JP2007193946A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
JP2007193946A
JP2007193946A JP2006008115A JP2006008115A JP2007193946A JP 2007193946 A JP2007193946 A JP 2007193946A JP 2006008115 A JP2006008115 A JP 2006008115A JP 2006008115 A JP2006008115 A JP 2006008115A JP 2007193946 A JP2007193946 A JP 2007193946A
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light
light source
heat
guide plate
frame
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Takuo Hirokawa
拓郎 広川
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device performing superb heat radiation with excellent luminous efficiency. <P>SOLUTION: The light-emitting device, provided with a light source 7 consisting of a light-emitting diode, a light guide plate 4 having a light-receiving face 43a guiding in light from the light source 7 and an irradiation face 41 emitting light in plane with the light guided from the light-receiving face 43a, a circuit board 6 supplying power to the light source 7, and a frame 1 housing the light source 7 and the light guide plate 4, is also provided with a heat radiation member 8 in contact with a peripheral part of the frame 1 and separated from a center part of the frame 1 to form a space part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、例えば液晶パネルからなる受光式表示パネルを照明する発光装置に関するもので、特に光源として発光ダイオードを用いた発光装置に係わる。   The present invention relates to a light-emitting device that illuminates a light-receiving display panel made of, for example, a liquid crystal panel, and more particularly to a light-emitting device that uses a light-emitting diode as a light source.

この種の光源装置は、受光式表示パネルを背後から照らすバックライト装置あるいは受光式表示パネルを表面から照らすフロントライト装置と称され、種々のものが提案されている。   This type of light source device is called a backlight device that illuminates the light receiving display panel from the back or a front light device that illuminates the light receiving display panel from the surface, and various devices have been proposed.

例えばバックライト装置の例として下記特許文献1に記載のものが知られている。このバックライト装置は、液晶パネルに沿って延在する導光板と、この導光板の側端面(受光面)に沿って対向配置される複数の発光ダイオードと、これら複数の発光ダイオードを支持すると共に電力供給を行う回路基板とを備えている。そして、前記発光ダイオードを実装した回路基板の面に対して反対の面に、軟質金属シートを備えている。前記回路基板と前記軟質金属シートに、熱伝導率が高い金属を使用し、前記発光ダイオードで発生する熱を放熱している。
特開2002−229022号公報
For example, the thing of the following patent document 1 is known as an example of a backlight apparatus. The backlight device supports the plurality of light emitting diodes, a light guide plate extending along the liquid crystal panel, a plurality of light emitting diodes opposed to each other along a side end surface (light receiving surface) of the light guide plate, and And a circuit board for supplying power. And the soft metal sheet is provided in the surface opposite to the surface of the circuit board which mounted the said light emitting diode. A metal having high thermal conductivity is used for the circuit board and the soft metal sheet, and heat generated by the light emitting diode is radiated.
Japanese Patent Laid-Open No. 2002-229022

ところで、光源として発光ダイオードを用いた発光装置にあっては、その発光効率や寿命を確保するために発光ダイオードの熱対策が必要であり、従来のような放熱対策が成されてきた。しかし、このような熱対策を行っても、さらに輝度ムラが少なく、かつ高い輝度を得ようとする場合、発光ダイオードの数を増やしたり、消費電力の大きい発光ダイオードを使用することとなる。すると、従来の熱対策では充分な放熱が行われず、発光ダイオードの発光効率の低下、発光装置の導光板などの熱による変形などの新たな問題が生じてしまう。   By the way, in a light emitting device using a light emitting diode as a light source, it is necessary to take measures against heat of the light emitting diodes in order to ensure the light emission efficiency and lifetime, and conventional heat radiation measures have been taken. However, even if such heat countermeasures are taken, if the luminance unevenness is further reduced and high luminance is to be obtained, the number of light emitting diodes is increased or a light emitting diode with high power consumption is used. Then, sufficient heat dissipation is not performed by the conventional heat countermeasures, and new problems such as a decrease in light emission efficiency of the light emitting diode and deformation due to heat of the light guide plate of the light emitting device occur.

そこで本発明は、良好な放熱を行い、発光効率の良い発光装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a light emitting device that performs good heat dissipation and has high luminous efficiency.

