CN112804812B - Cone angle contact heat radiation structure of plug-in circuit board - Google Patents
Cone angle contact heat radiation structure of plug-in circuit board Download PDFInfo
- Publication number
- CN112804812B CN112804812B CN202011583938.2A CN202011583938A CN112804812B CN 112804812 B CN112804812 B CN 112804812B CN 202011583938 A CN202011583938 A CN 202011583938A CN 112804812 B CN112804812 B CN 112804812B
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- Prior art keywords
- circuit board
- heat
- shell
- contact
- stud
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention relates to a cone angle contact heat dissipation structure of a plug-in circuit board, belonging to the technical field of electronic products. The invention is formed by the connection of the circuit boards in a mutual insertion way, is convenient to assemble and disassemble and can save the space of the cabin body; the metal shells are in contact fit with each other at a small taper angle, so that good heat transfer and heat dissipation of the circuit board chip can be realized.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a cone angle contact heat dissipation structure of an opposite-insertion type circuit board.
Background
In the field of electronic products, with the continuous development of light weight and miniaturization technologies, it is increasingly difficult to perform wire bonding and other operations in a limited narrow space. According to the existing cabin structure form, the circuit board and the circuit board are connected by direct bonding wires or flexible boards in many times. The related problems are high difficulty of wire bonding operation, poor maintainability and poor heat dissipation effect. Redundant wires are left between the plates, and are accumulated and extruded in the cabin body, so that the circuit board chip can be seriously extruded; meanwhile, because the heat dissipation of the circuit board chip is not good, the temperature of the chip rises sharply along with the increase of the working time or the rise of the environmental temperature, the chip cannot work normally, and the chip can be burnt out in serious cases.
Disclosure of Invention
Technical problem to be solved
The technical problem to be solved by the invention is as follows: how to design a structure that the circuit board is simply connected and has good heat dissipation in an electronic cabin, in particular to an electronic product which needs to ensure the reliable connection of the circuit board and the reliable operation of a chip in a closed narrow space.
(II) technical scheme
In order to solve the above technical problem, the present invention provides a cone angle contact heat dissipation structure for an opposite-insertion type circuit board, which includes a first heat conduction housing 1, a first circuit board 2, a cone angle contact mating surface 3, a stud 4, a fixing screw 5, a second circuit board 6, a second heat conduction housing 7, a second connector 8 and a first connector 9;
the first circuit board 2 is contacted with the bottom of the first heat conduction shell 1, and the first circuit board 2 is fixed through the external thread of the stud 4; the second circuit board 6 and the second heat conduction shell 7 are connected into a whole, an internal chip of the second circuit board 6 is in contact with the second heat conduction shell 7 through a heat conduction rubber pad, the second circuit board 6 is in contact with the end part of the stud 4, and the second circuit board 6 is fixed through the connection of the first fixing screw 5 and the internal thread of the stud 4; a first connector 9 is welded on the first circuit board 2; a second connector 8 is welded on the second circuit board 6; when two circuit boards are installed, the two circuit boards are positioned and installed by a second connector guide pin 11 on the second connector 8 and a first connector guide pin hole 13 on the first connector 9; the bottom of the first heat conduction shell 1 is provided with a contact step 15 which is used for contacting with a step of a system shell 17; after assembly, the first heat-conducting shell 1 and the second heat-conducting shell 7 form a conical contact matching surface 3 with a certain angle therebetween.
Preferably, the taper of the conical contact mating surface 3 is 1 °.
Preferably, the second heat-conducting housing 7 has a counterbore.
Preferably, the lower part of the stud 4 is provided with an external thread, and the head part of the stud is provided with an internal thread.
Preferably, the connection effective height of the stud 4 is greater than the height of two connectors after being connected in a plug-in mode.
Preferably, the difference between the effective connecting height of the stud 4 and the height of the two connectors after being inserted and connected is within 0.1 mm.
Preferably, the first circuit board 2 includes a chip board, a mounting hole.
Preferably, the second circuit board 6 includes a chip board, a mounting hole.
