CN212033009U - Semiconductor packaging structure - Google Patents

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging structure, comprising an encapsulation shell, the left and right sides of the bottom of the encapsulation shell are fixedly connected with lead frames, the top of the package shell is provided with a placement groove, the A mounting chip is placed inside the placement slot, the left and right sides of the bottom of the mounting chip are soldered with connection solder balls, and the tops of the two lead frames penetrate and extend to the interior of the placement slot. In the utility model, a lead frame is installed at the bottom of the package shell, and a placement slot is opened at the top, so that the mounting chip can be soldered into the two lead frames by connecting the solder balls, and the placement slot is connected to the cover plate to encapsulate the placement slot, and The bottom of the connection cover is installed with a heat dissipation component, which can directly contact the mounted chip, so as to better conduct heat conduction to the mounted chip, so that the device achieves a relatively good heat dissipation effect of the package structure, thereby increasing the performance and reliability of electronic components and service life.

Description

A semiconductor packaging structure

technical field

The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure.

Background technique

Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors , no matter from the perspective of technology or economic development, the importance of semiconductors is very huge. Most electronic products, such as computers, mobile phones or core units in digital recorders, are closely related to semiconductors. .

Electronic components such as microprocessors and integrated circuits must operate within a certain specified temperature range to operate effectively. Excessive heat reduces the performance, reliability and average life of electronic components, and can even cause failures, but in traditional chip packaging During the process, the heat dissipation effect of the chip is relatively poor, so we propose a semiconductor packaging structure to solve the above problems.

Utility model content

(1) Technical problems solved

In view of the deficiencies of the prior art, the utility model provides a semiconductor packaging structure, which has relatively good heat dissipation effect, thereby increasing the performance, reliability and service life of electronic components, and solving the heat dissipation effect of the chip. Relatively poor, reducing the problem of electronic component performance, reliability and average life.

(2) Technical solutions

In order to achieve relatively good heat dissipation effect of the above-mentioned packaging structure, thereby increasing the performance, reliability and service life of electronic components, the present utility model provides the following technical solutions: a semiconductor packaging structure, including a packaging shell, the packaging shell The left and right sides of the bottom are fixedly connected with lead frames, the top of the package shell is provided with a placement slot, and the placement slot is placed inside the placement chip. The top of the lead frame penetrates and extends to the inside of the placement slot, the two connecting solder balls are welded to the top of the two lead frames respectively, and positioning blocks are fixedly installed on the left and right sides of the placement slot. The front and other surfaces of the slot are embedded with clamping members, the top of the placement slot is clamped with a connection cover, the left and right sides of the connection cover are fixedly installed with positioning slots, and the two positioning blocks are opposite to each other. One side is respectively extended and clamped to the inside of the two positioning grooves, the front and back of the connection cover are provided with installation holes, and the opposite sides of the two clamping members are respectively extended and inserted into the two installation holes. Inside the hole, a heat dissipation component is fixedly mounted on the bottom of the connection cover, and the bottom of the heat dissipation component is in contact with the mounting chip.

Preferably, a heat dissipation groove is formed at the bottom of the package shell, the top of the heat dissipation groove is communicated with the placement groove, and the mounting chip is located on the top of the heat dissipation groove.

Preferably, thermally conductive sheets are fixedly connected to the left and right sides of the package shell, the opposite sides of the two thermally conductive sheets penetrate into the placement groove, and the two thermally conductive sheets are respectively in contact with the left and right sides of the mounting chip. .

Preferably, a thermally conductive silicone sheet is adhered to the bottom of the heat dissipating component, and the bottom of the thermally conductive silicone sheet is in contact with the mounting chip.

Preferably, both of the two snap-on members include snap-on barrels, the two snap-on barrels are both embedded on the top of the package shell, and opposite sides of the two snap-on barrels penetrate into the placement groove, A damping block is slidably connected to the inside of the two clamping cylinders, a movable insert block is fixedly connected to the opposite side of the two damping blocks, and one end of the two movable insert blocks away from the damping block penetrates and is slidably connected. To the outside of the clamping cylinder, an elastic spring is fixedly installed between the damping block and the clamping cylinder, and the elastic spring is sleeved on the movable insertion block.