本発明は、前記目的を達成するため、
発光ダイオードからなる光源と、
この光源からの光を導入する受光面とこの受光面から導入した光で面発光する照射面とを有する導光板と、
前記光源に電力供給を行う回路基板と、
前記光源と前記導光板とを収納するフレームとを備えた発光装置において、
前記フレームの一部に接するとともに、前記フレームとの間に空間部を形成する放熱部材を設けた
ものである。
In order to achieve the above object, the present invention provides
A light source comprising a light emitting diode;
A light guide plate having a light receiving surface for introducing light from the light source and an irradiation surface for emitting light by light introduced from the light receiving surface;
A circuit board for supplying power to the light source;
In a light emitting device comprising a frame for housing the light source and the light guide plate,
A heat dissipating member that is in contact with a part of the frame and that forms a space with the frame is provided.

また本発明は、
前記空間部につながる通気部を設けた
ものである。
The present invention also provides
A ventilation portion connected to the space portion is provided.

また本発明は、
前記フレームの一部の前記光源に対応する部分に前記放熱部材を接した
ものである。
The present invention also provides
The heat dissipation member is in contact with a part of the frame corresponding to the light source.

本発明によれば、初期の目的を達成でき、良好な放熱を行い、発光効率の良い発光装置を提供することを目的とすることができる。   According to the present invention, it is possible to achieve an initial object, to perform a good heat dissipation, and to provide a light emitting device having a high luminous efficiency.

以下、図面に基づいて本発明による発光装置を適用した表示装置を例に実施形態を説明する。   Embodiments will be described below with reference to the drawings, taking as an example a display device to which a light emitting device according to the present invention is applied.

本実施形態による表示装置は、フレーム1と、表示パネル2と、光学フィルム3と、導光板4と、反射フィルム5と、回路基板6と、光源7と、放熱部材8と、熱伝導シート(熱伝導体)9、10を備えている。   The display device according to this embodiment includes a frame 1, a display panel 2, an optical film 3, a light guide plate 4, a reflective film 5, a circuit board 6, a light source 7, a heat radiating member 8, a heat conductive sheet ( (Thermal conductor) 9 and 10.

フレーム1は、上フレーム1aと下フレーム1bとからなり、上フレーム1aは、遮光性の合成樹脂からなり、表示パネル2と光学フィルム3のそれぞれを位置決め支持する。   The frame 1 is composed of an upper frame 1a and a lower frame 1b. The upper frame 1a is composed of a light-shielding synthetic resin, and positions and supports each of the display panel 2 and the optical film 3.

下フレーム1bは、金属材料からなり、ほぼ十の字形状の板材の各端部を断面形状が略L字状となるように折り曲げて折り曲げ部1b1を形成してなり、上記のようにフレーム1と組み合わされることにより、光学フィルム3、導光板4、反射フィルム5、光源7及び熱伝導シート(熱伝導体)9の各構成要素を収納するハウジング(筐体)を構成するものであり、また、これら各構成要素を裏側から支持する裏カバーまたはシャーシとして機能する。また、導光板5と光源7との間に空間(空気層)を形成するように、導光板5の位置決めを行う係止片1b2を、複数の光源7が並んだ方向に対して垂直方向に延びる各折り曲げ部1b1に備えている。本実施形態では、この係止片1b2は、複数の光源7が並んだ方向に対して垂直方向に延びる各折り曲げ部1b1の光源7側の側端部を折り曲げて形成したものである。   The lower frame 1b is made of a metal material, and is formed by bending each end portion of a substantially ten-shaped plate material so that the cross-sectional shape is substantially L-shaped, thereby forming a bent portion 1b1. In combination with the optical film 3, the light guide plate 4, the reflective film 5, the light source 7, and the heat conductive sheet (heat conductor) 9. , It functions as a back cover or chassis that supports each of these components from the back side. Further, the locking piece 1b2 for positioning the light guide plate 5 is arranged in a direction perpendicular to the direction in which the plurality of light sources 7 are arranged so as to form a space (air layer) between the light guide plate 5 and the light source 7. Each extending bent portion 1b1 is provided. In the present embodiment, the locking piece 1b2 is formed by bending a side end portion on the light source 7 side of each bent portion 1b1 extending in a direction perpendicular to the direction in which the plurality of light sources 7 are arranged.

