TWI337837B - Heat sink and modular heat sink - Google Patents

Heat sink and modular heat sink Download PDF

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Publication number
TWI337837B
TWI337837B TW096120699A TW96120699A TWI337837B TW I337837 B TWI337837 B TW I337837B TW 096120699 A TW096120699 A TW 096120699A TW 96120699 A TW96120699 A TW 96120699A TW I337837 B TWI337837 B TW I337837B
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Taiwan
Prior art keywords
heat sink
positioning
base
modular
positioning structure
Prior art date
Application number
TW096120699A
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Chinese (zh)
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TW200850130A (en
Inventor
yu chu Chen
Ching Ho
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Ama Precision Inc
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Priority to TW096120699A priority Critical patent/TWI337837B/en
Priority to US12/132,630 priority patent/US8056614B2/en
Publication of TW200850130A publication Critical patent/TW200850130A/en
Application granted granted Critical
Publication of TWI337837B publication Critical patent/TWI337837B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

0960085 23945twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種散熱器’且特別是有關於一種模 組化的散熱器。 【先前技術】 隨著半導體技術的進步，顯示器的尺寸也趨向於大型 化。常見的顯示器如應用於家庭觀賞的液晶顯示器師id crystal display, LCD)、電毁顯示器 __ 此㈣ pand， PDP)等平面顯示器’還有可以應用於大型的戶外廣告看板 的發光二極體(light emitting diode，LED)顯示器。 以大型戶外廣告看板為例，基於訊號延遲問題仍未完 全克服及成本的考量，-般大型的戶外廣告看板，多是將 多個小型的液晶顯示H、電_示器或發光二極體顯示 器。以㈣二極體顯示器而言，發光二極體顯示器是將多 個發光二極體模組以陣列的方式排列成所f要呈現的尺 寸。 受限於散熱器的尺寸及散熱效果，目前也只能夠一個 ^型的發光二極體模組中搭配—個或多個散熱器。铁而， 备多個小型光二極體馳拼接在—起㈣成一個大型 的發光二極義示糾，絲發光二極 ^似體模組可與周圍較冷的環境相接觸因= 良好的散熱效果。相對而言，位·光二& =小型發光-極體模組的散熱效果就會較差。因此，如何 達到大型發光二極義Μ的大面積散熱效果是目前亟欲 0960085 23945twf.doc/n 解決的問題。 【發明内容】 本發明提供一種可供模組化的散熱器。 本發明提供一種可依使用者需求而組裝成不同大小之 模組化散熱器。 本1明提出一種散熱器，其包括一底座以及一鰭片 組。底座之兩側邊各為結構相對應的一母頭及一公頭，而 鰭片組配置於底座上。 、 ――在本發明之一實施例中，上述之母頭内側有至少— -定位結構，而公頭外側有至少—第二定位結構 定位結構與m結構相職。 且弟― 點 在本發明之一實施例中，上述之第一 而第二定位結構為凹槽。 ，構為凸 槽 =發明之—實施例中，上述之第—定位 而弟二定位結構為凸點。 為凹 成型在本發明之—實施射，上述之底座_片組為―體 定位ί本2之—實施例中，上述之母頭更具有多個第-位孔且卓—定位孔貫穿母頭。 定位ί本實施例中，上述之公頭更具有多個第二 叱4孔貝牙公碩，並與第一定位孔相對應。 。。本發明錢出—種模組化散熱器，其包括—第 -第二散熱器。第一散熱器包括一第一底座及—·第 1片組，其中第一鰭片組配置於第一底座上，而底座具 0960085 23945twf.doc/n 0960085 23945twf.doc/n 有一母頭。第二散埶5|速垃 @ 逑接於弟—散熱器，其包括-第- 底座及-第—韓片组，其中第n组配置 : 上’而底座具有—公頭，且麵滑設於母射。底座 在本發明之一實施例中，上述之母頭内側有 :定位結構，而公頭外側有至少—第二定位結構 ： 疋位結構與第二定位結構相對應。 第 之-實施例中，上述ϋ位結 而弟—疋位結構為凹槽。 〇 在本發明之一實施例中 而第二定位結構為凸點 在本發明之一實施例中 點 槽 凹 上述之第一定位結構為 上述之母頭具有一延伸自第 底座的挾持部，且公頭具有一緊縮且 抉持部適於挾持緊縮部。 之 在本發明之一實施例中，上述之第一底座與第一鲈 、、且為一體成型。 ^ 在本發明之一實施例中’上述之第二底座與第二哼片 紐為—體成型。 ， 八在本發明之一實施例中’上述之母頭更具有多個第一 久位孔，且定位孔並貫穿母頭。 ^ 在本發明之一實施例中，上述之公頭更具有多個第二 定位孔’貫穿公頭，並與第一定位孔相對應。 在本發明之一實施例中，上述之模組化散熱器更包括 _ 一固定件，配置於第一底座之母頭上，其適於固定第 散熱器及第二散熱器，其中每一固定件包括一本體以及 0960085 23945twf.doc/n -彈片延伸自本體的彈片。此外，彈片並翹曲於本體之第 ^表面’其中彈片之末端有—插銷，而插銷位於彈片朝向 第二表面，且插銷插入兩相對應之第一、第二定位孔，以 固定第一散熱器及第二散熱器。 在本發明之一實施例中，上述之固定件之材質包括金 屬或塑膠。 ' “ 在本發明之一實施例中，上述之固定件更具有—位於 本體之側邊的折彎部，其中折彎折彎部，使折彎部彎曲至 彈片上方，以限位彈片。 本發明在散熱器的兩側分別設置結構相對應的公頭及 母頭，因此可將兩個以上散熱器相互組裝以形成模組化的 散熱器。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉車父佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖ΙΑ、1B及1C分別為本發明一實施例之模组化散 熱器三個不同視角的示意圖。圖2A為將兩個散熱器組裝 前的示意圖，而圖2B為圖2A之散熱器組裝後的示意圖。 請同時參考圖ΙΑ、IB、1C、2A及2B’模組化散熱器3〇〇〇 是利用多個圖1A示之散熱器1〇〇〇組裝而成，且為了說明 方便，所以圖2A及2B中將兩個相同的散熱器分別以10〇〇 及2000標記’且兩個散熱器1〇〇〇、2〇〇〇中，相似的元件 標號代表相同的元件，因此僅對散熱器1〇〇〇的結構及特徵 做說明。讀者應可知悉，散熱器2000與散熱器1〇〇〇同為 0960085 23945twf.doc/n 具有本發明特徵之散熱器。 