CN209767910U - Heat dissipation shielding structure and circuit board - Google Patents
Heat dissipation shielding structure and circuit board Download PDFInfo
- Publication number
- CN209767910U CN209767910U CN201822197577.2U CN201822197577U CN209767910U CN 209767910 U CN209767910 U CN 209767910U CN 201822197577 U CN201822197577 U CN 201822197577U CN 209767910 U CN209767910 U CN 209767910U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- heat
- shielding structure
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The embodiment of the application provides a heat dissipation shielding structure and a circuit board. This heat dissipation shielding structure includes: a top portion made of an electrically and thermally conductive material; a spacer made of a conductive material, the spacer being disposed on the top portion at a position corresponding to a ground line of the circuit board to form at least two isolation cavities when connected to the ground line, the at least two isolation cavities being respectively for accommodating circuits of at least two regions separated by the ground line; a thermally conductive member having one end connected to the top and another end for connection to a heat source device in any one of the at least two regions. The heat dissipation shielding structure adopts an integral structure, so that not only can the mutual shielding between the circuits of the at least two regions be realized, but also the shielding of the circuits of the at least two regions to the outside can be realized, and the heat dissipation of the heat source device can be realized. In addition, the heat dissipation shielding structure is convenient to manufacture and install and has a good shielding effect.
Description
Technical Field
the application relates to the technical field of electronics, in particular to a heat dissipation shielding structure and a circuit board.
Background
When a circuit in a certain area on a circuit board is shielded, it is necessary to shield electronic devices around the area and electromagnetic interference from the outside to the circuit in the area. To this end, prior art shielding solutions have used a separate shield made of conductive material on the circuit board to isolate the circuitry in this area from the surrounding electronics and the environment, while grounding the shield. Therefore, when a heat source device (e.g., a chip) requiring heat dissipation processing exists in the circuit in the area, the current practice is to form a hole at a position opposite to the device on the top of the shielding member, and then to dispose a heat dissipation member on the heat source device through the hole, so that the heat generated by the heat source device can be conducted to the outside through the heat dissipation member.
However, the above-mentioned shielding and heat dissipation schemes have at least two disadvantages: when shielding and radiating treatment are carried out on circuits in a plurality of areas on a circuit board, a shielding part and a heat conducting part matched with the shielding part are required to be independently arranged for the circuit in each area, so that the manufacturing and the installation are complicated, and the production efficiency is influenced; secondly, because the mode through holing at the shielding part top sets up the heat-conducting member, lead to appearing the space between the edge in shielding part top hole and the heat-conducting member, reduced external electromagnetic interference's shielding effect.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a heat dissipation shielding structure and a circuit board, so as to at least partially solve the above problems.
In order to achieve the above purpose, the embodiments of the present application propose the following technical solutions:
In a first aspect, an embodiment of the present application provides a heat dissipation shielding structure, configured to shield and dissipate heat of a circuit board, where the heat dissipation shielding structure includes:
A top portion made of an electrically and thermally conductive material;
The isolating piece is made of a conductive material and arranged at a position, corresponding to a grounding circuit of the circuit board, on the top part so as to form at least two isolating cavities when the isolating piece is connected with the grounding circuit, and the at least two isolating cavities are respectively used for accommodating circuits of at least two areas, separated by the grounding circuit, on the circuit board;
A thermally conductive member having one end connected to the top portion and another end for connection to a heat source device in any one of the at least two regions.
Optionally, the top portion comprises first and second opposing surfaces, the spacer being disposed on the first surface, the first and/or second surface comprising at least one protrusion and/or at least one recess.
Optionally, for any one of the at least two regions, a sum of an area of a portion of the first surface opposite to the region and an area of a portion of the second surface opposite to the region has a positive correlation with a set heat dissipation temperature of the region.
Optionally, the heat dissipation shielding structure further comprises an elastic member disposed between the heat source device and the heat conducting member; the elastic member is made of an elastic material capable of conducting heat.
Optionally, the elastic material capable of conducting heat is heat-conducting silica gel.
optionally, the top, the spacer and the heat conducting member are integrally formed.
Optionally, the top, the spacer and the thermal conductor are made of aluminum.
Optionally, the circuit board is provided with a via hole, and the heat dissipation shielding structure further includes a fixing member matched with the via hole.
In a second aspect, an embodiment of the present application provides a circuit board, where the heat dissipation shielding structure of the first aspect is disposed on the circuit board.
Optionally, the circuit board comprises a PCB.
