JP2010103308A - Electronic device, light source device, and display having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device, a light source device, and a display that suppresses rise in temperature of a circuit board and components, such as a light emitting diode and a driver mounted on a circuit board, due to heat generation of the components. <P>SOLUTION: The electronic device includes a light emitting diode substrate 3 which includes a circuit portion and is mounted with the light emitting diode 1, a heat sink 12 which dissipates heat conducted to the light emitting diode substrate 3, and a flexible printed substrate 4 which includes a first conductor layer 41 connected to the circuit portion and a second conductor layer 42 connected to a non-circuit portion of the light emitting diode substrate 3. The heat sink 12 is arranged in contact with the second conductor layer 42, so that the heat conducted to the light emitting diode substrate 3 is conducted to the heat sink 12 from the light emitting diode substrate 3 to the second conductor layer 42 of the flexible printed substrate 4 to be dissipated. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board on which components are mounted, a light source device used as a light source of a display device such as an electronic device, a liquid crystal display device, and the like, and a display device including the light source device. About.

  In a display device such as a television, a light source device is disposed on the rear side of a display unit having a display surface for displaying an image on the front side, and an electronic device is provided in the light source device.

The light source device includes, for example, a plurality of light-emitting diode substrates on which light-emitting diodes are mounted, and a box-shaped frame that accommodates and supports the light-emitting diode substrates, and a portion of the bottom plate that faces the light-emitting diode substrate in the box-shaped frame. A heat radiating hole is opened, and the side opposite to the mounting surface of the light emitting diode substrate is exposed to the heat radiating hole, and the heat generated by the light emitting diode as the light source is radiated from the heat radiating hole to the outside of the box frame. (For example, refer to Patent Document 1).
JP 2007-317778 A

  However, in the light source device that dissipates heat by opening a heat dissipation hole in the box frame as in Patent Document 1, the side opposite to the mounting surface of the light emitting diode substrate touches the outside air of the box frame and radiates heat by natural convection. Therefore, there is a problem that the heat dissipation of the light emitting diode substrate is poor.

  A display device such as a television can be thinned by using a light emitting diode as a light source. However, since the luminance characteristic cannot be improved only by using the light emitting diode as in Patent Document 1, generally, a light guide plate that uniformly guides light emitted from the light emitting diode in the direction opposite to the light emitting diode substrate is used. ing.

  However, the light emitting diode substrate is mounted with a light emitting diode and a driver for operating the light emitting diode, and the driver has a larger mounting area than the light emitting diode and is higher than the height of the light emitting diode. Arrangement places are restricted, and as a result, arrangement places of light emitting diodes are restricted, which hinders improvement of luminance characteristics.

  FIG. 15 is an enlarged cross-sectional view showing a configuration of an electronic device incorporated in the previously developed light source device. The applicant of the present invention mounts the light emitting diode 101 on one surface of the light emitting diode substrate 100 and the driver 102 for operating the light emitting diode 101 on the other surface as shown in FIG. We have developed a light source device that can improve the luminance characteristics. Further, since the light emitting diode 101 is more likely to have luminance unevenness as the temperature rises, in the light source device developed previously, heat radiation having a thickness equal to or greater than the height of the driver 102 is provided on the driver mounting surface side of the light emitting diode substrate 100. By providing the plate 103 away from the driver 102, heat generated by the heat generated by the driver 102 is radiated from the light emitting diode substrate 100 to the outside through the heat radiating plate 103, and the temperature of the light emitting diode substrate 100 is increased by the driver 102. It suppresses and reduces uneven brightness.

  However, in the previously developed light source device, since the heat sink 103 is provided avoiding the driver 102 that operates the light emitting diode 101, the heat dissipation area of the heat sink 103 with respect to the light emitting diode substrate 100 is limited, and heat dissipation is reduced. It is difficult to improve efficiency, and the heat sink 103 having a thickness greater than the height of the driver 102 hinders the reduction in thickness, and further improvement measures have been demanded.