散熱器1000包括一底座1100以及一鰭片組12〇〇,其 中底座1100的兩側邊各為結構相對應的一母頭U2〇及一 公頭1140，而ϋ片组1200配置於底座η〇〇上。 詳細地來說，母頭1120為一滑執，而公頭114〇為一 自底座1100延伸的突出部。此外，母頭112〇的内側有至 少一第一定位結構1122，而公頭1140的外側有至少一第 二定位結構1142，其中第一定位結構1122會與第二定位 結構1142相對應，且第一定位結構1122及第二定位結構 1142的數量可依照使用需求來設置。舉例而言，當第一定 位結構1122為凸點時，第二定位結構1142就是凹槽；當 第一定位結構1122為凹槽時，第二定位結構U42就是凸 點。此處所敘明之凸點與凹槽僅為本說明書舉例之用，本 技術領域或非本技術領域之相關人員，皆可輕而易舉地聯 想並利用其他兩互相對應的結構來做為第一定位結構 1122以及弟二定位結構1142。 由於圖ΙΑ、1Β及ic示之散熱器1〇〇〇的底座uoo 具有母頭1120及公頭1140,因此我們便可以將多個散熱 器1100組裝在-起，以形成如圖2Β示之模組化散熱器 3000。 請繼續參考圖1Α、圖2Α及圖2Β，詳細地來說，我 們可以將兩個散熱器1000、2000擺在一起，其中散熱器 1000的母頭1120是與散熱器2000的公頭2140相對。 然後’將散熱器2000的公頭214〇由母頭112〇的邊緣 1337837 0960085 23945twf.doc/n 置入，並使散熱器1000、2000產生相對的移動， _ 2140滑入母頭1120之中。 么頭0960085 23945twf.doc/n IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat sink and particularly relates to a molded heat sink. [Prior Art] With the advancement of semiconductor technology, the size of displays has also tended to be large. Common displays such as id crystal display (LCD) for home viewing, LCD display, LCD display, etc. __ This (four) pand, PDP) flat panel display 'also has a light-emitting diode that can be applied to large outdoor advertising billboards ( Light emitting diode, LED) display. Taking large-scale outdoor advertising billboards as an example, based on the signal delay problem has not been completely overcome and cost considerations, such large-scale outdoor advertising billboards, mostly multiple small liquid crystal display H, electric_display or light-emitting diode display . In the case of a (four) diode display, the light-emitting diode display is arranged such that a plurality of light-emitting diode modules are arrayed in such a manner as to be presented. Limited by the size and heat dissipation effect of the heat sink, it is currently only possible to match one or more heat sinks in a type of light-emitting diode module. Iron, a small number of small light diodes are spliced together in a (four) into a large-scale light-emitting diode display, the wire-emitting diode-like body module can be in contact with the surrounding cold environment = good heat dissipation effect. Relatively speaking, the positional light 2 & = small light-polar body module will have a poor heat dissipation effect. Therefore, how to achieve the large-area heat dissipation effect of large-scale light-emitting diodes is currently solved by the problem of 0960085 23945twf.doc/n. SUMMARY OF THE INVENTION The present invention provides a heat sink that can be modularized. The invention provides a modular heat sink which can be assembled into different sizes according to user requirements. A heat sink is proposed in the present invention, which includes a base and a fin set. The two sides of the base are a female head and a male head corresponding to the structure, and the fin group is disposed on the base. In an embodiment of the invention, the inner side of the female head has at least a positioning structure, and the outer side of the male head has at least a second positioning structure. The positioning structure and the m structure are in a position. And in one embodiment of the invention, the first and second positioning structures are grooves. , configured as a convex groove = invented - in the embodiment, the above-mentioned first positioning and the second positioning structure are convex. In the embodiment of the present invention, the above-mentioned base is further provided with a plurality of first-position holes and the positioning holes are penetrated