Preferably, the heat dissipation component includes a heat dissipation block, the top of the heat dissipation block is fixedly connected with the connection cover, the top of the heat dissipation block is provided with heat dissipation grooves arranged at equal distances, and the bottom of the heat dissipation block is connected to the thermally conductive silicone sheet. bonding.

(3) Beneficial effects

Compared with the prior art, the utility model provides a semiconductor packaging structure, which has the following beneficial effects:

1. In this semiconductor package structure, a lead frame is installed at the bottom of the package shell, and a placement slot is opened at the top, so that the mounting chip can be soldered into the two lead frames by connecting the solder balls, and the placement slot is connected to the placement slot by connecting the cover plate. package, and the bottom of the connecting cover is installed with a heat dissipation component, which can directly contact the mounted chip, so as to better conduct heat conduction to the mounted chip, so that the device achieves a relatively good heat dissipation effect of the package structure, thereby increasing the performance of electronic components , reliability and service life.

2. In the semiconductor package structure, a heat dissipation groove is provided at the bottom of the package casing, so that the heat dissipation groove ventilates the bottom of the mounted chip, which further increases the heat dissipation effect of the device.

3. In the semiconductor packaging structure, the heat-conducting sheets are fixedly connected to the left and right sides of the packaging shell, so that the two heat-conducting sheets can conduct heat on the left and right sides of the mounted chip, so that the heat-conducting effect of the device is relatively better, and the two heat-conducting sheets can conduct heat on the left and right sides of the mounted chip. A silicone thermal pad is installed on the opposite side of the sheet, and the thermal pad is not easy to damage the mounted chip during heat conduction, which increases the practicability of the device.

4. In this semiconductor package structure, a thermally conductive silica gel sheet is attached to the bottom of the heat dissipation component, so that the heat dissipation component is not in hard contact with the mounting chip. Availability and service life of the device.

5. In the semiconductor packaging structure, the clamping members include a clamping cylinder, a damping block, a movable insertion block and an elastic spring. The clamping cylinder can support the damping block and the movable insertion block, so that the movable insertion block is subjected to the elastic force of the elastic spring. , the movable plug can be stably inserted into the installation hole, which increases the stability of the device.

6. In the semiconductor package structure, the heat dissipation components include a heat dissipation block and a heat dissipation groove. After the heat dissipation block absorbs heat, the heat dissipation groove can conduct heat conduction, thereby expelling heat, which increases the practicability of the device.

Description of drawings

Fig. 1 is the front sectional view of the structure of the utility model;

Fig. 2 is the enlarged view of A part in the utility model structure Fig. 1;

3 is a top sectional view of the connection structure between the clamping member and the mounting hole of the present invention;

FIG. 4 is an enlarged view of part B in FIG. 3 of the present utility model.

Description of the labels in the figure:

1. Encapsulation shell; 2. Lead frame; 3. Placement slot; 4. Mounting chip; 5. Connecting solder balls; 6. Positioning block; Active plug; 704, elastic spring; 8, connection cover plate; 9, positioning slot; 10, mounting hole; 11, heat dissipation part; 111, heat dissipation block; 112, heat release groove; 12, heat dissipation groove; 13, heat conduction sheet ; 14. Thermally conductive silicone sheet.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Please refer to FIGS. 1-4 , a semiconductor packaging structure includes a package casing 1 , a lead frame 2 is fixedly connected to the left and right sides of the bottom of the package casing 1 , a placement slot 3 is opened on the top of the encapsulation shell 1 , and a placement slot 3 is placed inside the placement slot 3 . Mounting the chip 4, the left and right sides of the bottom of the mounting chip 4 are soldered with connection solder balls 5, the tops of the two lead frames 2 penetrate and extend to the inside of the placement slot 3, and the two connection solder balls 5 are respectively connected to the two lead frames 2. The top of the slot 3 is welded, the left and right sides of the placement slot 3 are fixedly installed with positioning blocks 6, the front and other surfaces of the placement slot 3 are embedded with snap-connecting members 7, and the top of the placement slot 3 is clamped with a connection cover 8. The left and right sides of the cover plate 8 are fixedly installed with positioning grooves 9, the opposite sides of the two positioning blocks 6 are respectively extended and clamped to the interior of the two positioning grooves 9, and the front and back of the connecting cover plate 8 are provided with installation holes. 10. The opposite sides of the two clamping members 7 are respectively extended and inserted into the interior of the two mounting holes 10. The bottom of the connection cover 8 is fixedly mounted with a heat dissipation component 11, and the bottom of the heat dissipation component 11 is in contact with the mounting chip 4. The lead frame 2 is installed at the bottom of the package shell 1, and the placement slot 3 is opened at the top, so that the mounting chip 4 can be soldered into the two lead frames 2 by connecting the solder balls 5, and the placement slot 3 is connected to the placement slot by connecting the cover plate 8. 3 is packaged, and the bottom of the connection cover 8 is installed with a heat dissipation component 11, which can directly contact the mounting chip 4, so as to better conduct heat conduction to the mounting chip 4, so that the device achieves a relatively good heat dissipation effect of the package structure, thereby Increase the performance, reliability and service life of electronic components.

