CN217361553U - Packaging structure and electronic equipment - Google Patents
Packaging structure and electronic equipment Download PDFInfo
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- CN217361553U CN217361553U CN202123161498.4U CN202123161498U CN217361553U CN 217361553 U CN217361553 U CN 217361553U CN 202123161498 U CN202123161498 U CN 202123161498U CN 217361553 U CN217361553 U CN 217361553U
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Abstract
The application provides a packaging structure and electronic equipment compresses tightly power device through elasticity compressor element, has reduced elastic buffer's thickness, has improved power device's radiating efficiency. The packaging structure can comprise an elastic buffer piece, a power device, a printed circuit board, an elastic pressing piece and a shell. The shell comprises a first shell and a second shell, the first shell is connected with the second shell to form a closed structure, and the elastic buffer part, the power device, the printed circuit board and the elastic compressing part are all arranged inside the closed structure. One side of the elastic buffer part can be in contact with the second shell, the other side of the elastic buffer part can be in contact with one side of the power device, the other side of the power device can be connected with one side of the printed circuit board, the other side of the printed circuit board can be connected with one side of the elastic pressing part, and the other side of the elastic pressing part can be connected with the first shell.
Description
Technical Field
The application relates to the technical field of energy, in particular to a packaging structure.
Background
With the rapid development of semiconductor technology, power devices (such as diodes) are also applied more and more widely. The power device is a high heat dissipation element, and in order to support, protect and dissipate heat of the power device, the power device often needs to be packaged to form a packaging structure. The power device can be connected by reverse-buckling, and meanwhile, in order to ensure the close fit between the power device and the casing, an elastic buffer (such as a gel with thermal conductivity and the like) is generally required to be arranged between the power device and the casing.
The package structure in the related art employs screws to compress the power device. However, since the case, the screws, and the power devices of the package structure have manufacturing tolerances, it is necessary to compress each power device by increasing the thickness of the elastic buffer. The increase of the thickness of the elastic buffer member can cause the heat dissipation efficiency of the power device to be low.
SUMMERY OF THE UTILITY MODEL
The application provides a packaging structure compresses tightly power device through elasticity compressor element, has reduced elastic buffer's thickness, has improved power device's radiating efficiency.
In a first aspect, the present application provides a package structure, which may include an elastic buffer, a power device, a printed circuit board, an elastic pressing member, and a housing.
The shell can comprise a first shell and a second shell, and the first shell and the second shell are connected to form a closed structure. The elastic buffer part, the power device, the printed circuit board and the elastic pressing part are all arranged inside the closed structure.
Optionally, one side of the elastic buffer member may contact with the second housing, the other side of the elastic buffer member may contact with one side of the power device, the other side of the power device may be connected with one side of the printed circuit board, the other side of the printed circuit board may be connected with one side of the elastic pressing member, and the other side of the elastic pressing member may be connected with the first housing.
The application provides a packaging structure can compress tightly power device through elasticity pressing part, and printed circuit board and elasticity pressing part's deformation can absorb the manufacturing tolerance of the roughness of second casing, power device's manufacturing tolerance and power device's welding float height, can reduce elastic buffer's compression thickness, has also reduced heat transfer thermal resistance, and then has improved power device's radiating efficiency.
In a possible embodiment, the elastic pressing member may adopt any one of a spring (which may be a metal spring), a spring sheet (which may be a metal spring sheet), and an elastic pad. Certainly, the elasticity compresses tightly the piece and can also adopt other elastic compressing pieces (can select heat-resisting material) such as rubber pad, as long as can compress tightly power device through printed circuit board can, this application compresses tightly the type of piece and does not do the restriction to the elasticity.
In a possible implementation manner, the number of the elastic pressing pieces and the number of the power devices may be equal or different.
In another possible implementation manner, in order to ensure that each power device is tightly attached to the second housing, the number of the elastic buffer members may be equal to the number of the power devices.
In one example, the elastomeric buffer is silicone grease or gel. Of course, the elastic buffer member may also be other elastic components, and the application is not limited.
In another example, the power device may be at least one of an Insulated Gate Bipolar Transistor (IGBT), an insulated gate field-effect transistor (MOSFET), and a diode. Of course, the power device may be of other types, and the embodiment of the present application is not limited.
In one possible implementation, the first housing may be a flat plate structure. In order to form the closed structure, the second housing may be a U-shaped structure in an arrangement direction along the elastic buffer, the power device, the printed circuit board, and the elastic pressing member.
In another possible implementation, the shape of the first housing and the shape of the second housing may be the same.