  This invention is made | formed in view of such a situation, and the main objective is connected to the 1st conductor layer and non-circuit part connected to the circuit part of the circuit board in which components, such as a light emitting diode, are mounted. A flexible printed circuit board having a second conductor layer is provided, and a heat radiator is placed in contact with the second conductor layer of the flexible printed circuit board, thereby efficiently increasing the temperature of the circuit board and the components mounted on the circuit board. An object of the present invention is to provide an electronic device, a light source device, and a display device that can be well controlled and can be reduced in thickness without being affected by a radiator.

  An electronic device according to the present invention includes a circuit board having a circuit part, on which a component is mounted, and a heat radiator that dissipates heat transmitted to the circuit board, and is connected to the circuit part. A flexible printed circuit board having a first conductor layer and a second conductor layer connected to a non-circuit portion of the circuit board, wherein the heat dissipator is disposed in contact with the second conductor layer. And

  In the present invention, heat transferred from the component mounted on the circuit board to the circuit board can be directly radiated from the circuit board, and from the circuit board through the second conductor layer of the flexible printed board. Since it can transmit to a heat radiator, the temperature rise of the circuit board and the components mounted on the circuit board can be efficiently suppressed. Therefore, when the light-emitting diode as the light source is the above-described component, the luminance unevenness due to the temperature rise of the light-emitting diode can be reduced, and the thickness can be reduced without being affected by the radiator.

In the electronic device according to the present invention, the second conductor layer is preferably laminated on the first conductor layer via an insulating layer.
In the present invention, since the second conductor layer is formed without affecting the first conductor layer of the flexible printed circuit board, the contact area of the second conductor layer with the radiator is relatively increased. It is possible to improve heat dissipation in the flexible printed circuit board.

In the electronic device according to the present invention, it is preferable that the second conductor layer has a mounting piece that is biased toward the first conductor layer and is attached to the non-circuit portion.
In this invention, since the mounting piece also serves as the heat transfer portion, the mounting piece is attached to the circuit board, so that the heat transmitted from the mounted component to the circuit board is transmitted from the mounting piece to the second conductor. Heat can be transferred to the layer and heat transfer to the flexible printed circuit board can be improved.

In the electronic device according to the present invention, the mounting piece is disposed at two positions on the periphery of the flexible printed board, and the first conductor layer has a connection portion disposed between the mounting pieces. Is preferable.
In this invention, since the position of the attachment piece relative to the circuit board is determined by connecting the connecting portion to the circuit board, the workability of assembling the flexible printed board can be improved.

The electronic device according to the present invention preferably includes a second component related to the component, and the first conductor layer has the second component mounted thereon.
In the present invention, the second component related to the component mounted on the circuit board is mounted on the flexible printed board without being mounted on the circuit board, and the flexible printed board is connected to the circuit board. Therefore, the heat generated by the heat generation of the second component can be suppressed from being directly transmitted to the circuit board, and the heat can be radiated from the flexible printed board through the mounting surface of the second component, and the heat radiation area is relatively large. Therefore, the temperature rise of the circuit board and the components mounted on the circuit board can be further suppressed. Therefore, when the light emitting diode as a light source is the said component, the brightness nonuniformity by the temperature rising of this light emitting diode can be reduced further. In addition, since the circuit board on which the components are mounted and the second component mounted on the flexible printed circuit board can be juxtaposed, the electronic device can be further reduced in thickness.

In the electronic device according to the present invention, it is preferable that a plurality of the circuit boards are juxtaposed and the flexible printed circuit board is connected to an adjacent circuit board.
In this invention, the heat transmitted to each adjacent circuit board is transmitted to the flexible printed circuit board connected to the adjacent circuit board, and can be dissipated from the heat radiator of the flexible printed circuit board. The heat transmitted to each adjacent circuit board can be efficiently radiated.

In addition, the electronic device according to the present invention preferably includes a support having a support surface that supports the circuit board, and a recess is provided at a position facing the flexible printed board in the support. .
In the present invention, the heat dissipating member that is in contact with the second conductor layer of the flexible printed circuit board can be disposed on the side opposite to the support surface of the support body, so that the heat transmitted to the circuit board can be more efficiently performed. It can dissipate heat.

