TWI671869B - Heat dissipation structure of electronic device - Google Patents

Heat dissipation structure of electronic device

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Publication number
TWI671869B
TWI671869B TW107126917A TW107126917A TWI671869B TW I671869 B TWI671869 B TW I671869B TW 107126917 A TW107126917 A TW 107126917A TW 107126917 A TW107126917 A TW 107126917A TW I671869 B TWI671869 B TW I671869B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
body
heat pipe
heat
dissipation module
Prior art date
Application number
TW107126917A
Other languages
Chinese (zh)
Inventor
林勝煌
朱彥霖
Original Assignee
奇鋐科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奇鋐科技股份有限公司 filed Critical 奇鋐科技股份有限公司
Priority to TW107126917A priority Critical patent/TWI671869B/en
Application granted granted Critical
Publication of TWI671869B publication Critical patent/TWI671869B/en

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Abstract

The heat dissipation structure of the electronic device includes at least one body having a first heat pipe group and a second heat pipe group, the first heat pipe group including at least one first heat pipe system perpendicular to the body and a first heat dissipation module and a first fan The second heat pipe group includes at least one second heat pipe having a first portion perpendicular to the body and the first portion extending a second portion parallel to the body, and the second portion is provided with a second heat dissipation module and a second fan; The first fan generates a first airflow in a first direction through the first heat dissipation module and the second heat dissipation module, and the second fan generates a second airflow in a second direction through the second heat dissipation module. .

Description

Electronic device heat dissipation structure

The present invention relates to the field of heat dissipation, and more particularly to an electronic device heat dissipation structure.

When the computer is in operation, many internal components generate a lot of heat, so a good cooling system is a key factor in determining the performance and reliability of the computer. Among all the components that generate heat, the heat dissipation problem of the CPU (CPU) and the graphics processing unit (GPU) with the highest workload is the most difficult. In particular, the current picture of various types of computer games is becoming more and more delicate, and the functions of computer-aided drawing software are becoming more and more powerful. Such softwares often cause the central processing unit and the graphics chip processor to be under high load during operation, and also cause a large number of The heat generated, if not effectively dissipated, can lead to a decline in the performance of the central processing unit or graphics processor, and in severe cases, it is more likely to cause damage to the central processing unit or graphics processor or a significant reduction in service life.

Therefore, how to provide a heat dissipating structure with high heat dissipation efficiency is the direction in which the inventors of the present invention and related manufacturers engaged in the industry desire to study and improve.

It is an object of the present invention to provide an electronic device heat dissipation structure having at least two gas streams flowing in different directions to assist in heat dissipation.

Another object of the present invention is to provide an electronic device heat dissipation structure in which at least two airflows in different directions collide with each other to help dissipate heat.

Another object of the present invention is to provide an electronic device heat dissipation structure having a body having vertical and L-shaped heat pipes arranged in rows or columns in a staggered and/or parallel arrangement.

In order to achieve the above object, the present invention provides an electronic device heat dissipation structure, comprising: a body having a first heat pipe group and a second heat pipe group, wherein the first heat pipe group includes at least one first heat pipe system perpendicular to the body and a first heat dissipation module is disposed, the second heat pipe group includes at least one second heat pipe having a first portion perpendicular to the body and the first portion is bent to extend a second portion parallel to the body, and the second portion is provided with a second portion a heat dissipation module; a first fan corresponding to the first heat dissipation module and driving a first airflow to flow along the first direction; and a second fan corresponding to the second heat dissipation module and driving a second airflow along Flowing in a second direction.

The first airflow flows through the first heat dissipation module and the second heat dissipation module; the second airflow flows through the second heat dissipation module and impinges on the first airflow flowing through the second heat dissipation module.

The system is a temperature equalizing plate or a flat heat pipe, and has a body chamber. The body cavity is provided with a body capillary structure and a working liquid. The body is provided with a plurality of through holes communicating with the body cavity.

The first heat pipe has a first closed end and a first open end, and a first heat pipe chamber is located between the first closed end and the first open end, the first open end is transparent through the body a hole is connected to the body, and the first heat pipe chamber communicates with the body cavity through the first open end: the at least one second heat pipe has a second closed end and a second open end and a second heat pipe cavity The chamber is located between the second closed end and the second open end, the second open end is connected to the body through a through hole of the body, and the second heat pipe chamber communicates with the body cavity through the second open end room.