Furthermore, in the arrangement direction of the elastic buffer part, the power device, the printed circuit board and the elastic pressing part, the sections of the first shell and the second shell are both U-shaped structures.
Alternatively, the height of the first housing and the height of the second housing may be equal or different.
In yet another possible implementation manner, the cross section of the first housing may be a U-shaped structure in the arrangement direction along the elastic buffer member, the power device, the printed circuit board and the elastic pressing member. The second housing may be of a flat plate structure.
Optionally, the second housing may be provided with a plurality of fins.
It can be understood that the external surface area of the second housing can be increased by a plurality of fins (which may be referred to as heat dissipation elements), so as to improve the heat dissipation efficiency of the second housing, and further improve the heat dissipation efficiency of the power device.
In a second aspect, the present application provides an electronic device, which may include an input terminal, an output terminal, and a package structure provided in the first aspect and possible implementations thereof.
The electronic device may be connected to an ac power source (or a commercial power source, etc.) through an input terminal, and may also be connected to a load (such as an ac load or a dc load) through an output terminal.
Optionally, the electronic device may be a charging pile or a communication power supply, and the application is not limited.
It should be noted that the second aspect is consistent with the technical solution of the first aspect of the present application, and the beneficial effects obtained by various aspects and corresponding possible implementations are similar and will not be described again.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.
Fig. 1 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
To make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," and the like in the description examples and claims of this application and in the drawings are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or order. Furthermore, the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover a non-exclusive inclusion, such as a list of steps or elements. A method, system, article, or apparatus is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, system, article, or apparatus.
It should be understood that in the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" for describing an association relationship of associated objects, indicating that there may be three relationships, e.g., "a and/or B" may indicate: only A, only B and both A and B are present, wherein A and B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single item(s) or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
With the rapid development of semiconductor technology, power devices such as diodes are applied more and more widely. The power device is a high heat dissipation element, and in order to support, protect and dissipate heat of the power device, the power device is often packaged to form a package structure. The power device can be connected in an inverted buckling manner, and meanwhile, in order to ensure that the power device is tightly attached to the shell, an elastic buffer part with thermal conductivity, such as gel, is generally required to be arranged between the power device and the shell.
Due to manufacturing tolerances of the housing, the screws and the power devices of the packaging structure, the screws cannot compress each power device. In order to compress the power device, a thicker elastic buffer is often required, which results in low heat dissipation efficiency of the power device.
In order to solve the problem of low heat dissipation efficiency of the power device, an embodiment of the present application provides a package structure of the power device, as shown in fig. 1. The package structure a may include an elastic buffer 5, a power device 4, a Printed Circuit Board (PCB) 3, an elastic pressing member 2, and a case 1.
The housing 1 may include a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 are connected to form a closed structure. Elastic buffer 5, power device 4, printed circuit board 3 and elastic pressing piece 2 all set up inside the enclosed construction.
Alternatively, one side of the elastic buffer 5 (i.e., the lower surface of the elastic buffer 5 in fig. 1) may contact the second housing 12 (i.e., the inner bottom surface of the second housing 12), the other side of the elastic buffer 5 (i.e., the upper surface of the elastic buffer 5 in fig. 1) may contact one side of the power device 4 (i.e., the lower surface of the power device 4 in fig. 1, i.e., the front surface of the power device 4), the other side of the power device 4 (i.e., the upper surface of the power device 4 in fig. 1, i.e., the rear surface of the power device 4) may be connected to one side of the printed circuit board 3 (i.e., the lower surface of the printed circuit board 3 in fig. 1), the other side of the printed circuit board 3 (i.e., the upper surface of the printed circuit board 3 in fig. 1) may be connected to one side of the elastic pressing member 2 (i.e., the lower surface of the elastic pressing member 2 in fig. 1), and the other side of the elastic pressing member 4 (i.e., the upper surface of the elastic pressing member 2 in fig. 1) may be connected to the first housing 11 (i.e., the inner bottom surface of the first housing 11 in fig. 1) Top surface) of the connector.
The packaging structure that this application embodiment provided can compress tightly power device through elasticity compressor element, and printed circuit board and elasticity compressor element's deformation can absorb the manufacturing tolerance of the roughness of second casing, power device's manufacturing tolerance and power device's welding float height, can reduce elastic buffer's compression thickness, has also reduced heat transfer thermal resistance, and then has improved power device's radiating efficiency.
Optionally, as shown in fig. 1, the package structure provided in the embodiment of the present application may include a plurality of power devices (e.g., 4 power devices in fig. 1), and the embodiment of the present application does not limit the number of the power devices.