In the electronic device according to the present invention, it is preferable that the second component is accommodated in the recess.
In this invention, since the 2nd component mounted in a flexible printed circuit board is accommodated in the recessed part of the support body which supports a circuit board, in the structure provided with a support body, the magnitude | size of the said 2nd component The electronic device can be thinned without being affected by the above.

In the electronic device according to the present invention, it is preferable that the heat dissipator is in contact with a surface of the support opposite to the support surface.
In the present invention, the heat transferred from the circuit board to the flexible printed board can be transferred from the second conductor layer of the flexible printed board to the support through the heat sink, and can be radiated from the support. Therefore, the temperature rise of the circuit board and the components mounted on the circuit board can be more efficiently suppressed. Therefore, when the light emitting diode as a light source is the said component, the brightness nonuniformity by the temperature rising of this light emitting diode can be reduced further.

The light source device according to the present invention includes the electronic device according to the above-described invention in which the component is a light-emitting diode, and a light guide plate that guides light emitted from the light-emitting diode in a direction opposite to the circuit board. To do.
In this invention, the heat transferred from the light emitting diode mounted on the circuit board to the circuit board can be radiated from the heat radiating body attached to the flexible printed circuit board, and the heat radiation area is relatively large. Therefore, the temperature rise of the circuit board and the light emitting diode mounted on the circuit board can be suppressed, and unevenness in luminance due to the temperature rise of the light emitting diode can be reduced.
In addition, since the circuit board on which the light emitting diode is mounted and the heat dissipator that contacts the flexible printed board can be juxtaposed, the light source device including the electronic device and the light guide plate can be thinned.

The display device according to the present invention includes a display unit having a display surface on one side and the light source device of the above-described invention disposed on the other side of the display unit.
In the present invention, since the temperature rise of the circuit board provided in the light source device and the light emitting diode mounted on the circuit board can be efficiently suppressed, luminance unevenness due to the temperature rise of the light emitting diode can be reduced, and Therefore, the thickness can be reduced without being affected by the heat radiating body.

  According to the present invention, heat transferred from a component mounted on a circuit board to the circuit board is dissipated from the heat sink disposed in contact with the flexible printed circuit board and the second conductor layer of the flexible printed circuit board. In addition, since the heat radiation area can be made relatively large, the temperature rise of the circuit board and the components mounted on the circuit board can be suppressed, and it is thin without being affected by the heat radiator. Can be achieved.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.
Embodiment 1
1 and 2 are enlarged sectional views showing the configuration of an electronic device incorporated in the light source device, FIG. 3 is a plan view showing the configuration of a flexible printed circuit board in the electronic device, and FIG. 4 is an electronic device portion incorporated in the light source device. FIG. 5 is an enlarged rear view showing the configuration of the electronic device part incorporated in the light source device, FIG. 6 is a rear view showing the configuration of the light source device, and FIG. It is a rear view which shows the structure of the state which removed the circuit board of the part.

  The illustrated light source device has a display surface on the front side and is mounted on the rear side of the display unit in a thin display device having a display unit having a substantially rectangular parallelepiped shape. A diode 1 and a driver 2 for operating the light emitting diode 1 and each of the light emitting diodes 1 are mounted, and a plurality of light emitting diode substrates 3 juxtaposed in a lattice shape and adjacent light emitting diode substrates 3 and 3 The flexible printed circuit board 4 to which both ends are connected, the support 5 that supports the light emitting diode substrate 3 side by side, a plurality of light guide plates 6 that guide the light emitted by the light emitting diodes 1 in the lateral direction, and the light guide plate 6 led. A plurality of reflecting plates 7 that reflect light in the opposite direction to the support 5 are provided.

  8 is a schematic exploded view showing the configuration of the light emitting diode substrate portion, FIG. 9 is a schematic front perspective view showing the configuration of the electronic device portion incorporated in the light source device, and FIG. 10 shows the configuration of the light emitting diode substrate portion. It is typical sectional drawing.