A first heat pipe capillary structure is disposed in the first heat pipe chamber to contact the body capillary structure; and a second heat pipe capillary structure is disposed in the second heat pipe cavity to contact the body capillary structure.

The first heat dissipation module includes a plurality of stacked first heat dissipation plates, and the first heat dissipation plates are spaced apart, and a first air flow channel is disposed between the adjacent first heat dissipation plates; the second heat dissipation module includes a plurality of Stacking The second heat dissipation plate is disposed at intervals, and a second air flow path is disposed between the adjacent second heat dissipation plates.

The first heat dissipation plate and the second heat dissipation plate are fins or a temperature equalization plate or a heat sink.

The second portion of the at least one second heat pipe is spaced above the body to face the body.

The first heat pipe group includes at least one third heat pipe having a third portion perpendicular to the body and the third portion being bent to extend a fourth portion parallel to the body and contacting the first heat dissipation module.

The second heat pipe group includes at least one fourth heat pipe system perpendicular to the body and contacting the second heat dissipation module.

The second heat pipe group includes at least one fifth heat pipe and at least one sixth heat pipe system perpendicular to the body, and the fifth heat pipe is provided with a third heat dissipation module, and the sixth heat pipe is provided with a fourth heat dissipation module; The fan is connected to the third heat dissipation module and drives a third airflow to flow from the third heat dissipation module toward the second heat dissipation module; a fourth fan is connected to the fourth heat dissipation module and drives a fourth airflow from the The fourth heat dissipation module flows toward the second heat dissipation module.

The first direction of the first airflow is parallel to or inclined toward the body; the second direction of the second airflow is perpendicular to the body.

10‧‧‧ Ontology

101‧‧‧Upper casing

1011‧‧‧ upper surface

102‧‧‧ Lower case

1021‧‧‧ lower surface

103‧‧‧ body chamber

1031‧‧‧ Body capillary structure

21‧‧‧First fan

22‧‧‧second fan

11‧‧‧First heat pipe group

111‧‧‧First heat pipe

1111‧‧‧ first closed end

1112‧‧‧First open end

11121‧‧‧Connected holes

1113‧‧‧First heat pipe chamber

1131‧‧‧First heat pipe capillary structure

12‧‧‧Second heat pipe group

121‧‧‧second heat pipe

1211‧‧‧Part 1

1212‧‧‧Part II

1214‧‧‧Second closed end

1215‧‧‧ second open end

12151‧‧‧Connected holes

1216‧‧‧Second heat pipe chamber

1231‧‧‧Second heat pipe capillary structure

13, 13A‧‧‧First Thermal Module

131, 131A‧‧‧ first heat sink

132, 132A‧‧‧ the first airflow path

133‧‧‧through hole

134A‧‧‧ slots

135A‧‧‧through hole

14, 14A‧‧‧ second thermal module

141, 141A‧‧‧second heat sink

142, 142A‧‧‧ second air passage

143‧‧‧through hole

143A‧‧‧through hole

144A‧‧‧Slot

21‧‧‧First fan

22‧‧‧second fan

211, 221, 231, 241‧‧" transfer boxes

F1‧‧‧First airflow

F2‧‧‧second airflow

211‧‧‧ Third heat pipe

2111‧‧‧Part III

2112‧‧‧Part IV

212‧‧‧ fourth heat pipe

35‧‧‧ fifth heat pipe

36‧‧‧ sixth heat pipe

15‧‧‧ Third Thermal Module

16‧‧‧The fourth thermal module

23‧‧‧ Third fan

24‧‧‧Fourth fan

FA‧‧‧Multi-directional fluid impact field

The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are described in detail by reference to the specific embodiments herein,

