WO2017092537A1

WO2017092537A1 - Vision sensing apparatus having heat dissipation structure

Info

Publication number: WO2017092537A1
Application number: PCT/CN2016/104231
Authority: WO
Inventors: 张磊; 李阳帆; 周东旭
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2015-11-30
Filing date: 2016-11-01
Publication date: 2017-06-08
Also published as: CN205284014U

Abstract

A vision sensing apparatus (1) includes a circuit board (30), a heating electronic member, a first shell (10), a second shell (20), a heat conducting member (520) and a heat dissipating structure (50). The circuit board (30) has a first surface (310) and a second surface (320) opposite to the first surface (310). The heating electronic member is installed on the first surface (310) of the circuit board (30). The first shell (10) has heat conductivity and is located at a side of the first surface (310) of the circuit board (30). The second shell (20) has heat conductivity and is located at a side of the second surface (320) of the circuit board (30). The heat conducting member (520) is heat-conductively connected with the first shell (10) and the heating electronic member. The heat dissipating structure (50) is heat-conductively connected with the circuit board (30) and the second shell (20). Heat generated during operation of the heating electronic member is dissipated through two dissipating channels, so as to enhance efficiency of dissipating heat.

Description

Vision sensing device with heat dissipation structure

Technical field

The present invention relates to heat dissipation technology, and more particularly to a vision sensing device having a heat dissipation structure.

Background technique

With the development of electronic technology, the integration degree of chips is getting higher and higher, the chip size is getting smaller and smaller, and the heat flux density of the chip is also getting higher and higher. When these chips are applied to miniaturized products, the narrow space structure inside the product is not conducive to the heat dissipation of the chip. Temperature is a key factor affecting the reliability of the chip. As the temperature increases, the failure rate of the chip increases as a geometric multiple. Therefore, how to quickly and efficiently dissipate heat from the chip is an important factor in determining the reliability of the product.

At present, electronic products with high heat flux density and small product size, such as visual sensing devices, are limited by product size and cannot use fans. Natural heat dissipation schemes tend to have too small heat dissipation area and low heat dissipation efficiency. .

Summary of the invention

In view of this, it is necessary to provide a visual sensing device with high heat dissipation efficiency.

An embodiment of the invention provides a visual sensing device, including:

a circuit board having a first surface and a second surface opposite the first surface;

a heating electronic component mounted on the first surface of the circuit board;

a first housing having thermal conductivity, which is located on a first surface side of the circuit board;

a second housing having thermal conductivity, located on a second surface side of the circuit board;

a thermally conductive element electrically connected to the first housing and the heat generating electronic component;

a heat dissipation structure electrically connecting the circuit board and the second housing.

Further, the heat conducting component is a thermal paste layer;

Or/and the connection area of the heat dissipation structure and the second surface of the circuit board corresponds to the heat-generating electronic component.

Further, the first housing protrudes from the heat-generating electronic component with a bump, and the heat-conducting element thermally connects the heat-generating electronic component and the bump.

Further, the heat conducting element further thermally connects the circuit board and the bump.

Further, the heat dissipation structure includes another heat conduction element, which is a thermal conductive paste layer.

Further, the heat conducting element and the other heat conducting element are respectively a layer of thermally conductive clay.

Further, the heat dissipation structure further includes a heat sink located between the other heat conduction element and the second housing.

Further, the heat sink is laterally provided with an arcuate recess for contacting the other thermally conductive element.

Further, the heat sink includes a base and a plurality of fins extending from the base, the base contacting the other heat conducting element.

Further, the heat sink contacts the second housing.

Further, the heat sink further includes an extending portion extending outward from opposite ends of the base and the heat sink, the extending portion having a fixing member, and the fixing member is fixed to the circuit board.

Further, the heat sink further includes a pressing structure extending from the extending portion, and the second housing protrudes toward the heat sink with a pressing plate, and the pressing plate faces the circuit board Pressing the compression structure.

Further, the first housing is provided with a plurality of vent holes.

Further, the visual sensing device further includes an image capturing component, and the second housing defines an opening corresponding to the image capturing component.

Further, the heat dissipation structure is located on one side of the image pickup element.

An embodiment of the present invention further provides a visual sensing device, including:

a first heat dissipation channel coupled to the heat generating electronic component and located on a side of the first surface of the circuit board;

A second heat dissipation channel is coupled to the second surface of the circuit board.