through the female head. . Positioning ί In the embodiment, the male head has a plurality of second 叱4 holes and a corresponding locating hole. . . The invention provides a modular heat sink comprising a first-second heat sink. The first heat sink includes a first base and a first set, wherein the first fin set is disposed on the first base, and the base has a female head 0960085 23945twf.doc/n 0960085 23945twf.doc/n. The second divergence 5|speed la@ 逑 于 于 — 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器In the mother-in-law. In one embodiment of the invention, the inner side of the female head has a positioning structure, and the outer side of the male head has at least a second positioning structure: the clamping structure corresponds to the second positioning structure. In the first embodiment, the above-mentioned ϋ position and the 疋-结构 structure are grooves. In one embodiment of the present invention, the second positioning structure is a bump, and in the embodiment of the present invention, the first positioning structure is a recessed portion, wherein the female head has a holding portion extending from the base, and The male head has a contraction and the gripping portion is adapted to hold the constriction. In an embodiment of the invention, the first base and the first base are integrally formed. In one embodiment of the invention, the second base and the second web are formed in a body. In an embodiment of the invention, the female head has a plurality of first permanent holes, and the positioning holes are penetrated through the female. In one embodiment of the invention, the male head further has a plurality of second positioning holes 'through the male head and corresponding to the first positioning holes. In an embodiment of the present invention, the modular heat sink further includes a fixing member disposed on the female head of the first base, and is adapted to fix the first heat sink and the second heat sink, wherein each fixing member It includes a body and a 0988085 23945twf.doc/n - shrapnel extending from the body. In addition, the elastic piece is warped on the first surface of the body, wherein the end of the elastic piece has a latch, and the latch is located at the elastic piece facing the second surface, and the latch is inserted into the corresponding first and second positioning holes to fix the first heat dissipation. And a second radiator. In an embodiment of the invention, the material of the fixing member comprises metal or plastic. In one embodiment of the present invention, the fixing member further has a bent portion located at a side of the body, wherein the bent portion is bent to bend the bent portion above the elastic piece to limit the elastic piece. In the invention, the male and female connectors corresponding to the structure are respectively disposed on both sides of the heat sink, so that two or more heat sinks can be assembled with each other to form a modular heat sink. The above features and advantages of the present invention can be more obvious. It is to be understood that the following is a detailed description of the embodiment of the car, and the following is a detailed description of the following: [Embodiment] FIGS. 1B and 1C respectively illustrate three different types of modular heat sinks according to an embodiment of the present invention. Figure 2A is a schematic view of the two heat sinks before assembly, and Figure 2B is a schematic view of the heat sink of Figure 2A. Please also refer to Figure ΙΑ, IB, 1C, 2A and 2B' modular heat sinks. 