表示パネル2は、例えばTFT(薄膜トランジスタ)型の液晶表示パネルからなり、光源7の点灯に伴って所定情報を表示する。   The display panel 2 is composed of, for example, a TFT (thin film transistor) type liquid crystal display panel, and displays predetermined information as the light source 7 is turned on.

光学フィルム3は、例えば断面三角形状のプリズム列が一定間隔で形成された輝度上昇用フィルムを2枚、各プリズム列が直交するように、表示パネル2の裏側であって導光板4上に配置されている。   The optical film 3 is, for example, arranged on the light guide plate 4 on the back side of the display panel 2 so that the two prisms for increasing brightness in which the prism rows having a triangular cross section are formed at regular intervals are orthogonal to each other. Has been.

導光板4は、例えば光透過率が良好な透明樹脂(例えばアクリル樹脂)によって、照射面41と、この照射面に対向する対向面42と、これら対向面42と照射面41とをつなぐ4つの側端面43とを備えた長方体状の板材に形成され、光学フィルム3を間に介して表示パネル2の裏側に配置されている。   The light guide plate 4 includes, for example, a transparent resin (for example, acrylic resin) having a good light transmittance, an irradiation surface 41, an opposing surface 42 facing the irradiation surface, and four connecting the opposing surface 42 and the irradiation surface 41. It is formed in a rectangular plate having a side end face 43 and is disposed on the back side of the display panel 2 with the optical film 3 interposed therebetween.

照射面41は、表示パネル2のパネル面(裏面側)に沿って延在する平面からなり、対向面42は、照射面41と平行に延在する平面からなる。また4つの側端面43のうち、所定(この場合一つ)の側端面43は、光源7と空間を隔てて対向し、且つ光源7からの光を導光板4内に取り入れる受光面43aとして形成されている。そしてこの受光面43aから取り入れた光で照射面41が面発光する構成である。   The irradiation surface 41 is a flat surface extending along the panel surface (back surface side) of the display panel 2, and the facing surface 42 is a flat surface extending in parallel with the irradiation surface 41. Of the four side end surfaces 43, a predetermined (one in this case) side end surface 43 is formed as a light receiving surface 43 a that faces the light source 7 with a space and takes light from the light source 7 into the light guide plate 4. Has been. The irradiation surface 41 emits light with the light taken from the light receiving surface 43a.

なお、下フレーム1bに係止片1b2を設け、導光板4を光源7から隔てて、導光板4と光源7との間に空間(空気層)を設けたことによって、例えば、光源7自体の耐熱温度が高い場合、光源7の消費電力が大きいと、光源7の温度が非常に高温になることがあり、このような状況で、導光板4、特に受光面43aやその近傍の光学フィルム3の変形を抑制することができ、光源7の性能を充分に引き出すことができる。なお、下フレーム1bに設けた係止片1b2は、下フレーム1bだけでなく、上フレーム1aに設けてもよい。   In addition, by providing the locking piece 1b2 on the lower frame 1b, separating the light guide plate 4 from the light source 7, and providing a space (air layer) between the light guide plate 4 and the light source 7, for example, the light source 7 itself When the heat-resistant temperature is high, if the power consumption of the light source 7 is large, the temperature of the light source 7 may become very high. Under such circumstances, the light guide plate 4, particularly the light receiving surface 43a and the optical film 3 in the vicinity thereof. The deformation of the light source 7 can be suppressed, and the performance of the light source 7 can be sufficiently extracted. The locking piece 1b2 provided on the lower frame 1b may be provided not only on the lower frame 1b but also on the upper frame 1a.

反射フィルム5は、例えば白色の合成樹脂フィルムからなり、導光板4の裏側であって対向面42に密着するように配置され、導光板4内の光を照射面41側に反射する。   The reflective film 5 is made of, for example, a white synthetic resin film, and is disposed on the back side of the light guide plate 4 so as to be in close contact with the facing surface 42, and reflects the light in the light guide plate 4 toward the irradiation surface 41.

