CN112987880B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN112987880B CN112987880B CN201911211467.XA CN201911211467A CN112987880B CN 112987880 B CN112987880 B CN 112987880B CN 201911211467 A CN201911211467 A CN 201911211467A CN 112987880 B CN112987880 B CN 112987880B
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- China
- Prior art keywords
- heat
- cover plate
- heat dissipation
- shell
- heat sink
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- 230000017525 heat dissipation Effects 0.000 title claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000007787 solid Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat abstractor, includes fin, casing and elastic component, and the fin is used for radiating the heat-generating body, and the casing is used for acceping heat-generating body and fin, and the casing includes the apron, and the slice end of fin is placed towards the apron, and the apron is through elastic component elastic connection fin towards the inside one side of casing, and the apron is through the plane termination trigger heat-generating body of elastic component push against the fin in order to dispel the heat.
Description
Technical Field
The invention relates to a heat dissipation device.
Background
At present, the use of a high-energy solid state disk by a computer motherboard has become a development trend, but the heat productivity of the high-energy solid state disk is higher, which means that more cooling fins are needed to cool the solid state disk. The traditional radiating fin fixing mode is to punch holes on the main board, and then fix the two ends of the radiating fin on the main board through screws, but for a small chassis, the main board does not have enough space to provide holes for fixing the radiating fin, so the radiating fin cannot be fixed on the main board.
Disclosure of Invention
In view of the above, it is necessary to provide a heat dissipating device in which the heat sink is separated from the motherboard and dissipates heat from the heat-generating body solid state disk.
In one embodiment of the invention, the heat dissipating device comprises a heat dissipating fin, wherein the heat dissipating fin is used for dissipating heat of a heating element, the heat dissipating device further comprises a shell and an elastic piece, the shell is used for accommodating the heating element and the heat dissipating fin, the shell comprises a cover plate, the sheet-shaped end of the heat dissipating fin is arranged towards the cover plate, one surface of the cover plate, which faces towards the inside of the shell, is elastically connected with the heat dissipating fin through the elastic piece, and the cover plate pushes the plane end of the heat dissipating fin to contact the heating element through the elastic piece so as to dissipate heat.
In an embodiment of the invention, a guide post is disposed on one surface of the cover plate facing the inside of the housing, the elastic member is disposed on the guide post in a penetrating manner, the heat sink is provided with a through hole, the heat sink is slidably disposed on the guide post through the through hole in a penetrating manner, the elastic member is disposed between the cover plate and the heat sink, and the guide post is used for guiding the heat sink.
In an embodiment of the invention, a baffle is disposed around each guide post of the cover plate, the length of the baffle is smaller than that of the guide post, and the tail end of the baffle is used for limiting the movement of the cooling fin towards the position close to the cover plate.
In an embodiment of the invention, a stop block is arranged at the tail end of the guide post, and the stop block is used for limiting the movement of the radiating fin away from the cover plate.
In one embodiment of the invention, a heat conducting gasket is attached to the planar end of the heat sink, and the heat conducting gasket is used for filling an air gap on the surface of the heating element.
In an embodiment of the invention, the housing is a casing of a chassis, and the cover plate is an upper cover of the casing.
In an embodiment of the invention, the stop block is a flat head screw, and the area of the screw head is larger than the area of the guide post.
In an embodiment of the invention, the elastic member is a spring.
The radiating device achieves the purpose of radiating the heat of the heating body solid state disk while separating the radiating fin from the main board through the cover plate and the elastic piece.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipating device according to an embodiment of the invention.
Fig. 2 is a schematic perspective view illustrating an internal structure of a heat dissipating device according to an embodiment of the invention.
Fig. 3 is an exploded view of a heat dissipating device according to an embodiment of the present invention.
Fig. 4 is an enlarged view of IV in an embodiment of the invention.
Description of the main reference signs
Heat dissipating device 100
Heating element 200
Heat sink 10
Sheet-like end 11
Planar end 12
Through hole 13
Housing 20
Cover plate 21
Guide post 211
Stop block 2111
Baffle 212
Elastic member 30
Heat conducting gasket 300
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.
Referring to fig. 1 and 2, in an embodiment of the invention, a heat dissipating device 100 includes a heat sink 10, a housing 20 and an elastic member 30. The heat sink 10 includes a sheet end 11 and a planar end 12. The flat end 12 is used to contact the heating body 200 and absorb heat of the heating body 200 while transferring the heat to the sheet-shaped end 11, and the sheet-shaped end 11 is used to radiate the heat. The case 20 accommodates the heating element 200 and the heat sink 10. The housing 20 includes a cover 21. The sheet-like ends 11 of the heat sink 10 are placed toward the cover plate 21. The side (inner surface) of the cover 21 facing the inside of the case 20 is elastically connected to the heat sink 10 by the elastic member 30. The cover 21 pushes the flat end 12 of the heat sink 10 against the heat generating body 200 through the elastic member 30 to radiate heat.
