CN211719574U - Paster diode component easy to install - Google Patents
Paster diode component easy to install Download PDFInfo
- Publication number
- CN211719574U CN211719574U CN202020592008.2U CN202020592008U CN211719574U CN 211719574 U CN211719574 U CN 211719574U CN 202020592008 U CN202020592008 U CN 202020592008U CN 211719574 U CN211719574 U CN 211719574U
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- CN
- China
- Prior art keywords
- metal
- packaging body
- insulating
- conducting plate
- diode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 238000009434 installation Methods 0.000 claims abstract description 10
- 238000005253 cladding Methods 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a paster diode subassembly of easy installation, including the paster diode, the paster diode includes insulating packaging body, cladding be in the inboard chip of insulating packaging body, connection the electrically conductive foot at chip both ends, the insulating packaging body outside still overlaps and is equipped with the shell, the shell is including being located metal heat-conducting plate, the connection of insulating packaging body downside are in splint, the connection at both ends around the metal heat-conducting plate about both ends the insulating extension board, the connection metal current conducting plate, the connection of insulating extension board one end the metal mounting panel of metal current conducting plate one end, electrically conductive sole portion is equipped with the arc contact site, arc contact site down the terminal surface with the metal current conducting plate is inconsistent. The utility model discloses a paster diode pack can solve the big and big problem of the change degree of difficulty behind the damage of the paster diode installation degree of difficulty among the prior art.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to paster diode subassembly of easy installation.
Background
The diode is also called a crystal diode, and is called a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, known as forward bias, and to block in the reverse direction, known as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. A part of the semiconductor silicon or germanium is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the semiconductor silicon or germanium is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode.
The prior art chip diode structure is generally soldered on the circuit of the circuit board by using two conductive pins to achieve the rectification function of the circuit. However, the difficulty of mounting the chip diode is high, and once the chip diode is damaged, the soldering tin points at the welding position need to be removed, so that the replacement difficulty is high.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides an easy paster diode subassembly of installing can solve the big and big problem of the change degree of difficulty behind the damage of the paster diode installation degree of difficulty among the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a paster diode subassembly of easy installation, includes the paster diode, the paster diode includes insulating packaging body, cladding and is in the inboard chip of insulating packaging body, connection the electrically conductive foot at chip both ends, the insulating packaging body outside is still overlapped and is equipped with the shell, the shell is including being located metal heat-conducting plate, the connection of insulating packaging body downside are in splint, the connection at both ends around the metal heat-conducting plate about both ends the insulating extension board, the connection be in the metal current conducting plate of insulating extension board one end, connect the metal mounting panel of metal current conducting plate one end, electrically conductive sole portion is equipped with the arc contact site, arc contact site down the terminal surface with the metal current conducting plate is inconsistent.
Specifically, the edge of the lower end of the insulating packaging body is further provided with a limiting groove, and one end of the conductive pin is fixed in the limiting groove.
Specifically, the metal mounting plate is further provided with a mounting hole.
Specifically, both ends all are equipped with the confession around the insulating packaging body the groove of stepping down of splint embedding, still be equipped with a plurality of draw-in grooves on the insulating packaging body, the draw-in groove is located the inslot side of stepping down, the splint inboard be equipped with groove matched with buckle steps down.
Specifically, the outer side surface of the conductive pin is also provided with a waterproof coating.
The utility model has the advantages that:
first, the utility model discloses a paster diode subassembly, the outside of insulating packaging body has increased a shell, can fix the shell on the circuit board earlier, and then through the mode of lock installation paster diode, easy installation, and the electrically conductive foot of paster diode is connected with the metal current conducting plate of lower extreme in the mode of elastic contact, need not the welding can realize both electric connection, installation effectiveness is high;
and secondly, a metal heat-conducting plate with high heat conductivity coefficient is arranged on the shell, and the metal heat-conducting plate is attached to the bottom of the surface mount diode after installation, so that the heat dissipation efficiency of the surface mount diode can be improved.
Drawings
Fig. 1 is a schematic structural diagram of a patch diode assembly of the present invention, which is easy to install.
Fig. 2 is an enlarged view of a portion a in fig. 1.
Fig. 3 is a schematic structural diagram of a patch diode assembly of the present invention, which is easy to install.
Fig. 4 is a schematic structural diagram of the patch diode assembly of the present invention applied to a circuit board.