  The light-emitting diode substrate 3 has a substantially rectangular shape having circuit portions on one surface and the other surface, and a plurality of light-emitting diodes 1 are arranged side by side in the longitudinal direction and the width direction on one surface, and each light-emitting diode 1 on one surface is mounted on the other surface. One driver 2 and two connection portions 31 and 32 for operation are provided.

  As shown in FIG. 8 (a), a total of 32 light emitting diodes 1 are mounted in the longitudinal direction and 4 in the width direction, for example, and a total of 32 light emitting diodes 1 are mounted. An optical plate 6 is arranged, and one reflecting plate 7 corresponding to the light emitting diodes 1 in the longitudinal direction is arranged, and a total of four reflecting plates 7 are arranged.

  In the light emitting diode substrate 3, first insertion holes 33 for attaching the light guide plate 6 to the support 5 with the fasteners 9 are provided corresponding to the respective light guide plates 6. The relationship between one light-emitting diode substrate 3 and the light guide plate 6 is configured as shown in FIG. 8 (b). As shown in FIG. 9, the longitudinal direction and the width direction are formed on one surface of the support body 5 having a substantially rectangular shape. They are arranged side by side. A reflective layer 34 is formed by silk printing on the portion of the light emitting diode substrate 3 facing each of the light emitting diodes 1.

  In the light-emitting diode substrates 3 arranged side by side, the two adjacent light-emitting diode substrates 3 in the longitudinal direction are connected to each other by a flexible printed circuit board 4, and the light-emitting diode substrate 3 at one end is connected to a power circuit board described later. The flexible printed circuit board 10 is connected, and the light emitting diode substrate 3 at the other end is connected to a control circuit board described later by a third flexible printed circuit board 11 (see FIGS. 1, 2, and 4).

  The flexible printed circuit board 4 includes an insulating film, a first conductor layer 41 having a circuit portion printed on one surface of the insulating film, and a film-like second conductor layer laminated on the other surface side of the insulating film. 42 and an insulating layer covering each of the first and second conductor layers 41 and 42, and connection portions 43 and 44 are provided at both ends in the longitudinal direction (see FIGS. 1 to 3). ).

  The corner portions at both ends of the first conductor layer 41 are omitted, and connection portions 43 and 44 are provided in the first conductor layer 41 between the notch portions 4a and 4a.

  At least the central portion of the insulating layer covering the second conductor layer 42 is peeled off, and the sheet-like heat radiator 12 is joined to the second conductor layer 42 exposed by the peeling. The center portions in the width direction of both end portions of the second conductor layer 42 are removed, and mounting pieces 45 that are biased toward the first conductor layer 41 side from the notched portion 4b on both sides (corner portions) of the notched portion 4b. 45 is provided, and the insulating films on both sides of the notch 4a are removed, and the mounting pieces 45, 45 are exposed.

  As shown in FIG. 2, the attachment pieces 45, 45 are bent in different directions as shown in FIG. 2, and have a substantially L-shape so that the tip portion is in surface contact with the other surface of the light emitting diode substrate 3. A through hole 46 penetrating in the thickness direction is opened at the front part of the mounting pieces 45, 45, and the metal male screw 13 inserted into the through hole 46 is screwed into the light emitting diode substrate 3 so that the front part is It is fixed so that it is in surface contact with the other surface, and heat transmitted to the light emitting diode substrate 3 can be transmitted to the mounting pieces 45, 45 through the male screw 13.

  The heat dissipating body 12 is a sheet having a rectangular shape with both ends projecting outward from both side edges of the flexible printed circuit board 4, and is configured such that both ends are in surface contact with the other surface of the plate portion of the support described later. Has been.