3〇〇〇 is assembled by using a plurality of heat sinks 1A shown in FIG. 1A, and for convenience of description, two identical heat sinks are labeled with 10〇〇 and 2000 respectively in FIGS. 2A and 2B. Two radiators, 1〇〇〇, 2〇〇〇, The similar component numbers represent the same components, so only the structure and characteristics of the heat sink 1〇〇〇 are explained. The reader should be aware that the heat sink 2000 and the heat sink 1 are the same as 0960085 23945twf.doc/n The heat sink 1000 includes a base 1100 and a fin set 12〇〇, wherein the two sides of the base 1100 are respectively a female U2 〇 and a male 1140 corresponding to the structure, and the cymbal group The 1200 is disposed on the base η. In detail, the female head 1120 is a sliding handle, and the male head 114 is a protrusion extending from the base 1100. In addition, the inner side of the female head 112 has at least one first The positioning structure 1122 has a second positioning structure 1142 on the outer side of the male 1140. The first positioning structure 1122 corresponds to the second positioning structure 1142, and the number of the first positioning structure 1122 and the second positioning structure 1142 can be For example, when the first positioning structure 1122 is a bump, the second positioning structure 1142 is a groove; when the first positioning structure 1122 is a groove, the second positioning structure U42 is a bump. As stated here The points and the grooves are only exemplified in the present specification, and those skilled in the art or non-technical fields can easily associate and utilize the other two corresponding structures as the first positioning structure 1122 and the second positioning structure. 1142. Since the base uoo of the heat sink 1〇〇〇 of the figure Β, 1Β and ic has the female head 1120 and the male head 1140, we can assemble the plurality of heat sinks 1100 in the same manner to form a schematic view as shown in FIG. The modular radiator 3000. Please continue to refer to Figure 1Α, Figure 2Α and Figure 2Β. In detail, we can put two heat sinks 1000 and 2000 together, in which the female 1120 of the heat sink 1000 is cooled. The male 2140 of the device 2000 is opposite. Then, the male 214 of the heat sink 2000 is placed by the edge of the female 112 1 1337837 0960085 23945 twf.doc/n, and the heat sinks 1000, 2000 are moved relative to each other, and the _ 2140 is slid into the female 1120. Head

特別的是’由於母頭1120具有第一定位結構 而公頭2140具有第二定位結構2142，因此在組裝人q ’ 公頭2U0滑人母頭112〇内後，第一定位結構112^遇二= 構相對應的第二定位結構2142便會互相卡合，並且發出4 合的聲響。此外，組裝人員也能夠藉由手的觸感，以2 到第一定位結構1122與第二定位結構2142的卡合。&又 若公頭2M0仍未到達預定的組裝點，組襄人員便需 持續施力以使公頭2140繼續移動，並使第二定位結構 與下一個第一定位結構1122卡合。組裝人員可藉由第一 a 位結構1122及第二定位結構2142卡合時的聲響次數或= 感，輕易地判斷散熱器1000、2000是否到達組^定位^對 人員而言，散熱器ι〇00、2000具有模組化時的組裝便In particular, since the female head 1120 has the first positioning structure and the male head 2140 has the second positioning structure 2142, the first positioning structure 112 is encountered after assembling the person q' male 2U0 sliding female head 112〇. The corresponding second positioning structures 2142 will engage each other and emit a 4-way sound. In addition, the assembler can also engage the second positioning structure 1122 with the second positioning structure 2142 by the touch of the hand. & If the male 2M0 still does not reach the predetermined assembly point, the group personnel need to continue to apply force to continue the movement of the male 2140 and to engage the second positioning structure with the next first positioning structure 1122. The assembler can easily judge whether the heat sinks 1000, 2000 reach the group by the number of sounds or the sense of sound when the first a-bit structure 1122 and the second positioning structure 2142 are engaged, the heat sink ι〇 00, 2000 has modular assembly