The invention also provides an assembly method of the structure, which comprises the following steps:
firstly, placing a first circuit board 2 welded with a first connector 9 into a first heat conduction shell 1, screwing a stud 4 into the first heat conduction shell, and connecting and fixing the first circuit board 2 and the stud 4 through an external thread at the bottom of the stud 4;
secondly, connecting the second circuit board 6 welded with the second connector 8 with a second heat-conducting shell 7 to form a circuit board assembly, wherein a chip device on the second circuit board 6 is contacted with the second heat-conducting shell 7 through a heat-conducting rubber pad;
thirdly, pressing the circuit board assembly in the second step to the first circuit board 2 from top to bottom, and in the pressing process, connecting the circuit board assembly by means of the second connector guide pins 11 and the first connector guide pin holes 13 of the two connectors in a guiding manner, and meanwhile, gradually contacting the cone angle contact matching surface 3 of the first heat conduction shell 1 and the second heat conduction shell 7 to finally form a heat conduction contact surface;
fourthly, screwing the first fixing screw 5 into the internal thread hole of the stud 4 through the counter bore of the second heat conduction shell 7 to firmly connect and fix the first circuit board 2 and the second circuit board 6; finally, the connected electronic cabin is arranged in the system shell 17, the contact step 15 of the first heat conduction shell 1 is in contact with the step surface of the system shell 17, and the system shell 17 is connected with the electronic cabin product through a second fixing screw 16.
The invention also provides a method for realizing the heat dissipation of the circuit board by using the structure, after the assembly is finished, the heat of the chip of the first circuit board 2 is firstly transferred to the first heat-conducting shell 1 and then transferred to the system shell 17 through the contact step 15; thus, the heat of the chip of the second circuit board 6 is firstly transferred to the second heat-conducting shell 7, transferred to the first heat-conducting shell 1 through the conical surface contact matching surface 3, transferred to the system shell 17 through the contact step 15, and finally transferred to the outside air through the system shell 17.
(III) advantageous effects
1. The connector guide pin is positioned, the circuit board is simple to assemble, the connection is reliable, and the detachability is good.
2. The circuit board is prevented from being connected by welding wires, and the chip board is prevented from being extruded by wires among boards.
3. The conical surface contact mode is adopted, so that good contact heat conduction effect between the shells is guaranteed, and meanwhile, the automatic centering and mounting effects are achieved.
4. By adopting the conical surface contact design, the assembling press-in amount is slowly and gradually increased until the plug connector is completely connected, over-tight or over-constrained restraint between the shells is avoided, and the assembling adaptability is improved.
Drawings
FIG. 1 is a schematic view of a cone-angle contact heat-dissipating electronic module of a plug-in circuit board according to the present invention;
FIG. 2 is a schematic view of a first thermally conductive housing according to the present invention;
FIG. 3 is a schematic view of the cone angle contact relationship between the first heat-conducting shell and the second heat-conducting shell according to the present invention;
FIG. 4 is a schematic diagram of the structure of a first circuit board (a) and a second circuit board (b) according to the present invention;
fig. 5 is a schematic diagram of the assembly relationship between the electronic cabin and the system housing.
Wherein: 1. a first thermally conductive housing; 2. a first circuit board; 3. a cone angle contact mating surface; 4. a stud; 5. a first set screw; 6. a second circuit board; 7. a second thermally conductive housing; 8. a second connector; 9. a first connector; 10. an electronics compartment-to-exterior connector; 11. a second connector guide pin; 12. a second circuit board mounting hole; 13. a first connector guide pin hole; 14. a first circuit board mounting hole; 15. a contact step; 16. a second set screw; 17. a system housing.
Detailed Description
In order to make the objects, contents, and advantages of the present invention more apparent, the following detailed description of the present invention will be made in conjunction with the accompanying drawings and examples.
In a closed narrow product space, the heat dissipation and heat conduction problems of the chip need to be considered so as to ensure the safety and reliability of the product. The invention is formed by the connection of the circuit boards in a mutual insertion way, is convenient to assemble and disassemble and can save the space of the cabin body; the metal shells are in contact fit with each other at a small taper angle, so that good heat transfer and heat dissipation of the circuit board chip can be realized.