The reference signs are: the chip diode comprises a chip diode 1, an insulating packaging body 11, a limiting groove 111, a relief groove 112, a clamping groove 113, a conductive pin 12, an arc-shaped contact part 121, a shell 2, a metal heat conduction plate 21, a clamping plate 22, a buckle 221, an insulating extension plate 23, a metal conductive plate 24, a metal mounting plate 25, a mounting hole 251, a circuit board 3, a circuit 4 and a screw 5.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in FIGS. 1-4:
an easily installed patch diode assembly comprises a patch diode 1, wherein the patch diode 1 comprises an insulating packaging body 11, a chip coated on the inner side of the insulating packaging body 11, conductive pins 12 connected with two ends of the chip, a shell 2 is further sleeved on the outer side of the insulating packaging body 11, the shell 2 comprises a metal heat conduction plate 21 positioned on the lower side of the insulating packaging body 11, clamping plates 22 connected with the front end and the rear end of the metal heat conduction plate 21, insulating extension plates 23 connected with the left end and the right end of the metal heat conduction plate 21, a metal conductive plate 24 connected with one end of the insulating extension plate 23, and a metal mounting plate 25 connected with one end of the metal conductive plate 24, an arc contact part 121 is arranged at the bottom of the conductive pin 12, the lower end face of the arc contact part 121 is abutted against the metal conductive plate 24, when the patch diode assembly is installed and used, a circuit board 3 with a circuit 4, the housing 2 is firstly placed in the mounting area, the two metal mounting plates 25 are respectively contacted with the two wiring ends of the circuit 4, the housing 2 is fixed on the circuit board 3 by using the screws 5, and then the patch diode 1 is placed in the housing 2, so that the lower end surfaces of the two arc-shaped contact parts 121 are respectively abutted to the metal conductive plates 24 at the corresponding positions, and the electrical connection between the patch diode 1 and the circuit 4 is realized.
Preferably, in order to fix one end of the conductive pin 12, so that the arc-shaped contact portion 121 of the conductive pin 12 has excellent elastic contact performance, a limiting groove 111 is further provided at the lower end edge of the insulating package 11, and one end of the conductive pin 12 is fixed in the limiting groove 111.
Preferably, the metal mounting plate 25 is further provided with mounting holes 251 in order to facilitate mounting of the metal mounting plate 25 on the circuit board 3.
Preferably, in order to improve the degree of adhesion between the chip diode 1 and the housing 2, the front end and the rear end of the insulating packaging body 11 are both provided with the yielding groove 112 for the clamping plate 22 to be embedded, the insulating packaging body 11 is further provided with a plurality of clamping grooves 113, the clamping grooves 113 are located on the inner side of the yielding groove 112, and the inner side of the clamping plate 22 is provided with a buckle 221 matched with the yielding groove 112.
Preferably, in order to improve the waterproof capability of the conductive pin 12, a waterproof coating is further provided on the outer side surface of the conductive pin 12.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a paster diode pack of easy installation, includes paster diode (1), its characterized in that, paster diode (1) is including insulating packaging body (11), cladding in insulating packaging body (11) inboard chip, connect electrically conductive foot (12) at chip both ends, insulating packaging body (11) outside still overlaps and is equipped with shell (2), shell (2) are including being located metal heat-conducting plate (21) of insulating packaging body (11) downside, connect splint (22) at both ends around metal heat-conducting plate (21), connect insulating extension board (23) at both ends about metal heat-conducting plate (21), connect metal conductive plate (24) of insulating extension board (23) one end, connect metal mounting panel (25) of metal conductive plate (24) one end, electrically conductive foot (12) bottom is equipped with arc contact portion (121), the lower end face of the arc-shaped contact part (121) is abutted against the metal conductive plate (24).
2. An easily mounted patch diode assembly as claimed in claim 1, wherein the lower edge of the insulating package (11) is further provided with a limiting groove (111), and one end of the conductive pin (12) is fixed in the limiting groove (111).
3. An easily mountable patch diode assembly as claimed in claim 1, wherein the metal mounting plate (25) is further provided with mounting holes (251).
4. An easily installed patch diode assembly according to claim 1, wherein the insulation package body (11) is provided with a recess (112) for the clamping plate (22) to be embedded in at both front and rear ends, the insulation package body (11) is further provided with a plurality of clamping grooves (113), the clamping grooves (113) are located inside the recess (112), and the clamping plate (22) is provided with a buckle (221) inside the recess (112).
5. An easily mountable patch diode assembly as claimed in claim 1, wherein the outer side of the conductive legs (12) are further provided with a water-resistant coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020592008.2U CN211719574U (en) | 2020-04-20 | 2020-04-20 | Paster diode component easy to install |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020592008.2U CN211719574U (en) | 2020-04-20 | 2020-04-20 | Paster diode component easy to install |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211719574U true CN211719574U (en) | 2020-10-20 |
Family
ID=72835626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020592008.2U Active CN211719574U (en) | 2020-04-20 | 2020-04-20 | Paster diode component easy to install |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211719574U (en) |
-
2020
- 2020-04-20 CN CN202020592008.2U patent/CN211719574U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231106 Address after: 523430 Building 1 and 2, No. 70, Liaobu Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: 523430 Room 102, building 1, 76 Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee before: Mutual Creation (Dongguan) Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |