TW201319786A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- TW201319786A TW201319786A TW100142831A TW100142831A TW201319786A TW 201319786 A TW201319786 A TW 201319786A TW 100142831 A TW100142831 A TW 100142831A TW 100142831 A TW100142831 A TW 100142831A TW 201319786 A TW201319786 A TW 201319786A
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- TW
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- Prior art keywords
- heat sink
- substrate
- heat
- rib
- card slot
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
本發明涉及一種散熱裝置，尤其是指一種用於冷卻電子元件的散熱裝置。The present invention relates to a heat sink, and more particularly to a heat sink for cooling electronic components.
隨著電子產業的蓬勃迅速發展，大型積體電路技術不斷進步，電腦內部不只是中央處理器，設於主板附加卡上的晶片發熱量也在不斷增加。大量熱量如不能及時散發，將導致電子元件內部溫度越來越高，嚴重影響電子元件運行的穩定性，如今散熱問題已成為影響電腦運行性能的一個重要因素，也成為高速處理器實際應用的瓶頸。因此，通常在電子元件的表面設置有散熱裝置，以降低電子元件的工作溫度。With the rapid development of the electronics industry, the large-scale integrated circuit technology continues to advance, and the internal computer is not only the central processor, but also the heat generated by the chip attached to the motherboard add-on card. If a large amount of heat cannot be dissipated in time, it will lead to higher and higher internal temperature of electronic components, which seriously affects the stability of electronic components. Nowadays, heat dissipation has become an important factor affecting the running performance of computers, and it has become a bottleneck for the practical application of high-speed processors. . Therefore, a heat sink is usually provided on the surface of the electronic component to lower the operating temperature of the electronic component.
通常，散熱裝置包括一貼置於電子元件上的基板及形成於基板上的復數散熱鰭片。基板與鰭片通過鋁擠一體成型。然而，此種散熱器受限於鋁擠工藝的原因，通常無法將尺寸做的較大，導致其散熱面積有限。Generally, the heat sink includes a substrate attached to the electronic component and a plurality of heat dissipation fins formed on the substrate. The substrate and the fin are integrally molded by aluminum extrusion. However, such a heat sink is limited by the aluminum extrusion process, and it is generally impossible to make the size larger, resulting in a limited heat dissipation area.
有鑒於此，有必要提供一種尺寸較大的散熱裝置。In view of this, it is necessary to provide a heat sink having a large size.
一種散熱裝置，包括第一散熱器及與該第一散熱器相連接的第二散熱器，所述第一散熱器包括第一基板及設置於第一基板上的復數第一散熱鰭片，所述第二散熱器包括第二基板及設置於第二基板上的復數第二散熱鰭片，所述第一基板的側邊處向外凸伸形成有凸肋，所述第二基板的側邊處向內凹陷形成有卡槽，所述凸肋卡置於該卡槽內。A heat sink includes a first heat sink and a second heat sink connected to the first heat sink, the first heat sink including a first substrate and a plurality of first heat sink fins disposed on the first substrate The second heat sink includes a second substrate and a plurality of second heat dissipation fins disposed on the second substrate. The side edges of the first substrate are outwardly convexly formed with ribs, and the sides of the second substrate A card slot is formed inwardly recessed, and the rib is stuck in the card slot.
本發明的散熱裝置中，所述第一散熱器與第二散熱器通過凸肋與卡槽之間的卡合實現連接，可以加大散熱裝置的尺寸，進而增加散熱面積。In the heat dissipation device of the present invention, the first heat sink and the second heat sink are connected by the engagement between the rib and the card slot, and the size of the heat sink can be increased, thereby increasing the heat dissipation area.
請參見圖1至圖2，本發明的散熱裝置用於對安裝於電路板（圖未示）上的電子元件（圖未示）散熱，其包括一第一散熱器10及與該第一散熱器10卡扣相連的一第二散熱器20。Referring to FIG. 1 to FIG. 2, the heat dissipating device of the present invention is configured to dissipate heat from an electronic component (not shown) mounted on a circuit board (not shown), and includes a first heat sink 10 and the first heat sink. The device 10 is snapped to a second heat sink 20.
