by a first action of the first fan and a second action of the second fan.

Preferably, the first action is one of attracting ambient air into the heat sink and exhausting hot air from the heat sink to environment.

Preferably, the second action is one of attracting ambient air into the heat sink and exhausting hot air from the heat sink to environment.

Preferably, the first fan is received within a first receptacle of a first frame coupled with the heat sink.

Preferably, the second fan is received within a second receptacle of a second frame coupled with the heat sink.

Preferably, each of the first frame and the second frame has hooks engaged with corresponding recesses of the heat sink.

The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view showing a typical heat-dissipating assembly for a chip;

FIG. 2 is exploded view illustrating a heat-dissipating assembly according to a first preferred embodiment of the present invention;

FIG. 3 is a perspective view of the a heat-dissipating assembly in FIG. 2; and

FIG. 4 is a perspective view illustrating a heat-dissipating assembly according to a second preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIGS. 2 and 3 are exploded and perspective view illustrating the heat-dissipating assembly according to the first preferred embodiment of the present invention, respectively. The heat-dissipating assembly principally includes a heat sink 22, two fans 23 and 24, and two frames 25 and 26.

The heat sink 22 is made of a highly conductive material, for example aluminum, and includes a base 221 in contact with a surface of a CPU 21 and a plurality of fins 223 extending upwards from the base 221. Since each of the fins 223 is plate-shaped, and thus a plurality of channels are formed between the fins 223. According to the present invention, the edges of the fins 223 are defined as a first side surface 2231, a second side surface 2232 and a top surface 2233. In this embodiment, the first fan 23 and the second fan 24 are respectively received within a first receptacle 251 of the first frame 25 and a second receptacle 261 of the second frame 26. Each of the first frame 25 and the second frame 26 has hooks 252, 262 engaged with corresponding recesses 225, 226 of the heat sink 22 such that the first fan 23 and the second fan 24 are respectively disposed on the first side surface 2231 and the second side surface 2232.

It is known that a portion of heat generated from the CPU 21 is conducted via the base 221 of the heat sink 22 and then removed by forced convection. Each of the fans 23 and 24 is optionally designed to attract ambient air into the heat sink 22 or exhaust hot air from the heat sink 22 to environment, for example the first fan 23 attracts ambient air and the second fan 24 exhausts hot air. Thus, the convection effect between the heat sink 22 and environment can be largely increased. It is of course that both fans 23 and 24 may attract ambient air or exhaust hot air. When both of the fans 23 and 24 attract ambient air into the heat sink 22, the hot air flows through the channels between fins 223 and is then exhausted from the top surface 2233 to environment. When both of the fans 23 and 24 exhaust hot air to environment, the ambient air is forced to be attracted through the top surface 2233 to the channels.

According to the present invention, the fans 23 and 24 are hot-swappable. When one of the two fans 23 and 24 is malfunctioned in operation, the other fan will operate at a higher speed so as to continuously remove most heat generated from the CPU 21. Thus, the user has a sufficient time to replace a new fan on-line. The principle of hot-swap is known to a person skilled in the art.

FIG. 4 is a perspective view of the heat-dissipating assembly according to the second preferred embodiment of the present invention. The structure and the operation principle are the same as those of FIG. 3, except that the second fan 24 is disposed on the top surface 2233 of the heat sink 22 and the hooks 262 of the frame 26 are engaged with recesses 227 of the heat sink 22.

As will be apparent from the above description, the heat-dissipating assembly according to the present invention has the following advantages:

(a) Since two fans are employed, the conducted heat under the hub of one fan can be effectively removed by the other fan so as to enhance heat dissipation.

(b) The heat-dissipating assembly of the present invention can provide reliable heat-dissipation because the other fan can still dissipate heat even though one fan has a breakdown.

(c) The fans 23 and 24 can be optionally disposed on two positions selected from the first side surface 2231, the second side surface 2232 and the top surface 2233 and designed to attract ambient air or exhaust hot air, which enhances the layout flexibility of the heat-dissipating assembly.

(d) Both of the two fans employed are hot-swappable such that when a fan has breakdown the user has a sufficient time to replace a new one on-line.