As shown in fig. 1 to 5, the heat dissipation structure of the opposite-insertion type circuit board provided by the present invention includes: the device comprises a first heat-conducting shell 1, a first circuit board 2, a cone angle contact matching surface 3, a stud 4, a fixing screw 5, a second circuit board 6, a second heat-conducting shell 7, a second connector 8 and a first connector 9;
the first circuit board 2 is contacted with the bottom of the first heat conduction shell 1, and the first circuit board 2 is fixed through the external thread of the stud 4; the second circuit board 6 and the second heat conduction shell 7 are connected into a whole, an internal chip of the second circuit board 6 is in contact with the second heat conduction shell 7 through a heat conduction rubber pad, the second circuit board 6 is in contact with the end part of the stud 4, and the second circuit board 6 is fixed through the connection of the first fixing screw 5 and the internal thread of the stud 4; a first connector 9 and a second connector 8 are welded on the first circuit board 2 and the second circuit board 6 respectively; when two circuit boards are installed, the two circuit boards are positioned and installed by a second connector guide pin 11 on the second connector 8 and a first connector guide pin hole 13 on the first connector 9; the bottom of the first heat conduction shell 1 is provided with a contact step 15 which is used for contacting with a step of a system shell 17 so as to ensure heat transfer; after assembly, a small-angle conical surface contact matching surface 3 is formed between the first heat conduction shell 1 and the second heat conduction shell 7, and when the conical surfaces of the two heat conduction shells are in contact during design, the two connectors are connected completely, so that over-restraint generated when the two connectors are in contact and the two conical surfaces of the two heat conduction shells are in contact and act simultaneously is avoided.
Further, the second heat-conducting housing 7 has a counterbore.
Further, the conical surface contact matching surface 3 is determined according to the space size and the contact effect, and the taper in the structure is 1 degree.
Further, the first circuit board 2 includes a chip board and a mounting hole.
Further, the second circuit board 6 includes a chip board and a mounting hole.
Further, the lower part of the stud 4 is provided with an external thread, and the head part of the stud is provided with an internal thread; and the effective height of the stud 4 is slightly greater than the height of the two connectors after the two connectors are oppositely plugged, so that the difference between the effective height of the stud 4 and the height of the two connectors after being oppositely plugged in the structure is within 0.1mm under the condition that the two connectors are well contacted.
The assembly process is as follows: firstly, placing a first circuit board 2 welded with a first connector 9 into a first heat conduction shell 1, screwing a stud 4 into the first heat conduction shell, and connecting and fixing the first circuit board 2 and the stud 4 through an external thread at the bottom of the stud 4; secondly, connecting the second circuit board 6 welded with the second connector 8 with a second heat-conducting shell 7 to form a circuit board assembly, wherein a chip device on the second circuit board 6 is contacted with the second heat-conducting shell 7 through a heat-conducting rubber pad; thirdly, pressing the circuit board assembly in the second step to the first circuit board 2 from top to bottom, and in the pressing process, connecting the circuit board assembly by means of the second connector guide pins 11 and the first connector guide pin holes 13 of the two connectors in a guiding manner, and meanwhile, gradually contacting the cone angle contact matching surface 3 of the first heat conduction shell 1 and the second heat conduction shell 7 to finally form a good heat conduction contact surface; fourthly, screwing the first fixing screw 5 into the internal thread hole of the stud 4 through the counter bore of the second heat conduction shell 7 to firmly connect and fix the first circuit board 2 and the second circuit board 6; finally, the connected electronic cabin is arranged in the system shell 17, the contact step 15 of the first heat conduction shell 1 is in contact with the step surface of the system shell 17, and the system shell 17 is connected with the electronic cabin product through a second fixing screw 16. Thus, the chip heat of the first circuit board 2 is firstly transferred to the first heat conducting shell 1 and then transferred to the system shell 17 through the contact step 15; thus, the heat of the chip of the second circuit board 6 is firstly transferred to the second heat-conducting shell 7, transferred to the first heat-conducting shell 1 through the conical surface contact matching surface 3, transferred to the system shell 17 through the contact step 15, and finally transferred to the outside air through the system shell 17.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A cone angle contact heat dissipation structure of an opposite-insertion type circuit board is characterized by comprising a first heat conduction shell (1), a first circuit board (2), a cone angle contact matching surface (3), a stud (4), a fixing screw (5), a second circuit board (6), a second heat conduction shell (7), a second connector (8) and a first connector (9);
the first circuit board (2) is in contact with the bottom of the first heat-conducting shell (1), and the first circuit board (2) is fixed through the external threads of the stud (4); the second circuit board (6) and the second heat-conducting shell (7) are connected into a whole, an internal chip of the second circuit board (6) is in contact with the second heat-conducting shell (7) through a heat-conducting rubber pad, the second circuit board (6) is in contact with the end part of the stud (4), and the second circuit board (6) is fixed through the internal thread connection of the first fixing screw (5) and the stud (4); a first connector (9) is welded on the first circuit board (2); a second connector (8) is welded on the second circuit board (6); when two circuit boards are installed, the two circuit boards are positioned and installed by a second connector guide pin (11) on a second connector (8) and a first connector guide pin hole (13) on a first connector (9); the bottom of the first heat conduction shell (1) is provided with a contact step (15) which is used for contacting with the step of the system shell (17); after assembly, a conical surface contact matching surface (3) with a certain angle is formed between the first heat conduction shell (1) and the second heat conduction shell (7).
