201204227 六、發明說明： 【發明所屬之技術領威】 [_本發明涉及4散熱裝置，尤係—種贱對發熱電子元 件散熱的散熱裝置° 【先前技術】 [0002]隨著電子資訊產業的迅速發展，電腦、伺服器等電子裝 置内的發熱電子元件’如中央處理器（CUP)、記憶體等 的發熱量愈來愈大’若不及時將該等熱量散熱去，將極 大地影響電子裝置的運行穩定性及使用壽命。為了將電 〇 子裝置内的發熱電子元件的熱量散表，業界通常係使用 一種具備集熱、傳熱和散熱锋金養來輔助發 熱電子元件進行散熱。丨$ ,： [0003] ❹ 通常情況下，散熱器的體積越大，散熱器的散熱效率越 高，然而，將體積較大的散熱器用於對發熱電子元件散 熱時，散熱器通常會與該發熱電子元件周圍的其他電子 元件發生干涉，使散熱器的安裝極為不便，甚至會損壞 其他的電子元件，這種情況在體ft#目辦較小的電子裝置 ，如1U (1U=4. 445cm)祠服器中表現更為突出，但當使 用體積較小的散熱器進行散熱時’散熱器的散熱效率又 難以達到散熱的需求。 【發明内容】 [0004] 有鑒於此，實有必要提供一種散熱效率較高且可減少與 其他電子元件發生干涉的散熱裝置。 099122076 一種散熱裝置，用於對發熱電子元件散熱，所述散熱裝 置包括第一散熱器及設於所述第一散熱器上的第二散熱 表單編號A0101 第3頁/共Η頁 0992038875-0 [0005] 201204227 器，所述第一散熱器用於貼合於所述發熱電子元件上， 所述第二散熱器的體積小於所述第一散熱器的體積，所 述第二散熱器可拆卸地熱連接於所述第一散熱器的一側 〇 [0006] 該散熱裝置用於對發熱電子元件散熱時，發熱電子元件 產生的熱量，一部分藉由該第一散熱器散發，一部分藉 由該第一散熱器傳遞至第二散熱器，並藉由該第二散熱 器散發。該第二散熱器的體積及位置設置相對較靈活， 如此，該第二散熱器既可以分擔一部分散熱功能以保證 該散熱裝置具有較高的散熱效率，又可以降低該散熱裝 置對該發熱電子元件周圍的其他電子元件的干涉。 【實施方式】 [0007] 下面參照附圖結合實施例對本發明作進一步之說明。 [0008] 請參照圖1及圖2，本發明第一實施例中的散熱裝置100包 括一第一散熱器10、可折卸地熱連接於該第一散熱器10 一側的一第二散熱器20，及將該第二散熱器20固定於該 第一散熱器10上的兩固定件30。 [0009] 該第一散熱器10及第二散熱器20均可採用鋁擠的方法一 體成型，亦可採用鰭片焊接的方法成型。本實施例中該 第一散熱器10及第二散熱器20均為藉由鋁擠的方法一體 成型。 [0010] 該第一散熱器10包括一第一吸熱板11及設於該第一吸熱 板11上的複數第一散熱鰭片12，該第一吸熱板11及第一 散熱縛片12均由導熱性材料製成，如銅、铭及其合金。 099122076 表單編號A0101 第4頁/共14頁 0992038875-0 201204227 該第一吸熱板Π為一矩形的板體，該第一吸熱板11包括 一連接部111及位於該連接部111 一側的一第一鰭片部 112。該連接部111呈平板狀，該連接部ill上未設置任 何散熱鰭片，該連接部111上設有兩個通孔1111。所述第 一散熱鰭片12自該第一吸熱板11的第一鰭片部112垂直向 上延伸》該第一吸熱板11的下表面用於與一發熱電子元 件40 (請參照圖3)貼合。 [0011] ο 該第二散熱器20的體積比該第一散熱器1〇的體積小，該 第二散熱器20包括一第二吸熱板21及設於該第二吸熱板 21上的複數第二散熱縛片22，所述第二吸熱板21及第二 散熱鰭片22均由導熱性材料5丨製成，‘i呼、鋁及其合金。 該第二吸熱板21為一矩形的板體，該第二吸熱板21包括 一結合部211及位於該結合部211—側的一第二鰭片部 212 ’該結合部211呈平板狀，該結合部211上未設置任 何散熱鰭片’該結合部211上設有固定孔2111 ^該兩固定 孔2111對應於該第一散熱器上的兩通孔ηη。所述第 ...... - 11 - *·· ;<) ;：..κ ❹ 一散熱錄片22'自該:第:二韓片，部212垂直向上延伸，所述第 二散熱鰭片22自該第二鰭片部212向上延伸的高度小於所 述第一散熱鰭片12自該第一散熱器1〇的第一鰭片部112向 上延伸的高度。 [0012] 將該第一散熱器2〇固定於該第一散熱器丨〇上時，將該第 二散熱器20的結合部211疊置在該第一散熱器1〇的連接部 1 Η上，使該第二散熱器20的結合部211上的固定孔2111 正對該第一散熱器10的連接部ln上的通孔丨丨丨〗，然後 以所述固定件3〇分別穿設其中。為使該第二散熱器2〇的 099122076 表單編號Α0101 第5頁/共14頁 0992038875-0 201204227 結合部211與該第一散熱器1〇的連接部}11之間緊密接觸 ’可與該第一散熱器1〇的連接部1丨〗與該第二散熱器2〇的 結合部2 Π之間設置一層導熱材料，如導熱矽膠等。 [0013] [0014] 099122076 如圖3所示，該散熱裝置100用於對電路板5〇上的發熱電 子元件40散熱時，該第一散熱器10的第一吸熱板n貼合 於該發熱電子元件40上，該發熱電子元件4〇產生的熱量 ，一部分藉由該第一散熱器10散發，一部分藉由該第一 散熱器10的連接部111傳遞至該第二散熱器2〇，並藉由該 第二散熱器20散發。該第二散熱器2〇的體積相對於該第 一散熱器10要小’且於該第w散熱器1〇上的位置設置相 對較靈活，如此，該第二散熱器2〇既可以分擔一部分散 熱功能以保證該散熱裝置1〇〇具有較高的散熱效率，又可 以降低該散熱裝置1〇〇對該發熱電子元件4〇周圍的其他電 子元件60、70的干涉。 其次，本發明的發明精神考藏由翁熱電于元件Μ更新而 帶來的需對散熱裝置進行重新設計的問題亦能很好的解 決，例如，原始情況下只用一第一棟熱器1〇對該發熱電 子元件40進行散熱，當該發熱電子元件4〇更新為一更高 瓦數的發熱電子元件時，該第一散熱器1〇不需重新設計 ’只需將該第二散熱器2()固定於該第—散熱器1()上即可 滿足發熱電子元件40所增加的散熱需求’而該第二散熱 器20可以藉由相對簡單的成型方法製成，如藉由_的、 方法製成，制程簡單且成本較低。 若要進一步增強該散熱裝置100的散熱效率，可於該第— 散熱器10上設置-個以上的第二散熱器2〇，例如，圖4所 表單編號A010I 第6頁/共14頁 0992038875-0 [0015] 201204227 - 示的本發明第二實施例中的散熱裝置100a，該散熱裝置 100a包括兩個第二散熱器20，所述兩個第二散熱器20分 別位於該第一散熱器10a的相對兩側。 [0016] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 ^ [0017] 圖1為本發明第一實施例中的散熱裝置的立體組裝圖。 [0018] 圖2為圖1所示的散熱裝置的立體分解圖.。 [0019] 圖3為圖1所示的散熱裝置一應用實例的側視圖。 [0020] 圖4為本發明第二實施例中的散熱裝置的側視圖。 