此外，為了易於辨識，我們也可以使公頭214〇具有一 緊縮部2144，而相對應地母頭112〇具有一延伸自第一底 j⑽的挾持部1124。如此一來，組裝人員便可以容易氏 ，辨識出公頭⑽及母頭⑽，以避免組裝錯誤。另外， =散熱器⑽0、2_組裝在一起時，緊縮部·會被挟 持部U24所挾持，也可以增加散熱器1〇〇〇、厕 —起時的緊密度。 哭^組將公頭推移到敢蚊位點時，散熱 〇〇組裝s成’而形成模組化散熱器3〇〇〇。 10 1337837 0960085 23945twf.doc/n 2140，也可為未貫穿貫穿公頭2140的凹槽。但第一定位結 構1122與第二定位結構2142僅能有其一為凹槽，另一為 結構相對應的凸點。 當使用固定件2200以固定散熱器1〇〇〇、2000時，組 裝人員將彈片2224的插銷2224a插入相對應的第一定位孔 1126及第二定位孔2146，便能將散熱器1〇〇〇、2000固定 在一起。此外，為了避免彈片2242的恢復力而使插銷2224a 並未插入於第一定位孔1126及第二定位孔2146，因此我 們更可以利用本體2222的一側壁形成一折彎部2226。因 此，在將插銷2224a插入相對應的第一定位孔1126及第二 定位孔2146後，組裝人員推移折彎部2266,使折彎部2226 位於彈片2244上，以限位彈片2224。 雖然本實施例是以兩個尺寸相同的散熱器1〇〇〇、2〇〇〇 舉例說明，但本發明並不以此為限。簡單地來說，我們也 可以是利用各種不同尺寸的散熱器’組成大型的模組化散 埶器。 此外’藉由第一、第二定位結構1122、2142及固定件 2200的輔助’我們也可以將散熱器模組化成我們所需要的 形狀及結構，視需求而定。舉例而言，為了讓模組化散熱 器能夠有較佳的散熱效果’我們也可將多個散熱器組裝成 如圖4之模組化散熱器3〇〇〇,，其中模組化散熱器3〇〇〇, 中未裝設散熱器1〇〇〇的空隙23〇〇會被周圍的冷空氣填 滿’因此位於空隙23〇〇旁的散熱器1000可有更為良好的 散熱效果，使整個模組化散熱器3000,具有較好的散熱效 12 g 1337837 0960085 23945twf.doc/n Ϊ执I術領域具通常知識者，可輕而易舉地聯想模組化 = Ϊ狀及拼裝結構’並視其實際需求來組裝，說明 書中不再舉例說明。 綜上所述，本發明之散熱器因具有公、母頭，因此可 以將兩個以上的散熱器加以模組化，以 =器。此外，公、母頭上設置的定位結構，= 裝人歧裝時_聲響或手絲_衫已職组裝定Moreover, for ease of identification, we can also have the male head 214 〇 having a constriction 2144, and the corresponding female head 112 has a grip 1124 extending from the first bottom j (10). In this way, the assembler can easily identify the male (10) and female (10) to avoid assembly errors. In addition, when the radiators (10) 0 and 2_ are assembled, the tightening portion can be held by the holding portion U24, and the tightness of the radiator 1 and the toilet can be increased. When the crying group moves the male head to the mosquito-repellent spot, the heat sink is assembled to form a modular heat sink. 10 1337837 0960085 23945twf.doc/n 2140 may also be a groove that does not penetrate through the male head 2140. However, the first positioning structure 1122 and the second positioning structure 2142 can only have one groove and the other corresponding to the structure. When the fixing member 2200 is used to fix the heat sink 1〇〇〇, 2000, the assembler inserts the pin 2224a of the elastic piece 2224 into the corresponding first positioning hole 1126 and the second positioning hole 2146, so that the heat sink 1〇〇〇 can be 2000 is fixed together. In addition, in order to prevent the restoring force of the elastic piece 2242, the latch 2224a is not inserted into the first positioning hole 1126 and the second positioning hole 2146. Therefore, a side portion of the body 2222 can be used to form a bent portion 2226. Therefore, after the latch 2224a is inserted into the corresponding first positioning hole 1126 and the second positioning hole 2146, the assembler pushes the bent portion 2266 to position the bent portion 2226 on the elastic piece 2244 to limit the elastic piece 2224. Although the present embodiment is illustrated by two heat sinks 1 and 2, which are the same size, the present invention is not limited thereto. Simply put, we can also use a variety of different sizes of radiators to form a large modular diffuser. In addition, by