上述第一散熱器10由導熱性能良好的金屬如銅、鋁等製成，其包括一第一基板12及由該第一基板12向上延伸而出的復數第一散熱鰭片14。優選地，本實施例中採用鋁擠的工藝一體成型第一散熱器10，以降低製造成本。所述第一基板12為一矩形板體，其底面與所述電子元件相緊密接觸。所述第一散熱鰭片14垂直於第一基板12的頂面設置。這些第一散熱鰭片14相互平行、間隔排列。相鄰二第一散熱鰭片14間形成有氣流通道140。該第一基板12的其中一側邊120處向外凸伸出一縱長的凸肋122。所述凸肋122沿所述側邊120的縱長方向延伸。該凸肋122的寬度沿著遠離側邊120的方向逐漸增大。該凸肋122的橫截面沿遠離第一基板12的方向呈一漸擴的圖形（參見圖4）。在本實施例中，所述凸肋122的橫截面為梯形，可以理解地，所述橫截面也可以為三角形、半圓形、扇形或其他形狀。The first heat sink 10 is made of a metal having good thermal conductivity, such as copper, aluminum, or the like, and includes a first substrate 12 and a plurality of first heat dissipation fins 14 extending upward from the first substrate 12. Preferably, in the embodiment, the first heat sink 10 is integrally formed by a process of aluminum extrusion to reduce the manufacturing cost. The first substrate 12 is a rectangular plate body whose bottom surface is in close contact with the electronic component. The first heat dissipation fins 14 are disposed perpendicular to a top surface of the first substrate 12 . These first heat radiation fins 14 are arranged in parallel and spaced apart from each other. An air flow passage 140 is formed between the adjacent two first heat dissipation fins 14 . An elongated rib 122 protrudes outwardly from one side 120 of the first substrate 12 . The ribs 122 extend along the longitudinal direction of the side edges 120. The width of the rib 122 gradually increases in a direction away from the side 120. The cross section of the rib 122 is in a diverging pattern in a direction away from the first substrate 12 (see FIG. 4). In this embodiment, the rib 122 has a trapezoidal cross section, and it is understood that the cross section may also be triangular, semi-circular, fan-shaped or other shapes.
請同時參見圖3，上述第二散熱器20由導熱性能良好的金屬如銅、鋁等製成，其包括一第二基板22及由該第二基板22向上延伸而出的復數第二散熱鰭片24。優選地，本實施例中採用鋁擠的工藝一體成型第二散熱器20，以降低製造成本。所述第二基板22為一矩形板體。所述第二散熱鰭片24垂直於第二基板22的頂面設置。這些第二散熱鰭片24相互平行、間隔排列。相鄰二第二散熱鰭片24間形成有氣流通道240。該第二基板22面向所述第一基板12設置的一側邊220處向內凹陷形成一縱長的卡槽222。所述卡槽222沿所述側邊220的縱長方向延伸。所述卡槽222在形狀上與所述凸肋122對應互補，該卡槽222的橫截面在形狀上與所述凸肋122的橫截面對應一致（參見圖4），以使凸肋122能夠剛好卡置入該卡槽222，進而卡扣連接所述第一散熱器10的第一基板12與第二散熱器20的第二基板22。Referring to FIG. 3 , the second heat sink 20 is made of a metal having good thermal conductivity, such as copper, aluminum, etc., and includes a second substrate 22 and a plurality of second heat dissipation fins extending upward from the second substrate 22 . Sheet 24. Preferably, in the embodiment, the second heat sink 20 is integrally formed by a process of aluminum extrusion to reduce the manufacturing cost. The second substrate 22 is a rectangular plate body. The second heat dissipation fins 24 are disposed perpendicular to the top surface of the second substrate 22 . These second heat radiation fins 24 are arranged in parallel and spaced apart from each other. An air flow passage 240 is formed between the adjacent two second heat dissipation fins 24. The one side of the second substrate 22 facing the first substrate 12 is recessed inwardly to form an elongated slot 222. The card slot 222 extends along the longitudinal direction of the side edge 220. The card slot 222 is correspondingly complementary to the rib 122. The cross section of the slot 222 is corresponding in shape to the cross section of the rib 122 (see FIG. 4), so that the rib 122 can be The card is inserted into the card slot 222, and the first substrate 12 of the first heat sink 10 and the second substrate 22 of the second heat sink 20 are buckled.
