CN106170199B - Heat dissipation shielding system and communication product - Google Patents
Heat dissipation shielding system and communication product Download PDFInfo
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- CN106170199B CN106170199B CN201610797875.8A CN201610797875A CN106170199B CN 106170199 B CN106170199 B CN 106170199B CN 201610797875 A CN201610797875 A CN 201610797875A CN 106170199 B CN106170199 B CN 106170199B
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- shielding
- circuit board
- heat
- shield
- cover
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Details Of Aerials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to the technical field of electronics, in particular to a heat dissipation shielding system and a communication product, which comprise: the heating element is arranged on the circuit board, the shielding cover and the heat conducting pipe jointly form a shielding space, the heating element is arranged in the shielding space, the heat conducting pipe is arranged outside the shielding space and is connected with the shielding cover through heat conducting silica gel, at least one side wall of the shielding cover is clamped in at least one clamping component, the clamping component is fixed on the circuit board, an elastic component is abutted between at least one side wall of the shielding cover and the circuit board, and the elastic component is used for abutting against the shielding cover so that the shielding cover and the heat conducting pipe can be kept in good contact through the heat conducting silica gel. When the heat conduction silica gel between the heat conduction pipe and the shielding cover deforms, the elastic component can enable the shielding cover to bounce upwards, so that the heat conduction pipe and the shielding cover are always in good contact, and the heat dissipation effect of the heating chip is guaranteed.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a heat dissipation shielding system and a communication product.
Background
Some communication terminal products include chips with large heat generation, for example: for power amplifiers and the like, chips with large heat productivity generally need electromagnetic shielding and heat dissipation.
Fig. 1 (a) -1 (b) are schematic diagrams of a heat dissipation shielding system in the prior art, wherein fig. 1 (a) is a cross-sectional view, and fig. 1 (b) is a side view. The heating chip 11 is surrounded by a complete shielding cavity formed by the circuit board 12, the shielding frame 13 and the shielding cover 14 to achieve the purpose of electromagnetic shielding, a heat conducting pad 15 is installed between the shielding cover 14 and the heating chip 11 to reduce the thermal resistance between the heating chip 11 and the shielding cover 14, meanwhile, a heat conducting pipe 16 is added above the shielding cover 14, the heat conducting pipe 16 is adhered to the shielding cover 14 through elastic heat conducting silica gel 17, and therefore the heat is dissipated out through the heat conducting pipe 16; the shield frame 13 is generally engaged with the clip member 18 through a side wall, so that the shield frame 13 is fixed and the shield frame 13 is electrically grounded through the clip member 18.
The main problems of the heat dissipation shielding system shown in fig. 1 (a) to 1 (b) are: the elastic heat conductive silicone 17 between the heat pipe 16 and the shielding cover 14 is deformed by compression with time, which may cause poor contact between the heat pipe 16 and the shielding cover 14, thereby affecting the heat dissipation effect of the heat generating chip 11.
In summary, the heat dissipation shielding system of the prior art has a poor heat dissipation effect.
Disclosure of Invention
The invention provides a heat dissipation shielding system and a communication product, which are used for solving the technical problem of poor heat dissipation effect in the prior art.
On one hand, the embodiment of the invention provides a heat dissipation shielding system, which comprises a heating element, a circuit board, a shielding cover and a heat conducting pipe, wherein the heating element is arranged on the circuit board, the shielding cover and the circuit board jointly form a shielding space, the heating element is arranged in the shielding space, the heat conducting pipe is arranged outside the shielding space and is connected with the shielding cover through heat conducting silica gel, at least one side wall of the shielding cover is clamped with at least one clamping component, the clamping component is fixed on the circuit board, an elastic component is abutted between at least one side wall of the shielding cover and the circuit board, and the elastic component is used for abutting against the shielding cover so that the shielding cover and the heat conducting pipe are kept in good contact through the heat conducting silica gel.
Optionally, at least one end of the elastic component is fixed on the circuit board; or
The elastic component is fixed at the bottom of at least one side wall of the shielding case; or alternatively
At least one end of the elastic member is fixed to an end of the at least one holding member.
Optionally, at least one sidewall of the shield case is engaged with two clamping members, one end of the elastic member is fixed to an end portion of one of the clamping members close to the elastic member, and the other end of the elastic member is fixed to an end portion of the other clamping member close to the elastic member.
Optionally, the resilient member is of a convex configuration.
Optionally, the elastic member is a metal clip having conductive properties.
Optionally, the metal clip is made of stainless steel.
Optionally, the heat generating element and the shielding cover are connected by a heat conducting pad.
Optionally, the upper surface of the shielding case is provided with a through hole, and the through hole is opposite to the heating element.
Optionally, the at least one clamping member is soldered to the circuit board, and the at least one clamping member is opened toward the upper surface of the shielding case.