Further, the first heat dissipation channel includes a first heat conduction element coupled to the heat generating electronic component and a first housing thermally coupled to the first heat conduction element.

Further, the bonding area of the second heat dissipation channel and the second surface of the circuit board corresponds to the heat-generating electronic component;

Or/and the second heat dissipation channel includes a second heat conduction element coupled to the circuit board and The second heat conducting element is thermally coupled to the second housing.

Further, the first casing and the second casing surround the circuit board and the heat-generating electronic component, and the first casing and the second casing are a metal casing or an alloy casing.

Further, the first heat conduction element and the second heat conduction element are thermal conductive paste layers.

Further, the first heat conducting element and the second heat conducting element are layers of a thermally conductive clay.

Further, the first housing protrudes from the heat-generating electronic component with a bump, and the first heat-conducting element thermally connects the heat-generating electronic component and the bump.

Further, the second heat dissipation channel further includes a heat sink between the second heat conduction element and the second housing.

Further, the heat sink is laterally provided with an arcuate recess for contacting the second heat conducting element.

Further, the heat sink includes a base and a plurality of fins extending from the base, the base contacting the second heat conducting element.

Further, the heat sink contacts the second housing.

Further, the first housing is provided with a plurality of vent holes;

Or/and the visual sensing device further includes an image capturing component, the second housing having an opening corresponding to the image capturing component;

Or/and the first housing and the second housing are outer casings of the visual sensing device.

Compared with the prior art, the heat-dissipating structure/channel is disposed on opposite sides of the heat-generating electronic component, so that heat generated when the heat-generating electronic component operates is dissipated through the two heat-dissipating channels, thereby improving heat dissipation efficiency.

DRAWINGS

1 is a perspective view of a visual sensing device having a heat dissipation structure according to an embodiment of the present invention; Assembly diagram.

2 is a perspective assembled view of another angle of the visual sensing device shown in FIG. 1.

3 is a perspective exploded view of the visual sensing device shown in FIG. 1.

4 is a perspective exploded view of another angle of the visual sensing device of FIG. 1.

Figure 5 is a cross-sectional view taken along line I-I of the visual sensing device of Figure 1.

Figure 6 is an enlarged schematic view of a portion V of Figure 5.

Main component symbol description

First housing 10

First substrate 110

First side plate 120

Vent 130

Bump 150

Second housing 20

Second substrate 210

Opening 211

Second side plate 220

Jack 230

Resisting plate 250

Circuit board 30

First surface 310

Second surface 320

Electronic components 40

Chip 410

Image capture component 430

Heat dissipation structure 50

Radiator 510

Main body 511

Base plate 5111

Heat sink 5113

Extension 513

Extension arm 5131

Fixing parts 5133

Thermally conductive element 520

First thermal conduction element 521

Second thermal conduction element 523

Notch 530

Compression structure 540

Positioning unit 541

Elastic part 543

The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or the component can be present. When a component is considered to "connect" another component, it can be directly connected to another component or possibly a central component. When a component is considered to be "set to" another component, it can be placed directly on another component or possibly with a centered component. The terms "vertical," "horizontal," "left," "right," and the like, as used herein, are for illustrative purposes only.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 1 to FIG. 4, an embodiment of the present invention provides a visual sensing device 1. The visual sensing device 1 includes a first housing 10, a second housing 20 that mates with the first housing 10, The circuit board 30, the electronic component 40 mounted on the circuit board 30, and the heat dissipation structure 50 for dissipating heat from the electronic component 40. The circuit board 30, the electronic component 40, and the heat dissipation structure 50 are housed in a space surrounded by the first casing 10 and the second casing 20. The first housing 10 and the second housing 20 are divided into two opposite sides of the circuit board 30. In one embodiment, the first housing 10 and the second housing 20 are outer casings of the visual sensing device 1 .

The first housing 10 includes a first substrate 110 and a first side plate 120 extending from a periphery of the first substrate 110 toward one side thereof. In this embodiment, the first substrate 110 is square. The number of the first side plates 120 is four. Two of the opposite first side plates 120 are provided with a plurality of vent holes 130. The first housing 10 is a heat conductive housing, such as a metal housing, an alloy housing, a thermally conductive carbon nano housing, or the like. In this embodiment, the first housing 10 is an aluminum alloy housing. The first housing 10 further includes a bump 150 protruding from an inner surface of the first substrate 110 toward the electronic component 40.