2. A structure according to claim 1, characterized in that the taper of the tapered contact mating surface (3) is 1 °.
3. A structure as claimed in claim 1, characterized in that said second heat-conducting shell (7) has a counterbore.
4. Structure as claimed in claim 1, characterized in that the stud (4) is externally threaded at its lower part and internally threaded at its head.
5. Structure as claimed in claim 4, characterized in that the effective height of the stud (4) connection is greater than the height of two connectors after mating.
6. The structure according to claim 5, characterized in that the difference between the effective height of the stud (4) connection and the height of the two connectors after the two connectors are inserted into each other is within 0.1 mm.
7. A structure as claimed in claim 1, characterized in that said first circuit board (2) comprises a chip board, mounting holes.
8. A structure as claimed in claim 1, characterized in that said second circuit board (6) comprises a chip board, mounting holes.
9. A method of assembling a structure according to any one of claims 1 to 8, comprising the steps of:
firstly, a first circuit board (2) welded with a first connector (9) is placed into a first heat conduction shell (1), a stud (4) is screwed in, and the first circuit board and the stud (4) are connected and fixed through an external thread at the bottom of the stud (4);
secondly, connecting a second circuit board (6) welded with a second connector (8) with a second heat-conducting shell (7) to form a circuit board assembly, wherein a chip device on the second circuit board (6) is in contact with the second heat-conducting shell (7) through a heat-conducting rubber pad;
thirdly, pressing the circuit board assembly in the second step to the first circuit board (2) from top to bottom, and in the pressing process, connecting the circuit board assembly by means of the second connector guide pins (11) and the first connector guide pin holes (13) of the two connectors in a guiding manner, and meanwhile, gradually contacting the cone angle contact matching surfaces (3) of the first heat conduction shell (1) and the second heat conduction shell (7) to finally form a heat conduction contact surface;
fourthly, screwing a first fixing screw (5) into the internal thread hole of the stud (4) through a counter bore of the second heat-conducting shell (7) to firmly connect and fix the first circuit board (2) and the second circuit board (6); and finally, the connected electronic cabin is arranged in a system shell (17), so that the contact step (15) of the first heat conduction shell (1) is in surface contact with the step of the system shell (17), and the system shell (17) is connected with an electronic cabin product by using a second fixing screw (16).