  FIG. 11 is a perspective view showing the configuration of the light guide plate. The light guide plate 6 has a substantially rectangular parallelepiped shape, and includes a light incident surface 6a and a light exit surface 6b that irradiates light incident on the light incident surface 6a in a direction substantially orthogonal to the light incident surface 6a. A light incident surface 6a is disposed at a position facing one side, a light exit surface 6b is disposed at a position facing the rear surface of the display unit, and a reflecting plate 7 is disposed on a surface opposite to the light exit surface 6b. It is pasted. Specifically, one surface on one side in the longitudinal direction is a flat surface parallel to the light emitting diode substrate 3, and one surface and the other surface on the other side in the longitudinal direction are inclined surfaces that are inclined with respect to the light emitting diode substrate 3. A square-shaped accommodation hole 61 and a second insertion hole 62 corresponding to the first insertion hole 33 are formed at the other end, and one surface of the accommodation hole 61 is a light incident surface 6a and a flat surface is a light emission surface 6b. The reflective plate 7 is affixed on the other surface.

  The light guide plate 6 is juxtaposed so that one inclined surface and the other surface of the adjacent light guide plate 6 face each other, and the light output surface 6 b of each light guide plate 6 is flush with the light emitting diode substrate 3. And fixed to the support 5 by the stopper 9 inserted into the second insertion hole 62 and the first insertion hole 33.

  The stopper 9 includes two pins 91 that are spaced apart from each other and a connecting plate 92 that connects one end of the pin 91, and the second light guide plate 6 has a second insertion hole 62 to the first insertion hole 33. The light guide plate 6 and the light emitting diode substrate 3 are fixed to the support 5 by inserting the pins 91 and fitting the tip portions of the pins 91 into mounting holes described later.

  The support 5 is formed by forming a metal plate, and has a flat plate portion 51 having a substantially rectangular shape. The light emitting diode substrate 3 and the light guide plate 6 shown in FIG. Are arranged side by side in the longitudinal direction and the width direction, and a spacer 14 is interposed between each light emitting diode substrate 3 and the plate portion 51. The spacer 14 has heat dissipation properties and is arranged avoiding the driver 2 mounted on the other surface of the light emitting diode substrate 3.

  The plate portion 51 includes a plurality of recesses 52 for connecting the flexible printed circuit board 4 to the light emitting diode substrates 3 and 3 from the other side of the plate portion 51, and the second flexible printed circuit board 10 and the third flexible printed circuit board 11. Corresponding to the plurality of through holes 53 and 54 for connecting each from the other surface side of the plate portion 51 to the light emitting diode substrate 3 and the first insertion hole 33, each of the light guide plates 6 is attached by the fastener 9. A plurality of mounting holes 55 are opened.

  The recess 52 is formed of a rectangular hole that passes therethrough and is formed slightly larger than the flexible printed circuit board 4. The recess 52 is concealed by a part of the adjacent light emitting diode substrates 3 and 3 as shown in FIGS. 1 and 2, and the distance between the adjacent light emitting diode substrates 3 and 3 is relatively short.

  The second flexible printed circuit board 10 is connected to one side portion in the longitudinal direction of the other surface of the plate portion 51, and a power supply circuit board 15 for supplying a voltage to the driver 2 is attached. A third flexible printed board 11 is connected, and a control circuit board 16 for controlling the driver 2 is attached. A power circuit board 17 for supplying a voltage to the display section, a terminal circuit board 18 for processing an image displayed on the display surface of the display section, and the display section A plurality of circuit boards such as a control circuit board 19 for controlling the above are attached.

  In the light source device configured as described above, the light emitting diode substrates 3 are juxtaposed in a plurality of rows on the one surface of the plate portion 51 of the support 5 via the spacers 14, and a plurality of light guide plates 6 are disposed on the light emitting diode substrate 3. By inserting the pin 91 of the stopper 9 which is juxtaposed in a row and inserted into the second insertion hole 62 and the first insertion hole 33 into the mounting hole 55, each of the light emitting diode substrates 3 is placed on the plate portion 51 via the spacer 14. While being fixed to one surface, each of the light guide plates 6 is fixed on the light emitting diode substrate 3.