Referring to fig. 3 and 4, a guide post 211 is disposed on a surface (inner surface) of the cover 21 facing the interior of the housing 20. The elastic member 30 is disposed on the guide post 211. The heat sink 10 is provided with through holes 13 at both ends. The heat sink 10 is slidably disposed on the guide post 211 through the through hole 13, and the elastic member 30 is located between the cover 21 and the heat sink 10. The guide posts 211 serve to guide the heat sink 10.
The cover plate 21 is provided with a baffle 212 on both sides of each guide post 211. The length of the baffle 212 is less than the length of the guide post 211. The end of the baffle 212 serves to limit the movement of the heat sink 10 toward the cover plate 21. The distance between the end of the baffle 212 and the end of the guide post 211 is the movable range of the heat sink 10.
The end of the guide post 211 is provided with a stop block 2111. Stop 2111 is used to limit the movement of heat sink 10 away from cover 21, preventing heat sink 10 from falling off of guide post 211.
The distance between the heat radiation surface of the heat generating body 200 and the cover plate 21 is smaller than or equal to the distance between the stopper 2111 and the cover plate 21. If the distance between the heat radiation surface of the heat-generating body 200 and the cover 21 is too large, the heat radiation fin 10 cannot contact the heat-generating body 200. When the distance between the heating element 200 and the cover 21 is smaller than the distance between the stop block 2111 and the cover 21, the heating element 200 supports the heat sink 10, and the heat sink 10 slides on the guide post 211 toward the cover 21, so that the elastic element 30 is compressed, and the elastic element 30 pushes the heat sink 10 to contact the heating element 200 for heat dissipation.
The planar end 12 of the heat sink 10 has attached thereto a thermally conductive gasket 300. The heat conductive gasket 300 is used to fill the air gap on the surface of the heating element 200, so that heat conduction is more sufficient.
In one embodiment of the present invention, the housing 20 is a casing of a chassis. The cover plate 21 is an upper cover of the housing. The heating element 200 is a solid state disk. The stopper 2111 is a flat head screw, and the area of the screw head is larger than the sectional area of the guide post 211. The elastic member 30 is a spring.
It should be noted that, when the placement position of the heating element 200 interferes with the axial direction of the guide post 211, the height of the heating element 200 is smaller than or equal to the height of the stopper 2111, otherwise, the stopper 2111 contacts the heating element 200, so that the cover 21 cannot cover the housing 20. When the height of the heating element 200 is lower than the height of the stop block 2111, the planar end 12 cannot naturally contact the heating element 200, so that at this time, the height of the heat conducting spacer 300 is greater than or equal to the distance between the stop block 2111 and the heating element 200, and is smaller than the distance between the end of the baffle 212 and the end of the guide post 211 plus the distance between the stop block 2111 and the heating element 200, so that the movable distance of the heat sink 10 on the guide post 211 can be fully utilized, and the cover plate 21 can cover the housing 20. When the placement position of the heat generating body 200 does not interfere with the axial direction of the guide post 211, the height of the heat generating body 200 may be within the movable range of the heat sink 10.
It will be appreciated that in other embodiments, the number of fins 10, posts 211, springs 30, stops 2111, and baffles 212 may be increased or decreased; the heat sink 100 may have a plurality of heat-generating bodies 200 therein; the heat-generating body 200 may be other components than a solid state disk.
The heat sink 100 achieves the purpose of dissipating heat from the heat generating body 200 while separating the heat sink 10 from the main board through the cover plate 21 and the elastic member 30.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention. Those skilled in the art can make other changes and modifications within the spirit of the invention, which are intended to be within the scope of the invention, without departing from the technical spirit of the invention. Such variations, which are in accordance with the spirit of the invention, are intended to be included within the scope of the invention as claimed.
Claims (7)
1. The utility model provides a heat abstractor, includes the fin, the fin is used for the heat dissipation to the heat-generating body, its characterized in that: the heat dissipation device further comprises a shell and an elastic piece, wherein the shell is used for accommodating the heating element and the heat dissipation fins, the shell comprises a cover plate, the sheet-shaped end of the heat dissipation fins faces the cover plate to be placed, the cover plate faces one side inside the shell, a guide pillar is arranged on the cover plate, the elastic piece penetrates through the guide pillar, a through hole is formed in the heat dissipation fins, the heat dissipation fins penetrate through the guide pillar in a sliding mode, the elastic piece is located between the cover plate and the heat dissipation fins, the cover plate faces one side inside the shell and is elastically connected with the heat dissipation fins through the elastic piece, and the cover plate abuts against the plane end of the heat dissipation fins to contact the heating element through the elastic piece.
