JP4412225B2 - Terminal box for solar cell module - Google Patents

Description

  The present invention relates to a terminal box for a solar cell module.

  The solar power generation system is configured to supply a direct current from a solar cell panel laid on the roof of a house to each electrical appliance via an inverter or the like. A solar cell panel consists of a plurality of solar cell modules, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.

As a conventional terminal box, a terminal which is arranged adjacent to the box and has one end connected to a plus electrode and a minus electrode drawn from the back side of the solar cell module and the other end connected to an external connection cable A device including a board and a bypass diode bridged between the terminal boards is known (for example, see Patent Document 1 below). The bypass diode is for short-circuiting the reverse current at the time of reverse load from one side of the external connection cable to the other, and the chip-like diode function part is sandwiched between the diode function part and the diode function part. It consists of a pair of conductor pieces to be connected. Each conductor piece has a contact portion with the diode function portion between the overlapping portions, and extends in the opposite direction from this contact portion and is connected to the corresponding terminal plate by soldering or the like on the extended end side. Yes.
Japanese Patent No. 3498945

By the way, in the above case, it was not a structure that can efficiently dissipate the heat generated by the diode function unit. In that regard, some of the known diodes packaged by resin sealing include a heat sink, and although the structure is such that heat can be dissipated through such a heat sink, the heat sink itself is not so large. It was difficult to ensure sufficient heat dissipation characteristics with this alone.
The present invention has been completed based on the above situation, and an object thereof is to ensure good heat dissipation characteristics.

As means for achieving the above-mentioned object, the invention of claim 1 can be connected to a terminal plate which is arranged in parallel on the substrate to which the positive electrode and the negative electrode of the solar cell module can be connected. A cable for external connection and a rectifying element unit spanned between the corresponding two terminal plates, the rectifying element unit for reverse load bypass connected to each of the corresponding two terminal plates It comprises a rectifying element and a metallic heat radiating member that holds the rectifying element in contact. The rectifying element is packaged by resin sealing, and the heat radiating member has a step formed in the rectifying element. a shape along the portion provided with the abutted against the holding surface in the stepped portion, said heat radiating member is constituted by a pair of upper and lower split members, depending on the screwing of the two divided members The two divided bodies are united, and the rectifying element is sandwiched between the opposing surfaces of the two divided bodies by this uniting, and one of the two divided bodies abuts the upper surface of the rectifying element. The other is characterized in that the other can be brought into contact with the lower surface of the rectifying element .

According to a second aspect of the present invention, in the apparatus according to the first aspect , the two divided bodies are provided with a through hole that coaxially penetrates both the divided bodies while holding the rectifying element. The screw member to be inserted is screwed into the screw receiving portion of the substrate, whereby the rectifying element is tightened through the both divided bodies.

The invention of claim 3 is characterized in that, in the invention of claim 1 or 2 , the heat radiating member is made of aluminum or an aluminum alloy.

<Invention of Claim 1>
Since the metallic heat dissipation member that holds the packaged rectifier element in contact is provided, the heat generated by the rectifier element can be efficiently radiated through the heat dissipation member. Further, since the rectifying element and the heat radiating member are integrated as a rectifying element unit, the assembling property to the substrate is excellent. And since the holding surface of the heat radiating member forms a shape along the existing stepped portion of the rectifying element and is abutted against this stepped portion, the heat radiating member also contacts the stepped portion and the heat radiating area is further increased. In addition, the bonding strength between the rectifying element and the heat dissipation member can be increased.

Further, since the heat dissipation member is constituted by a pair of upper and lower divided bodies, and the rectifying element is sandwiched between the opposing surfaces of both divided bodies by the combination of both divided bodies, the holding of the rectifying element becomes more reliable. .

<Invention of Claim 2 >
Since the screw member is inserted into the through holes of both divided bodies and the tip of the screw member is screwed into the screw receiving portion of the substrate, the rectifying element is tightened via both divided bodies. The holding is further ensured, and the heat radiating member can be fixed to the substrate simultaneously with the tightening of the rectifying element.

