CN210956663U

CN210956663U - Firm SMD diode takes precautions against earthquakes

Info

Publication number: CN210956663U
Application number: CN201922419705.8U
Authority: CN
Inventors: 吴雄坚
Original assignee: Zhongzhi Semiconductor Technology Dongguan Co ltd
Current assignee: Semtech Semiconductor Technology Dongguan Co Ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-07-07
Anticipated expiration: 2029-12-26

Abstract

The utility model provides a shockproof firm type SMD diode, including the insulating packaging body, be equipped with two electrically conductive pins that are L shape in the insulating packaging body, the bottom protrusion of electrically conductive pin is in the insulating packaging body, is equipped with the welding recess on the electrically conductive pin, is equipped with electrically conductive welding block in the welding recess, is connected with the diode chip between two electrically conductive pins, and two electrodes of diode chip are electrically conductively communicated with two electrically conductive pins through two electrically conductive welding blocks respectively; the bottom of the conductive pin is connected with a conductive elastic foot which is of a laterally-inverted U-shaped structure. The utility model discloses have good elastic deformation ability, accessible elastic deformation offsets partial vibrations power to can avoid SMD diode to take place structural damage because of taking place to shake by a wide margin, have good anti-seismic performance, and insulating packaging body can not be torn to conductive elastic foot elastic deformation's in-process, in addition, SMD diode's inner structure is stable firm.

Description

Firm SMD diode takes precautions against earthquakes

Technical Field

The utility model relates to a SMD diode specifically discloses a SMD diode of firm type takes precautions against earthquakes.

Background

The diode is divided into a plug-in diode and a patch diode, the patch diode mainly comprises a diode chip, conductive pins and an insulation packaging body, the diode chip is respectively connected with the two conductive pins in a welding mode during processing, and then injection molding processing is carried out to obtain the insulation packaging body.

The diode is generally welded on the PCB for use, the PCB and the electronic element thereon are generally indispensable devices of the electronic device, with the continuous development of the society, the portability requirement of the electronic device is higher and higher, and the portable electronic device is frequently subjected to different use situations and is easily dropped, collided and the like. In the event of a collision, the diodes on the PCB are easily damaged by excessive impact, and the internal structure may be damaged by excessive vibration force.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a chip diode with good shock resistance and stability against the problems in the prior art, so as to avoid the diode from being damaged due to large shock.

In order to solve the prior art problem, the utility model discloses a shockproof stable surface mounted diode, which comprises an insulating packaging body, wherein two L-shaped conductive pins are arranged in the insulating packaging body, the bottoms of the conductive pins protrude out of the insulating packaging body, welding grooves are arranged on the conductive pins, conductive welding blocks are arranged in the welding grooves, a diode chip is connected between the two conductive pins, and two electrodes of the diode chip are respectively in conductive communication with the two conductive pins through the two conductive welding blocks; the bottom of the conductive pin is connected with a conductive elastic foot which is of a laterally-inverted U-shaped structure.

Furthermore, a heat dissipation aluminum plate is arranged in the insulating packaging body and is positioned above the diode chip.

Furthermore, the conductive elastic pins are elastic graphite pins, and a conductive silver glue layer is connected between the conductive elastic pins and the conductive pins.

Furthermore, an insulating elastic rubber block is connected between the two tail ends of the conductive elastic foot.

Furthermore, the bottom of the conductive pin is covered with an anti-corrosion heat dissipation layer.

Furthermore, the anti-corrosion heat dissipation layer is a heat dissipation silica gel layer.

The utility model has the advantages that: the utility model discloses a SMD diode of firm type that takes precautions against earthquakes is provided with the electrically conductive elasticity foot structure that is located the outer side of insulating packaging body and falls the U-shaped form, has good elastic deformation ability, accessible elastic deformation offsets partial vibrations power to can avoid SMD diode to take place structural damage because of taking place to shake by a wide margin, good anti-seismic performance has, and the insulating packaging body can not be torn to electrically conductive elasticity foot elastic deformation's in-process, in addition, SMD diode's inner structure is stable firm, and is not fragile.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

The reference signs are: the diode chip package comprises an insulating package body 10, a heat dissipation aluminum plate 11, a conductive pin 20, a welding groove 201, a conductive welding block 202, a conductive elastic pin 21, a conductive silver adhesive layer 22, an insulating elastic adhesive block 23, an anti-corrosion heat dissipation layer 24 and a diode chip 30.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1.