While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (14)

What is claimed is:
1. A heat-dissipating assembly for removing a portion of heat from a heat-generating device, comprising:
a heat sink having a base in contact with a surface of said heat-generating device and a plurality of fins extending upwards from said base; and
a first fan and a second fan respectively disposed on a first position and a second position of said heat sink, said first fan and said second fan being hot-swappable, said first position and said second position being two different positions selected from the group consisting of a first side surface, a second side surface and a top surface defined by the edges of said fins,
wherein said portion of heat is conducted from said heat-generating device to said fins via said base, and further removed by a first action of said first fan and a second action of said second fan.
2. The heat-dissipating assembly according to claim 1, wherein said heat-generating device is an electronic device in operation.
3. The heat-dissipating assembly according to claim 2, wherein said electronic device is a CPU (central processing unit).
4. The heat-dissipating assembly according to claim 1, wherein said first action is one of attracting ambient air into said heat sink and exhausting hot air from said heat sink to environment.
5. The heat-dissipating assembly according to claim 1, wherein said second action is one of attracting ambient air into said heat sink and exhausting hot air from said heat sink to environment.
6. The heat-dissipating assembly according to claim 1, wherein said first fan is received within a first receptacle of a first frame coupled with said heat sink.
7. The heat-dissipating assembly according to claim 6, wherein said second fan is received within a second receptacle of a second frame coupled with said heat sink.
8. The heat-dissipating assembly according to claim 7, wherein each of said first frame and said second frame has hooks engaged with corresponding recesses of said heat sink.
9. A heat-dissipating assembly for removing a portion of heat generated from a CPU (central processing unit), comprising:
a heat sink having a base in contact with a surface of said heat-generating device and a plurality of fins extending upwards from said base; and
a first fan and a second fan respectively disposed on a first position and a second position of said heat sink, said first fan and said second fan being hot-swappable, said first position and said second position being two different positions selected from the group consisting of a first side surface, a second side surface and a top surface defined by the edges of said fins,
wherein said portion of heat is conducted from said CPU to said fins via said base, and further removed by a first action of said first fan and a second action of said second fan.
10. The heat-dissipating assembly according to claim 9, wherein said first action is one of attracting ambient air into said heat sink and exhausting hot air from said heat sink to environment.
11. The heat-dissipating assembly according to claim 9, wherein said second action is one of attracting ambient air into said heat sink and exhausting hot air from said heat sink to environment.
12. The heat-dissipating assembly according to claim 9, wherein said first fan is received within a first receptacle of a first frame coupled with said heat sink.
13. The heat-dissipating assembly according to claim 12, wherein said second fan is received within a second receptacle of a second frame coupled with said heat sink.
14. The heat-dissipating assembly according to claim 13, wherein each of said first frame and said second frame has hooks engaged with corresponding recesses of said heat sink.
US09/855,081 2001-05-14 2001-05-14 Heat-dissipating assembly having heat sink and dual hot-swapped fans Expired - Fee Related US6496368B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/855,081 US6496368B2 (en) 2001-05-14 2001-05-14 Heat-dissipating assembly having heat sink and dual hot-swapped fans

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/855,081 US6496368B2 (en) 2001-05-14 2001-05-14 Heat-dissipating assembly having heat sink and dual hot-swapped fans

Publications (2)

Publication Number Publication Date
US20020167798A1 US20020167798A1 (en) 2002-11-14
US6496368B2 true US6496368B2 (en) 2002-12-17

Family

ID=25320298

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/855,081 Expired - Fee Related US6496368B2 (en) 2001-05-14 2001-05-14 Heat-dissipating assembly having heat sink and dual hot-swapped fans

Country Status (1)