<Invention of Claim 3 >
Since the heat dissipating member is made of a metal having high thermal conductivity such as aluminum or an aluminum alloy, the heat dissipating characteristics are further improved.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. The terminal box for a solar cell module according to this embodiment is attached to the back side of a solar cell module (see reference numeral 100 in FIG. 5) in which a large number of solar cells connected in series on the surface are arranged. A box body 10, a large number of terminal boards 30 arranged in parallel in the box body 10, and a rectifying element unit 50 spanned between adjacent terminal boards 30 are provided. In the following description, the upper side in FIG.

  The box body 10 is formed into a box shape with an open top surface by a synthetic resin material, filled with an insulating resin, and covered with a cover (see reference numeral 70 in FIG. 11) from above. Yes. Specifically, as shown in FIG. 1, the box body 10 includes a substantially rectangular substrate 11 on which a plurality of terminal plates 30 are placed side by side, and a side plate 12 that rises from the peripheral edge of the substrate 11 and surrounds the periphery. And a partition wall 13 raised from a predetermined position of the substrate 11. The front end portion of the substrate 11 has a horizontally long rectangular opening 14, and the front ends of the plurality of terminal boards 30 face the opening 14. Leads (not shown) connected to the positive electrode and the negative electrode of the solar cell module are passed through the opening 14 of the substrate 11, and each lead passed is connected to the tip of the terminal plate 30 by soldering or the like. It is like that.

  Positioning protrusions 15 that can be engaged with the positioning holes 31 of the terminal board 30 are provided on the upper surface of the substrate 11 so as to correspond to the terminal boards 30. A pair of bendable locking pieces 16 protrude from both ends of the positioning projection 15 so that the locking pieces 16 engage with both side edges of the terminal plate 30 in the process of mounting the terminal plate 30. As the terminal plate 30 is properly assembled, the locking pieces 16 are restored, and both side edges of the terminal plate 30 are pressed from above to restrict the floating of the terminal plate 30.

Further, a positioning wall 18 for positioning a terminal plate 30A described later is provided on the upper surface of the substrate 11. The positioning wall 18 is formed so as to extend along the width direction of the corresponding terminal plate 30A, and a receiving groove (not shown) in which the rear end portion of the terminal plate 30A can be fitted is provided at the base. The terminal board 30 is positioned in accordance with the tilting operation by tilting the front end of the terminal board 30 with the rear end received by the rear face of the groove while taking an oblique posture when mounted on the substrate 11. The hole 31 is configured to be fitted into the positioning protrusion 15.
In addition, notches 17 are provided at both rear end portions of the side plate 12, a cable 80 for external connection is fitted from above, and a cable pressing member 20 is fitted to fix the cable 80. The cable pressing member 20 and the side plate 12 are integrally connected.

  The terminal plate 30 is formed in a strip shape and a short size by cutting a conductive metal plate material or the like, and four terminal plates 30 are provided side by side at a substantially central portion in the front-rear direction of the substrate 11. Corresponding external connection cables 80 are connected to the terminal boards 30 </ b> B disposed on both ends of the substrate 11. The core wire 81 is exposed at the end of the cable 80 due to the peeling of the covering 82, and the barrel portion 32 formed at the end of the terminal plate 30 is caulked to the core wire 81, so that the cable 80 and the terminal plate 30 are connected. Connected. A connector portion (not shown) is connected to the extended end of the cable 80.

  The terminal plate 30B to which the cable 80 is connected is offset in the axial direction in the middle of the length direction so as to correspond to the arrangement positions of the cable 80 and the leads. The partition wall 13 is defined along both side edges of the terminal plate 30 and the cable 80, and the terminal plate 30 and the cable 80 inside thereof are filled with an insulating resin. Thereby, compared with the case where the whole box main body 10 is filled, there exists an advantage which can save the filling amount of insulating resin.

  Two terminal plates 30 </ b> A that are not connected to the cable 80 are arranged at a substantially central portion of the upper surface of the substrate 11. Each terminal board 30A can be engaged with each of the positioning wall 18 and the positioning protrusion 15 installed on the substrate 11 at two positions on both ends in the front-rear direction. The movement is surely regulated. Further, each terminal plate 30 is provided with an attaching portion 34 projecting sideways, and a conductor piece 51 (described later) of the rectifying element unit 50 is placed on the upper surface of the attaching portion 34 and soldered. It is like that. The attachment portion 34 is arranged at a position one level lower than the main body portion 35 side to which the lead is connected so as to correspond to the arrangement position of the conductor piece 51. A pair of protrusions 36 for guiding the conductor piece 51 are provided on the upper surface of the attachment portion 34.