In another aspect, an embodiment of the present invention provides a communication product, including the heat dissipation shielding system as described in any one of the above.
The invention provides a heat dissipation shielding system which comprises a heating element, a circuit board, a shielding cover and a heat conduction pipe, wherein the heating element is arranged on the circuit board, the shielding cover and the circuit board jointly form a shielding space, the heating element is arranged in the shielding space, the heat conduction pipe is arranged outside the shielding space and is connected with the shielding cover through heat conduction silica gel, at least one side wall of the shielding cover is clamped with at least one clamping part, the clamping part is fixed on the circuit board, an elastic part is abutted between at least one side wall of the shielding cover and the circuit board, and the elastic part is used for abutting against the shielding cover so that the shielding cover and the heat conduction pipe are kept in good contact through the heat conduction silica gel. According to the invention, at least one side wall of the shielding cover is clamped with at least one clamping component, the at least one clamping component is fixed on the circuit board, and the elastic component is abutted between the at least one side wall of the shielding cover and the circuit board, so that when the heat-conducting silica gel between the heat-conducting pipe and the shielding cover deforms, the elastic component can upwards bounce the shielding cover, so that the heat-conducting pipe and the shielding cover are always in good contact, and the heat-radiating effect of the heating chip is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 (a) is a cross-sectional view of a prior art heat-dissipating shield system;
FIG. 1 (b) is a side view of a prior art heat dissipation shield system;
fig. 2 is a side view of a heat dissipation shielding system according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a positional relationship between a shield and a clip member according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a relationship between an elastic member and a clamping member according to an embodiment of the present invention;
fig. 5 is a top view of a heat dissipation shielding system according to an embodiment of the present invention;
FIG. 6 is a side view of a resilient member in relation to a clamping member according to an embodiment of the present invention;
FIG. 7 is a bottom view of the resilient member in relation to the retaining member provided in accordance with an embodiment of the present invention;
fig. 8 is a schematic view of a clamping member and an elastic member according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiments of the present invention will be described in further detail with reference to the drawings.
As shown in fig. 2, a side view of a heat dissipation shielding system provided for an embodiment of the present invention includes: heating element (not shown in the figure), circuit board (not shown in the figure), shield cover 20 and heat pipe 21, heating element set up in on the circuit board, shield cover 20 with the circuit board forms the shielding space jointly, heating element set up in the shielding space, heat pipe 21 set up in outside the shielding space and through heat conduction silica gel 22 with shield cover 20 connects, at least one lateral wall block of shield cover 20 in at least one hold assembly 23, hold assembly 23 is fixed in the circuit board, at least one lateral wall of shield cover 20 with support between the circuit board and hold elastic component 24, elastic component 24 is used for supporting hold shield cover 20, so that shield cover 20 with heat pipe 21 passes through heat conduction silica gel 22 keeps good contact. Optionally, the at least one clip member 23 is soldered to the circuit board, and the at least one clip member 23 is opened toward the upper surface of the shield case. Optionally, the heat generating component and the shielding can 20 are connected through a thermal pad. Optionally, the upper surface of the shielding case 20 is provided with a through hole, and the through hole faces the heating element.
In the embodiment of the present invention, the elastic member 24 is added between the bottom of the side wall of the shielding case 20 and the circuit board, and the elastic member 24 is in a compressed state, that is, the elastic member 24 has an abutting effect on the side wall of the shielding case 20, so as to increase an upward elastic force on the shielding case 20, so that when the heat conductive silica gel 22 between the heat conductive pipe 21 and the shielding case 20 is diluted, the elastic member 24 can bounce the shielding case 20 upward by a certain displacement amount, so that the heat conductive pipe 21 and the shielding case 20 always keep good contact, and good heat dissipation of a heating element is realized, thereby ensuring the heat dissipation effect of a heating chip.
Referring to fig. 3, a schematic diagram of a positional relationship between the shielding case 20 and the clamping member 23 according to an embodiment of the present invention is provided, wherein a sidewall of the shielding case 20 is engaged with the clamping member 23, and the clamping member 23 is fixed on the circuit board, because the clamping member 23 has a clamping force on the sidewall of the shielding case 20, the shielding case 20 is kept fixed, in the embodiment of the present invention, the elastic member 24 is required to be able to bounce the shielding case 20 upwards, that is, the shielding case 20 has a certain displacement upwards, so in actual use, the clamping force of the clamping member 23 is not set too large, otherwise the elastic member 24 cannot bounce the shielding case 20; of course, the clamping force of the clamping member 23 should not be too small, which would result in instability of the shield 20. Specifically, how to set the elastic force of the elastic member 24 and the clamping force of the clamping member 23 may be set according to the actual application requirements, and the present invention is not limited thereto.