2. The heat sink as recited in claim 1, wherein: the cover plate is provided with a baffle plate around each guide post, the length of the baffle plate is smaller than that of the guide post, and the tail end of the baffle plate is used for limiting the movement of the radiating fin towards the position close to the cover plate.
3. The heat sink as recited in claim 2, wherein: the tail end of the guide post is provided with a stop block, and the stop block is used for limiting the movement of the radiating fin away from the cover plate.
4. A heat sink as claimed in claim 3, wherein: and a heat conduction gasket is attached to the plane end of the radiating fin and used for filling an air gap on the surface of the heating body.
5. The heat sink as recited in claim 1, wherein: the shell is a shell of a case, and the cover plate is an upper cover of the shell.
6. A heat sink as claimed in claim 3, wherein: the stop block is a flat head screw, and the area of the screw head is larger than that of the guide post.
7. The heat sink as recited in claim 1, wherein: the elastic piece is a spring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911211467.XA CN112987880B (en) | 2019-12-02 | 2019-12-02 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911211467.XA CN112987880B (en) | 2019-12-02 | 2019-12-02 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
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CN112987880A CN112987880A (en) | 2021-06-18 |
CN112987880B true CN112987880B (en) | 2023-11-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911211467.XA Active CN112987880B (en) | 2019-12-02 | 2019-12-02 | Heat dissipation device |
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CN (1) | CN112987880B (en) |
Citations (10)
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---|---|---|---|---|
CN101389201A (en) * | 2007-09-11 | 2009-03-18 | 李钧塘 | Elastic heat conducting and radiating device |
CN101472451A (en) * | 2007-12-28 | 2009-07-01 | 英业达股份有限公司 | Electronic device with movable radiating space |
CN104125746A (en) * | 2013-04-24 | 2014-10-29 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
CN205284014U (en) * | 2015-11-30 | 2016-06-01 | 深圳市大疆创新科技有限公司 | Vision sensing device with heat radiation structure |
CN106406472A (en) * | 2016-07-06 | 2017-02-15 | 郑州职业技术学院 | Novel memory cooling apparatus |
CN206162309U (en) * | 2016-09-22 | 2017-05-10 | 深圳市嘉合劲威电子科技有限公司 | Solid state disk assembly and heat dissipation device thereof |
CN206251564U (en) * | 2016-12-20 | 2017-06-13 | 鼎点视讯科技有限公司 | Heat abstractor, heat dissipation for circuit board system and electronic equipment |
CN108681385A (en) * | 2018-08-07 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of radiator can be applied to different size solid state disk |
CN208367615U (en) * | 2018-06-12 | 2019-01-11 | 黄河科技学院 | A kind of computer heat dissipation equipment |
CN209070480U (en) * | 2018-12-31 | 2019-07-05 | 吉林省芝麻软件开发中心 | A kind of hard disc of computer radiator |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10440812B2 (en) * | 2018-02-26 | 2019-10-08 | Dell Products L. P. | Heatsink mounting system to maintain a relatively uniform amount of pressure on components of a circuit board |
-
2019
- 2019-12-02 CN CN201911211467.XA patent/CN112987880B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101389201A (en) * | 2007-09-11 | 2009-03-18 | 李钧塘 | Elastic heat conducting and radiating device |
CN101472451A (en) * | 2007-12-28 | 2009-07-01 | 英业达股份有限公司 | Electronic device with movable radiating space |
CN104125746A (en) * | 2013-04-24 | 2014-10-29 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
CN205284014U (en) * | 2015-11-30 | 2016-06-01 | 深圳市大疆创新科技有限公司 | Vision sensing device with heat radiation structure |
CN106406472A (en) * | 2016-07-06 | 2017-02-15 | 郑州职业技术学院 | Novel memory cooling apparatus |
CN206162309U (en) * | 2016-09-22 | 2017-05-10 | 深圳市嘉合劲威电子科技有限公司 | Solid state disk assembly and heat dissipation device thereof |
CN206251564U (en) * | 2016-12-20 | 2017-06-13 | 鼎点视讯科技有限公司 | Heat abstractor, heat dissipation for circuit board system and electronic equipment |
CN208367615U (en) * | 2018-06-12 | 2019-01-11 | 黄河科技学院 | A kind of computer heat dissipation equipment |
CN108681385A (en) * | 2018-08-07 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of radiator can be applied to different size solid state disk |
CN209070480U (en) * | 2018-12-31 | 2019-07-05 | 吉林省芝麻软件开发中心 | A kind of hard disc of computer radiator |
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Publication number | Publication date |
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CN112987880A (en) | 2021-06-18 |
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