Compared with the prior art, the beneficial effects of the application include:
The embodiment of the application provides a heat dissipation shielding structure and a circuit board. This heat dissipation shielding structure includes: a top portion made of an electrically and thermally conductive material; a spacer made of a conductive material, the spacer being disposed on the top portion at a position corresponding to a ground line of the circuit board to form at least two isolation cavities when connected to the ground line, the at least two isolation cavities being respectively for accommodating circuits of at least two regions separated by the ground line; a thermally conductive member having one end connected to the top and another end for connection to a heat source device in any one of the at least two regions. The heat dissipation shielding structure adopts an integral structure, so that not only can the mutual shielding between the circuits of the at least two regions be realized, but also the shielding of the circuits of the at least two regions to the outside can be realized, and the heat dissipation of the heat source device can be realized. In addition, the heat dissipation shielding structure is convenient to manufacture and install and has a good shielding effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a view of a heat dissipation shielding structure according to an embodiment of the present application;
Fig. 2 is a schematic structural diagram of a circuit board provided with a ground line in an embodiment of the present application;
Fig. 3 is another view of a heat dissipation shielding structure according to an embodiment of the present application;
Fig. 4 is a schematic structural diagram of a circuit board provided with the heat dissipation shielding structure according to an embodiment of the present application.
Icon: 10-a heat dissipation shielding structure; 100-top; 101-a first surface; 102-a second surface; 110-a spacer; 120-a thermally conductive member; 130-a fixture; 20-a circuit board; 21-ground line.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a view of a heat dissipation shielding structure 10 according to an embodiment of the present application, where the heat dissipation shielding structure 10 is used for shielding and dissipating heat of a circuit board 20 shown in fig. 2, and includes a top portion 100, a spacer 110, and a heat conducting member 120.
In this embodiment, the top 100 is made of an electrically and thermally conductive material, and the spacer 110 is made of an electrically conductive material.
As shown in fig. 2, the circuit board 20 is provided with a ground line 21. In designing the circuit board 20, according to the actual shielding requirement between the electronic devices on the circuit board 20, an isolation line with a certain width for separating the circuits of at least two areas on the circuit board is disposed on the circuit board 20, and a conductive material (e.g., a conductive metal) is plated on the isolation line to form a ground line 21 separating the circuits of the at least two areas.
The spacer 110 is disposed on the top 100 at a position corresponding to the ground line 210 of the circuit board. When the spacer 110 is connected to the ground line 21, at least two isolation cavities for accommodating the circuits of the at least two regions, respectively, can be formed.
Based on the above design, when the heat dissipation shielding structure 10 is used to shield the circuit board 20: first, the side of the top 100 connected to the spacer 110 has a peripheral wall, and when the end of the peripheral wall away from the top 100 is attached to the circuit board 20 along the edge of the whole area including the at least two areas, an isolation cavity for isolating the circuit of the at least two areas from the outside is formed between the top 100 and the circuit board 20. Further, the spacer 110 connected between the top 100 and the ground line 21 (i.e., connected to the top 100 and the circuit board 20) divides the isolation cavity into at least two sub-isolation cavities of the same number as the at least two regions along the ground line 21, the at least two isolation cavities isolating circuits of the at least two regions from each other. On the basis that the circuits of the at least two regions are isolated from each other and from the outside by the top portion 100 and the isolation member 110, the isolation member 110 and the top portion 100 (connected to the isolation member 110), both made of conductive materials, are electrically connected to the ground line 21, so that the mutual shielding between the circuits of the at least two regions and the shielding of the circuits of the at least two regions from the outside are simultaneously achieved.
further, the heat conductive member 120 has one end connected to the top 100 and the other end for connecting to a heat source device (e.g., a chip) in any one of the at least two areas. Since the top 100 is also made of a thermally (and electrically) conductive material, when the thermal conductive member 120 is connected to the heat source device, heat generated from the heat source device can be conducted to the outside through the top 100, thereby achieving heat dissipation of the heat source device.
The heat dissipation shielding structure 10 provided in the embodiment of the present application adopts an integral structure composed of the top 100, the spacer 110 and the heat dissipation member 120, which not only can realize mutual shielding between circuits of at least two regions on the circuit board 21 and shielding of the circuits of the at least two regions from the outside, but also can realize heat dissipation of a heat source device in any one of the at least two regions. Compared with the existing shielding part with the top opening and the heat conducting part matched with the shielding part, which are separately arranged for each area, the heat dissipation shielding structure 10 is more convenient in manufacturing and installation and has better shielding effect.