the aid of the first and second positioning structures 1122, 2142 and the fixing member 2200, we can also convert the heat sink into the shape and structure we need, depending on the needs. For example, in order to make the modular heat sink have better heat dissipation effect, we can also assemble multiple heat sinks into the modular heat sink 3如图 as shown in Figure 4, in which the modular heat sink 3〇〇〇, the gap 23 in which the heat sink is not installed will be filled with the surrounding cold air. Therefore, the heat sink 1000 located beside the gap 23 can have a better heat dissipation effect. The entire modular radiator 3000 has a good heat dissipation effect. 12 g 1337837 0960085 23945twf.doc/n The general knowledge of the field of I, can easily be modularized = Ϊ shape and assembled structure 'and The actual needs are assembled, and the description is not given in the specification. In summary, since the heat sink of the present invention has male and female heads, it is possible to modularize two or more heat sinks to be used. In addition, the positioning structure set on the male and female heads, = when loading the disguise, _ sound or hand silk _ shirt has been assembled

^因此具有組裝便利性。另外’我們也可从利用不同 選擇熱S綠裝賴組化散熱^S此組裝時的尺寸 类、步而言，模組化散熱器可依紐達到的散熱效 只*、.且裝形狀荨需求來決定其組裝模式、形狀及大小， =貼近客戶的錢需求’因此相相符合客製化之服 務的目的。^ Therefore, it has assembly convenience. In addition, we can also use the different types of heat S green assembly heat dissipation ^S assembly size, step, the modular heat sink can achieve the heat dissipation effect only *, and shape The demand determines the mode, shape and size of the assembly, = close to the customer's money needs 'so it meets the purpose of customized service.

—雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範_，當可作些許之更動與潤飾， ^本發明之賴範圍當視後附之申請專職圍所界定者 為準。 【圖式間單說明】 ，ΙΑ、1B及lc分別為本發明一實施例之模組化散 ，，、、益三個不同視角的示意圖。 圖2A為將兩個散熱器組裝前的示意圖。 圖2B為圖2a之散熱器組裝後的示意圖。 13 Γ v 1337837 0960085 23945twf.doc/n 圖3A及圖3B為固定件之兩個視角的示意圖。 圖4為本發明另一實施例之模組化散熱器的示意圖。 【主要元件符號說明】 1000、2000 :散熱器 1100 :底座 1120 :母頭 1122 :第一定位結構 1124 :挾持部 * 1126:第-定位孔 1140、2140 :公頭 1142、2142 :第二定位結構 1200 :鰭片組 2144 ··緊縮部 2146 :第二定位孔 2200 :固定件 2222 :本體 φ 2222a:第一表面 2222b :第二表面 2224 :彈片 2226 :折彎部 2224a :插銷 2300 :空隙 3000、3000’ ：模組化散熱器 14 • 5The present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the invention, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. ^ The scope of the invention is subject to the definition of the application for full-time enclosure. [Illustration of the drawings], ΙΑ, 1B, and lc are schematic diagrams of three different perspectives of modularization, and, and benefits, respectively, according to an embodiment of the present invention. 2A is a schematic view of the two heat sinks before assembly. 2B is a schematic view of the heat sink of FIG. 2a assembled. 13 Γ v 1337837 0960085 23945twf.doc/n Figures 3A and 3B are schematic views of two viewing angles of the fixture. 4 is a schematic diagram of a modular heat sink according to another embodiment of the present invention. [Main component symbol description] 1000, 2000: heat sink 1100: base 1120: female 1122: first positioning structure 1124: holding portion * 1126: first positioning hole 1140, 2140: male 1142, 2142: second positioning structure 1200: fin group 2144 · tightening portion 2146: second positioning hole 2200: fixing member 2222: body φ 2222a: first surface 2222b: second surface 2224: elastic piece 2226: bent portion 2224a: pin 2300: gap 3000, 3000': modular radiator 14 • 5