The second housing 20 includes a second substrate 210 and a second side plate 220 extending from a periphery of the second substrate 210 toward the first housing 10 . In this embodiment, the second substrate 210 is square. The number of the second side plates 220 is four. The two opposite second side plates 220 are respectively provided with the insertion holes 230. The material of the second casing 20 is a heat conductive casing, such as a metal casing, an alloy casing, a heat conductive carbon nanoshell, or the like. In this embodiment, the second housing 20 is an aluminum alloy housing. The second substrate 210 of the second housing 20 is provided with an opening 211. The second housing 20 further includes a pressing plate 250 extending from the second substrate 210 toward the heat dissipation structure 50 .

The circuit board 30 is a plate-like structure having a first surface 310 facing the first housing 10 and a second surface 320 facing the second housing 20. In this embodiment, the circuit board 30 has a square shape corresponding to the first housing 10 and the second housing 20.

The electronic component 40 includes a chip 410 disposed on the first surface 310 of the circuit board 30. The electronic component 40 also includes an image capture component 430 that is mounted to the second surface 320 of the circuit board 30.

The heat dissipation structure 50 includes a heat sink 510 and a plurality of heat conducting elements 520. In one embodiment, the thermally conductive element 520 is a thermally conductive paste layer.

The heat sink 510 is located on one side of the second surface 320 of the circuit board 30. The heat sink 510 is provided with an arcuate recess 530 opposite to the lateral direction. The heat sink 510 includes a main body portion 511 and an extending portion 513 extending outward from opposite side ends of the main body portion 511.

The main body portion 511 includes a bottom plate 5111 and a plurality of holes extending from the bottom plate 5111 to one side. Hot film 5113. In one embodiment, the width of the middle portion of the bottom plate 5111 is smaller than the width of both ends thereof. In this embodiment, the middle portion of the bottom plate 5111 is recessed from the front and rear sides toward the middle.

The plurality of fins 5113 are spaced apart from each other, and an air flow passage is formed between the adjacent fins 5113. The plurality of fins 5113 are curved in a lateral direction. The length of the heat sink 5113 corresponding to the bottom plate 5111 is smaller than the length of the heat sink 5113 corresponding to the two ends of the bottom plate 5111.

The extending portion 513 has two opposite extending arms 5131 extending from the main body portion 511 and a plurality of fixing members 5133 located at one end of the extending arm 5131 away from the main body portion 511.

The heat sink 510 also includes a compression structure 540. The pressing structure 540 extends from the corresponding extending portion 513 away from one end of the main body portion 511 toward the main body portion 511 . The pressing structure 540 includes a positioning portion 541 fixed to an end portion of the extending portion 513 and an elastic portion 543 extending from the positioning portion 541 toward the main body portion 511. The elastic portion 543 is a spring piece. The elastic portion 543 of the pressing structure 540 corresponds to the pressing plate 250 of the second housing 20.

The plurality of thermally conductive elements 520 include a first thermally conductive element 521 and a second thermally conductive element 523. The first heat conducting element 521 is located between the first surface 310 of the circuit board 30 and the first housing 10 . The second heat conducting element 523 is located between the second surface 320 of the circuit board 30 and the bottom plate 5111 of the heat sink 510. In one embodiment, the plurality of thermally conductive elements 520 are thermally conductive clay layers.

Referring to FIG. 5 and FIG. 6, the heat sink 510 and the second housing 20 are placed on the side of the second surface 320 of the circuit board 30 during assembly. The second thermally conductive element 523 is disposed between the bottom plate 5111 of the heat sink 510 and the second surface 320 of the circuit board 30. The arcuate recess 530 of the heat sink 510 corresponds to an image pickup component 430 (shown in FIG. 4) mounted to the circuit board 30. The image pickup element 430 corresponds to the opening 211 of the second housing 20 (as shown in FIG. 4). The heat sink 510 is fixed to the second surface 320 of the circuit board 30 by the fixing member 5133. The heat sink 5113 of the heat sink 510 contacts the second substrate 210 of the second housing 20. The pressing plate 250 of the second casing 20 presses against the pressing structure 540 of the heat sink 510 in the direction of the circuit board 30. The second heat conducting element 523 is completely squeezed by the heat sink 510 to completely fill a gap between the bottom plate 5111 and the second surface of the circuit board 30. A connection area of the second heat conduction element 523 and the second surface 320 of the circuit board 30 corresponds to the chip 410. The first housing 10 and the first heat conducting component 521 are disposed on a side of the first surface 310 of the circuit board 30. The first heat conducting component 521 is disposed on the bump 150 of the first housing 10 and on the circuit board 30 Between the chips 410 on the first surface 310. The first housing 10 is fixed to the second housing 20 by a fastener (not shown), and the first heat conducting element 521 between the bump 150 and the chip 410 is squeezed completely Filling a gap between the bump 150 and the chip 410, and filling a gap between the first surface 310 of the circuit board 30 and the bump 150 on both sides of the chip 410, the chip 410 The first heat conducting element 521 is completely surrounded by the circuit board 30.