請再次參見圖1至圖4，組裝本發明的散熱裝置時，先將所述第一散熱器10的第一基板12的側邊120面向第二散熱器20的第二基板22的側邊220設置，將第一基板12與第二基板22相錯開，使得所述凸肋122的一端對準卡槽222的一端開口處，再將第一基板12與第二基板22相對滑動，使得凸肋122沿卡槽222滑動並卡置入該卡槽222內，直至第一基板12與第二基板22對齊。此時，第一基板12的側邊120與第二基板22的側邊220相貼合，第一基板12的頂面與第二基板22的頂面對應齊平，第一基板12的底面與第二基板22的底面對應齊平，這樣所述第一散熱器10與第二散熱器20通過凸肋122與卡槽222之間的卡合實現連接。所述第一散熱器10與第二散熱器20連接後，可以通過焊接進一步加固連接及密封二者之間的縫隙。優選地，本實施例中採用氬弧進行焊接，以密封第一散熱器10與第二散熱器20的結合處，防止液體滲入。Referring to FIG. 1 to FIG. 4 again, when assembling the heat dissipating device of the present invention, the side 120 of the first substrate 12 of the first heat sink 10 faces the side 220 of the second substrate 22 of the second heat sink 20 first. The first substrate 12 and the second substrate 22 are offset from each other such that one end of the rib 122 is aligned with the opening of one end of the card slot 222, and the first substrate 12 and the second substrate 22 are relatively slid so that the rib is ribbed. 122 slides along the card slot 222 and is inserted into the card slot 222 until the first substrate 12 and the second substrate 22 are aligned. At this time, the side 120 of the first substrate 12 and the side 220 of the second substrate 22 are in contact with each other, and the top surface of the first substrate 12 is flush with the top surface of the second substrate 22, and the bottom surface of the first substrate 12 is The bottom surface of the second substrate 22 is flush, so that the first heat sink 10 and the second heat sink 20 are connected by the engagement between the ribs 122 and the card slot 222. After the first heat sink 10 is connected to the second heat sink 20, the gap between the joint and the seal can be further strengthened by welding. Preferably, in the embodiment, welding is performed by using an argon arc to seal the joint of the first heat sink 10 and the second heat sink 20 to prevent liquid from penetrating.
綜上所述，本發明的散熱裝置中，所述第一散熱器10與第二散熱器20通過凸肋122與卡槽222之間的卡合實現連接，從而增加整體的散熱面積。並且，第一散熱器10與第二散熱器20是通過卡扣的方式進行固定的，過程較為簡便，從而簡化制程。可以理解地，所述第一散熱器10上可以設置有多個凸肋122（分別形成於第一基板12的各個側邊120處），而與多個第二散熱器20相配合而組合在一起。同理，所述第一散熱器10上也可以同時形成有卡槽222，所述第二散熱器20上也可以同時形成有凸肋122，從而實現第一散熱器10與第二散熱器20的多種組合。而且，該散熱裝置的第一散熱器10與第二散熱器20之間配合牢固，進而確保散熱裝置穩定工作。In summary, in the heat dissipation device of the present invention, the first heat sink 10 and the second heat sink 20 are connected by the engagement between the rib 122 and the card slot 222, thereby increasing the overall heat dissipation area. Moreover, the first heat sink 10 and the second heat sink 20 are fixed by means of snapping, and the process is relatively simple, thereby simplifying the process. It can be understood that the first heat sink 10 can be provided with a plurality of ribs 122 (formed at respective side edges 120 of the first substrate 12), and combined with the plurality of second heat sinks 20 together. Similarly, the first heat sink 10 can also be formed with a card slot 222 at the same time. The second heat sink 20 can also be formed with the ribs 122 at the same time, thereby implementing the first heat sink 10 and the second heat sink 20 . Multiple combinations. Moreover, the first heat sink 10 and the second heat sink 20 of the heat sink are firmly matched to ensure stable operation of the heat sink.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10．．．第一散熱器10. . . First radiator
12．．．第一基板12. . . First substrate
120、220．．．側邊120, 220. . . Side
122．．．凸肋122. . . Rib
14．．．第一散熱鰭片14. . . First heat sink fin
140、240．．．氣流通道140, 240. . . Air flow channel
20．．．第二散熱器20. . . Second radiator
22．．．第二基板twenty two. . . Second substrate
222．．．卡槽222. . . Card slot
24．．．第二散熱鰭片twenty four. . . Second heat sink fin
圖1是本發明一實施例的散熱裝置的立體組合圖。1 is a perspective assembled view of a heat sink according to an embodiment of the present invention.