Country Link
US (1) US6496368B2 (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020180285A1 (en) * 2001-05-30 2002-12-05 Machiroutu Sridhar V. Fan assembly for a computer
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US6556442B2 (en) * 2001-06-19 2003-04-29 Global Win Technology Co. Ltd. CPU cooling structure
US20030188847A1 (en) * 2002-01-30 2003-10-09 Cheng-Tien Lai Fan duct assembly
US20040001315A1 (en) * 2002-06-28 2004-01-01 Yue-June Li Heat dissipation assembly
US20040008488A1 (en) * 2002-07-10 2004-01-15 Cheng-Tien Lai Fan holder for heat sink
US6717814B2 (en) * 2002-06-06 2004-04-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20040066623A1 (en) * 2002-10-07 2004-04-08 Cheng-Kuo Lu Structure of a heat dissipation device for computers
US20040120115A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating assembly
US6778392B2 (en) * 2002-12-13 2004-08-17 Arima Computer Corporation Heat dissipation device for electronic component
US20040212962A1 (en) * 2003-04-11 2004-10-28 Via Technologies, Inc. Lateral airflow fan-sink for electronic devices
US20040228728A1 (en) * 2003-03-20 2004-11-18 Yi-Lung Kuo Fan for cooling a computer
US20050047086A1 (en) * 2003-08-27 2005-03-03 Elias Gedamu Heat dissipation apparatus and method
US20050087329A1 (en) * 2003-10-03 2005-04-28 Jie Zhang Heat dissipation module with a pair of fans
US20050199369A1 (en) * 2004-03-15 2005-09-15 Chen Shih H. Dual centrifugal fan structure and heat dissipation device having the fan structure
US20060012955A1 (en) * 2004-07-19 2006-01-19 Wade Vinson System and method for cooling electronic devices
US20060102319A1 (en) * 2004-11-16 2006-05-18 Asia Vital Component Co., Ltd. Heat dissipation enhancing device
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
US20070035926A1 (en) * 2005-08-12 2007-02-15 Wan-Lin Xia Heat sink assembly
US20070121289A1 (en) * 2005-11-25 2007-05-31 Foxconn Technology Co., Ltd. Heat dissipation device
US20070131409A1 (en) * 2005-12-14 2007-06-14 Fujitsu Limited Heat radiating apparatus and electronic apparatus
US20080049395A1 (en) * 2006-07-11 2008-02-28 Guillaume Peter Ventilation device ventilating an electronic module
US20080174956A1 (en) * 2007-01-23 2008-07-24 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an extra strength of assembled relationship
US20080174958A1 (en) * 2007-01-23 2008-07-24 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an engaging structure
US20090040718A1 (en) * 2007-08-09 2009-02-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly having a fan duct
US20090151909A1 (en) * 2007-12-13 2009-06-18 Asia Vital Components Co., Ltd. Heat-Dissipating Unit
US20100039772A1 (en) * 2003-10-30 2010-02-18 Fujitsu Limited Cooling device and electronic device
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20120099270A1 (en) * 2010-10-25 2012-04-26 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus and electronic device with heat dissipating apparatus
US20120300401A1 (en) * 2011-05-27 2012-11-29 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation device
US20130213618A1 (en) * 2008-10-30 2013-08-22 General Electric Company Synthetic jet embedded heat sink
US8767400B2 (en) 2011-06-27 2014-07-01 The Bergquist Torrington Company Cooling module with parallel blowers
US9253928B2 (en) 2011-06-27 2016-02-02 Henkel IP & Holding GmbH Cooling module with parallel blowers
TWI671869B (en) * 2018-08-02 2019-09-11 奇鋐科技股份有限公司 Heat dissipation structure of electronic device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
US20050167083A1 (en) * 2004-01-29 2005-08-04 Belady Christian L. Heat sink including redundant fan sinks
EP1589401A1 (en) * 2004-04-19 2005-10-26 Shuttle Inc. Air circulating structure for heat dissipation device
US20060089847A1 (en) * 2004-05-21 2006-04-27 Dale-Thiebout Tracy E System and method for providing automated real estate transaction management with centralized transaction information storage
US7120019B2 (en) * 2004-08-18 2006-10-10 International Business Machines Corporation Coaxial air ducts and fans for cooling and electronic component
EP1701382A1 (en) * 2005-03-09 2006-09-13 ITer Networking Corporation Chip-based CPU cooler and cooling method thereof
CN101155501B (en) * 2006-09-27 2011-11-09 鸿富锦精密工业(深圳)有限公司 Heat radiator
US20080113607A1 (en) * 2006-09-28 2008-05-15 Inventec Corporation Wind-guiding cover
CN101222837A (en) * 2007-01-11 2008-07-16 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Heat radiating device
CN101452328A (en) * 2007-12-03 2009-06-10 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Computer radiator
CN101730451B (en) * 2008-10-24 2013-02-20 富准精密工业(深圳)有限公司 Heat radiation device
CN101909415A (en) * 2009-06-02 2010-12-08 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Heat dissipation device and fixing frame thereof
TWI506206B (en) * 2010-05-14 2015-11-01 Foxconn Tech Co Ltd Heat dissipation device and airflow generator thereof
US9417017B2 (en) * 2012-03-20 2016-08-16 Thermal Corp. Heat transfer apparatus and method
US8922990B1 (en) * 2012-04-03 2014-12-30 Google Inc. Active cooling fin pack
US20130284408A1 (en) * 2012-04-30 2013-10-31 Spx Corporation Reservoir Cooling Apparaturs and Method
US10455202B2 (en) * 2016-05-13 2019-10-22 Lenovo (Beijing) Co., Ltd. Heat dissipating apparatus and electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141211A (en) * 1998-06-29 2000-10-31 Hewlett-Packard Company Heat sink conduction between disk drive carrier and information storage enclosure
US6181556B1 (en) * 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
US6259600B1 (en) * 1999-06-17 2001-07-10 Api Networks, Inc. Apparatus and method for cooling a processor circuit board
US6282090B1 (en) * 1997-11-05 2001-08-28 Micron Electronics, Inc. Apparatus for cooling central processing units in personal computers
US6304445B1 (en) * 2000-04-27 2001-10-16 Sun Microsystems, Inc. Fan heat sink and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282090B1 (en) * 1997-11-05 2001-08-28 Micron Electronics, Inc. Apparatus for cooling central processing units in personal computers
US6141211A (en) * 1998-06-29 2000-10-31 Hewlett-Packard Company Heat sink conduction between disk drive carrier and information storage enclosure
US6259600B1 (en) * 1999-06-17 2001-07-10 Api Networks, Inc. Apparatus and method for cooling a processor circuit board
US6181556B1 (en) * 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
US6304445B1 (en) * 2000-04-27 2001-10-16 Sun Microsystems, Inc. Fan heat sink and method

Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020180285A1 (en) * 2001-05-30 2002-12-05 Machiroutu Sridhar V. Fan assembly for a computer
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
US6556442B2 (en) * 2001-06-19 2003-04-29 Global Win Technology Co. Ltd. CPU cooling structure
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US20030188847A1 (en) * 2002-01-30 2003-10-09 Cheng-Tien Lai Fan duct assembly
US6736196B2 (en) * 2002-01-30 2004-05-18 Hon Hai Precision Ind. Co., Ltd. Fan duct assembly
US6717814B2 (en) * 2002-06-06 2004-04-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20040001315A1 (en) * 2002-06-28 2004-01-01 Yue-June Li Heat dissipation assembly
US6768641B2 (en) * 2002-06-28 2004-07-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20040008488A1 (en) * 2002-07-10 2004-01-15 Cheng-Tien Lai Fan holder for heat sink
US6788536B2 (en) * 2002-07-10 2004-09-07 Hon Hai Precision Ind. Co., Ltd. Fan holder for heat sink
US20040066623A1 (en) * 2002-10-07 2004-04-08 Cheng-Kuo Lu Structure of a heat dissipation device for computers
US6778392B2 (en) * 2002-12-13 2004-08-17 Arima Computer Corporation Heat dissipation device for electronic component
US20040120115A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating assembly
US6920045B2 (en) * 2002-12-24 2005-07-19 Delta Electronics, Inc. Heat-dissipating assembly
US20040228728A1 (en) * 2003-03-20 2004-11-18 Yi-Lung Kuo Fan for cooling a computer
US7004726B2 (en) * 2003-03-20 2006-02-28 Shuttle, Inc. Fan for cooling a computer
US20040212962A1 (en) * 2003-04-11 2004-10-28 Via Technologies, Inc. Lateral airflow fan-sink for electronic devices
US20050047086A1 (en) * 2003-08-27 2005-03-03 Elias Gedamu Heat dissipation apparatus and method
US20050087329A1 (en) * 2003-10-03 2005-04-28 Jie Zhang Heat dissipation module with a pair of fans
DE112004002071B4 (en) * 2003-10-30 2012-08-30 Fujitsu Ltd. Electronic component with cooling device
US20100039772A1 (en) * 2003-10-30 2010-02-18 Fujitsu Limited Cooling device and electronic device
US20050199369A1 (en) * 2004-03-15 2005-09-15 Chen Shih H. Dual centrifugal fan structure and heat dissipation device having the fan structure
US20060012955A1 (en) * 2004-07-19 2006-01-19 Wade Vinson System and method for cooling electronic devices
US7405932B2 (en) 2004-07-19 2008-07-29 Hewlett-Packard Development Company, L.P. System and method for cooling electronic devices
US20060102319A1 (en) * 2004-11-16 2006-05-18 Asia Vital Component Co., Ltd. Heat dissipation enhancing device
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
US7447020B2 (en) * 2005-08-12 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
US20070035926A1 (en) * 2005-08-12 2007-02-15 Wan-Lin Xia Heat sink assembly
US7277280B2 (en) * 2005-11-25 2007-10-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a dual-fan arrangement
US20070121289A1 (en) * 2005-11-25 2007-05-31 Foxconn Technology Co., Ltd. Heat dissipation device
US20070131409A1 (en) * 2005-12-14 2007-06-14 Fujitsu Limited Heat radiating apparatus and electronic apparatus
JP4554503B2 (en) * 2005-12-14 2010-09-29 富士通株式会社 Heat dissipation device and electronic device
JP2007165602A (en) * 2005-12-14 2007-06-28 Fujitsu Ltd Heat radiating apparatus, and electronic appliance
US7630201B2 (en) * 2005-12-14 2009-12-08 Fujitsu Limited Heat radiating apparatus and electronic apparatus
US7995340B2 (en) * 2006-07-11 2011-08-09 General Electric Company Ventilation device ventilating an electronic module
US20080049395A1 (en) * 2006-07-11 2008-02-28 Guillaume Peter Ventilation device ventilating an electronic module
US7515414B2 (en) 2007-01-23 2009-04-07 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an engaging structure
US7963317B2 (en) 2007-01-23 2011-06-21 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an extra strength of assembled relationship
US20080174956A1 (en) * 2007-01-23 2008-07-24 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an extra strength of assembled relationship
US20080174958A1 (en) * 2007-01-23 2008-07-24 Sunonwealth Electric Machine Industry Co., Ltd. Mini-sized heat-dissipating module having an engaging structure
US7495913B1 (en) * 2007-08-09 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly having a fan duct
US20090040718A1 (en) * 2007-08-09 2009-02-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly having a fan duct
US20090151909A1 (en) * 2007-12-13 2009-06-18 Asia Vital Components Co., Ltd. Heat-Dissipating Unit
US20130213618A1 (en) * 2008-10-30 2013-08-22 General Electric Company Synthetic jet embedded heat sink
US9651318B2 (en) * 2008-10-30 2017-05-16 General Electric Company Synthetic jet embedded heat sink
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US8587942B2 (en) * 2010-10-25 2013-11-19 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus and electronic device with heat dissipating apparatus
US20120099270A1 (en) * 2010-10-25 2012-04-26 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus and electronic device with heat dissipating apparatus
US20120300401A1 (en) * 2011-05-27 2012-11-29 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation device
US8767400B2 (en) 2011-06-27 2014-07-01 The Bergquist Torrington Company Cooling module with parallel blowers
US9253928B2 (en) 2011-06-27 2016-02-02 Henkel IP & Holding GmbH Cooling module with parallel blowers
TWI671869B (en) * 2018-08-02 2019-09-11 奇鋐科技股份有限公司 Heat dissipation structure of electronic device