10. A method for dissipating heat from a circuit board using the structure of any one of claims 1 to 8, wherein after assembly, the heat of the chips of the first circuit board (2) is transferred to the first heat-conducting housing (1) and then to the system housing (17) through the contact step (15); therefore, the heat of the chip of the second circuit board (6) is firstly transferred to the second heat-conducting shell (7), transferred to the first heat-conducting shell (1) through the conical surface contact matching surface (3), transferred to the system shell (17) through the contact step (15), and finally transferred to the outside air through the system shell (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011583938.2A CN112804812B (en) | 2020-12-28 | 2020-12-28 | Cone angle contact heat radiation structure of plug-in circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011583938.2A CN112804812B (en) | 2020-12-28 | 2020-12-28 | Cone angle contact heat radiation structure of plug-in circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN112804812A CN112804812A (en) | 2021-05-14 |
| CN112804812B true CN112804812B (en) | 2022-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011583938.2A Active CN112804812B (en) | 2020-12-28 | 2020-12-28 | Cone angle contact heat radiation structure of plug-in circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4708660A (en) * | 1986-06-23 | 1987-11-24 | Control Data Corporation | Connector for orthogonally mounting circuit boards |
| US5196087A (en) * | 1991-06-18 | 1993-03-23 | Multimedia Design, Inc. | Method for making multi-layer printed circuit board |
| JPH10290087A (en) * | 1997-04-14 | 1998-10-27 | Hitachi Ltd | Electronic apparatus |
| CN201490181U (en) * | 2009-07-29 | 2010-05-26 | 精伦电子股份有限公司 | Chip heat radiation device |
| EP2736125A1 (en) * | 2012-11-27 | 2014-05-28 | Hosiden Corporation | Component module, mating connector, and connection structure between component module and mating connector |
| WO2015116445A1 (en) * | 2014-02-03 | 2015-08-06 | Tyco Electronics Corporation | Pluggable module |
| CN205082127U (en) * | 2015-09-30 | 2016-03-09 | 成都九洲迪飞科技有限责任公司 | Shielding structure based on double -deck PCB board |
| CN205082044U (en) * | 2015-09-30 | 2016-03-09 | 成都九洲迪飞科技有限责任公司 | Shield device of sealed double -deck PCB board |
| CN205302845U (en) * | 2015-11-30 | 2016-06-08 | 长治市华杰光电科技有限公司 | A LED display screen module drain pan structure |
| WO2017092537A1 (en) * | 2015-11-30 | 2017-06-08 | 深圳市大疆创新科技有限公司 | Vision sensing apparatus having heat dissipation structure |
| EP3302009A1 (en) * | 2016-09-30 | 2018-04-04 | Napatech A/S | Extension pcb with common cooling system |
| JP2018143013A (en) * | 2017-02-27 | 2018-09-13 | 日立オートモティブシステムズ株式会社 | Electronic controller |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
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| CN102892277B (en) * | 2011-07-20 | 2016-08-03 | 光宝电子(广州)有限公司 | Circuit board arrangement and manufacture method thereof and there is the power supply unit of this circuit board arrangement |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4708660A (en) * | 1986-06-23 | 1987-11-24 | Control Data Corporation | Connector for orthogonally mounting circuit boards |
| US5196087A (en) * | 1991-06-18 | 1993-03-23 | Multimedia Design, Inc. | Method for making multi-layer printed circuit board |
| JPH10290087A (en) * | 1997-04-14 | 1998-10-27 | Hitachi Ltd | Electronic apparatus |
| CN201490181U (en) * | 2009-07-29 | 2010-05-26 | 精伦电子股份有限公司 | Chip heat radiation device |
| EP2736125A1 (en) * | 2012-11-27 | 2014-05-28 | Hosiden Corporation | Component module, mating connector, and connection structure between component module and mating connector |
| WO2015116445A1 (en) * | 2014-02-03 | 2015-08-06 | Tyco Electronics Corporation | Pluggable module |
| CN205082127U (en) * | 2015-09-30 | 2016-03-09 | 成都九洲迪飞科技有限责任公司 | Shielding structure based on double -deck PCB board |
| CN205082044U (en) * | 2015-09-30 | 2016-03-09 | 成都九洲迪飞科技有限责任公司 | Shield device of sealed double -deck PCB board |
| CN205302845U (en) * | 2015-11-30 | 2016-06-08 | 长治市华杰光电科技有限公司 | A LED display screen module drain pan structure |
| WO2017092537A1 (en) * | 2015-11-30 | 2017-06-08 | 深圳市大疆创新科技有限公司 | Vision sensing apparatus having heat dissipation structure |
| EP3302009A1 (en) * | 2016-09-30 | 2018-04-04 | Napatech A/S | Extension pcb with common cooling system |
| JP2018143013A (en) * | 2017-02-27 | 2018-09-13 | 日立オートモティブシステムズ株式会社 | Electronic controller |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
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|---|---|
| CN112804812A (en) | 2021-05-14 |
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