1 is a perspective exploded view of the body of the present invention; FIG. 2 is a schematic perspective view of the body of the present invention; FIG. 3 is a schematic diagram of a three-dimensional combination of the body and the first fan and the second fan; The schematic diagram of the operation of the present invention; FIG. 4B is a schematic diagram of another alternative embodiment of the present invention; 5A is a schematic view of a body 5A-5A section line; FIG. 5B is an enlarged schematic view of FIG. 5A; FIG. 6A is a schematic view of a body 6A-6A section line; FIG. 6B is a 6 is a schematic view of a second embodiment of the present invention; FIG. 8 is a schematic view of a third embodiment of the present invention; and FIG. 9 is a schematic view of a fourth embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

1 is a perspective exploded view of the body of the present invention; FIG. 2 is a schematic perspective view of the body of the present invention; FIG. 3 is a schematic diagram of a three-dimensional combination of the body and the first fan and the second fan; FIG. 4B is a schematic diagram of another alternative embodiment of the present invention; FIG. 5A is a schematic view of a body 5A-5A of the present invention; FIG. 5B is an enlarged schematic view of FIG. 5A; 6A is a schematic view of a section line of the body 6A-6A of the present invention; and FIG. 6B is an enlarged schematic view of FIG. 6A. As shown in the figure, the heat dissipation structure of the electronic device of the present invention includes a body 10 and a first fan 21 and a second fan 22. The body 10 has a first heat pipe group 11 and a second heat pipe group 12, and the body 10 For example, it is a temperature equalizing plate or a flat heat pipe having an upper casing 101 and a lower casing 102, and a body chamber 103 is defined between the upper casing 101 and the lower casing 102, and the lower surface of the lower casing 102 1021 is a heat contact surface contacting at least one heat source, and an upper surface 1011 of the upper casing 101 is a heat dissipation surface. The body chamber 103 includes a body capillary structure 1031 and a working liquid or a plurality of support columns are provided to support the upper casing 101 and the lower casing 102 (as shown in Figures 5A, 5B and 6A). Further, above the body 10 (for example, above the upper casing 101), a multi-directional fluid impact field FA is defined to provide fluid flow by the first fan 21 and the second fan 22.

The first heat pipe group 11 and the second heat pipe group 12 are disposed on the upper casing 101 of the body 10, that is, one ends of the first heat pipe group 11 and the second heat pipe group 12 (such as an open end to be described later) and The upper casing 101 of the body 10 is connected, but is not limited thereto, and one end (open end) of the first heat pipe group 11 and the second heat pipe group 12 may be connected to the side of the body 10. The first heat pipe group 11 includes at least one first heat pipe 111 (three heat pipes are shown) perpendicular to the body 10. The second heat pipe group 12 includes at least one second heat pipe 121 (three heat pipes are shown), and each of the second heat pipes 121 has a first portion 1211 perpendicular to the body 10, and the first portion 1211 is bent to extend a second portion. 1212 is parallel to the body 10, and the second portion 1222 is located above the body 10 and faces the body 10 at intervals. The first heat pipe group 11 and the second heat pipe group 12 are, for example, a circular pipe or a flat heat pipe or a D-type heat pipe or a flat plate heat pipe.

Furthermore, as shown in FIGS. 5A, 5B and 6A, 6B, the first heat pipe 111 of the first heat pipe group 11 has a first closed end 1111 and a first open end 1112 and a first heat pipe chamber 1113. Located between the first closed end 1111 and the first open end 1112, the first open end 1112 extends through the upper casing 101 of the body 10 and is provided with a communication hole 11121 communicating with the body cavity 103. The first heat pipe chamber 1113 communicates with the body chamber 103 through the first open end 1112. A first heat pipe capillary structure 1131 is disposed in the first heat pipe chamber 1113 to contact the body capillary structure 1031. The second heat pipe 121 of the second heat pipe group 12 has a second closed end 1214 and a second open end 1215 and a second heat pipe chamber 1216 between the second closed end 1214 and the second open end 1215. The second open end 1215 extends through the upper casing 101 of the body 10 and is provided with a communication hole 12151 communicating with the body cavity 103. The second heat pipe chamber 1216 communicates with the body through the second open end 1215. Body chamber 103. A second heat pipe capillary structure 1231 is disposed in the second heat pipe chamber 1216 to contact the body capillary structure 1031. In this way, the working fluid can be circulated in the body chamber 103 and the first heat pipe chamber 1113 and the second heat pipe chamber 1216 to transfer heat to the first heat pipe group 11 and the second heat pipe group 12 and The upper surface 1011 of the upper casing 101 of the body 10 dissipates heat.