In the embodiment of the present invention, the elastic component 24 is disposed in various ways, and optionally, the position of the elastic component 24 is set in at least three ways:
in the first mode, at least one end of the elastic member 24 is fixed to the circuit board
That is, the elastic member 24 may be directly fixed to the circuit board, for example, one end of the elastic member 24 may be welded to the circuit board or may be screwed to the circuit board, or both ends of the elastic member 24 may be welded to the circuit board or may be screwed to the circuit board.
Second, the elastic member 24 is fixed to the bottom of at least one sidewall of the shield case 20
In this embodiment, the elastic member 24 is fixed to the bottom of the side wall of the shield case 20, and may be welded or screwed to the bottom of the side wall of the shield case 20.
Third mode, at least one end of the elastic member 24 is fixed to an end of the at least one holding member 23
In this embodiment, the elastic member 24 is fixed to the end of the holding member, and there are at least two types:
1. one end of an elastic member 24 is fixed to one end of one holding member 23
Referring to fig. 4, a relationship between the elastic member 24 and the clamping member 23 is schematically shown, wherein one end of the elastic member 24 is connected to a first end of one clamping member 23, and the other end of the elastic member 24 is not connected to any member, so that in practical use, the elastic member 24 can be fixed only by fixing the clamping member 23 on the circuit board.
2. Both ends of the elastic member 24 are fixed to both ends of the two holding members 23
In this situation, referring to fig. 5, a top view of the heat dissipation shielding system according to the embodiment of the present invention is provided, wherein at least one sidewall of the shielding case 20 is engaged with two clamping members 23, one end of the elastic member 24 is fixed to an end of one of the clamping members 23 close to the elastic member 24, and the other end of the elastic member 24 is fixed to an end of the other clamping member 23 close to the elastic member 24. Specifically, reference may be made to fig. 6, which is a side view illustrating a relationship between the elastic member 24 and the clamping member 23 provided in an embodiment of the present invention, and fig. 7, which is a bottom view illustrating a relationship between the elastic member 24 and the clamping member 23 provided in an embodiment of the present invention, wherein one elastic member 24 is fixed in two clamping members 23, and two ends of the elastic member 24 are respectively connected with the two clamping members 23 (may be welded or riveted by a screw).
Alternatively, the elastic member 24 provided in the embodiment of the present invention is a metal clip with conductive performance, and specifically, for example, the metal clip may be a metal clip made of stainless steel or a metal clip made of copper.
Referring to fig. 8, a schematic view of the clamping member 23 and the elastic member 24 is provided for an embodiment of the present invention, and alternatively, the elastic member 24 has a convex structure, but may also have other shapes, such as a circle, a spiral, a square, and the like, and the shape of the elastic member 24 is not limited in the present invention.
In addition, the embodiment of the invention also provides a communication product, which comprises the heat dissipation shielding system.
It should be particularly noted that, in the embodiment of the present invention, for each side wall of one shielding case 20, the clamping members 23 may be disposed between one side wall and the circuit board, and the number of the disposed clamping members 23 may be one or more, or the clamping members 23 may be disposed between a plurality of side walls (e.g., two, three, or four) and the circuit board, and the number of the disposed clamping members 23 may be one or more; and the elastic component 24 can be arranged between one of the side walls and the circuit board, or between a plurality of side walls and the circuit board; the number of the elastic members 24 provided between the side wall and the circuit board is not limited, and for example, one elastic member 24 may be provided, or a plurality of elastic members 24 may be provided.
Specifically, the holding part 23 may be a metal clip or a movable clipping slot; the elastic member 24 may be a spring, or other members having an elastic function.
Specifically, the elastic member 24 may be disposed on the circuit board, the holding member 23, or the shield case 20.
The invention provides a heat dissipation shielding system which comprises a heating element, a circuit board, a shielding case 20 and a heat conducting pipe 21, wherein the heating element is arranged on the circuit board, the shielding case 20 and the circuit board jointly form a shielding space, the heating element is arranged in the shielding space, the heat conducting pipe 21 is arranged outside the shielding space and is connected with the shielding case 20 through heat conducting silica gel 22, at least one side wall of the shielding case 20 is clamped with at least one clamping part 23, the clamping part 23 is fixed on the circuit board, an elastic part 24 is abutted between at least one side wall of the shielding case 20 and the circuit board, and the elastic part 24 is used for abutting against the shielding case 20 so that the shielding case 20 and the heat conducting pipe 21 can keep good contact through the heat conducting silica gel 22. According to the invention, at least one side wall of the shielding cover 20 is clamped with at least one clamping part 23, the at least one clamping part 23 is fixed on the circuit board, and the elastic part 24 is abutted between at least one side wall of the shielding cover 20 and the circuit board, so that when the heat conduction silica gel 22 between the heat conduction pipe 21 and the shielding cover 20 deforms, the elastic part 24 can bounce the shielding cover 20 upwards, so that the heat conduction pipe 21 and the shielding cover 20 are always in good contact, and the heat dissipation effect of the heating chip is ensured.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. The utility model provides a heat dissipation shielding system, its characterized in that, includes heating element, circuit board, shield cover and heat pipe, heating element set up in on the circuit board, the shield cover with the circuit board forms shielding space jointly, heating element set up in the shielding space, the heat pipe set up in shielding space outside and through heat conduction silica gel with the shield cover is connected, at least one lateral wall block of shield cover in at least one centre gripping part, centre gripping part is fixed in the circuit board, at least one lateral wall of shield cover with support between the circuit board and hold elastomeric element, elastomeric element is convex structure, elastomeric element is used for supporting and holds the shield cover, so that the shield cover with the heat pipe passes through heat conduction silica gel keeps good contact.