Claims (1)

1337837 99-9-3 十、申請專利範面： 1.一種模組化散熱器，包括： 二第:if器，包括一第一底座及一第一趙片組，其 中該第-則組配置於該第—底座上，而該第一 一母頭’該母頭具有多個第一定朽 -八有 貫贫該母頭；有夕㈣疋位孔，且該些第一定位孔1337837 99-9-3 X. Patent application: 1. A modular radiator, comprising: a second: if device, comprising a first base and a first Zhao group, wherein the first group configuration On the first base, and the first female head 'the female head has a plurality of first fixed-eight-passing the female head; the outer (four) clamping holes, and the first positioning holes 一ί二散熱器，連接於該第一散熱器，包括-第二底 座及則組，其中該第二則組配置於該第二底座 該她找賤母頭中， 定位孔’該些第二定位孔貫穿該公頭 旅與該些第一定位孔相對應；以及 定件，適於固定該第—散 器，該固定件包括： 取*、、、 一本體；以及 _ · 彈片延伸自該本體，並輕曲於該本體之一第 〆表面」、中該彈片之末端有—插銷，而該插銷位於該彈 片朝向:第二表面’且該插銷插人兩相對應之該第一定位 孔與該第二定位孔，以岐該第一散㈣及該第二散熱器。 2. 如申凊專利範圍第1項所述之模組化散熱器，其中 該母頭=側有至少-第-定位結構，而該公頭外側有至少 H位結構’且該第-定位結構與該第二定位結構相 對應。 3. =申請專利範圍第2項所述之模組化散熱器，其中 該第1位結構為凸點，而該第二定位結構為凹槽。 15 99-9-3 4·如中請專利範圍第2項所述之模組化散熱器，其中 SX 疋位結構為凹槽，而該第二定位結構為凸點。 5.如φ請專利範圍第2項所述之模組化散熱器其中 具有—挾持部，延伸自該第—底座，該公頭具有一 …部，且該第一散熱器之該挾持部適於挾持該緊縮部。 6·如申請專利範圍第丨項所述之模組化散熱器其中 底座與該第一鰭片組為一體成型。 货λ如申請專利範圍第丨項所述之模組化散熱器，其中 Λ 一底座與該第二鰭片組為一體成型。 8.如申請專利範圍第i項所述之模組化散熱器，其中 孩些固定件之材質包括金屬或塑膠。 9·如申請專利範圍第丨項所述之模組化散熱器，該本 具有一折彎部，位於該本體之侧邊，其中折彎該折彎 …使該折彎部彎曲至該彈片上方，以限位該彈片。a second heat sink connected to the first heat sink, comprising: a second base and a group, wherein the second group is disposed in the second base, the female is positioned in the female head, and the positioning holes are the second positioning a hole extending through the male locator corresponding to the first locating holes; and a fixing member adapted to fix the first scatterer, the fixing member comprising: taking a *, , a body; and _ · a spring extending from the body And the light is bent on a second surface of the body, wherein the end of the elastic piece has a latch, and the latch is located at the second surface of the elastic piece and the pin is inserted into the corresponding first positioning hole and The second positioning hole is for the first dispersion (four) and the second heat sink. 2. The modular heat sink of claim 1, wherein the female head = side has at least a - first positioning structure, and the male outer side has at least an H position structure 'and the first positioning structure Corresponding to the second positioning structure. 3. The modular heat sink of claim 2, wherein the first position structure is a bump and the second positioning structure is a groove. The modular heat sink of claim 2, wherein the SX clamp structure is a groove and the second positioning structure is a bump. 5. The modulating heat sink of the second aspect of the patent scope has a holding portion extending from the first base, the male head having a portion, and the holding portion of the first heat sink is adapted Yu held the tightening department. 6. The modular heat sink of claim 2, wherein the base is integrally formed with the first fin set. The modular heat sink of the invention of claim 2, wherein the base and the second fin set are integrally formed. 8. The modular heat sink of claim i, wherein the material of the fixing member comprises metal or plastic. 9. The modular heat sink of claim 2, wherein the body has a bent portion on a side of the body, wherein the bend is bent, the bend is bent over the elastic piece To limit the shrapnel. 1616
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US20080302509A1 (en) 2008-12-11
US8056614B2 (en) 2011-11-15

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