TW202008536A - Heat dissipation structure of electronic device - Google Patents

Abstract

A heat dissipation structure of electronic device includes a main body having a first heat pipe set and a second heat pipe set. The first heat pipe set includes at least one first heat pipe normal to the main body. A first thermal module and a first fan are disposed on the first heat pipe. The second heat pipe set includes at least one second heat pipe having a first section normal to the main body and a second section extending from the first section in parallel to the main body. A second thermal module and a second fan are disposed on the second section. The first fan creates a first airflow flowing through the first and second thermal modules in a first direction. The second fan creates a second airflow flowing through the second thermal module in a second direction.

Description

Heat dissipation structure of electronic device

The invention relates to the field of heat dissipation, in particular to a heat dissipation structure of an electronic device.

When the computer is operating, many internal components generate a lot of heat energy, so a good heat dissipation system is a key factor in determining the computer's operating performance and reliability. Among all the heat-generating components, the heat dissipation problems of the central processing unit (CPU) and graphics chip processor (GPU), which have the highest workload, are the most difficult. In particular, the current graphics of various computer games are getting more and more delicate, and the functions of computer-aided drawing software are becoming more and more powerful. When these types of software are running, they often put the central processor and the graphics chip processor under high load, and they will also cause a lot of If the heat energy cannot be dissipated effectively, the performance of the central processing unit or graphics chip processor will be reduced. In severe cases, the central processing unit or graphics chip processor may be damaged or the service life will be greatly reduced. Therefore, how to provide a heat dissipation structure with high heat dissipation efficiency is the place where the inventors of the present case and related manufacturers engaged in this industry are eager to study the direction of improvement.

An object of the present invention is to provide a heat dissipation structure for an electronic device having at least two airflows flowing in different directions to help heat dissipation. Another object of the present invention is to provide a heat dissipation structure for an electronic device in which at least two air flows in different directions collide with each other to help dissipate heat. Another object of the present invention is to provide an electronic device heat dissipation structure with vertical and L-shaped heat pipes arranged in rows and columns in a staggered and/or parallel arrangement. To achieve the above objective, the present invention provides a heat dissipation structure for an electronic device, which includes: a body having a first heat pipe group and a second heat pipe group, the first heat pipe group including at least one first heat pipe system perpendicular to the body and A first heat dissipation module is provided, the second heat pipe set includes at least one second heat pipe having a first portion perpendicular to the body and the first portion bent to extend a second portion parallel to the body, and the second portion is provided with a second Cooling module; a first fan corresponding to the first cooling module and driving a first air flow in the first direction; a second fan corresponding to the second cooling module and driving a second air flow Flow in a second direction. The aforementioned first airflow flows through the first heat dissipation module and the second heat dissipation module; the second airflow flows through the second heat dissipation module and strikes the first airflow flowing through the second heat dissipation module. The foregoing system is a temperature-equalizing plate or a flat plate heat pipe, and has a body cavity. The body cavity is provided with a body capillary structure and a working liquid. The body is provided with a plurality of through holes to communicate with the body cavity. The aforementioned first heat pipe has a first closed end and a first open end and a first heat pipe chamber is located between the first closed end and the first open end, the first open end penetrates through the body The hole is connected to the body, and the first heat pipe chamber communicates with the body chamber through the first open end: the at least one second heat pipe has a second closed end and a second open end and a second heat pipe cavity The chamber is located between the second closed end and the second open end, the second open end is connected to the body through the through hole of the body, and the second heat pipe chamber communicates with the body cavity through the second open end room. The first heat pipe cavity is provided with a first heat pipe capillary structure contacting the body capillary structure; the second heat pipe chamber is provided with a second heat pipe capillary structure contacting the body capillary structure. The foregoing first heat dissipation module includes a plurality of stacked first heat dissipation plates, the first heat dissipation plates are spaced apart, and there is a first air flow path between two adjacent first heat dissipation plates; the second heat dissipation module includes a plurality Stacked second heat dissipation plates, the second heat dissipation plates are spaced apart, and there is a second air flow channel between two adjacent second heat dissipation plates. The first heat dissipation plate and the second heat dissipation plate are fins, temperature equalizing plates or heat sinks. The second portion of the at least one second heat pipe is located above the body and faces the body at intervals. The first heat pipe set includes at least a third heat pipe having a third portion perpendicular to the body and a third portion bent to extend a fourth portion parallel to the body and contacting the first heat dissipation module. The aforementioned second heat pipe group includes at least one fourth heat pipe perpendicular to the body and contacting the second heat dissipation module. The aforementioned second heat pipe group includes at least one fifth heat pipe and at least one sixth heat pipe perpendicular to the body, and the fifth heat pipe is provided with a third heat dissipation module, the sixth heat pipe is provided with a fourth heat dissipation module; a third The fan is connected to the third heat dissipation module and drives a third air flow from the third heat dissipation module toward the second heat dissipation module; a fourth fan is connected to the fourth heat dissipation module and drives a fourth air flow from the The fourth heat dissipation module flows toward the second heat dissipation module. The first direction of the first air flow is parallel to or inclined toward the body; the second direction of the second air flow is perpendicular to the body.