In a possible implementation manner, the elastic pressing member 2 may adopt any one of a spring (as shown in fig. 2, it may be a metal spring), a spring sheet (it may be a metal spring sheet), and an elastic pad. Of course, the elastic pressing member 2 may also be another elastic pressing member (a pressing member made of a heat-resistant material may be selected) such as a rubber pad, as long as the power device 4 can be pressed by the printed circuit board 3, and the type of the elastic pressing member 2 is not limited in the embodiment of the present application.
In another possible implementation manner, the number of the elastic pressing pieces 2 and the number of the power devices 4 may be equal or different.
For example, in fig. 1 and 2, each of the elastic pressing member 2 and the power device 4 is 4. That is, the number of the elastic pressing members 2 is equal to the number of the power devices 4.
For another example, in fig. 3, the number of the elastic pressing members 2 is 3, and the number of the power devices 4 is 4. That is, the number of the elastic pressing members 2 is not equal to the number of the power devices 4.
Alternatively, the number of the elastic buffer members 5 may be equal to the number of the power devices 4 in order to ensure close contact between each power device and the second housing 12.
For example, in fig. 1 to 3, the number of the elastic buffer 5 and the number of the power devices 4 are 4.
It should be noted that, because the power device has a smaller volume, and considering the implementation of the process, the elastic buffer 5 can be used to implement the close attachment of a plurality of power devices to the second object 12. That is, the number of the elastic buffer members 5 may be different from the number of the power devices 4.
Further, the elastic buffer 5 may employ silicone grease or gel. Of course, the elastic buffer 5 may also be other components with elasticity, and the embodiment of the present invention is not limited thereto.
In an example, the power device 4 may be at least one of an insulated gate bipolar transistor, an insulated gate field effect transistor (abbreviated as MOS transistor), and a diode. Of course, the power device may be of other types, and the embodiment of the present application is not limited.
It should be noted that the package structure may implement packaging of a plurality of IGBTs (e.g., 4 IGBTs), or implement packaging of a plurality of MOS transistors (e.g., 4 MOS transistors), and the like. Of course, the package structure may also implement a combined package of multiple IGBTs (e.g., 2 IGBTs) and multiple MOS transistors (e.g., 2 MOS transistors), and the like.
In another example, the power device 4 may employ a gallium nitride power transistor (e.g., a gallium nitride field effect transistor, etc.) or a silicon carbide power transistor (e.g., a silicon carbide diode, a silicon carbide MOS transistor), etc.
In one possible implementation, as shown in fig. 4, the first housing 11 may be a flat plate structure. In order to form a closed structure, the second housing 12 may be a U-shaped structure in the arrangement direction (i.e., vertical direction in fig. 4) along the elastic buffer 5, the power device 4, the printed circuit board 3, and the elastic pressing member 2.
In one possible implementation, as shown in fig. 1 to 3, the first housing 11 and the second housing 12 are identical in shape.
Alternatively, with continued reference to fig. 1 to 3, the first housing 11 and the second housing 12 are each of a U-shaped configuration in cross section in the direction along which the elastic buffer 5, the power device 4, the printed circuit board 3, and the elastic pressing member 2 are arranged (i.e., in the vertical direction in fig. 1 to 3).
Further, the height of the first housing 11 and the height of the second housing 12 may be equal or different.
For example, in fig. 1 to 3, the height of the first housing 11 is smaller than the height of the second housing 12. That is, the height of the first housing 11 and the height of the second housing 12 are not equal.
In yet another possible implementation, as shown in fig. 5, the cross section of the first housing 11 in the arrangement direction (i.e., the vertical direction in fig. 5) along the elastic buffer 5, the power device 4, the printed circuit board 3 and the elastic pressing member 2 may be a U-shaped structure. The second housing 12 may be of a flat plate structure.
In one possible implementation, as shown in fig. 1 to 5, the second housing 12 may be provided with a plurality of fins 121.
It is understood that the plurality of fins 121 (which may be referred to as heat dissipation elements) can increase the external surface area of the second casing 12, thereby increasing the heat dissipation efficiency of the second casing 12 and further increasing the heat dissipation efficiency of the power device.