As shown in FIG. 1 to FIG. 4A and FIG. 4B , a first heat dissipation module 13 is sleeved with the first heat pipe 111 of the first heat pipe group 11 , and a second heat dissipation module 14 is sleeved with the second heat pipe group 12 . The second heat pipe 121 and the multi-directional fluid above the body 10 collide with the field. The first heat dissipation module 13 includes a plurality of stacked first heat dissipation plates 131. The first heat dissipation plates 131 are spaced apart and have two adjacent The first heat dissipation plate 131 has a first air flow path 132 parallel to the body 10 or inclined toward the body 10 and corresponding to the second heat dissipation module 14 , and each of the first heat dissipation plates 131 defines at least one through hole 133 to be sleeved. The first heat pipe 111; the second heat dissipation module 14 includes a plurality of stacked second heat dissipation plates 141. The second heat dissipation plates 141 are spaced apart, and a second air flow between the two adjacent second heat dissipation plates 141 The 142 is perpendicular to the body 10 and corresponds to the first heat dissipation module 13 , and each of the second heat dissipation plates 141 defines at least one through hole 143 to sleeve the second portion 1212 of the second heat pipe 121 . Furthermore, the first heat dissipation plate 131 of the first heat dissipation module 13 and the second heat dissipation plate 141 of the second heat dissipation module 14 are, for example, heat sinks or heat dissipation fins or temperature equalization plates. In the case of a temperature equalizing plate, a chamber is defined therein to accommodate a working fluid in the chamber for vapor-liquid circulation operation.

In addition, a first fan 21 is directly or indirectly connected to the first heat dissipation module 13, and a second fan 22 is directly or indirectly connected to the second heat dissipation module 14, which is shown in the figure. The second fan 22 (for example, an axial fan or a centrifugal fan or a cross-flow fan) can be connected to the first heat dissipation module 13 and the second heat dissipation module 14 directly or through a transfer frame 211 and 221, respectively. As shown in FIG. 4A, since the first airflow path 132 is parallel to the body 10, when the first fan 21 operates to generate a first airflow F1 through the first airflow path 132, the first airflow F1 is along A first direction (ie, a direction parallel to the body 10, and the first airflow F1 is parallel to the body 10 in FIG. 4A) flows from the first heat dissipation module 13 to the second heat dissipation module 14. However, in another alternative embodiment, as shown in FIG. 4B, since the first airflow path 132 is inclined toward the body 10, when the first airflow F1 passes through the first airflow path 132, the first airflow F1 is along a The first direction (ie, the direction in which the body 10 is tilted, in Figure 4B) The first airflow F1 is inclined to flow from the first heat dissipation module 13 to the second heat dissipation module 14 .

Furthermore, when the second fan 22 operates, a second airflow F2 flows along a second direction (ie, a direction perpendicular to the body 10); and the second airflow F2 of the second fan 22 flows through the second heat dissipation. The module 14 and the first airflow F1 flowing to the second heat dissipation module 14 to heat the first heat module 13 and the second heat dissipation module 14 by the first airflow F1 and the second airflow F2. Convection heat dissipation.

With the above implementation, the present invention provides a first airflow F1 and a second airflow F2 flowing through the first heat dissipation module 13 and the second heat dissipation module 14 in different directions to generate heat convection, and the first airflow F1 and the The multi-directional fluid flow of the second airflow F2 above the body 10 strikes the field FA to create a fluid impact, thereby helping the body 10 to dissipate heat.