回路基板6は、その基材が柔軟性を備えている。基材としては、例えば、ポリイミドなどの柔軟性を有する合成樹脂からなる。そして、基材には、図示しない配線パターンが設けられている。前記配線パターンは、少なくとも光源7への給電路を形成するものである。また、本実施形態では、光源7を複数個使用するため、前記配線パターンが複雑であるが、前記配線パターンは多層ではなく単層であるために、平面的な面積が広くなり、下フレーム1bの折り曲げ部1b1に沿って配設される回路基板6は、折り曲げ部1b1の根元を過ぎ、さらに導光板5側に向かって下フレーム1bに沿って配設される。このように回路基板6を下フレーム1bの形状に沿うように、回路基板6の折り曲げ部分に、折り曲げ容易部として、貫通した切れ目61を複数設けたものである。なお、回路基板6が下フレーム1bの形状に沿うように、折れ曲がりを容易にするためには、切れ目61の他には、ミシン目のようなものとしても良い。この切れ目61のような折れ曲げ容易部を設けたことで、回路基板6を下フレーム1bに密着させることができる。回路基板6を下フレーム1bに密着させることで、回路基板6に設けた光源7からの熱を下フレーム1bによりよく伝えることができる。また、回路基板6の前記配線パターンを単層としたことで、回路基板6の厚みを薄くすることができ、回路基板6が薄いことで、回路基板6が柔軟で下フレーム1bの形状に沿って配設しやすく、さらに、薄いことで、光源7の熱をよりよく下フレーム1bに伝えることができる。なお、回路基板6の基材としては、ポリイミドの他の合成樹脂を用いても良いし、アルミニウムなどの金属の箔を基材として用いてもよい。   The substrate of the circuit board 6 has flexibility. As a base material, it consists of synthetic resins which have flexibility, such as a polyimide, for example. A wiring pattern (not shown) is provided on the base material. The wiring pattern forms at least a power supply path to the light source 7. In the present embodiment, since the plurality of light sources 7 are used, the wiring pattern is complicated. However, since the wiring pattern is not a multilayer but a single layer, the planar area is widened, and the lower frame 1b. The circuit board 6 disposed along the bent portion 1b1 passes the base of the bent portion 1b1, and is further disposed along the lower frame 1b toward the light guide plate 5 side. In this way, a plurality of penetrating cuts 61 are provided in the bent portion of the circuit board 6 as easy-to-bend portions so that the circuit board 6 follows the shape of the lower frame 1b. In addition, in order to make it easy to bend so that the circuit board 6 follows the shape of the lower frame 1b, in addition to the cut 61, it may be a perforation. By providing the easy-bending portion such as the cut 61, the circuit board 6 can be brought into close contact with the lower frame 1b. By bringing the circuit board 6 into close contact with the lower frame 1b, the heat from the light source 7 provided on the circuit board 6 can be better transferred to the lower frame 1b. Further, since the wiring pattern of the circuit board 6 is a single layer, the thickness of the circuit board 6 can be reduced, and because the circuit board 6 is thin, the circuit board 6 is flexible and conforms to the shape of the lower frame 1b. In addition, since it is thin, the heat of the light source 7 can be better transferred to the lower frame 1b. In addition, as a base material of the circuit board 6, other synthetic resin of a polyimide may be used, and metal foils, such as aluminum, may be used as a base material.

光源7は、例えば発光面(後述)が導光板4の受光面43aを向き、発光面とは反対側が導通部(後述)となる、所謂、トップビュー型の面実装型発光ダイオードチップからなるもので、複数個は配置されている。これら光源7の各々は、一面に開口する凹部71を備えた絶縁性合成樹脂材料からなるハウジング72と、このハウジング72の凹部71内に配置された図示しない半導体発光素子(ベアチップ)と、この半導体発光素子への電力共通路となる図示しない配線部材とを備えており、凹部71の解放側を発光面73として、この発光面73が導光板4の受光面43aに対向配置される。なお凹部71内は、例えばエポキシ樹脂またはシリコーン樹脂等の透光性樹脂によって封止されている。   The light source 7 is composed of a so-called top-view type surface-mounted light-emitting diode chip in which the light-emitting surface (described later) faces the light-receiving surface 43a of the light guide plate 4 and the side opposite to the light-emitting surface is a conductive portion (described later). A plurality are arranged. Each of these light sources 7 includes a housing 72 made of an insulating synthetic resin material provided with a recess 71 opened on one surface, a semiconductor light emitting element (bare chip) (not shown) disposed in the recess 71 of the housing 72, and the semiconductor A wiring member (not shown) serving as a power common path to the light emitting element is provided. The light emitting surface 73 is disposed opposite to the light receiving surface 43 a of the light guide plate 4 with the release side of the recess 71 as the light emitting surface 73. The recess 71 is sealed with a light-transmitting resin such as an epoxy resin or a silicone resin.