The chip 410 generates heat when the visual sensing device 1 is in operation. A portion of the heat is directly transmitted to the bump 150 of the first housing 10 via the first heat conducting element 521, thereby being emitted from the first housing 10 to the external environment, thereby the first heat conducting element 521, The first housing 10 constitutes a first heat dissipation channel of the chip 410. Another part of the heat is transferred to the circuit board 30, and then transmitted to the bottom plate 5111 and the heat sink 5113 of the heat sink 510 via the second heat conducting element 523, and part of the heat is directly radiated by the heat sink 5113, and part of the heat is The heat sink 5113 is transmitted to the second housing 20 and is radiated to the external environment, so that the second heat conducting component 523, the heat sink 510 and the second housing 20 constitute the second of the chip 410. Cooling channel.

With respect to the prior art, the heat generated by the chip 410 is transmitted to the first housing 10 through the first heat conducting element 521, and then is radiated to the external environment through the first housing 10 to form a first A heat dissipation channel. In addition, heat generated by the chip 410 is also transmitted to the circuit board 30, and then connected to the heat sink 510 through a second heat conducting component 523, and the heat sink 510 is connected to the second housing 20. Forming a second heat dissipation channel. Since the two heat dissipation channels sandwich the heat source in the middle, the heat dissipation efficiency is greatly improved. It is experimentally verified that the second heat dissipation channel can increase the heat dissipation efficiency by more than 50% than the first heat dissipation channel.

In addition, since the heat sink 510 is connected to the second housing 20, heat is finally transmitted to the second housing 20 to be radiated to the external environment, and the second housing 20 is used as the heat sink 510. Part of it increases the heat dissipation area and improves the heat dissipation efficiency.

In addition, the heat conducting element 520, particularly when the heat conducting element 520 is a layer of thermally conductive clay, has a very high compression characteristic, and the chip 410, the circuit board 30 and the first housing 10 can be completely filled by extrusion. The gap between the circuit board 30 and the heat sink 510 forms a complete envelopment between the chip 410 and other electronic components on the circuit board 30, thereby achieving the effect of immersion heat dissipation and further improving The heat dissipation efficiency.

It can be understood that another heat sink can be disposed between the first heat conduction element 521 and the first housing 10 .

It can be understood that other chips on the circuit board 30 can also use the first heat dissipation channel and the second heat dissipation channel to dissipate heat.

It can be understood that the heat conducting element 520 can also be a heat pipe or a heat conducting plate internally filled with a phase change medium.

In addition, those skilled in the art can make various other changes and modifications in accordance with the technical concept of the present invention, and all such changes and modifications are within the scope of the claims of the present invention.

Claims

A visual sensing device comprising:

a circuit board having a first surface and a second surface opposite the first surface;

a heating electronic component mounted on the first surface of the circuit board;

It is characterized by:

a first housing having thermal conductivity, which is located on a first surface side of the circuit board;

a second housing having thermal conductivity, located on a second surface side of the circuit board;

a thermally conductive element electrically connected to the first housing and the heat generating electronic component;

a heat dissipation structure electrically connecting the circuit board and the second housing.
The visual sensing device of claim 1 wherein said thermally conductive element is a thermally conductive paste layer;