The embodiment of the utility model discloses a chip diode of firm type takes precautions against earthquakes, including insulating packaging body 10, be equipped with two L shape conductive pin 20 in insulating packaging body 10, the bottom of conductive pin 20 protrudes in insulating packaging body 10, expose in with the external environment, preferably, conductive pin 20 is metal conductive pin 20, have good heat conductivility, through the direct contact with the outside air of bottom of conductive pin 20, can effectively release the inside heat of chip diode to the outside air fast, thereby effectively improve chip diode's heat dispersion, be equipped with welding groove 201 on conductive pin 20, be equipped with a conductive welding piece 202 in each welding groove 201, preferably, conductive welding piece 202 is the tin piece, be connected with same diode chip 30 between two conductive pin 20, two electrodes of diode chip 30 are electrically conductively connected with two conductive pin 20 through two conductive welding pieces 202 respectively, the welding groove 201 is used for accommodating the conductive welding block 202 to realize the connection between the diode chip 30 and the conductive pin 20, so that the structural firmness between the diode chip 30 and the conductive pin 20 can be effectively improved, and the shock resistance are strong; the conductive pins 20 are connected to the conductive elastic pins 21 at the bottom, the conductive elastic pins 21 are located outside the insulating package 10, the insulating package 10 can be prevented from being torn when the conductive elastic foot 21 is elastically deformed, the conductive elastic foot 21 is in a side-inverted U-shaped structure, the top surface of the conductive elastic foot 21 is connected with the conductive pin 20, the bottom surface of the conductive elastic foot 21 is welded on a bonding pad of a PCB, when the electronic product to which the PCB is applied vibrates, the vibration force is transmitted to the conductive elastic legs 21 through the PCB, since the U-shaped structure of the conductive elastic leg 21 can counteract a part of the vibration force by elastic deformation, therefore, the jitter between the conductive pins 20 and the insulating package 10 is reduced, the stability of the internal structure of the chip diode can be effectively ensured, the jitter amplitude of the insulating package 10 can be reduced, and the insulating package 10 can be effectively prevented from being damaged due to the fact that the jitter collides with other structures.

The utility model discloses be provided with the electrically conductive elasticity foot 21 structure that is located the outside side of insulating packaging body 10 and falls the U-shaped form, good elastic deformation ability has, accessible elastic deformation offsets partial shaking force to can avoid SMD diode to take place structural damage because of taking place to shake by a wide margin, good anti-seismic performance has, and the insulating packaging 10 bodies can not be torn to the in-process of electrically conductive elasticity foot 21 elastic deformation, in addition, SMD diode's inner structure is stable firm, and is not fragile.

In this embodiment, the insulating package body 10 is further provided with a heat dissipation aluminum plate 11, the heat dissipation aluminum plate 11 is located above the diode chip 30, the heat dissipation aluminum plate 11 is not in contact with the diode chip 30, the diode chip 30 can be prevented from being short-circuited by the heat dissipation aluminum plate 11, the heat dissipation aluminum plate 11 has good heat conductivity, the heat dissipation effect of the patch type diode can be effectively improved, and the heat accumulation is prevented from affecting the working performance of the patch type diode.

In this embodiment, the conductive elastic pins 21 are elastic graphite pins, the elastic graphite has a large compression rate and a large recovery rate, and is high in elasticity, and further has good conductivity, corrosion resistance and heat conductivity, and can improve the heat dissipation and the conductive effect of the patch diode, and meanwhile, the conductive elastic pins 21 exposed to the outside can be prevented from being corroded and damaged, so that the service life of the patch diode is effectively prolonged, the conductive silver adhesive layer 22 is connected between the conductive elastic pins 21 and the conductive pins 20, and the conductive silver adhesive layer has good bonding capability and conductive performance, and can stably connect the conductive elastic pins 21 and the conductive pins 20, and meanwhile, the conductive communication effect of the conductive elastic pins 21 and the conductive pins 20 can be ensured. Preferably, the conductive elastic leg 21 may also be a copper elastic pin.

In this embodiment, an insulating elastic rubber block 23 is connected between two ends of the conductive elastic foot 21, preferably, the insulating elastic rubber block 23 is an insulating silicon rubber block, which has good elasticity and insulating property, and can prevent the conductive elastic foot 21 from short circuit due to contact between the two ends caused by excessive elastic deformation.

In this embodiment, the bottom of the conductive pin 20 is covered with the anti-corrosion heat dissipation layer 24, the anti-corrosion heat dissipation layer 24 is disposed away from the conductive elastic pin 21, and the anti-corrosion heat dissipation layer 24 can prevent the conductive pin 20 exposed to the outside from being corroded and damaged.

Based on the above embodiment, the anti-corrosion heat dissipation layer 24 is a heat dissipation silica gel layer, and the heat dissipation silica gel is also called heat conduction silica gel, so that the anti-corrosion heat dissipation layer has good heat conduction performance and anti-corrosion performance.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The shockproof stable patch diode is characterized by comprising an insulating packaging body (10), wherein two L-shaped conductive pins (20) are arranged in the insulating packaging body (10), the bottoms of the conductive pins (20) protrude out of the insulating packaging body (10), welding grooves (201) are formed in the conductive pins (20), conductive welding blocks (202) are arranged in the welding grooves (201), a diode chip (30) is connected between the two conductive pins (20), and two electrodes of the diode chip (30) are respectively in conductive communication with the two conductive pins (20) through the two conductive welding blocks (202); the bottom of the conductive pin (20) is connected with a conductive elastic pin (21), and the conductive elastic pin (21) is of a laterally-inverted U-shaped structure.

2. The diode of claim 1, wherein a heat dissipating aluminum plate (11) is further disposed in the insulating package (10), and the heat dissipating aluminum plate (11) is located above the diode chip (30).

3. The chip diode of claim 1, wherein the conductive elastic pins (21) are elastic graphite pins, and a conductive silver adhesive layer (22) is connected between the conductive elastic pins (21) and the conductive leads (20).

4. The diode of claim 1, wherein an insulating elastic rubber block (23) is connected between two ends of the conductive elastic foot (21).

5. A shock-resistant robust chip diode according to claim 1, wherein the bottom of said conductive leads (20) is covered with an anti-corrosion heat sink layer (24).

6. The patch diode of claim 5, wherein the anti-corrosion and stable heat dissipation layer (24) is a heat dissipation silicone layer.