圖2是圖1中散熱裝置的立體分解圖。Figure 2 is an exploded perspective view of the heat sink of Figure 1.
圖3是圖1中散熱裝置從另一角度的立體分解圖。Figure 3 is an exploded perspective view of the heat sink of Figure 1 from another angle.
圖4是圖1中散熱裝置的正面視圖。Figure 4 is a front elevational view of the heat sink of Figure 1.
12．．．第一基板12. . . First substrate
122．．．凸肋122. . . Rib
14．．．第一散熱鰭片14. . . First heat sink fin
22．．．第二基板twenty two. . . Second substrate
222．．．卡槽222. . . Card slot
24．．．第二散熱鰭片twenty four. . . Second heat sink fin
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103495498A CN103096688A (en) | 2011-11-08 | 2011-11-08 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201319786A true TW201319786A (en) | 2013-05-16 |
Family
ID=48208613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100142831A TW201319786A (en) | 2011-11-08 | 2011-11-23 | Heat dissipation device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130112387A1 (en) |
| CN (1) | CN103096688A (en) |
| TW (1) | TW201319786A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066302B (en) * | 2013-03-22 | 2016-12-28 | 技嘉科技股份有限公司 | Radiating module and manufacture method thereof |
| CN104571398B (en) * | 2013-10-15 | 2018-04-13 | 英业达科技有限公司 | Servomechanism and its radiating subassembly |
| CN104168744A (en) * | 2014-07-30 | 2014-11-26 | 太仓陶氏电气有限公司 | Intensive radiator |
| CN109168288B (en) * | 2014-09-26 | 2020-07-14 | 华为技术有限公司 | Radiator and electronic product |
| BE1023686B1 (en) * | 2015-11-12 | 2017-06-15 | Maes Jonker Nv | DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER |
| CN110007721B (en) * | 2018-01-05 | 2023-08-22 | 联想企业解决方案(新加坡)有限公司 | Computer server and main board assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10009398C2 (en) * | 2000-02-28 | 2002-03-14 | Epcos Ag | Heatsink module and arrangement of heatsink modules |
| US6958914B2 (en) * | 2003-12-09 | 2005-10-25 | Dell Products L.P. | Interlocking heat sink |
| CN100518475C (en) * | 2006-06-02 | 2009-07-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| TWI337837B (en) * | 2007-06-08 | 2011-02-21 | Ama Precision Inc | Heat sink and modular heat sink |
| CN101808490A (en) * | 2009-02-17 | 2010-08-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
-
2011
- 2011-11-08 CN CN2011103495498A patent/CN103096688A/en active Pending
- 2011-11-23 TW TW100142831A patent/TW201319786A/en unknown
- 2011-12-28 US US13/338,252 patent/US20130112387A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN103096688A (en) | 2013-05-08 |
| US20130112387A1 (en) | 2013-05-09 |
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