Preferably, the bottom of the package casing 1 is provided with a heat dissipation groove 12 , the top of the heat dissipation groove 12 is communicated with the placement groove 3 , the mounting chip 4 is located on the top of the heat dissipation groove 12 , and the heat dissipation groove 12 is opened at the bottom of the package casing 1 , so that The heat dissipation slot 12 ventilates the bottom of the mounted chip 4, which further increases the heat dissipation effect of the device.

Preferably, thermally conductive sheets 13 are fixedly connected to the left and right sides of the package casing 1 , the opposite sides of the two thermally conductive sheets 13 penetrate into the placement groove 3 , and the two thermally conductive sheets 13 are respectively in contact with the left and right sides of the mounting chip 4 . , the thermal conductive sheets 13 are fixedly connected to the left and right sides of the package casing 1, so that the two thermal conductive sheets 13 can conduct heat on the left and right sides of the mounting chip 4, so that the thermal conductivity of the device is relatively better, and the two thermal conductive sheets 13 A silicone thermal pad is installed on the opposite side, and the thermal conduction sheet 13 is not easy to damage the mounting chip 4 during heat conduction, thereby increasing the practicability of the device.

Preferably, a thermally conductive silicone sheet 14 is bonded to the bottom of the heat-dissipating component 11 , and the bottom of the thermally-conductive silicone sheet 14 is in contact with the mounting chip 4 . The chip 4 is in hard contact, and the thermally conductive silicone sheet 14 has the function of protecting the mounted chip 4 while having heat conduction capability, which further increases the practicability and service life of the device.

Preferably, both of the two clamping members 7 include a clamping cylinder 701 , the two clamping cylinders 701 are both embedded on the top of the package casing 1 , and the opposite sides of the two clamping cylinders 701 penetrate into the placement groove 3 , A damping block 702 is slidably connected to the inside of the two clamping cylinders 701 , and a movable plug 703 is fixedly connected to the opposite side of the two damping blocks 702 , and one end of the two movable plugs 703 away from the damping block 702 penetrates and is slidably connected. To the outside of the clamping cylinder 701, an elastic spring 704 is fixedly installed between the damping block 702 and the clamping cylinder 701. The elastic spring 704 is sleeved on the movable insert block 703, and the clamping member 7 includes the clamping cylinder 701, The damping block 702 , the movable insert 703 and the elastic spring 704 , and the snap-fit cylinder 701 can support the damping block 702 and the movable insert 703 , so that when the movable insert 703 is elastically forced by the elastic spring 704 , the movable insert 703 can be stably inserted into the spring 704 . Inside the mounting hole 10, the stability of the device is increased.

Preferably, the heat dissipation component 11 includes a heat dissipation block 111 , the top of the heat dissipation block 111 is fixedly connected to the connection cover 8 , the top of the heat dissipation block 111 is provided with heat dissipation grooves 112 arranged at equal distances, and the bottom of the heat dissipation block 111 is connected to the thermally conductive silicone sheet 14 . For bonding, the heat dissipation member 11 includes a heat dissipation block 111 and a heat dissipation groove 112. After the heat dissipation block 111 absorbs heat, the heat dissipation groove 112 conducts heat conduction and discharges heat, thereby increasing the practicability of the device.