  The rectifying device unit 50 disposed between the adjacent terminal plates 30 includes a bypass diode 52 (corresponding to a rectifying device for reverse load bypass according to the present invention) for preventing a reverse current flow, and the bypass diode 52. And a pair of upper and lower divided bodies 57 that hold the upper and lower sides so as to be sandwiched from above and below.

As shown in FIG. 2, the bypass diode 52 includes a resin mold portion 54 having a substantially rectangular parallelepiped shape, and a pair of conductors protruding from a substantially central portion of the front end surface of the resin mold portion 54 and solder-connected to the corresponding terminal plate 30. A part 51 (corresponding to each of the P-type region (anode side) and the N-type region (cathode side)) and a part projecting rearward from the lower edge of the rear end surface of the resin mold portion 54 and the remaining large part Includes a heat radiating plate 55 (corresponding to the N-type region (cathode side)) arranged to be exposed on the bottom surface of the resin mold portion 54. Both conductor pieces 51 has its distal end by a shaped bent substantially S is disposed facing away from the resin mold portion 54 together with the leads to approximately the same height as the bottom surface of the resin mold portion 54.

  On the other hand, both the split bodies 57 are formed in a block shape from aluminum, and the bypass diode 52 can be sandwiched in the thickness direction between the opposing surfaces by combining. One of the divided bodies 57A can be in contact with the upper surface of the bypass diode 52, and the other 57B can be in contact with the lower surface of the bypass diode 52.

The inner wall of one of the split bodies 57 has a holding surface 57E that can come into close contact with a stepped portion that is connected substantially perpendicularly from the upper surface to the rear surface of the resin mold portion 54 of the bypass diode 52. The inner wall of the other 57B of both divided bodies 57 is provided with a holding surface 57E that can come into close contact with a stepped portion that is substantially perpendicular to the bottom surface of the mounting portion 58 that projects from the bypass diode 52 from the bottom surface. Yes. Mutual boundary surfaces of the divided body 5 7 is set substantially on a horizontal plane containing the top surface of the mounting portion 58. The front surface of the resin mold portion 54 of the bypass diode 52 is exposed without being covered by the two divided bodies 57 so that the pair of conductor pieces 51 can protrude. It is designed to be lined up almost in the same plane.

  The two divided bodies 57 have a substantially rectangular parallelepiped shape as a whole in a state where the bypass diode 52 is held, and the longitudinal length thereof is set to be approximately twice as long as the longitudinal length of the bypass diode 52. Further, both split bodies 57 are provided with through-holes 57G that pass through coaxially from one 57A to the other 57B substantially vertically when both are combined. The through hole 57G can also communicate with an attachment hole 58A already provided in the attachment portion 58 of the bypass diode 52.

  When both divided bodies 57 sandwich the bypass diode 52, the through hole 57G and the mounting hole 58A are coaxially opened through, the screw member 60 is inserted therethrough, and the tip of the screw member 60 is provided on the substrate 11. By being screwed into the bottomed screw hole 11E (corresponding to the screw receiving portion of the present invention), the bypass diode 52 is interposed between the head portion 61 of the screw member 60 and the substrate 11 via both divided bodies 57. It can be tightened from above and below.

  Next, the manufacturing method and effects of this embodiment will be described. First, the terminal plate 30 and the cable 80 are caulked and connected by caulking the barrel portion 32 of the terminal plate 30 to the core wire 81 exposed at the end of the cable 80. Subsequently, the terminal board 30 is placed and fixed on the substrate 11. At this time, the terminal plate 30 is positioned by inserting the positioning protrusion 15 projecting on the substrate 11 into the positioning hole 31 of the terminal plate 30, and the terminal plate 30 is further elastically locked by the locking piece 16. 30 lifts are restricted. Next, the cable pressing member 20 is attached while covering the cable 80 from above, and the cable 80 is fixed on the substrate 11. For the terminal board 30 </ b> A that is not connected to the cable 80, the rear end portion is fitted into the receiving groove of the positioning wall 18.

  In addition, the rectifying element unit 50 is formed by sandwiching the bypass diode 52 from above and below by both divided bodies 57, and this rectifying element unit 50 is placed on the substrate 11. In this state, the screw member 60 is inserted into the through hole 57G from above, and the tip of the screw member 60 is screwed into the screw hole 11E of the substrate 11, whereby the rectifying element unit 50 is placed on the substrate 11 as shown in FIG. And the bypass diode 52 is held by the two split bodies 57. With the mounting operation of the rectifying element unit 50, both the conductor pieces 51 of the bypass diode 52 are placed on the corresponding attachment portions 34 of the terminal plate 30, and solder is applied thereto to electrically connect them.

  Thereafter, the box body 10 is bonded to the back side of the solar cell module with a double-sided tape or an adhesive, or fixed with a bolt. In the process of attachment, the lead connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and this lead is soldered to the tip of the terminal plate 30. Then, an insulating resin such as silicon resin is filled on the terminal plate 30 and the end of the cable 80 in the partition wall 13, and a cover is put on and the lid is tightened. Each connection part such as a caulking connection part and a solder connection part is hermetically sealed by the insulating resin. Moreover, by covering the cover, the cable pressing member 20 is pressed against the substrate 11 on the back surface of the cover.

  As described above, according to the present embodiment, both the holding surfaces 57E of the two divided bodies 57 are shaped to follow the stepped portion formed on the bypass diode 52, and thus are brought into contact with the stepped portion. Both split bodies 57 also come into contact with the stepped portion to increase the heat radiation area, and the bonding strength between the bypass diode 52 and both split bodies 57 can be increased. As a result, in addition to better heat dissipation characteristics, the bypass diode 52 can be reliably held in the thickness direction after being positioned in the front-rear direction. Moreover, since both the split bodies 57 are made of a metal having high thermal conductivity such as aluminum, the heat dissipation characteristics are further improved.

< Reference Example 1 >
4 to 7 show Reference Example 1 of the present invention. The reference example 1 is common to the first embodiment in that the bypass diode 52 is screwed to a metal block 91 as a heat radiating member, but is different from the first embodiment in that the tip of the screw member 60 does not reach the substrate 11 side. Different. Further, in Reference Example 1 , there is no portion corresponding to one 57A of the divided bodies 57 in the first embodiment.

  The metal block 91 as a heat radiating member is formed of aluminum or copper / aluminum alloy, and can fix three bypass diodes 52 arranged side by side in a lump. As shown in FIG. 5, the front end portion of the upper surface of the metal block 91 serves as a placement surface 91A on which the bypass diode 52 is placed, and the placement surface 91A is located behind the rear end side via a step portion 91B. It is set at a position one step lower than the end side. The stepped portion 91B corresponds to the holding surface of the present invention, and is arranged on a straight line along the width direction, and the mounting portion 58 protruding from the bypass diode 52 is fixed in the positioning state. It has become.

  When the front end surface of the bypass diode 52 is placed on the mounting surface 91 </ b> A of the metal block 91, the front end surface of the bypass diode 52 is substantially flush with the front end surface of the metal block 91. In addition, the front end surface of the metal block 91 faces a restriction wall 11K protruding from the upper surface of the substrate 11, thereby positioning the metal block 91 forward.

  The bypass diode 52 is attached to the metal block 91 via a screw member 60 that is inserted into an attachment hole 58 </ b> A already provided in the attachment portion 58. The attachment hole 58A of the attachment portion 58 is aligned with a bottomed screw hole 91E provided on the mounting surface 91A of the metal block 91. By screwing the distal end portion 62 of the screw member 60 from the attachment hole 58A to the screw hole 91E, the attachment portion 58 is sandwiched between the head 61 of the screw member 60 and the metal block 91, so that the bypass diode 52 is connected to the metal block 91. Can be attached to.

On the lower edge of the rear end surface of the metal block 91, a thin protruding edge portion 91F is formed so as to protrude rearward. As shown in FIG. 4, a pair of positioning walls 18 </ b> A are provided at positions corresponding to the left and right side edges of the protruding portion 91 </ b> F on the upper surface of the substrate 11. Positioning wall 18A is formed to extend along the width direction, capable of receiving grooves fit the left and right side edges of the projecting edge portion 91F on the base (not Shimese Figure) is provided. Further, the left and right side edges of the main body portion of the metal block 91 are latched by a flexible elastic receiving portion 19 </ b> A protruding from the upper surface of the substrate 11.