The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Figure 1 is a three-dimensional exploded view of the body of the present invention; Figure 2 is a three-dimensional combined view of the body of the present invention; Figure 3 is a three-dimensional combined view of the body of the present invention and the first fan and second fan; Figure 4A is a view of Fig. 4B is a schematic diagram of another alternative implementation of the invention; Fig. 5A is a schematic diagram of the section line 5A-5A of the body of the invention; Fig. 5B is an enlarged schematic diagram of Fig. 5A; FIG. 6A is a schematic diagram of the section line 6A-6A of the body of the present invention; FIG. 6B is an enlarged schematic diagram of FIG. 6A. As shown in the figure, the heat dissipation structure of the electronic device of the present invention includes a body 10 and a first fan 21 and a second fan 22. The body 10 has a first heat pipe group 11 and a second heat pipe group 12. The body 10 For example, it is a temperature equalizing plate or a flat plate heat pipe, having an upper casing 101 and a lower casing 102, a body chamber 103 is defined between the upper casing 101 and the lower casing 102, the lower surface of the lower casing 102 1021 is a thermal contact surface that contacts at least one heat source, and an upper surface 1011 of the upper casing 101 is a heat dissipation surface. The body chamber 103 includes a body capillary structure 1031 and a working liquid or a plurality of supporting columns are optionally provided to support the upper casing 101 and the lower casing 102 (as shown in FIGS. 5A, 5B and 6A). Furthermore, a multi-directional fluid impact field FA is defined above the body 10 (for example, above the upper casing 101) to provide fluid flow driven by the first fan 21 and the second fan 22. The first heat pipe group 11 and the second heat pipe group 12 are disposed on the upper casing 101 of the body 10, that is, one end of the first heat pipe 11 and the second heat pipe 12 (as described later) and the body The upper casing 101 of 10 is connected, but not limited to this, one end (open end) of the first heat pipe group 11 and the second heat pipe group 12 may also be connected to the side of the body 10. The first heat pipe group 11 includes at least one first heat pipe 111 (three heat pipes are shown in the figure) perpendicular to the body 10. The second heat pipe group 12 includes at least one second heat pipe 121 (three heat pipes are shown in the figure), and each second heat pipe 121 has a first portion 1211 perpendicular to the body 10, and the first portion 1211 is bent to extend a second portion 1212 is parallel to the body 10, and the second portion 1222 is located above the body 10 and faces the body 10 at intervals. The first heat pipe group 11 and the second heat pipe group 12 are, for example, round pipes, flat heat pipes, D-type heat pipes, or flat plate heat pipes. Moreover, as shown in FIGS. 5A, 5B, and 6A, 6B, the first heat pipe 111 of the first heat pipe group 11 has a first closed end 1111 and a first open end 1112, and a first heat pipe chamber 1113 Located between the first closed end 1111 and the first open end 1112, the first open end 1112 penetrates the upper casing 101 of the body 10 and is provided with a communication hole 11121 to communicate with the body cavity 103, so that the The first heat pipe chamber 1113 communicates with the body chamber 103 through the first open end 1112. The first heat pipe chamber 1113 is provided with a first heat pipe capillary structure 1131 contacting the body capillary structure 1031. The second heat pipe 121 of the second heat pipe group 12 has a second closed end 1214 and a second open end 1215 and a second heat pipe chamber 1216 between the second closed end 1214 and the second open end 1215 The second open end 1215 penetrates the upper casing 101 of the body 10 and is provided with a communication hole 12151 to communicate with the body chamber 103, and the second heat pipe chamber 1216 communicates with the base through the second open end 1215体室室103。 Body chamber 103. A second heat pipe capillary structure 1231 is disposed in the second heat pipe chamber 1216 to contact the body capillary structure 1031. In this way, the working liquid can circulate in the body chamber 103 and the first heat pipe chamber 1113 and the second heat pipe chamber 1216 to transfer heat to the first heat pipe group 11 and the second heat pipe group 12 and The upper surface 1011 of the upper casing 101 of the body 10 dissipates heat. Referring again to FIGS. 1 to 4A and 4B, a first heat dissipation module 13 is sleeved with the first heat pipe 111 of the first heat pipe group 11, and a second heat dissipation module 14 is sleeved with the second heat pipe group 12 The second heat pipe 121 and the multi-directional fluid impact field above the body 10, the first heat dissipation module 13 includes a plurality of stacked first heat dissipation plates 131, the first heat dissipation plates 131 are spaced apart, and are adjacent to each other The first heat dissipation plate 131 has a first air flow channel 132 parallel to the body 10 or inclined toward the body 10 and corresponding to the second heat dissipation module 14, and each first heat dissipation plate 131 defines at least one through hole 133 to sleeve the The first heat pipe 111; the second heat dissipation module 14 includes a plurality of stacked second heat dissipation plates 141, the second heat dissipation plates 141 are arranged at intervals, and there is a second air flow between two adjacent second heat dissipation plates 141 The channel 142 is perpendicular to the body 10 and corresponds to the first heat dissipation module 13, and each second heat dissipation plate 141 defines at least one through hole 143 to sleeve the second portion 1212 of the second heat pipe 121. Furthermore, the first heat dissipation plate 131 of the first heat dissipation module 13 and the second heat dissipation plate 141 of the second heat dissipation module 14 are, for example, heat sinks, heat dissipation fins or temperature equalization plates. If it is a temperature equalizing plate, a chamber is defined therein to accommodate a working liquid, and the vapor-liquid circulation operation in the chamber. Furthermore, a first fan 21 is directly or indirectly connected to the first heat dissipation module 13, and a second fan 22 is directly or indirectly connected to the second heat dissipation