【主要元件符號說明】 [0021] 散熱裝置：100、100a [0022] 第一散熱器：10、10a Q u— [0023] 第一吸熱板：11 [0024] 連接部：111 [0025] 通孔：1111 [0026] 第一鰭片部：11 2 [0027] 第一散熱鰭片：12 [0028] 第二散熱器：20 099122076 表單編號A0101 第7頁/共14頁 0992038875-0 201204227 [0029] 第二吸熱板：21 [0030] 結合部：21 1 [0031] 固定孔：2111 [0032] 第二鰭片部：21 2 [0033] 第二散熱鰭片：22 [0034] 固定件：3 0 [0035] 發熱電子元件：40 [0036] 電路板：50 [0037] 其他電子元件：60、70 099122076 表單編號A0101 第8頁/共14頁 0992038875-0201204227 VI. Description of the Invention: [Technology Leading Technology of the Invention] [The present invention relates to a heat dissipating device, in particular, a heat dissipating device for dissipating heat from a heating electronic component. [Prior Art] [0002] With the electronic information industry Rapid development, heating electronic components in electronic devices such as computers and servers, such as central processing units (CUPs), memory, etc., are getting more and more hot. If the heat is not dissipated in time, it will greatly affect the electronics. Operation stability and service life of the device. In order to dissipate the heat of the heat-generating electronic components in the electronic device, the industry usually uses a heat collecting, heat-transfer and heat-dissipating fin to assist the heat-generating electronic components for heat dissipation.丨$ , : [0003] ❹ Normally, the larger the heat sink, the higher the heat dissipation efficiency of the heat sink. However, when a larger heat sink is used to dissipate heat from the heat-generating electronic components, the heat sink usually Interference with other electronic components around the heat-generating electronic components makes the installation of the heat sink extremely inconvenient and may even damage other electronic components. In this case, a small electronic device such as 1U (1U=4. 445cm) The performance of the device is more prominent, but when using a smaller heat sink for heat dissipation, the heat dissipation efficiency of the heat sink is difficult to meet the heat dissipation requirement. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink having high heat dissipation efficiency and capable of reducing interference with other electronic components. 099122076 A heat dissipating device for dissipating heat from a heat-generating electronic component, the heat dissipating device comprising a first heat sink and a second heat dissipating form number A0101 disposed on the first heat sink, page 3 / total page 0992038875-0 [ 0005] 201204227, the first heat sink is for attaching to the heat-generating electronic component, the volume of the second heat sink is smaller than the volume of the first heat sink, and the second heat sink is detachably thermally connected When the heat dissipating device is used for dissipating heat from the heat-generating electronic component, heat generated by the heat-generating electronic component is partially emitted by the first heat sink, and a part of the heat is dissipated by the first heat sink. The device is delivered to the second heat sink and is dissipated by the second heat sink. The volume and position of the second heat sink are relatively flexible. Therefore, the second heat sink can share a part of the heat dissipation function to ensure the heat dissipation device has high heat dissipation efficiency, and can reduce the heat dissipation device to the heat-generating electronic component. Interference with other electronic components around. [Embodiment] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipation device 100 of the first embodiment of the present invention includes a first heat sink 10 and a second heat sink detachably thermally coupled to one side of the first heat sink 10 20 