  Further, both end portions of the flexible printed circuit board 4 are inserted into the recess 52 from the other surface side of the plate section 51, and the connection portions 43 and 44 of the flexible printed circuit board 4 are connected to the connection portions 31 and 32 of the light emitting diode substrate 3. The power circuit board 15 and the control circuit board 16 are attached to the other surface of the plate portion 51, the one end side light emitting diode substrate 3 and the power circuit board 15 are connected by the second flexible printed circuit board 10, and the other end of the row. The side light emitting diode substrate 3 and the control circuit substrate 16 are connected by the third flexible printed circuit board 11.

  The flexible printed circuit board 4 that connects the adjacent light emitting diode substrates 3 and 3 includes the first conductor layer 41 connected to the circuit portion of the light emitting diode substrate 3 and the second conductor layer 42 connected to the non-circuit portion. The heat conductor 12 is attached to the second conductor layer 42, and the heat transmitted from the light emitting diode 1 and the driver 2 to the light emitting diode substrate 3 is transmitted from the second conductor layer 42 to the heat radiator 12; Heat can be radiated from the heat radiating body 12, and the heat radiating area can be relatively increased. Therefore, the temperature rise of the light emitting diode substrate 3 and the light emitting diode 1 and the driver 2 mounted on the light emitting diode substrate 3 can be suppressed, and the luminance unevenness due to the temperature rise of the light emitting diode 1 can be reduced.

  The radiator 12 is in surface contact with the other surface of the plate portion 51 in the support 5 that supports the light-emitting diode substrate 3, and the heat transmitted to the radiator 12 is transmitted from the radiator 12 to the support 5. Since heat can be radiated from the support 5, the heat dissipation by the heat radiating body 12 can be further enhanced, and unevenness in brightness due to the temperature rise of the light emitting diode 1 can be further reduced.

  Further, since the heat dissipating body 12 bonded to the flexible printed circuit board 4 that connects the adjacent light emitting diode substrates 3 and 3 can be juxtaposed with the adjacent light emitting diode substrates 3 and 3, the light emitting diode substrate 3. The portion can be thinned, and the light source device can be thinned. Further, since the heat dissipating body 12 is disposed in the recess 52 opened to connect adjacent light emitting diode substrates 3 and 3 from the other surface side of the plate portion 51, the light emitting diode substrate 3 and the plate portion 51 are arranged. The distance between the light source device and the light source device can be reduced.

  FIG. 12 is a cross-sectional view illustrating a configuration of a display device including the light source device according to the present invention. This display device includes a display unit 80 having a display screen for displaying a television image on the front side, a light source device A disposed on the rear side of the display unit 80, a peripheral portion of the display unit 80, and a rear of the light source device A. And a cabinet 81 covering the side.

  The display unit 80 includes a display panel 82 having a display surface and an optical sheet 83 arranged on the rear side of the display panel 82. The peripheral portion of the display panel 82 is held in the front and back by the front holding frame body 84 and the rear holding frame body 85 to form a panel module, and the rear holding frame body 85 is formed on the peripheral portion of the support 5. Installed.

  The optical sheet 83 includes two relatively thick diffuser plates 83a for diffusing light emitted from the light emitting diode 1 as a light source, and a relatively thin synthetic resin sheet 83b such as a reflective polarizing plate, a prism sheet, and a diffuser sheet. Are laminated, and the periphery of the diffusion plate 83a is supported on the periphery of the support 5 via a second support plate described later.

  A step portion 56 that is biased in the plate thickness direction is provided at the peripheral portion of the plate portion 51 of the support 5, and a part of each light guide plate 6 is supported between the step portion 56 and the light emitting diode substrate 3. An elongated first support plate 86 is attached, and an elongated second support plate 87 that supports the optical sheet 83 is attached to the peripheral side of the step portion 56.

  The cabinet 81 includes a cabinet front part 81 a that covers the front side of the peripheral part of the display unit 80, and a deep dish-shaped cabinet rear part 81 b that covers the peripheral part and the rear side of the light source device A. It is attached to the periphery of this by a male screw.