Working principle: The lead frame 2 is installed at the bottom of the package shell 1, and the placement slot 3 is opened at the top, so that the mounting chip 4 can be soldered to the two lead frames 2 by connecting the solder balls 5, and the placement slot 3 is connected to the cover plate 8. The placement slot 3 is encapsulated, and the bottom of the connection cover 8 is installed with a heat dissipation component 11, which can directly contact the mounting chip 4, so as to better conduct heat conduction to the mounting chip 4, and the connection cover 8 is provided with a positioning slot 9 With the installation hole 10, the positioning block 6 and the clamping member 7 on the placement groove 3 can be clamped into the positioning groove 9 and the installation hole 10 respectively, so that the connection and installation of the connection cover 8 is relatively stable, and the structure of the device is relatively simple. , the packaging is relatively convenient, and finally the device achieves a relatively good heat dissipation effect of the packaging structure, thereby increasing the performance, reliability and service life of the electronic components, solving the relatively poor heat dissipation effect of the chip, and reducing the performance and reliability of the electronic components. and average life expectancy.

It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A semiconductor packaging structure, comprising an encapsulation casing (1), characterized in that: the left and right sides of the bottom of the encapsulation casing (1) are fixedly connected with lead frames (2), and the top of the encapsulation casing (1) is provided with a lead frame (2). There is a placement slot (3), a mounting chip (4) is placed inside the placement slot (3), and connecting solder balls (5) are welded on the left and right sides of the bottom of the mounting chip (4), and two of the leads The top of the frame (2) penetrates and extends to the inside of the placement slot (3), and the two connection solder balls (5) are respectively welded to the tops of the two lead frames (2). Positioning blocks (6) are fixedly installed on both sides, the front and other surfaces of the placement slot (3) are embedded with snap-on members (7), and the top of the placement slot (3) is snapped with a connection cover plate (8), the left and right sides of the connecting cover plate (8) are fixedly installed with positioning grooves (9), and the opposite sides of the two positioning blocks (6) are respectively extended and clamped to the two positioning grooves (9). ), the front and back of the connection cover plate (8) are provided with mounting holes (10), and the opposite sides of the two snap-on members (7) are respectively extended and inserted into the two mounting holes ( 10), a heat dissipation component (11) is fixedly mounted on the bottom of the connection cover plate (8), and the bottom of the heat dissipation component (11) is in contact with the mounting chip (4). 2. A semiconductor packaging structure according to claim 1, characterized in that: a heat dissipation groove (12) is provided at the bottom of the package casing (1), and the top of the heat dissipation groove (12) is connected to the placement groove (3). ) are connected, and the mounting chip (4) is located on the top of the heat dissipation groove (12). 3. A semiconductor packaging structure according to claim 1, characterized in that: both the left and right sides of the package casing (1) are fixedly connected with thermally conductive sheets (13), and the two thermally conductive sheets (13) are opposite to each other. One side of the chip penetrates into the placement groove (3), and the two thermally conductive sheets (13) are respectively in contact with the left and right sides of the mounting chip (4). 4. A semiconductor packaging structure according to claim 1, wherein a thermally conductive silicone sheet (14) is adhered to the bottom of the heat dissipating component (11), and the bottom of the thermally conductive silicone sheet (14) is mounted on the bottom of the thermally conductive silicone sheet (14). Chip (4) contacts. 5 . The semiconductor package structure according to claim 1 , wherein the two clamping members ( 7 ) both comprise clamping cylinders ( 701 ), and the two clamping cylinders ( 701 ) are embedded in both. 6 . It is arranged on the top of the package casing (1), the opposite sides of the two snap-on barrels (701) penetrate into the placement groove (3), and the inside of the two snap-on barrels (701) are slidably connected with A damping block (702), the opposite sides of the two damping blocks (702) are fixedly connected with a movable insert block (703), and one end of the two movable insert blocks (703) away from the damping block (702) runs through and It is slidably connected to the outside of the clamping cylinder (701), an elastic spring (704) is fixedly installed between the damping block (702) and the clamping cylinder (701), and the elastic spring (704) is sleeved on the movable insert block (703) on. 6 . The semiconductor package structure according to claim 4 , wherein the heat dissipation component ( 11 ) comprises a heat dissipation block ( 111 ), and the top of the heat dissipation block ( 111 ) is fixed to the connection cover plate ( 8 ). 7 . The top of the heat dissipation block (111) is provided with heat dissipation grooves (112) arranged at equal distances, and the bottom of the heat dissipation block (111) is bonded to the thermally conductive silicone sheet (14).

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