放熱部材8は金属からなり、下フレーム1bの背面側(図2中下側)に設けられている。この放熱部材8は平板形状で、その一部、この場合、周辺部分(外周部分)81が下フレーム1bの周辺部(底部外周部)に接し、他の一部、この場合、中央部分82が下フレーム1bから離間し、下フレーム1bと中央部分82との間に空間部(空気層)を形成しており、たとえて言えば、浅い皿のような形状である。また、放熱部材8がフレーム1の下フレーム1bに接する部分には、光源7が設けられている。また、中央部分82には、下フレーム1bと放熱部材8との間の空間部と外部とつなぐ通気部となる貫通した孔83を備えている。本実施形態では、この孔83を複数個備えている。この孔83を介して、下フレーム1bと放熱部材8との間に空間の空気が換気されて、放熱が良好に行われる。   The heat radiating member 8 is made of metal, and is provided on the back side (lower side in FIG. 2) of the lower frame 1b. The heat radiating member 8 has a flat plate shape, and a part thereof, in this case, a peripheral part (outer peripheral part) 81 is in contact with a peripheral part (bottom part outer peripheral part) of the lower frame 1b, and another part, in this case, a central part 82 is provided. A space (air layer) is formed between the lower frame 1b and the central portion 82 and is spaced from the lower frame 1b. For example, it is shaped like a shallow dish. A light source 7 is provided at a portion where the heat radiating member 8 is in contact with the lower frame 1 b of the frame 1. Further, the central portion 82 is provided with a through-hole 83 serving as a ventilation portion connecting the space between the lower frame 1b and the heat radiating member 8 and the outside. In the present embodiment, a plurality of the holes 83 are provided. The air in the space is ventilated between the lower frame 1b and the heat radiating member 8 through the hole 83, so that heat is radiated satisfactorily.

熱伝導シート9、10は、熱伝導効率の良い材料、例えばシリコーンエラストマーやアクリルエラストマーを基材とする粘着シートからなり、熱伝導シート9は、回路基板6の熱を下フレーム1bに良好に伝えるものであり、熱伝導シート10は、下フレーム1bの熱を放熱部材8に良好に伝えるものである。   The heat conductive sheets 9 and 10 are made of an adhesive sheet based on a material having good heat transfer efficiency, for example, a silicone elastomer or an acrylic elastomer, and the heat conductive sheet 9 transfers the heat of the circuit board 6 to the lower frame 1b. The heat conductive sheet 10 is a material that transfers heat of the lower frame 1b to the heat radiating member 8 well.

このように構成された表示装置において、光源7が発する熱は、回路基板6へ伝わり、回路基板6から熱伝導シート9、下フレーム1bと伝わり、下フレーム1bから放熱される。さらに、下フレーム1bからの熱は、放熱部材8に伝わり、放熱部材8から放熱される。また、放熱部材8に通気部である孔83を設けたことによって、下フレーム1bと放熱部材8との間の空間の空気が下フレーム1bと放熱部材8とからの放熱によって暖められるが、この暖められた空気が孔83によって換気されて、放熱が良好に行われる。   In the display device configured as described above, heat generated by the light source 7 is transmitted to the circuit board 6, is transmitted from the circuit board 6 to the heat conductive sheet 9, and the lower frame 1b, and is radiated from the lower frame 1b. Further, the heat from the lower frame 1 b is transmitted to the heat radiating member 8 and is radiated from the heat radiating member 8. In addition, by providing the heat radiation member 8 with the hole 83 as a ventilation portion, the air in the space between the lower frame 1b and the heat radiation member 8 is warmed by heat radiation from the lower frame 1b and the heat radiation member 8. The warmed air is ventilated by the holes 83, and heat dissipation is performed well.