As shown in FIG. 7, in another alternative implementation, the first heat pipe group 11 includes at least one third heat pipe 211 having a third portion 2111 perpendicular to the body 10 and the third portion 2111 bent to extend a fourth portion 2112. The body 10 is parallel to and contacts the first heat dissipation module 13A. The third heat pipe 211 is adjacent to the first heat pipe 111, and the first heat pipe 111 and the third heat pipe 211 are arranged in a row or column manner and/or parallel and/or height difference arrangement according to design requirements. The specific implementation of the third heat pipe 211 is the same as that of the aforementioned second heat pipe 121. In order to cooperate with the first heat pipe 111 and the third heat pipe 211, the first heat module 13A is provided with a through hole 135A for the fourth portion 2112 of the third heat pipe 211 to be inserted through the socket, and the slot 134A is opened correspondingly. The first heat pipe 111. The first heat dissipation module 13A includes a plurality of stacked first heat dissipation plates 131A. The first heat dissipation plates 131A are spaced apart from each other, and a first air flow channel 132A is disposed between the adjacent first heat dissipation plates 131A.

As shown in FIG. 8, in another alternative embodiment, the second heat pipe group 12 includes at least one fourth heat pipe 212 that is perpendicular to the body 10 and contacts the second heat dissipation module 14A. The fourth heat pipes 212 are adjacent to the second heat pipe 212. The second heat pipe 121, and the second heat pipe 121 and the fourth heat pipe 212 are arranged in a row or column staggered and/or parallel and/or height difference according to design requirements (as shown in FIGS. 8 and 9). . The fourth heat The tube 212 is embodied in the same manner as the first heat pipe 111 described above. In order to cooperate with the second heat pipe 121 and the fourth heat pipe 212, the second heat dissipation module 14A is provided with a through hole 143A for the second portion 1212 of the second heat pipe 121 to be inserted through the socket, and the slot 144A is correspondingly opened. The fourth heat pipe 212. The second heat dissipation module 14A includes a plurality of second heat dissipation plates 141A. The second heat dissipation plates 141A are spaced apart from each other, and a second air flow path 142A is disposed between the two adjacent second heat dissipation plates 141A.

As shown in FIG. 9, in another alternative embodiment, the second heat pipe group 12 includes at least one fifth heat pipe 35 and at least one sixth heat pipe 36 is perpendicular to the body 10, and the fifth heat pipe 35 is represented in the figure. The sixth heat pipe 36 and the sixth heat pipe 36 are respectively three, and the specific implementation thereof is the same as that of the first heat pipe 111 described above. A third heat dissipation module 15 and a fourth heat dissipation module 16 respectively sleeve the fifth heat pipe 35 and the sixth heat pipe 36. The third heat dissipation module 15 and the fourth heat dissipation module 16 have the same structure as the first heat dissipation module 13 described above. A third fan 23 is directly or indirectly connected to the third heat dissipation module 15, and a fourth fan 24 is directly or indirectly connected to the fourth heat dissipation module 16, and the third fan 23 and the fourth are shown in the figure. The fan 24 is, for example, an axial fan, and is connected to the third heat dissipation module 15 and the fourth heat dissipation module 16 by a switch frame 231 and 241, respectively. The third fan 23 generates a third airflow flowing from the third heat dissipation module 15 to the second heat dissipation module 14; the fourth fan 24 generates a fourth airflow flowing from the fourth heat dissipation module 16 to the In the second heat dissipation module 14, the first, second, third, and fourth airflows in the multi-directional fluid above the body 10 collide with the field FA to generate a fluid impact, thereby helping the body 10 to dissipate heat.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

Claims (12)