2. The heat dissipating shield system of claim 1, wherein at least one end of the resilient member is secured to the circuit board; or alternatively
The elastic component is fixed at the bottom of at least one side wall of the shielding cover; or alternatively
At least one end of the elastic member is fixed to an end of the at least one holding member.
3. The heat dissipating shield system of claim 1, wherein at least one of the sidewalls of the shield engages two clip members, one end of the spring member is secured to an end of one of the clip members adjacent the spring member, and the other end of the spring member is secured to an end of the other clip member adjacent the spring member.
4. The heat dissipating shield system of claim 1, wherein the heat generating component is coupled to the shield via a thermally conductive pad.
5. The heat dissipating shield system of claim 4, wherein the shield has a through hole in an upper surface thereof, the through hole facing the heat generating component.
6. The heat dissipating shield system of claim 1, wherein the at least one clip member is soldered to the circuit board and the at least one clip member opens toward the top surface of the shield.
7. A communication product, characterized in that it comprises a heat dissipation shielding system as claimed in any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797875.8A CN106170199B (en) | 2016-08-31 | 2016-08-31 | Heat dissipation shielding system and communication product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797875.8A CN106170199B (en) | 2016-08-31 | 2016-08-31 | Heat dissipation shielding system and communication product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106170199A CN106170199A (en) | 2016-11-30 |
| CN106170199B true CN106170199B (en) | 2023-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610797875.8A Active CN106170199B (en) | 2016-08-31 | 2016-08-31 | Heat dissipation shielding system and communication product |
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| Country | Link |
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| CN (1) | CN106170199B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208143670U (en) * | 2017-12-08 | 2018-11-23 | 南昌黑鲨科技有限公司 | Intelligent terminal radiator structure |
| CN112040718B (en) * | 2020-07-28 | 2023-05-16 | 湖北清江水电开发有限责任公司 | Glue-filled waterproof fire detector terminal box |
| CN114765939A (en) * | 2021-01-12 | 2022-07-19 | Oppo广东移动通信有限公司 | Chip shielding structure, preparation method and electronic device |
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| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| CN1658747A (en) * | 2004-01-08 | 2005-08-24 | 日本碍子株式会社 | Electromagnetic wave shield case and a method for manufacturing electromagnetic wave shield case |
| CN103037671A (en) * | 2011-10-10 | 2013-04-10 | 三星电子株式会社 | Structure for stacking printed board assemblies in electronic device |
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| CN204859871U (en) * | 2015-08-13 | 2015-12-09 | 青岛海信电器股份有限公司 | Heat radiating system |
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| CN206136579U (en) * | 2016-08-31 | 2017-04-26 | 广东虹勤通讯技术有限公司 | Heat dissipation shielding system and communication product |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4498163B2 (en) * | 2005-02-08 | 2010-07-07 | 株式会社東芝 | Heat dissipation device for electronic equipment |
| US7839656B2 (en) * | 2007-06-15 | 2010-11-23 | Sony Ericsson Mobile Communications Ab | Shielded circuit assembly and method |
| JP5322282B2 (en) * | 2009-04-24 | 2013-10-23 | Ｎｅｃエンジニアリング株式会社 | Heat dissipation device for electronic equipment |
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2016
- 2016-08-31 CN CN201610797875.8A patent/CN106170199B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| CN1658747A (en) * | 2004-01-08 | 2005-08-24 | 日本碍子株式会社 | Electromagnetic wave shield case and a method for manufacturing electromagnetic wave shield case |
| CN103037671A (en) * | 2011-10-10 | 2013-04-10 | 三星电子株式会社 | Structure for stacking printed board assemblies in electronic device |
| CN103401958A (en) * | 2013-07-03 | 2013-11-20 | 惠州Tcl移动通信有限公司 | Mobile phone chip shielding structure and mobile phone |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
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| Publication number | Publication date |
|---|---|
| CN106170199A (en) | 2016-11-30 |
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