また、放熱部材8を平板形状としたことで、発光装置の導光板4の背面側に設けることができ、従来のような放熱用の羽を複数枚並べて、長方体のような立体的形状の放熱部材に比べて、薄くコンパクトな放熱部材を得ることができる。なお本実施形態では放熱部材8を上記のごとく浅い皿のような形状に設定したが、フレーム1(下フレーム1a)と部分的に接触すると共に空間部を隔てて離間する箇所を有していればよく、波形形状や凹凸が連続するような形状であってもよい。   Further, since the heat radiating member 8 has a flat plate shape, it can be provided on the back side of the light guide plate 4 of the light emitting device, and a plurality of conventional heat radiating wings are arranged to form a three-dimensional shape like a rectangular parallelepiped. Compared to the heat radiating member, a thin and compact heat radiating member can be obtained. In this embodiment, the heat radiating member 8 is set in a shape like a shallow dish as described above. However, the heat radiating member 8 may partially contact the frame 1 (lower frame 1a) and be separated from the space. What is necessary is just to be a waveform shape and a shape where an unevenness | corrugation continues.

また、放熱部材8の周辺部分81が下フレーム1bの周辺部に接しており、この下フレーム1bの放熱部材8との接触部となる周辺部に光源7を設けたことにより、光源7の光を放熱部材8に熱を良好に伝えることができる。さらに、本実施形態では、光源7が4つある側端面43の一つにのみ設けていたが、例えば、相対する一対の側端面43それぞれに複数の光源7を設けた場合では、各側端面43毎に複数の光源7の放熱部材8を設ける必要がなく、部品点数の増加を抑えることができる。   Further, the peripheral portion 81 of the heat radiating member 8 is in contact with the peripheral portion of the lower frame 1b, and the light source 7 is provided in the peripheral portion that is a contact portion with the heat radiating member 8 of the lower frame 1b. The heat can be transferred well to the heat radiating member 8. Furthermore, in the present embodiment, the light source 7 is provided only on one of the four side end faces 43. However, for example, when a plurality of light sources 7 are provided on each of the pair of opposing side end faces 43, each side end face is provided. It is not necessary to provide the heat dissipating members 8 of the plurality of light sources 7 for every 43, and an increase in the number of parts can be suppressed.

なお、本発明の第2の実施形態として、良好に放熱を行うために、図7、8に示すものがある。なお、前記実施形態と同一及び相当個所には同一符号を付してその詳細な説明は省略する。   Incidentally, as a second embodiment of the present invention, there are those shown in FIGS. In addition, the same code | symbol is attached | subjected to the same and equivalent part as the said embodiment, and the detailed description is abbreviate | omitted.

本実施形態では、上フレーム1cが第1実施形態の合成樹脂のものから金属製に変更されたものである。そして、この上フレーム1cの側面1c1、特に光源7を設けた側の側面1c1に放熱部材11を備えている。この放熱部材11は、側面1c1に熱伝導シート12を介して接触する基部111と、この基部111から延長形成された複数の放熱羽根112とを備えている。この放熱羽根112が延長形成する方向は、表示装置の導光板4の板面方向と同一方向に延びたように形成されている。このように形成したことによって、表示装置の導光板4の照射面41に対して垂直方向の厚みを抑えながら、放熱部材11を追加したことによって、下フレーム1b、放熱部材8とともに、さらなる放熱を行うことができる。   In the present embodiment, the upper frame 1c is changed from the synthetic resin of the first embodiment to a metal. A heat radiating member 11 is provided on the side surface 1c1 of the upper frame 1c, particularly on the side surface 1c1 on the side where the light source 7 is provided. The heat radiating member 11 includes a base 111 that is in contact with the side surface 1c1 via the heat conductive sheet 12, and a plurality of heat radiating blades 112 that are extended from the base 111. The direction in which the heat radiating blade 112 extends is formed so as to extend in the same direction as the plate surface direction of the light guide plate 4 of the display device. By forming in this way, the heat dissipation member 11 is added while suppressing the thickness in the direction perpendicular to the irradiation surface 41 of the light guide plate 4 of the display device, thereby further radiating heat together with the lower frame 1b and the heat dissipation member 8. It can be carried out.