Embodiment 2
FIG. 13 is an enlarged cross-sectional view showing another configuration of the electronic device incorporated in the light source device. In this electronic device, the light emitting diode 1 is mounted on the light emitting diode substrate 3 instead of the light emitting diode 1 and the driver 2 mounted on the light emitting diode substrate 3. It is set as the structure mounted in the conductor layer 41 of this.

  In this embodiment, a part of the insulating layer on the first conductor layer 41 side of the flexible printed circuit board 4 is peeled off, and a driver 2 as a second component is attached to the circuit portion exposed by the peeling by a chip on board (COB). Implemented.

  In the embodiment shown in FIG. 13, the light-emitting diode substrate 3 has the light-emitting diode 1 mounted on one surface, and operates the light-emitting diode 1 on the flexible printed circuit board 4 that connects the adjacent light-emitting diode substrates 3 and 3 together. Since the driver 2 and the heat radiating body 12 are provided, the heat generated by the heat generated by the driver 2 can be prevented from being directly transmitted to the light emitting diode substrate 3, and the heat can be transmitted from the flexible printed circuit board 4 to the heat radiating body 12. Therefore, the temperature rise of the light emitting diode substrate 3 and the light emitting diode 1 mounted on the light emitting diode substrate 3 can be further suppressed. Luminance unevenness due to temperature rise can be further reduced.

  Further, the driver 2 mounted on the flexible printed circuit board 4 that connects the adjacent light emitting diode substrates 3 and 3 can be juxtaposed with the adjacent light emitting diode substrates 3 and 3 in a line, and the spacer 14 is eliminated. Therefore, it is possible to further reduce the thickness of the light-emitting diode substrate 3 and thus further reduce the thickness of the light source device.

  In addition, since the driver 2 is disposed in the recess 52 opened to connect the adjacent light emitting diode substrates 3 and 3 from the other surface side of the plate portion 51, the light emitting diode substrate 3 and the plate portion 51 Can be made relatively short, and the light source device can be made even thinner. In addition, since the separation distance between the adjacent light emitting diode substrates 3 and 3 can be made relatively short without being affected by the size of the driver 2 disposed in the recess 52, it is mounted on the light emitting diode substrate 3. The light emitting diodes 1 can be arranged at relatively short intervals, and the luminance characteristics of the light emitting diodes 1 can be improved.

Embodiment 3
FIG. 14 is an enlarged cross-sectional view showing another configuration of the electronic device incorporated in the light source device. In this electronic device, the flexible printed circuit board 4 is transmitted to the light emitting diode substrate 3 between the mounting pieces 45 and 45 of the flexible printed circuit board 4 and the other surface of the light emitting diode substrate 3 instead of the configuration in which the flexible printed circuit board 4 is mounted with a male screw. The sheet-like heat transfer body 20 that transfers the heat to the second conductor layer 42 of the flexible printed circuit board 4 is provided.

  When the connection portions 43 and 44 are connected to the connection portions 31 and 32, the heat transfer body 20 is held between the attachment pieces 45 and 45 and the other surface of the light emitting diode substrate 3. The structure currently hold | maintained previously at the other surface of the pieces 45 and 45 or the light emitting diode board | substrate 3 may be sufficient.

  In the embodiment shown in FIG. 14, the heat transmitted to the light emitting diode substrate 3 can be transmitted to the second conductor layer 42 of the flexible printed circuit board 4 without using the male screw. Thus, the flexible printed circuit board 4 can be assembled without performing the screwing operation, and the assembling workability can be improved.

  In the embodiment described above, the temperature rise of the light emitting diode substrate 3 on which the light emitting diode 1 is mounted as a light source is suppressed. However, the circuit board for suppressing the temperature rise is provided on the light emitting diode substrate 3. Not limited.

  In the embodiment described above, the heat dissipating body 12 is joined to the second conductor layer 42 of the flexible printed board 4 and arranged in contact therewith. It is good also as a structure arrange | positioned so that an edge part may be joined to the board part 51 of the support body 5, and the center part may contact the 2nd conductor layer 42, without joining.