module 14. In this figure, the first fan 21 and The second fan 22 (for example, an axial fan, a centrifugal fan, or a cross-flow fan) may be connected to the first heat dissipation module 13 and the second heat dissipation module 14 directly or through an adapter frame 211, 221, respectively. And as shown in FIG. 4A, since the first air flow path 132 is parallel to the body 10, when the first fan 21 operates to generate a first air flow F1 through the first air flow path 132, the first air flow F1 is along A first direction (that is, a direction parallel to the body 10, shown in FIG. 4A that the first air flow F1 is parallel to the body 10) flows from the first heat dissipation module 13 to the second heat dissipation module 14. However, in another alternative embodiment as shown in FIG. 4B, since the first air flow path 132 is inclined toward the body 10, when the first air flow F1 passes through the first air flow path 132, the first air flow F1 is along a The first direction (that is, the direction of tilting the body 10, which is shown in FIG. 4B shows that the first air flow F1 tilts the body 10) flows from the first heat dissipation module 13 to the second heat dissipation module 14. Furthermore, when the second fan 22 is operated, a second air flow F2 flows along a second direction (that is, the direction perpendicular to the body 10); the second air flow F2 of the second fan 22 flows through the second heat dissipation The module 14 collides with the first airflow F1 flowing to the second heat dissipation module 14 to heat the first thermal module 13 and the second heat dissipation module 14 by the first airflow F1 and the second airflow F2 Convection cooling. Through the above implementation, the present invention provides a first air flow F1 and a second air flow F2 flowing in different directions through the first heat dissipation module 13 and the second heat dissipation module 14 to generate heat convection, and the first air flow F1 and the The multi-directional fluid impact field FA of the second air flow F2 above the body 10 generates fluid impact, thereby helping the body 10 dissipate heat. As shown in FIG. 7, in another alternative implementation, the first heat pipe group 11 includes at least a third heat pipe 211 having a third portion 2111 perpendicular to the body 10 and the third portion 2111 is bent to extend a fourth portion 2112 The body 10 is parallel and contacts the first heat dissipation module 13A. The third heat pipes 211 are adjacent to the first heat pipe 111, and the first heat pipes 111 and the third heat pipes 211 are arranged in a staggered and/or parallel and/or height difference arrangement in rows or columns according to design requirements. The specific implementation of the third heat pipe 211 is the same as the structure of the aforementioned second heat pipe 121. In order to cooperate with the first heat pipe 111 and the third heat pipe 211, the first heat module 13A is provided with a through hole 135A for the fourth portion 2112 of the third heat pipe 211 to pass through, and a slot 134A is provided corresponding to First heat pipe 111. The first heat dissipation module 13A includes a plurality of stacked first heat dissipation plates 131A. The first heat dissipation plates 131A are spaced apart, and there is a first air flow path 132A between two adjacent first heat dissipation plates 131A. As shown in FIG. 8, in another alternative implementation, the second heat pipe group 12 includes at least a fourth heat pipe 212 perpendicular to the body 10 and in contact with the second heat dissipation module 14A, the fourth heat pipes 212 are adjacent to the The second heat pipe 121, and the second heat pipe 121 and the fourth heat pipe 212 are arranged in rows or columns and/or parallel and/or height difference according to design requirements (as shown in FIG. 8 and FIG. 9) . The specific implementation of the fourth heat pipe 212 is the same as the structure of the aforementioned first heat pipe 111. In order to cooperate with the second heat pipe 121 and the fourth heat pipe 212, the second heat dissipation module 14A is provided with a through hole 143A for the second portion 1212 of the second heat pipe 121 to pass through, and a slot 144A is provided to correspond四热管212. The second heat dissipation module 14A includes a plurality of stacked second heat dissipation plates 141A. The second heat dissipation plates 141A are spaced apart, and there is a second air flow path 142A between two adjacent second heat dissipation plates 141A. As shown in FIG. 9, in another alternative implementation, the second heat pipe group 12 includes at least one fifth heat pipe 35 and at least one sixth heat pipe 36 perpendicular to the body 10, and the fifth heat pipe 35 is shown in this drawing There are three heat pipes 36 and six heat pipes, and the specific implementation is the same as the structure of the first heat pipe 111 described above. A third heat dissipation module 15 and a fourth heat dissipation module 16 are sleeved on the fifth heat pipe 35 and the sixth heat pipe 36, respectively. The third heat dissipation module 15 and the fourth heat dissipation module 16 have the same structure as the first heat dissipation module 13 described above. A third fan 23 is directly or indirectly connected to the third heat dissipation module 15, and a fourth fan 24 is directly or indirectly connected to the fourth heat dissipation module 16. In this figure, the third fan 23 and the fourth The fan 24 is, for example, an axial fan and is connected to the third heat dissipation module 15 and the fourth heat dissipation module 16 through an adapter frame 231, 241, respectively. The third fan 23 generates a third air flow from the third heat dissipation module 15 to the second heat dissipation module 14; the fourth fan 24 generates a fourth air flow from the fourth heat dissipation module 15 to the In the second heat dissipation module 16, the first, second, third, and fourth airflows in the multi-directional fluid impact field FA above the body 10 generate fluid impact, thereby helping the body 10 dissipate heat. The present invention has been described in detail above, but the above is only one of the preferred embodiments of the present invention, and cannot limit the scope of the present invention. That is, all changes and modifications made within the scope of the application of the present invention shall still fall within the scope of the patent of the present invention.