また、第2実施形態では、表示装置の導光板4の照射面41(板面)に対して垂直方向の厚みを抑えたものであったが、図9で示す第3実施形態のように、表示装置の導光板4の照射面41(板面)と同じ水平方向の面積を抑える場合は、下フレーム1bの光源7を設けた配列方向にそって、導光板4の照射面41(板面)に対して垂直方向に延びる放熱部材13を設けたものである。この放熱部材13は、第2実施形態の放熱部材11と同一構造で、下フレーム1bの背面(図9中の下側の面)に熱伝導シート14を介して接触する基部131と、この基部131から延長形成された複数の放熱羽根132とを備えている。この放熱羽根132が延長形成する方向は、表示装置の導光板4の板面方向に対して垂直方向に延びたように形成されている。このように形成したことによって、表示装置の導光板4の照射面41と同じ水平方向の面積を抑えながら、放熱部材11を追加したことによって、下フレーム1bとともに、さらなる放熱を行うことができる。また図9に示す構成において前記第1,第2実施形態で適用した放熱部材8を追加することでより放熱効率を向上させることが可能となる。   Further, in the second embodiment, the thickness in the direction perpendicular to the irradiation surface 41 (plate surface) of the light guide plate 4 of the display device is suppressed, but as in the third embodiment shown in FIG. When suppressing the same horizontal area as the irradiation surface 41 (plate surface) of the light guide plate 4 of the display device, the irradiation surface 41 (plate surface) of the light guide plate 4 along the arrangement direction in which the light sources 7 of the lower frame 1b are provided. ) Is provided with a heat dissipating member 13 extending in the vertical direction. The heat dissipating member 13 has the same structure as the heat dissipating member 11 of the second embodiment, and a base 131 that is in contact with the back surface of the lower frame 1b (the lower surface in FIG. 9) via the heat conductive sheet 14, and the base A plurality of heat dissipating blades 132 extended from 131 are provided. The direction in which the heat radiating blades 132 are formed to extend in a direction perpendicular to the plate surface direction of the light guide plate 4 of the display device. By forming in this way, further heat dissipation can be performed together with the lower frame 1b by adding the heat dissipation member 11 while suppressing the same horizontal area as the irradiation surface 41 of the light guide plate 4 of the display device. In addition, in the configuration shown in FIG. 9, it is possible to improve the heat dissipation efficiency by adding the heat dissipation member 8 applied in the first and second embodiments.

本発明の第1の実施形態による表示装置を示す正面図。The front view which shows the display apparatus by the 1st Embodiment of this invention. 図1のA−A断面図。AA sectional drawing of FIG. 図2において光源付近を拡大して示す要部断面図。FIG. 3 is an essential part cross-sectional view showing an enlarged vicinity of a light source in FIG. 2. 図2のB−B断面図。BB sectional drawing of FIG. 同実施形態の光源を実装した基板の正面図。The front view of the board | substrate which mounted the light source of the embodiment. 同実施形態の表示装置の背面図。The rear view of the display apparatus of the embodiment. 本発明の第2の実施形態による表示装置を示す正面図。The front view which shows the display apparatus by the 2nd Embodiment of this invention. 図7のC−C断面図。CC sectional drawing of FIG. 本発明の第3の実施形態による表示装置を示す断面図。Sectional drawing which shows the display apparatus by the 3rd Embodiment of this invention.

符号の説明Explanation of symbols

1 フレーム
1a、1c 上フレーム
1b 下フレーム
1b1 折り曲げ部
1b2 係止片
2 表示パネル
3 光学フィルム
4 導光板
5 反射フィルム
6 回路基板
7 光源
8、11、13 放熱部材
9、10、12、14 熱伝導シート(熱伝導体)
41 照射面
42 対向面
43 側端面
43a 受光面
61 切れ目(折れ曲げ容易部)
71 凹部
72 ハウジング
73 発光面
81 周辺部分
82 中央部分
83 孔(通気部)
DESCRIPTION OF SYMBOLS 1 Frame 1a, 1c Upper frame 1b Lower frame 1b1 Bending part 1b2 Locking piece 2 Display panel 3 Optical film 4 Light guide plate 5 Reflective film 6 Circuit board 7 Light source 8, 11, 13 Heat radiation member 9, 10, 12, 14 Thermal conduction Sheet (heat conductor)
41 Irradiation surface 42 Opposing surface 43 Side end surface 43a Light receiving surface 61 Cut (easy to bend)
71 Concave portion 72 Housing 73 Light emitting surface 81 Peripheral portion 82 Central portion 83 Hole (venting portion)