Or/and the connection area of the heat dissipation structure and the second surface of the circuit board corresponds to the heat-generating electronic component.
The visual sensing device according to claim 1, wherein said first housing protrudes from said heat-generating electronic component with a bump, said thermally conductive element thermally connecting said heat-generating electronic component and said Bump.
The visual sensing device of claim 3 wherein said thermally conductive element is further thermally conductively coupled to said circuit board and said bump.
The visual sensing device of claim 1 wherein said heat dissipating structure comprises another thermally conductive element and said another thermally conductive element is a thermally conductive paste layer.
The visual sensing device of claim 5 wherein said thermally conductive element and said further thermally conductive element are each a layer of thermally conductive clay.
The visual sensing device of claim 5 wherein said heat dissipation structure further comprises a heat sink positioned between said further thermally conductive element and said second housing.
The visual sensing device of claim 7 wherein said heat sink is laterally provided with an arcuate recess for contacting said further thermally conductive element.
The visual sensing device of claim 7 wherein said heat sink includes a base and a plurality of fins extending from said base, said base contacting said further thermally conductive element.
A visual sensing device according to claim 9, wherein said heat sink contacts The second housing is described.
The visual sensing device according to claim 9, wherein the heat sink further comprises an extending portion extending outward from opposite ends of the base and the heat sink, the extending portion having a fixing member. The fixing member is fixed to the circuit board.
A visual sensing device according to claim 11, wherein said heat sink further comprises a pressing structure extending from said extending portion, said second housing projecting toward said heat sink And pressing the plate, the pressing plate pressing the pressing structure toward the circuit board.
The visual sensing device of claim 1 wherein said first housing is provided with a plurality of venting apertures.
The visual sensing device of claim 1 wherein said visual sensing device further comprises an image capture component, said second housing having an opening corresponding to said image capture component.
A visual sensing device according to claim 14, wherein said heat dissipating structure is located on one side of said image pickup element.
A visual sensing device comprising:

a circuit board having a first surface and a second surface opposite the first surface;

a heating electronic component mounted on the first surface of the circuit board;

It is characterized by:

a first heat dissipation channel coupled to the heat generating electronic component and located on a side of the first surface of the circuit board;

A second heat dissipation channel is coupled to the second surface of the circuit board.
The visual sensing device of claim 16 wherein said first heat dissipation channel comprises a first thermally conductive element coupled to said heat-generating electronic component and a first thermally conductively coupled body to said first thermally conductive component body.
The visual sensing device of claim 17 wherein:

The bonding area of the second heat dissipation channel and the second surface of the circuit board corresponds to the heat-generating electronic component;

Or/and the second heat dissipation channel includes a second heat conduction element coupled to the circuit board and a second housing thermally coupled to the second heat conduction element.
The visual sensing device according to claim 18, wherein said first housing and said second housing surround said circuit board and said heat generating electronic component, said first housing and said first The second housing is a metal housing or an alloy housing.
The visual sensing device of claim 19 wherein said first thermally conductive element and said second thermally conductive element are thermally conductive paste layers.
The visual sensing device of claim 20 wherein said first thermally conductive element and said second thermally conductive element are thermally conductive clay layers.
The visual sensing device according to claim 19, wherein the first housing protrudes from the heat-generating electronic component with a bump, and the first heat-conducting element thermally connects the heat-generating electronic component and The bump.
The visual sensing device of claim 22 wherein said thermally conductive element is further thermally coupled to said circuit board and said bump.
The visual sensing device of claim 19 wherein said second heat dissipation passage further comprises a heat sink between said second thermally conductive element and said second housing.
The visual sensing device of claim 24 wherein said heat sink is laterally provided with an arcuate recess for contacting said second thermally conductive element.
A visual sensing device according to claim 24, wherein said heat sink comprises a base and a plurality of fins extending from said base, said base contacting said second thermally conductive element.
The visual sensing device of claim 26 wherein said heat sink contacts said second housing.
The visual sensing device of claim 24, wherein the heat sink further comprises an extension extending outwardly from opposite ends of the base and the heat sink, the extension having a fixing member The fixing member is fixed to the circuit board.
A visual sensing device according to claim 28, wherein said heat sink further comprises a pressing structure extending from said extending portion, said second housing projecting toward said heat sink And pressing the plate, the pressing plate pressing the pressing structure toward the circuit board.
The visual sensing device of claim 19, wherein the first housing is provided with a plurality of vent holes;

Or/and the visual sensing device further includes an image capturing component, the second housing having an opening corresponding to the image capturing component;

Or/and the first housing and the second housing are outer casings of the visual sensing device.