and fixing the second heat sink 20 to the two fixing members 30 on the first heat sink 10. [0009] The first heat sink 10 and the second heat sink 20 may be integrally formed by aluminum extrusion, or may be formed by fin welding. In this embodiment, the first heat sink 10 and the second heat sink 20 are integrally formed by aluminum extrusion. [0010] The first heat sink 10 includes a first heat absorbing plate 11 and a plurality of first heat sink fins 12 disposed on the first heat absorbing plate 11. The first heat absorbing plate 11 and the first heat sinking film 12 are both Made of thermal conductive materials such as copper, Ming and its alloys. 099122076 Form No. A0101 Page 4 of 14 0992038875-0 201204227 The first heat absorbing plate is a rectangular plate body, and the first heat absorbing plate 11 includes a connecting portion 111 and a first portion on the side of the connecting portion 111. A fin portion 112. The connecting portion 111 has a flat shape, and no heat dissipating fins are disposed on the connecting portion ill. The connecting portion 111 is provided with two through holes 1111. The first heat dissipation fin 12 extends vertically upward from the first fin portion 112 of the first heat absorption plate 11. The lower surface of the first heat absorption plate 11 is used for attaching to a heat-generating electronic component 40 (please refer to FIG. 3). Hehe. [0011] The second heat sink 20 has a smaller volume than the first heat sink 1 , and the second heat sink 20 includes a second heat sink 21 and a plurality of heat sinks 21 The heat-dissipating plate 22, the second heat-absorbing plate 21 and the second heat-dissipating fins 22 are all made of a thermal conductive material 5, 'i, aluminum and alloys thereof. The second heat absorbing plate 21 is a rectangular plate body. The second heat absorbing plate 21 includes a joint portion 211 and a second fin portion 212 ′ on the side of the joint portion 211. The joint portion 211 has a flat shape. A fixing hole 2111 is disposed on the joint portion 211. The two fixing holes 2111 correspond to the two through holes ηη on the first heat sink. The first ... - 11 - * · · ; <) ;:.. κ ❹ a heat-dissipating film 22' from the: the second: the second piece, the portion 212 extends vertically upwards, the second The height of the heat dissipation fins 22 extending upward from the second fin portion 212 is smaller than the height of the first heat dissipation fins 12 extending upward from the first fin portions 112 of the first heat sink 1 . [0012] when the first heat sink 2 is fixed on the first heat sink, the joint portion 211 of the second heat sink 20 is stacked on the connecting portion 1 of the first heat sink 1 The fixing hole 2111 on the joint portion 211 of the second heat sink 20 is opposite to the through hole 连接 on the connecting portion ln of the first heat sink 10, and then the fixing member 3 穿 is respectively inserted therein. . In order to make the second heat sink 2 〇 099122076 form number Α 0101 5th / 14 pages 0992038875-0 201204227 joint portion 211 and the first heat sink 1 〇 connection portion} 11 in close contact with A heat conducting material such as a thermal conductive rubber or the like is disposed between the connecting portion 1 of the heat sink and the joint portion 2 of the second heat sink 