Claims (3)

発光ダイオードからなる光源と、
この光源からの光を導入する受光面とこの受光面から導入した光で面発光する照射面とを有する導光板と、
前記光源に電力供給を行う回路基板と、
前記光源と前記導光板とを収納するフレームとを備えた発光装置において、
前記フレームの一部に接するとともに、前記フレームとの間に空間部を形成する放熱部材と設けたことを特徴とする発光装置。
A light source comprising a light emitting diode;
A light guide plate having a light receiving surface for introducing light from the light source and an irradiation surface for emitting light by light introduced from the light receiving surface;
A circuit board for supplying power to the light source;
In a light emitting device comprising a frame for housing the light source and the light guide plate,
A light emitting device comprising: a heat dissipating member that is in contact with a part of the frame and that forms a space with the frame.
前記空間部につながる通気部を設けたことを特徴とする請求項1に記載の発光装置。 The light emitting device according to claim 1, further comprising a ventilation portion connected to the space portion. 前記放熱部材と接した前記フレームの一部に前記光源を設けたことを特徴とする請求項1に記載の発光装置。 The light-emitting device according to claim 1, wherein the light source is provided in a part of the frame in contact with the heat dissipation member.
JP2006008115A 2006-01-17 2006-01-17 Light-emitting device Pending JP2007193946A (en)

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KR100879772B1 (en) * 2007-09-06 2009-01-21 한성엘컴텍 주식회사 Surface emission device having a plurality of light emission devices
JP2011081996A (en) * 2009-10-06 2011-04-21 Panasonic Corp Lighting device and document scanning device having the same
WO2012001999A1 (en) * 2010-06-30 2012-01-05 シャープ株式会社 Illuminating device and image display device provided with same
JP2012014946A (en) * 2010-06-30 2012-01-19 Sharp Corp Lighting system and image display device equipped with it
JP2012234829A (en) * 2012-08-22 2012-11-29 Epson Imaging Devices Corp Lighting device, electro-optical device, and electronic equipment
JP2013507767A (en) * 2009-10-08 2013-03-04 エルジー イノテック カンパニー リミテッド Thermal printed circuit board and chassis assembly provided with the same
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100879772B1 (en) * 2007-09-06 2009-01-21 한성엘컴텍 주식회사 Surface emission device having a plurality of light emission devices
JP2011081996A (en) * 2009-10-06 2011-04-21 Panasonic Corp Lighting device and document scanning device having the same
JP2013507767A (en) * 2009-10-08 2013-03-04 エルジー イノテック カンパニー リミテッド Thermal printed circuit board and chassis assembly provided with the same
US8864338B2 (en) 2009-10-08 2014-10-21 Lg Innotek Co., Ltd. Heat radiating printed circuit board and chassis assembly having the same
WO2012001999A1 (en) * 2010-06-30 2012-01-05 シャープ株式会社 Illuminating device and image display device provided with same
JP2012014946A (en) * 2010-06-30 2012-01-19 Sharp Corp Lighting system and image display device equipped with it
WO2013031672A1 (en) * 2011-09-02 2013-03-07 シャープ株式会社 Illumination device, display device, and television reception device
JP2012234829A (en) * 2012-08-22 2012-11-29 Epson Imaging Devices Corp Lighting device, electro-optical device, and electronic equipment
JP2016115649A (en) * 2014-12-18 2016-06-23 岩崎電気株式会社 LED lamp
JP2017054659A (en) * 2015-09-09 2017-03-16 正寿 戸田 Lighting module
WO2017043557A1 (en) * 2015-09-09 2017-03-16 正寿 戸田 Lighting module
CN105674147A (en) * 2016-01-14 2016-06-15 京东方科技集团股份有限公司 Backlight module and display device

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