  Further, as shown in FIG. 5, a heat radiating block 92 is provided on the lower surface of the metal block 91 so as to protrude downward through a step between the mounting surface 91 </ b> G with respect to the substrate 11. Further, the substrate 11 is formed with a through hole 11 </ b> H that allows the heat dissipation block portion 92 to enter so as to communicate with the back surface side of the solar cell module 100. The heat radiating block 92 is tightly fitted in the width direction with respect to the hole edge of the through hole 11H. The projecting dimension of the heat dissipation block 92 is substantially the same as the thickness dimension of the substrate 11, and the projecting end surface (lower surface) faces the bottom surface of the substrate 11 as shown in FIG. It is set so that it can contact directly.

Next, the operation of Reference Example 1 will be described. First, the bypass diode 52 is placed on the mounting surface 91 </ b> A of the metal block 91 in a state where the attachment portion 58 of the bypass diode 52 is held against the stepped portion 91 </ b> B of the metal block 91. Subsequently, the screw member 60 is screwed into the attachment hole 58A of the attachment portion 58 and the screw hole 91E of the metal block 91 from above, and the bypass diode 52 is fixed to the metal block 91 with screws. Then, the heat radiating block portion 92 of the metal block 91 is fitted into the through hole 11H of the substrate 11 while the protruding edge portion 91F of the metal block 91 is fitted into the receiving groove of the positioning wall 18A. When the metal block 91 is placed on the substrate 11, the metal block 91 is elastically held in a state where the lifting is restricted by the elastic receiving portion 19 </ b> A of the substrate 11. Further, when the metal block 91 is placed on the substrate 11, a pair of conductor pieces 52Q protruding horizontally from the front end face of the bypass diode 52 are placed on the corresponding attachment portion 34 of the terminal plate 30, and solder is applied thereto. If applied, both are electrically connected. As shown in FIG. 6, the terminal block 11 </ b> R of the substrate 11 is raised from the reference surface of the substrate 11 so as to correspond to the height position of the pair of horizontally projecting conductor pieces 52 </ b> Q. Yes.

Thus, according to the reference example 1 , since the bypass diode 52 is screwed to the metal block 91, the joint between the both 52 and 91 can be strengthened. In addition, the effect by this screwing is produced similarly even if the metal block 91 does not have the heat dissipation block 92 and the substrate 11 does not have the through hole 11H. Moreover, in the said Embodiment 1, it is good also as a structure which set it as the structure where the front-end | tip of the screw member 60 does not reach to the board | substrate 11, and provided the positioning wall 18A and the elastic receiving part 19A in Reference Example 1 instead.

Further, since the substrate 11 is provided with a through hole 11H, and the heat dissipation block portion 92 of the metal block 91 enters the through hole 11H, the heat generated by the bypass diode 52 passes through the heat dissipation block portion 92. Thus, heat is efficiently radiated to the solar cell module 100 side.
In addition, since the projecting end surface of the heat dissipation block 92 faces the bottom surface of the substrate 11, the heat generated by the bypass diode 52 can be directly dissipated from the heat dissipation block 92 to the solar cell module 100 side.

  As shown in FIG. 7, a metal block 91 may be provided corresponding to each bypass diode 52. Further, one metal block 91 is provided corresponding to one bypass diode 52, and the pair of divided bodies 57 of the first embodiment are provided corresponding to the other bypass diode 52, so that a hybrid type is provided. It doesn't matter.

< Reference Example 2 >
FIG. 8 shows Reference Example 2 of the present invention. The reference example 2 is different from the reference example 1 in that the heat dissipating block 92 is not integrally formed with the metal block 91 and a member different from the heat dissipating block 92 is disposed inside the through hole 11H of the substrate 11. However, the rest is almost the same as Reference Example 1 .