Alternatively, the top 100, the spacer 110, and the heat-conducting member 120 may be integrally formed. Further, the top 100, the spacer 110, and the thermal conductor 120 may all be made of aluminum (e.g., aluminum ADC 12).
referring to fig. 3 again, fig. 3 is another view of the heat dissipation shielding structure 10. Optionally, as shown in fig. 1 and 3, the top 100 includes a first surface 101 and a second surface 102. The spacer 110 is disposed on the first surface 101, and the first surface 101 and/or the second surface 102 includes at least one convex portion and/or at least one concave portion.
It should be noted that the convex portions and the concave portions both function to increase the heat transfer area. Therefore, preferably, convex and/or concave portions may be provided on both the first surface 101 and the second surface 102 to obtain a larger heat conducting area. In addition, the present embodiment does not specifically limit the arrangement manner of the at least one convex portion and/or the at least one concave portion. As shown in fig. 3, any of the convex portions and/or any of the concave portions may be block-shaped, or may be circular, oval, or the like. Any of the projections and/or any of the recesses may also be nested within one another. The plurality of protrusions and/or the plurality of recesses may be arranged in a preset direction. In addition, at least a portion of the top portion 100 may be a continuous bent shape having substantially the same thickness to form a convex portion and a concave portion having the same size and shape on the first surface 101 and the second surface 102 on both sides of the top portion 100. For example, when a convex portion is formed on one of the first surface 101 and the second surface 102, a concave portion conforming to the size and shape of the convex portion is formed on the other of the first surface 101 and the second surface 102. For another example, when a concave portion is formed on one of the first surface 101 and the second surface 102, a convex portion conforming to the size and shape of the concave portion is formed on the other of the first surface 101 and the second surface 102.
Optionally, in response to different heat dissipation requirements of the respective regions, for any one of the at least two regions, the surface area of the top portion 100 and the portion of the region opposite to the region has a positive correlation with the set heat dissipation temperature of the region. In detail, the surface area is the sum of the area of the portion of the first surface 101 opposite to the region and the area of the portion of the second surface 102 opposite to the region.
Specifically, the greater the set heat dissipation temperature of the region, the greater the number of projections and/or recesses may be provided on the first surface 101 and/or the portion of the second surface 102 opposite to the region in one case; in yet another case, the portion of the first surface 101 and/or the second surface 102 opposite to the region may be provided with a convex and/or concave portion of a larger surface area; in other cases, a combination of the two cases may be used.
Alternatively, the heat dissipation shielding structure 10 may further include an elastic member disposed between the heat source device and the heat conductive member 120. The elastic member is made of an elastic material capable of conducting heat. The elastic member may be bonded to the heat source device.
When the heat sink is installed, the heat conductive member 120 having one end connected to the first surface of the top 100 is pre-pressed against the elastic member, so that the elastic member is fully contacted with both the other end of the heat conductive member 120 and the heat source device under a certain pressure, thereby increasing a heat conductive area between the heat source device and the heat conductive member 120 and improving a heat dissipation effect. In addition, the elastic member serves as a buffer between the heat source device and the heat conductive member 120 to protect the heat source device (e.g., chip).
Further, the elastic material capable of conducting heat may be a heat-conducting silicone.
Optionally, referring to fig. 1 again, the heat dissipation shielding structure 10 further includes a fixing member 130 matching with the via hole formed on the circuit board 20. In particular, the via may be circular and the fixing member may be cylindrical. In addition, the number of the via holes and the fixing members 130 may be, but is not limited to, 4 as illustrated in fig. 1, and the number of the via holes and the fixing members 130 in this embodiment is not particularly limited.
Referring to fig. 4 again, fig. 4 is a schematic structural diagram of a circuit board 20 according to an embodiment of the present disclosure. The circuit board 20 is provided with the heat dissipation shielding structure 10 provided by the embodiment of the present application.
optionally, the Circuit Board comprises a PCB (Printed Circuit Board).
To sum up, the embodiment of the application provides a heat dissipation shielding structure and a circuit board. This heat dissipation shielding structure includes: a top portion made of an electrically and thermally conductive material; a spacer made of a conductive material, the spacer being disposed on the top portion at a position corresponding to a ground line of the circuit board to form at least two isolation cavities when connected to the ground line, the at least two isolation cavities being respectively for accommodating circuits of at least two regions separated by the ground line; a thermally conductive member having one end connected to the top and another end for connection to a heat source device in any one of the at least two regions. The heat dissipation shielding structure adopts an integral structure, so that not only can the mutual shielding between the circuits of the at least two regions be realized, but also the shielding of the circuits of the at least two regions to the outside can be realized, and the heat dissipation of the heat source device can be realized. In addition, the heat dissipation shielding structure is convenient to manufacture and install and has a good shielding effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a heat dissipation shielding structure, its characterized in that for shielding and heat dissipation processing to the circuit board, heat dissipation shielding structure includes:
A top portion made of an electrically and thermally conductive material;
The isolating piece is made of a conductive material and arranged at a position, corresponding to a grounding circuit of the circuit board, on the top part so as to form at least two isolating cavities when the isolating piece is connected with the grounding circuit, and the at least two isolating cavities are respectively used for accommodating circuits of at least two areas, separated by the grounding circuit, on the circuit board;
A thermally conductive member having one end connected to the top portion and another end for connection to a heat source device in any one of the at least two regions.