10‧‧‧Body 101‧‧‧Upper case 1011‧‧‧Upper surface 102‧‧‧Lower case 1021‧‧‧Lower surface 103‧‧‧Body chamber 1031‧‧‧Body capillary structure 21‧‧‧First fan 22‧‧‧second fan 11‧‧‧The first heat pipe group 111‧‧‧The first heat pipe 1111‧‧‧First closed end 1112‧‧‧The first open end 11121‧‧‧Connecting hole 1113‧‧‧The first heat pipe chamber 1131‧‧‧Capillary structure of the first heat pipe 12‧‧‧The second heat pipe group 121‧‧‧The second heat pipe 1211‧‧‧Part 1 1212‧‧‧Part 2 1214‧‧‧Second closed end 1215‧‧‧The second open end 12151‧‧‧Connecting hole 1216‧‧‧The second heat pipe chamber 1231‧‧‧Capillary structure of the second heat pipe 13, 13A‧‧‧The first cooling module 131、131A‧‧‧The first heat sink 132, 132A‧‧‧ First air channel 133‧‧‧Through hole 134A‧‧‧Slot 135A‧‧‧Through hole 14.14A‧‧‧Second cooling module 141, 141A‧‧‧Second cooling plate 142、142A‧‧‧Second air channel 143‧‧‧Through hole 143A‧‧‧Through hole 144A‧‧‧Slot 21‧‧‧First fan 22‧‧‧second fan 211, 221, 231, 241 F1‧‧‧ First airflow F2‧‧‧Second Airflow 211‧‧‧The third heat pipe 2111‧‧‧Part III 2112‧‧‧Part 4 212‧‧‧The fourth heat pipe 35‧‧‧The fifth heat pipe 36‧‧‧The sixth heat pipe 15‧‧‧The third cooling module 16‧‧‧Fourth cooling module 23‧‧‧ Third fan 24‧‧‧Fourth fan FA‧‧‧Multi-directional fluid impact field