In Reference Example 2 , the lower surface of the metal block 91 is a flat surface along the upper surface (reference surface) of the substrate 11. An adhesive 93 having a good thermal conductivity such as a ceramic adhesive applied to the lower surface of the metal block 91 flows into the through hole 11H of the substrate 11 and is solidified.
Thereby, the heat generated in the bypass diode 52 is efficiently radiated from the metal block 91 to the solar cell module 100 side through the heat conductive adhesive 93.

< Reference Example 3 >
9 to 14 show Reference Example 3 , and the form of the rectifying element unit 50 is different from that of Embodiment 1 and Reference Examples 1 and 2 described above.
In other words, the rectifying element unit 50 includes a bypass diode 52 for preventing a reverse current flow and a clip 53 that elastically holds the bypass diode 52.

  In the case of this reference example, three rectifying element units 50 are provided. The number of attached rectifying element units 50 is determined in consideration of the capacity of the terminal box for the solar cell module and can be changed as appropriate. For example, as shown in FIG. 14, of the four terminal boards 30, two sets of terminal boards 30 located at both ends of the substrate 11 are bridged so as to be conductive by jumper pins 90, and a pair of terminals located at the center part. Only the terminal board 30 may be bridged by the rectifying element unit 50. If it carries out like this, while the number of bypass diodes 52 reduces and a temperature rise can be suppressed, heat conductivity becomes favorable by passing through the terminal board 30. Of course, of the four terminal boards 30, two sets of terminal boards 30 located at both ends of the substrate 11 are bridged by the rectifying element unit 50, and a pair of terminal boards 30 located at the center are bridged by jumper pins. It doesn't matter.

  The clip 53 is formed by punching a conductive metal plate such as oxygen-free copper into a predetermined shape and then bending it, and the whole is symmetrical with respect to the front-rear axis. Specifically, as shown in FIGS. 10 to 13, the clip 53 has a pair of support pieces 56 opposed to each other so as to be folded in a U shape, and the bypass diode 52 is interposed between the front ends of the support pieces 56. Can be held elastically. The lower support piece 56 </ b> A that contacts the bottom surface of the bypass diode 52 among the support pieces 56 has a front and rear length that is approximately four times the front and rear length of the bypass diode 52, and its rear end portion is the rear end portion of the substrate 11. It is formed to extend rearward until it reaches.

  The lower support piece 56 </ b> A has a width dimension that is approximately twice the width dimension of the bypass diode 52. At the front end edge of the lower support piece 56A, a lateral displacement restricting piece 56E is formed by cutting and raising to restrict the loose movement of the bypass diode 52 in the width direction by coming into contact with both side surfaces of the bypass diode 52. In addition, an abutment piece 56F that regulates the rearward movement of the bypass diode 52 by abutting against the rear end of the heat radiating plate 55 is formed by cutting and raising substantially at the center of the lower support piece 56A. A substantially U-shaped notch 56G is formed on both side edges of the lower support piece 56A, and the engaged portion 19 projecting from the substrate 11 can be engaged in the notch 56G. Yes. The engaged portion 19 is bent and deformed in contact with the edge of the notch 56G in the process of assembling the rectifying element unit 50 to the substrate 11, and as the lower support piece 56A is placed on the substrate 11, In addition to being restored, it comes into contact with the upper surface of the edge of the notch 56G, so that the rising of the rectifying element unit 50 can be regulated.

  An intermediate connecting portion 56H is raised from the center of the rear end of the lower support piece 56A, and an upper support piece 56B that is in contact with the upper surface of the bypass diode 52 is formed to extend forward from the raised end. Yes. The intermediate link portion 56 </ b> H and the upper support piece 56 </ b> B are formed slightly narrower than the width dimension of the bypass diode 52. Further, the upper support piece 56B has a gentle downward gradient from the intermediate connecting portion 56H toward the front, and comes into contact with the bypass diode 52 at the downward gradient end, and then expands into a tapered shape as an upward gradient. Yes. The tip of the upper support piece 56 </ b> B that expands in a tapered shape serves as a guide portion 56 </ b> K for guiding the bypass diode 52. The separation distance between the descending slope end of the upper support piece 56 </ b> B and the lower support piece 56 </ b> A in the natural state is set slightly smaller than the height dimension of the bypass diode 52.