2 . [0014] 099122076 As shown in FIG. 3, when the heat sink 100 is used to dissipate heat from the heat-generating electronic component 40 on the circuit board 5, the first heat sink n of the first heat sink 10 is attached to the heat. On the electronic component 40, a portion of the heat generated by the heat-generating electronic component 4 is radiated by the first heat sink 10, and a portion thereof is transmitted to the second heat sink 2 through the connecting portion 111 of the first heat sink 10, and Dissipated by the second heat sink 20. The volume of the second heat sink 2 is smaller than that of the first heat sink 10 and is relatively flexible at a position on the first heat sink 1 , so that the second heat sink 2 can share a part of the heat sink 2 The heat dissipation function ensures that the heat dissipation device 1 has high heat dissipation efficiency, and the interference of the heat dissipation device 1 to other electronic components 60 and 70 around the heat-generating electronic component 4 is reduced. Secondly, the spirit of the invention of the present invention can be solved by the problem that the heat sink is redesigned by the heating of the component in the component, for example, in the original case, only a first heater 1 is used.散热 dissipating heat to the heat-generating electronic component 40. When the heat-generating electronic component 4 is updated to a higher wattage of heat-generating electronic component, the first heatsink 1〇 does not need to be redesigned. 2() is fixed on the first heat sink 1() to meet the increased heat dissipation requirement of the heat-generating electronic component 40. The second heat sink 20 can be formed by a relatively simple molding method, such as by The method is made, the process is simple and the cost is low. To further enhance the heat dissipation efficiency of the heat sink 100, more than one second heat sink 2〇 may be disposed on the first heat sink 10, for example, the form number A010I of FIG. 4, page 6 / 14 pages 0992038875- [0015] 201204227 - The heat sink 100a of the second embodiment of the present invention is shown, the heat sink 100a includes two second heat sinks 20, and the two second heat sinks 20 are respectively located at the first heat sink 10a The opposite sides. [0016] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is an assembled perspective view of a heat sink according to a first embodiment of the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. 3 is a side view of an application example of the heat sink shown in FIG. 1. 4 is a side view of a heat sink according to a second embodiment of the present invention. [Main component symbol description] [0021] Heat sink: 100, 100a [0022] First heat sink: 10, 10a Q u - [0023] First heat sink: 11 [0024] Connection: 111 [0025] Through hole :1111 [0026] First fin portion: 11 2 [0027] First heat sink fin: 12 [0028] Second heat sink: 20 099122076 Form number A0101 Page 7 / 14 pages 0992038875-0 201204227 [0029] Second heat absorbing plate: 21 [0030] Bonding portion: 21 1 [0031] Fixing hole: 2111 [0032] Second fin portion: 21 2 [0033] Second heat sink fin: 22 [0034] Fixing member: 3 0 [0035] Heated electronic component: 40 [0036] Circuit board: 50 [0037] Other electronic components: 60, 70 099122076 Form number A0101 Page 8 of 14 0992038875-0