  In the embodiment described above, the second component related to the component mounted on the light-emitting diode substrate 3 as the circuit board is the driver 2, but the second component is not limited to the driver 2.

  Further, in the embodiment described above, the recess 52 that penetrates the flexible printed circuit board 4 is provided at the location facing the flexible printed circuit board 4. However, the recess 52 is a support surface that supports the light emitting diode substrate 3. It may be a non-penetrating recess that is more recessed. Further, the recess 52 is not always necessary.

It is an expanded sectional view which shows the structure of the electronic device integrated in the light source device which concerns on this invention. It is an expanded sectional view which shows the structure of the electronic device integrated in the light source device which concerns on this invention. It is a top view which shows the structure of the flexible printed circuit board in the electronic device which concerns on this invention. It is a typical back side perspective view showing composition of an electronic device part built in a light source device concerning the present invention. It is the expanded rear view which shows the structure of the electronic device part integrated in the light source device which concerns on this invention. It is a rear view which shows the structure of the light source device which concerns on this invention. It is a rear view which shows the structure of the state which removed some circuit boards of the light source device which concerns on this invention. It is a typical exploded view showing composition of a light emitting diode substrate part of a light source device concerning the present invention. It is a typical front side perspective view which shows the structure of the electronic device part integrated in the light source device which concerns on this invention. It is typical sectional drawing which shows the structure of the light emitting diode board | substrate part of the light source device which concerns on this invention. It is a perspective view which shows the structure of the light-guide plate of the light source device which concerns on this invention. It is sectional drawing which shows the structure of a display apparatus provided with the light source device which concerns on this invention. It is an expanded sectional view which shows the other structure of the electronic device integrated in the light source device which concerns on this invention. It is an expanded sectional view which shows the other structure of the electronic device integrated in the light source device which concerns on this invention. It is an expanded sectional view which shows the structure of the electronic device integrated in the light source device developed previously.

Explanation of symbols

1 Light-emitting diode (component)
2 Drivers (parts, second parts)
3 Light-emitting diode substrate (circuit board)
DESCRIPTION OF SYMBOLS 4 Flexible printed circuit board 41 1st conductor layer 42 2nd conductor layer 43,44 Connection part 45 Mounting piece 5 Support body 52 Recess 6 Light guide plate A Light source device 80 Display part

Claims (11)

  In an electronic device comprising a circuit board having a circuit part on which components are mounted, and a heat radiator that dissipates heat transmitted to the circuit board, the first conductor layer connected to the circuit part and the An electronic device comprising a flexible printed circuit board having a second conductor layer connected to a non-circuit portion of a circuit board, wherein the heat dissipating member is disposed in contact with the second conductor layer.   The electronic device according to claim 1, wherein the second conductor layer is laminated on the first conductor layer via an insulating layer.   The electronic device according to claim 1, wherein the second conductor layer includes an attachment piece that is biased toward the first conductor layer and is attached to the non-circuit portion.   The electronic device according to claim 3, wherein the attachment pieces are arranged at two positions on the periphery of the flexible printed board, and the first conductor layer has a connection portion arranged between the attachment pieces.   The electronic device according to claim 1, further comprising a second component related to the component, wherein the first conductor layer has the second component mounted thereon.   The electronic device according to claim 1, wherein a plurality of the circuit boards are juxtaposed and the flexible printed circuit board is connected to an adjacent circuit board.   The electronic device according to claim 1, further comprising a support body having a support surface that supports the circuit board, wherein a recess is provided at a position of the support body facing the flexible printed circuit board.   The electronic device according to claim 7, wherein the second component is accommodated in the recess.   The electronic device according to claim 7, wherein the radiator is in contact with a surface of the support opposite to the support surface.   The electronic device according to any one of claims 1 to 9, wherein the component is a light emitting diode, and a light guide plate that guides light emitted from the light emitting diode in a direction opposite to the circuit board. Light source device.   A display device comprising: a display unit having a display surface on one side; and the light source device according to claim 10 disposed on the other side of the display unit.

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