Note that the flatness of the second case is [ -0.05, +0.05 [ ]]The manufacturing tolerance of (2), the height (or thickness) of the power device is present-0.1,+0.1]And soldering of the power device pins to the printed circuit board can result in (0, 0.05)]The welding of (2) is floating. In order to prevent the second case from being in hard contact with the power device, an elastic buffer (e.g., gel) needs to be provided between the second case and the power device. Screws are used in the related art (the height of the screw column exists [ -0.1, + 0.1)]Manufacturing tolerance of) the stationary power device, it is possible to set the design thickness of the elastic buffer member (e.g., gel) to x (x)>0) And (4) millimeter. Thus, the minimum compression thickness h of the elastomeric buffer min X-0.05-0.1-0.1-0.05 x-0.3 mm due to h min Needs to be greater than 0, then x needs to be greater than 0.3 mm. Further, the maximum compression thickness h of the elastic buffer member max ＝x+0.1+0.1+0.05＝x+0.25>0.55 mm. If h min Taking 0.2 mm, then x needs to be greater than 0.5 mm. Further, the maximum compression thickness h of the elastic buffer member max ＝x+0.1+0.1+0.05＝x+0.25>0.75 mm. Compared with the related art, the deformation of the elastic pressing piece in the embodiment of the application can absorb the manufacturing tolerance of the flatness of the second shell, the manufacturing tolerance of the power device and the welding floating height of the power device, and can reduce the compression thickness of the elastic buffering piece to 0.2 mm, which is far less than 0.55 mm in the related art.
The embodiment of the present application further provides an electronic device B, which may include an input terminal IN, an output terminal OUT, and the package structure a provided IN the foregoing embodiment, as shown IN fig. 6.
The electronic device B may be connected to an ac power supply PS (or commercial power, etc.) through an input terminal IN, and may also be connected to a load L (such as an ac load or a dc load) through an output terminal OUT.
In an example, the electronic device may be a charging post. Fill electric pile's input and can be connected with the commercial power, fill electric pile and can be connected with electric automobile (load promptly) through output (if the rifle that charges), realize electric automobile's charging.
In another example, the electronic device may be a communication power supply. The input end of the communication power supply can be connected with a mains supply, and the output end of the communication power supply can be connected with a Remote Radio Unit (RRU) to realize power supply of the RRU.
Besides the charging pile and the communication power supply, the electronic device B may also be other devices, and the embodiment of the application is not limited.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above description is only an exemplary embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (12)
1. A packaging structure is characterized by comprising an elastic buffer part, a power device, a printed circuit board, an elastic pressing part and a shell;
the shell comprises a first shell and a second shell, and the first shell and the second shell are connected to form a closed structure; the elastic buffer part, the power device, the printed circuit board and the elastic pressing part are all arranged in the closed structure;
one side of the elastic buffer part is in contact with the second shell, the other side of the elastic buffer part is in contact with one side of the power device, the other side of the power device is connected with one side of the printed circuit board, the other side of the printed circuit board is connected with one side of the elastic pressing part, and the other side of the elastic pressing part is connected with the first shell.
2. The package structure of claim 1, wherein the elastic pressing member is any one of a spring, a spring plate and an elastic pad.
3. The package structure according to claim 1 or 2, wherein the number of the elastic buffers is equal to the number of the power devices.
4. The package structure of claim 1, wherein the elastic buffer is silicone grease or gel.
5. The package structure of claim 1, wherein the power device is at least one of an insulated gate bipolar transistor, an insulated gate field effect transistor, and a diode.
6. The package structure of claim 1, wherein the first housing is a flat plate structure;
the cross section of the second shell is of a U-shaped structure along the arrangement direction of the elastic buffer part, the power device, the printed circuit board and the elastic pressing part.
7. The encapsulation structure of claim 1, wherein the shape of the first housing and the shape of the second housing are the same.
8. The package structure according to claim 7, wherein the first case and the second case are each formed in a U-shaped cross section in a direction along which the elastic buffer, the power device, the printed circuit board, and the elastic pressing member are arranged.
9. The package structure according to claim 1, wherein a cross section of the first case in an arrangement direction along the elastic buffer, the power device, the printed circuit board, and the elastic pressing member is a U-shaped structure;
the second shell is of a flat plate structure.
10. The package structure of claim 1, wherein the second housing has a plurality of fins thereon, and the fins are used for dissipating heat.
11. An electronic device comprising an input terminal, an output terminal and the encapsulation structure of any one of claims 1 to 10;
the electronic equipment is connected with an alternating current power supply through the input end, and the electronic equipment is connected with a load through the output end.
12. The electronic device of claim 11, wherein the electronic device is a charging post or a communication power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123161498.4U CN217361553U (en) | 2021-12-17 | 2021-12-17 | Packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123161498.4U CN217361553U (en) | 2021-12-17 | 2021-12-17 | Packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217361553U true CN217361553U (en) | 2022-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123161498.4U Active CN217361553U (en) | 2021-12-17 | 2021-12-17 | Packaging structure and electronic equipment |
Country Status (1)
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|---|---|
| CN (1) | CN217361553U (en) |
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2021
- 2021-12-17 CN CN202123161498.4U patent/CN217361553U/en active Active
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