  A positioning wall 18 projects from the rear end portion of the substrate 11, and both end portions of the rear end of the lower support piece 56 </ b> A can enter a receiving groove (not shown) provided at the base of the positioning wall 18. ing. When the rectifying element unit 50 is mounted on the substrate 11, the rear end portions of the lower support piece 56A are held against the bottom surface of the receiving groove with an oblique posture, and the front end portion of the lower support piece 56A is tilted from such a state. A pair of conductor pieces 51 is placed on the corresponding terminal plate 30 in accordance with the tilting operation.

  As shown in FIG. 10, the rectifying element unit 50 is configured such that the bypass diode 52 is fitted into the opening of the clip 53 from the front, and the bypass diode 52 is sandwiched between the tip portions of the pair of support pieces 56 with a spring property. It is formed. At this time, by providing solder or a metallic heat dissipating pad member between the heat dissipating plate 55 of the bypass diode 52 and the lower support piece 56A of the clip 53, the heat dissipating characteristics from the heat dissipating plate 55 to the clip 53 are improved. Improvements may be made. Further, both end portions of the rear end of the lower support piece 56A are fitted into the receiving grooves of the positioning wall 18, and each of the pair of conductor pieces 51 is placed on the attachment portion 34 of the terminal plate 30 and soldered there. Thus, both are electrically connected. Further, the elastic support of the engaged portion 19 with respect to the lower support piece 56A restricts the lower support piece 56A and hence the rectifying element unit 50 from being lifted.

According to Reference Example 3 , since the metallic clip 53 that holds the bypass diode 52 in contact is provided, the heat generated by the bypass diode 52 can be efficiently radiated to the substrate 11 side through the clip 53. . Since the bypass diode 52 and the clip 53 are integrated as the rectifying element unit 50, the assembling workability to the substrate 11 is improved.
Further, since the clip 53 includes a pair of support pieces 56 and elastically holds the bypass diode 52, the clip 53 is not limited to the bypass diode 52 described above, and corresponds to a plurality of types of bypass diodes having different sizes. It can be used and has excellent versatility.

Further, when the rectifying element unit 50 is assembled, the edge of the notch 56G of the lower support piece 56A is elastically engaged with the engaged portion 19 while the rear end portion of the lower support piece 56A is fitted into the receiving groove of the positioning wall 18. Since it only needs to be combined, one-touch mounting on the substrate 11 is possible, and the work load is reduced.
Furthermore, since one clip 53 is provided corresponding to each bypass diode 52, as shown in FIG. 14 as compared with the case where a plurality of bypass diodes 52 are collectively held by one clip 53. In addition, variations when the rectifying element unit 50 is assembled on the substrate 11 are increased.

< Reference Example 4 >
FIG. 15 shows Reference Example 4 . In Reference Example 4, it differs from the reference example 3 in that one of the metal clips 53 are collectively holding a plurality of bypass diodes 52.

That is, the clip 53 of Reference Example 4, a plurality which are arranged side-by-side (the illustrated case three) so as to be collectively holding the bypass diode 52, stretching the clip 53 of Reference Example 3 in the width direction It is configured to include a pair of support pieces 56 that are formed wide. The rear region from the center in the front-rear direction of the upper surface of the substrate 11, that is, the rear region from the position where the terminal plate 30 is disposed, is a mounting surface on which the clip 53 is placed. The engaging portion 19 is provided so as to protrude.

  The rectifying element unit 50 is formed by elastically sandwiching a plurality of bypass diodes 52 between a pair of support pieces 56. The engaged portion 19 is elastically engaged in the notch 56G of the lower support piece 56A in the process in which the rectifying element unit 50 is placed on the substrate 11, and the rectifying element unit 50 is placed on the substrate 11. As it is done, it abuts elastically on the edge of the notch 56G, so that the rising of the rectifying element unit 50 can be regulated.

According to the reference example 4 , a plurality of bypass diodes 52 are collectively held by one clip 53. Unlike the reference example 3 , the clip 53 is not prepared for each bypass diode 52. That's it. Further, the bypass diode 52 can be easily attached.

< Reference Example 5 >
FIG. 16 shows Reference Example 5 of the present invention. The bypass diode 59 used in this reference example 5 is formed by cutting out the conductor piece 51 corresponding to the N-side region (cathode side) of the pair of conductor pieces 51 in the bypass diode 52 of the above embodiment.