  1. An electronic device heat dissipation structure includes: a body having a first heat pipe group and a second heat pipe group, wherein the first heat pipe group includes at least one first heat pipe system perpendicular to the body and a first heat dissipation module is disposed The second heat pipe group includes at least one second heat pipe having a first portion perpendicular to the body and the first portion is bent to extend a second portion parallel to the body, and the second portion is provided with a second heat dissipation module; a first fan, Connecting the first heat dissipation module and driving a first airflow to flow in a first direction; a second fan connecting the second heat dissipation module and driving a second airflow to flow in a second direction; A multi-directional fluid impact field is defined above the body.
  2. The electronic device heat dissipation structure of claim 1, wherein the first airflow flows from the first heat dissipation module to the second heat dissipation module; the second airflow flows through the second heat dissipation module and impinges on the flow a first air flow to the second heat dissipation module.
  3. The heat dissipation structure of the electronic device according to claim 1, wherein the system is a temperature equalizing plate or a flat heat pipe, and has a body cavity, wherein the body cavity is provided with a body capillary structure and a working liquid.
  4. The electronic device heat dissipation structure of claim 3, wherein the at least one first heat pipe has a first closed end and a first open end, and a first heat pipe chamber is located at the first closed end and the first open end Between the ends, the first open end penetrates the body and communicates with the body chamber, the first heat pipe chamber communicates with the body cavity through the first open end; the at least one second heat pipe has a second closed end And a second open end and a second heat pipe chamber are located between the second closed end and the second open end, the second open end extends through the body and communicates with the body cavity, the second heat pipe cavity The chamber communicates with the body chamber through the second open end.
  5. The heat dissipation structure of the electronic device of claim 4, wherein the first heat pipe chamber is provided with a first heat pipe capillary structure contacting the body capillary structure, and the first open end is provided with a communication hole communicating with the body cavity; A second heat pipe capillary structure is disposed in the second heat pipe chamber to contact the body capillary structure, and the second open end is provided with a communication hole communicating with the body cavity.
  6. The heat dissipation structure of the electronic device of claim 1, wherein the first heat dissipation module comprises a plurality of stacked first heat dissipation plates, wherein the first heat dissipation plates are spaced apart, and one of the adjacent first heat dissipation plates has a The second heat dissipation module includes a plurality of stacked second heat dissipation plates, and the second heat dissipation plates are spaced apart from each other, and a second air flow path is disposed between the adjacent second heat dissipation plates.
  7. The heat dissipation structure of the electronic device of claim 6, wherein the first heat dissipation plate and the second heat dissipation plate are fins or a temperature equalization plate or a heat sink.
  8. The electronic device heat dissipation structure of claim 1, wherein the second portion of the at least one second heat pipe is spaced above the body to face the body.
  9. The electronic device heat dissipation structure of claim 1, wherein the first heat pipe group comprises at least one third heat pipe having a third portion perpendicular to the body and the third portion being bent to extend a fourth portion parallel to the body and contacting the body The first thermal module.
  10. The electronic device heat dissipation structure of claim 1, wherein the second heat pipe group comprises at least one fourth heat pipe system perpendicular to the body and contacting the second heat dissipation module.
  11. The electronic device heat dissipation structure of claim 1, wherein the second heat pipe group comprises at least one fifth heat pipe and at least one sixth heat pipe system is perpendicular to the body, and the fifth heat pipe is provided with a third heat dissipation module, the first heat pipe The sixth heat pipe is provided with a fourth heat dissipation module; a third fan is connected to the third heat dissipation module and drives a third airflow to flow from the third heat dissipation module toward the second heat dissipation module; a fourth fan is connected to the The fourth heat dissipation module drives a fourth airflow to flow from the fourth heat dissipation module toward the second heat dissipation module.
  12. The electronic device heat dissipation structure of claim 1 or 2, wherein the first direction of the first airflow is parallel to or inclined toward the body; and the second direction of the second airflow is perpendicular to the body.
TW107126917A 2018-08-02 2018-08-02 Heat dissipation structure of electronic device TWI671869B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6496368B2 (en) * 2001-05-14 2002-12-17 Delta Electronics, Inc. Heat-dissipating assembly having heat sink and dual hot-swapped fans
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
CN100570865C (en) * 2007-02-28 2009-12-16 长春藤控股有限公司 Heat radiating device
CN203276154U (en) * 2013-05-27 2013-11-06 汪凤兰 Efficient heat dissipation device of computer CPU
TW201732214A (en) * 2016-03-01 2017-09-16 雙鴻科技股份有限公司 A water cooling device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6496368B2 (en) * 2001-05-14 2002-12-17 Delta Electronics, Inc. Heat-dissipating assembly having heat sink and dual hot-swapped fans
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
CN100570865C (en) * 2007-02-28 2009-12-16 长春藤控股有限公司 Heat radiating device
CN203276154U (en) * 2013-05-27 2013-11-06 汪凤兰 Efficient heat dissipation device of computer CPU
TW201732214A (en) * 2016-03-01 2017-09-16 雙鴻科技股份有限公司 A water cooling device

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