The purpose of the following drawings is to make the present invention easier to understand, and these drawings will be described in detail in this document and make them part of the specific embodiments. Through the specific embodiments in this document and referring to the corresponding drawings, I will explain the specific embodiments of the present invention in detail and explain the principle of the invention. Figure 1 is a three-dimensional exploded view of the body of the present invention; Figure 2 is a three-dimensional combined view of the body of the present invention; Figure 3 is a three-dimensional combined view of the body of the present invention and the first fan and second fan; Fig. 4B is a schematic diagram of another alternative implementation of the invention; Fig. 5A is a schematic diagram of a section line 5A-5A of the body of the invention; Fig. 5B is an enlarged schematic diagram of Fig. 5A; Figure 6A is a schematic diagram of the section line 6A-6A of the body of the invention; Figure 6B is an enlarged schematic diagram of Figure 6A; Figure 7 is a schematic diagram of the second embodiment of the invention; Figure 8 is a third embodiment of the invention Schematic diagram; Fig. 9 is a schematic diagram of a fourth embodiment of the present invention.

10‧‧‧Body

11‧‧‧The first heat pipe group

111‧‧‧The first closed end

12‧‧‧The second heat pipe group

1201‧‧‧Part 1

1202‧‧‧Part 2

13‧‧‧The first cooling module

131‧‧‧The first heat sink

132‧‧‧The first air channel

133‧‧‧Through hole

14‧‧‧Second cooling module

141‧‧‧Second cooling plate

142‧‧‧Second air channel

143‧‧‧Through hole

FA‧‧‧Multi-directional fluid impact field

Claims (13)

An electronic device heat dissipation structure includes: a body having a first heat pipe group and a second heat pipe group, the first heat pipe group including at least one first heat pipe system perpendicular to the body and provided with a first heat dissipation module, the The second heat pipe group includes at least one second heat pipe having a first portion perpendicular to the body and the first portion bent to extend a second portion parallel to the body, and the second portion is provided with a second heat dissipation module; a first fan, It is connected to the first heat dissipation module and drives a first air flow to flow in a first direction; a second fan is connected to the second heat dissipation module and drives a second air flow to flow in a second direction. The heat dissipation structure of an electronic device according to claim 1, wherein the first airflow flows from the first heat dissipation module to the second heat dissipation module; the second airflow flows through the second heat dissipation module and impinges on the flow The first airflow to the second heat dissipation module. The heat dissipation structure of an electronic device according to claim 1, wherein the system is a temperature equalizing plate or a flat plate heat pipe, and has a body cavity, and a body capillary structure and a working liquid are provided in the body cavity. The heat dissipation structure of an electronic device according to claim 3, wherein the at least one first heat pipe has a first closed end and a first open end and a first heat pipe chamber is located at the first closed end and the first open Between the ends, the first open end penetrates the body and communicates with the body chamber, the first heat pipe chamber communicates with the body chamber through the first open end; the at least one second heat pipe has a second closed end And a second open end and a second heat pipe chamber between the second closed end and the second open end, the second open end penetrates the body and communicates with the body chamber, the second heat pipe cavity The chamber communicates with the body chamber through the second open end. The heat dissipation structure of the electronic device according to claim 4, wherein the first heat pipe cavity is provided with a first heat pipe capillary structure contacting the body capillary structure, and the first open end is provided with a communication hole to communicate with the body chamber; A second heat pipe capillary structure is provided in the second heat pipe cavity to contact the body capillary structure, and a communication hole is provided at the second open end to communicate with the body chamber. The heat dissipation structure for an electronic device according to claim 1, wherein the first heat dissipation module includes a plurality of stacked first heat dissipation plates, the first heat dissipation plates are spaced apart, and there is a The first air flow channel; the second heat dissipation module includes a plurality of stacked second heat dissipation plates, the second heat dissipation plates are arranged at intervals, and there is a second air flow channel between two adjacent second heat dissipation plates. The heat dissipation structure of the electronic device according to claim 6, wherein the first heat dissipation plate and the second heat dissipation plate are fins or temperature equalizing plates or heat sinks. The heat dissipation structure of an electronic device according to claim 1, wherein the second portion of the at least one second heat pipe is located above the body and faces the body at intervals. The heat dissipation structure of an electronic device according to claim 1, wherein the first heat pipe group includes at least a third heat pipe having a third portion perpendicular to the body and the third portion bent to extend a fourth portion parallel to the body and contacting the The first cooling module. The heat dissipation structure of an electronic device according to claim 1, wherein the second heat pipe group includes at least a fourth heat pipe perpendicular to the body and contacting the second heat dissipation module. The heat dissipation structure of an electronic device according to claim 1, wherein the second heat pipe group includes at least one fifth heat pipe and at least one sixth heat pipe perpendicular to the body, and the fifth heat pipe is provided with a third heat dissipation module, the first The sixth heat pipe is provided with a fourth heat dissipation module; a third fan is connected to the third heat dissipation module and drives a third air flow from the third heat dissipation module toward the second heat dissipation module; a fourth fan is connected to the The fourth heat dissipation module drives a fourth air flow to flow from the fourth heat dissipation module toward the second heat dissipation module. The heat dissipation structure of an electronic device according to claim 1 or 2, wherein the first direction of the first airflow is parallel to or inclined toward the body; the second direction of the second airflow is perpendicular to the body. The heat dissipation structure of an electronic device according to claim 1 or 2, wherein a multi-directional fluid impact field is defined above the body.

Images