That is, the bypass diode 59 has a heat sink (not shown) corresponding to the N side region (cathode side) on the bottom surface and one conductor piece 51 corresponding to the P side region (anode side) on one end surface. The one end face is bridged between adjacent terminal boards 30 in a lateral orientation with the left side facing the left side. In the illustrated case, three bypass diodes 59 are arranged in series across each terminal board 30. And a heat sink is directly mounted on one terminal board 30A of the adjacent terminal boards 30, and the front-end | tip part of the conductor piece 51 is directly mounted on the other terminal board 30B, and each respond | corresponds. Solder-connected to the terminal boards 30A and 30B.
According to the reference example 5 , since the heat generated by the bypass diode 59 can be directly radiated from the heat radiating plate to the terminal plate 30A, the heat radiation characteristics are improved.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) In the first embodiment, the through hole is provided so as to be able to communicate with the attachment hole of the bypass diode. However, according to the present invention, the through hole only needs to pass through both the split bodies coaxially, and is not necessarily through. The hole may not communicate with the mounting hole. However, when the through hole communicates with the mounting hole, the screw member is inserted into the mounting hole, so that the holding of the bypass diode is further ensured.

(2) Example example, the heat radiating member has a boss portion which can be inserted into the mounting hole of the bypass diode, by the boss portion may be configured to achieve bonding of the bypass diode.

( 3 ) For example , the heat radiating member may have a structure including fins for radiating heat generated by the bypass diode to the solar cell module side. Such fins can be formed, for example, by providing an uneven shape on one surface of the heat dissipation member. In this way, the heat dissipation surface area is increased and the air permeability is improved, so that the temperature rise of the bypass diode can be suppressed more efficiently.

The top view which shows the internal structure of a box main body in Embodiment 1 of this invention Schematic exploded sectional view Schematic sectional view The top view which shows the internal structure of a box main body in the reference example 1 Schematic exploded sectional view Schematic sectional view FIG. 4 equivalent view showing the modification Schematic sectional view in Reference Example 2 The top view which shows the internal structure of a box main body in the reference example 3 (A) Cross-sectional view of clip before mounting bypass diode (B) Cross-sectional view of clip with bypass diode mounted Schematic exploded sectional view Schematic sectional view Plan view of the rectifying device unit FIG. 9 equivalent diagram showing the modification The top view which shows the internal structure of a box main body in the reference example 4 The top view which shows the internal structure of a box main body in the reference example 5

DESCRIPTION OF SYMBOLS 10 ... Box main body 11 ... Board | substrate 12 ... Side plate 13 ... Partition wall 30 ... Terminal board 34 ... Attached part 50 ... Rectifier element unit 52 ... Bypass diode 57 ... Divided body 57E ... Holding surface 80 ... Cable

Claims (3)

A terminal plate that is arranged in parallel on the substrate and can be connected to the positive electrode and the negative electrode of the solar cell module, an external connection cable that can be connected to the terminal plate, and the two corresponding terminal plates. A rectifying element unit,
The rectifying element unit is composed of a rectifying element for reverse load bypass connected to each of the two corresponding terminal plates, and a metallic heat dissipation member that holds the rectifying element in contact,
The rectifying element is packaged by resin sealing, and the heat dissipating member has a holding surface that abuts against the stepped portion in a shape along the stepped portion already provided in the rectifying element ,
The heat dissipating member is composed of a pair of upper and lower divided bodies, and the two divided bodies are combined by screwing both divided bodies, and the rectifying element is sandwiched between opposing surfaces of the two divided bodies by this combination. The solar cell is characterized in that one of the two divided bodies can be brought into contact with the upper surface of the rectifying element, and the other can be brought into contact with the lower surface of the rectifying element. Module terminal box.   Both the split bodies are provided with through-holes that pass through the split bodies coaxially while holding the rectifying element, and screw members inserted into the through-holes are screwed into the screw receiving portions of the substrate. The terminal box for a solar cell module according to claim 1, wherein the rectifying element is fastened via the two divided bodies.   The said heat radiating member consists of aluminum or an alloy of aluminum, The terminal box for solar cell modules of Claim 1 or Claim 2 characterized by the above-mentioned.

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