Also Published As

Publication number Publication date
US20020167798A1 (en) 2002-11-14

Similar Documents

Publication Publication Date Title
US5285350A (en) Heat sink plate for multiple semi-conductors
US6269864B1 (en) Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US6538888B1 (en) Radial base heatsink
US6047765A (en) Cross flow cooling device for semiconductor components
US7382047B2 (en) Heat dissipation device
US6625021B1 (en) Heat sink with heat pipes and fan
US7363963B2 (en) Heat dissipation device
US6909608B2 (en) Heat sink assembly with heat pipe
US7403388B2 (en) Cooling system for server and server having the same
US6288895B1 (en) Apparatus for cooling electronic components within a computer system enclosure
US6328097B1 (en) Integrated heat dissipation apparatus
US5781411A (en) Heat sink utilizing the chimney effect
US7120018B2 (en) Mother board with a ventilation-enhancing member
US6400568B1 (en) Method and apparatus for cooling electronic components
US7215548B1 (en) Heat dissipating device having a fin also functioning as a fan duct
US7249626B2 (en) Heat dissipation device
US20030019610A1 (en) Rapidly self - heat-conductive heat - dissipating module
US20060034055A1 (en) Compact cooling device
US5828549A (en) Combination heat sink and air duct for cooling processors with a series air flow
US5597035A (en) For use with a heatsink a shroud having a varying cross-sectional area
US6691768B2 (en) Heatsink design for uniform heat dissipation
US6826047B1 (en) Cool air-supplying device for a computer system
US6181556B1 (en) Thermally-coupled heat dissipation apparatus for electronic devices
US20030056941A1 (en) Double heat exchange module for a portable computer
US7025125B2 (en) Heat dissipating device with heat pipe

Legal Events

Date Code Title Description
AS Assignment

Owner name: DELTA ELECTRONICS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:JUI-YUAN, HSU;REEL/FRAME:011809/0770

Effective date: 20010508

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Expired due to failure to pay maintenance fee

Effective date: 20141217