2. The heat dissipating shield structure of claim 1, wherein the top portion comprises first and second opposing surfaces, the spacer being disposed on the first surface, the first and/or second surfaces comprising at least one protrusion and/or at least one depression.
3. The heat radiation shielding structure according to claim 2, wherein, for any one of the at least two regions, a sum of an area of a portion of the first surface opposing the region and an area of a portion of the second surface opposing the region has a positive correlation with a set heat radiation temperature of the region.
4. The heat dissipation shield structure of any one of claims 1-3, further comprising a resilient member disposed between the heat source device and the thermal conductive member; the elastic member is made of an elastic material capable of conducting heat.
5. the heat dissipation shielding structure of claim 4, wherein the thermally conductive elastic material is a thermally conductive silicone.
6. the heat dissipating shield structure of any one of claims 1-3, wherein the top, the spacer, and the thermal conductor are integrally formed.
7. The heat dissipating shield structure of claim 6, wherein the top portion, the spacer and the thermal conductor are all made of aluminum.
8. the heat dissipation shielding structure of any one of claims 1-3, wherein the circuit board has a via hole, the heat dissipation shielding structure further comprising a fixing member matching the via hole.
9. A circuit board, characterized in that the circuit board is provided with the heat dissipation shielding structure of any one of claims 1-8.
10. the circuit board of claim 9, wherein the circuit board comprises a PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822197577.2U CN209767910U (en) | 2018-12-25 | 2018-12-25 | Heat dissipation shielding structure and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822197577.2U CN209767910U (en) | 2018-12-25 | 2018-12-25 | Heat dissipation shielding structure and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209767910U true CN209767910U (en) | 2019-12-10 |
Family
ID=68747619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822197577.2U Active CN209767910U (en) | 2018-12-25 | 2018-12-25 | Heat dissipation shielding structure and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209767910U (en) |
-
2018
- 2018-12-25 CN CN201822197577.2U patent/CN209767910U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7965514B2 (en) | Assemblies and methods for dissipating heat from handheld electronic devices | |
| US9258928B2 (en) | Assemblies and methods for dissipating heat from handheld electronic devices | |
| EP3200226B1 (en) | Heat dissipation shielding structure and communication product | |
| US7924568B2 (en) | Heat sink device with a shielding member | |
| KR102142397B1 (en) | Mobile terminal and heat dissipation shielding structure | |
| JP2011040742A (en) | Heatsink with periodically patterned baseplate structure, and related device and method (heat sink with periodically patterned baseplate structure) | |
| US8988880B2 (en) | Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly | |
| TW201404249A (en) | Circuit board and cooling device thereof | |
| TWI495423B (en) | Thermal module and electronic device incorporating the same | |
| JPWO2017022221A1 (en) | Heat dissipation structure and electronic equipment | |
| US6982481B1 (en) | System for dissipating heat and shielding electromagnetic radiation produced by an electronic device | |
| KR200476160Y1 (en) | Heat dissipation structure of electronic shield cover | |
| TWI507116B (en) | Radiation element and potable electronic device using same | |
| JP6095873B2 (en) | Electronic equipment and electronic equipment system | |
| JP5738679B2 (en) | Heat dissipation structure | |
| CN209767910U (en) | Heat dissipation shielding structure and circuit board | |
| EP2933833A1 (en) | Electromagnetic shielding device | |
| CN106231836B (en) | Enclosed display device and method of assembling the same | |
| JP2006286757A (en) | Heat dissipation structure of electronic apparatus | |
| CN106170199B (en) | Heat dissipation shielding system and communication product | |
| CN108633213B (en) | Electronic device | |
| JP2013254925A (en) | Electronic circuit device | |
| CN209749010U (en) | Mainboard and heat dissipation device thereof | |
| CN215379561U (en) | Metal radiator and electronic control unit comprising same | |
| CN213029100U (en) | Shielding structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |