JP2006351597A - Terminal box for solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attain stabilized heat dissipation effect by an intermediate connection terminal. <P>SOLUTION: Four terminal boards 30 are juxtaposed on a substrate 11 wherein two terminal boards 30 provide cable connection terminals 30A connected with an output cable 90 for taking out an electromotive force from a solar cell module, and the remaining terminal boards 30 provide intermediate connection terminals 30B connected between both cable connection terminals 30A such that they can be short-circuited through a bypass diode 50. Joints 31 with the bypass diode 50 are provided at the opposite ends of the intermediate connection terminal 30B in the arranging direction thereof, and a heat insulation portion 35 is provided between both joints 31. The intermediate connection terminal 30B is divided by the heat insulation portion 35 into a cable side heat dissipation region 36 where a heat dissipation path to the cable connection terminal 30A is formed and a substrate side heat dissipation region 37 where a heat dissipation path to the substrate 11 is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a terminal box for a solar cell module.

  The solar power generation system supplies a direct current from a solar cell panel laid on the roof of a house to each electrical appliance via an inverter or the like. The solar cell panel is composed of a plurality of solar cell modules, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.

As a terminal box, the thing of the following patent documents 1 is known. In this case, four terminal boards are mounted in parallel on the substrate of the box body, and an output cable for taking out an electromotive force from the solar cell group is connected to two terminal boards located at both ends. Between the adjacent terminal plates, a bypass diode is connected in parallel with the output polarity of the solar cell group in the opposite direction. When a reverse load is applied, the current of the solar battery cell is bypassed to the bypass diode side and the terminal plates are short-circuited. The two intermediate connection terminals located between the terminal plates to which the cable is connected are provided with a connection portion with a bypass diode on both sides on the same axis.
JP 2002-252356 A

  By the way, in the above case, the heat generated by the bypass diode is radiated to the substrate side or radiated to the cable side through the terminal plate. At this time, the intermediate connection terminal functions as a heat radiating plate. It has become. However, since the intermediate connection terminal has two connection portions on both side edges, there is a concern that heat generated by the bypass diodes connected to both connection portions may interfere with each other, causing thermal interference. There was a concern that the temperature would rise significantly in the middle. Therefore, it may be difficult to obtain a sufficient heat dissipation effect by the intermediate connection terminal.

  The present invention has been completed based on the above-described circumstances, and an object of the present invention is to reduce thermal interference and obtain a stable heat radiation effect by an intermediate connection terminal.

  As means for achieving the above object, in the invention of claim 1, at least three terminal plates are arranged in parallel on the substrate, and two of these terminal plates are for taking out electromotive force from the solar cell module. The output terminal cable is connected to the cable connection terminal, and the remaining terminal plate is connected to both cable connection terminals via a reverse load bypass rectifier so that they can be short-circuited. The intermediate connection terminal includes a connection portion with the rectifying element at both ends in the arrangement direction, and a heat insulating portion between both connection portions, and is divided into a plurality of regions by the heat insulating portion. It has the characteristics.

  According to a second aspect of the present invention, in the first aspect, the intermediate connection terminal includes an N side (cathode side) of a chip-like rectifier element body having a rectification function in one of the two connection portions. It is characterized in that it can be connected and the other side includes one that can be connected to the P side (anode side) of the rectifying device body.

  According to a third aspect of the present invention, in the one according to the first or second aspect, the intermediate connection terminal is a cable-side heat dissipation in which a heat dissipation path to the adjacent cable connection terminal is constructed with the heat insulating portion as a boundary. It is characterized in that it is divided into a region and a substrate-side heat dissipation region in which a heat dissipation path to the substrate is constructed.

The invention of claim 4 is characterized in that, in the invention described in claim 3, each of the connection portions is set to be shifted from a position on a straight line along the arrangement direction.
According to a fifth aspect of the present invention, in the one according to the third or fourth aspect, in the substrate-side heat dissipation region, a heat dissipation path from the connection portion to the terminal portion of the intermediate connection terminal is bypassed by the heat insulating portion. It is characterized in that a detour portion is formed.

  The invention according to claim 6 is characterized in that, in the invention according to any one of claims 1 to 5, the heat insulating portion is formed of a slit-like air layer that opens at a side edge of the intermediate connection terminal. .

<Invention of Claim 1>
Since the intermediate connection terminal has connection portions with the rectifying element at both ends in the arrangement direction, there is a concern that when the rectifying element generates heat, thermal interference occurs between the two connection portions. However, according to the invention of claim 1, since the heat insulating portion is provided between both connecting portions of the intermediate connecting terminal, and the intermediate connecting terminal is divided into a plurality of regions by the heat insulating portion, the heat generated in the rectifying element is obtained. Is efficiently dissipated in each heat dissipation region. As a result, mutual thermal interference between the rectifying elements connected to both connection portions is suppressed, and a stable heat radiation effect is obtained by the intermediate connection terminals.

<Invention of Claim 2>
The intermediate connection terminal can be connected to the N side (cathode side) of the chip-like rectifying element body having a rectifying function at one of the two connection portions, and to the other side at the P side (anode side) of the rectifying element body. Therefore, the current flow based on the PN junction of the rectifying element is realized without using two terminal plates. Therefore, the whole terminal board can be put together compactly. In addition, since two rectifying device bodies are connected to one intermediate connection terminal, the influence of mutual thermal interference cannot be ignored, but since the thermal interference can be effectively blocked by the heat insulating portion, the intermediate connection terminal is good. Heat dissipation characteristics can be maintained.

<Invention of Claim 3>
The intermediate connection terminal is divided into a cable-side heat dissipation area where a heat dissipation path to the adjacent cable connection terminal is established and a board-side heat dissipation area where a heat dissipation path to the board is established One of the rectifying elements connected to the two connection portions is efficiently radiated to the cable side via the cable connection terminal, and the other is efficiently radiated to the solar cell module side via the substrate. That is, since the two rectifying elements connected to one intermediate connection terminal dissipate heat through different routes, the heat dissipation efficiency is further improved.

<Invention of Claim 4>
Since each of the connection portions is displaced from the position on the straight line along the arrangement direction, the mutual connection of the rectifying elements connected to the both connection portions can be reduced without particularly increasing the width dimension of the intermediate connection terminal in the arrangement direction. Thermal interference can be effectively suppressed.
<Invention of Claim 5>
In the heat dissipation area on the board side, there is a bypass part that bypasses the heat dissipation path from the connection part to the terminal part of the intermediate connection terminal by the heat insulating part. It is sufficiently cooled while the heat is transmitted through the bypass.

<Invention of Claim 6>
Since the heat insulating portion is formed of a slit-like air layer that opens to the side edge of the intermediate connection terminal, it is easily manufactured at low cost.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. A terminal box for a solar cell module according to this embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series are arranged. A plurality of terminal boards 30 arranged in parallel in the main body 10 and a plurality of bypass diodes 50 (corresponding to the “rectifier for bypass during reverse load” of the present invention) bridged between adjacent terminal boards 30. I have.

  The box body 10 is formed of a synthetic resin material in a box shape having an open top surface, filled with an insulating resin, and covered with a cover (not shown) from above. Specifically, as shown in FIG. 1, the box body 10 includes a substantially rectangular substrate 11 on which a plurality of terminal plates 30 are placed side by side, and a side plate 12 that rises from the peripheral edge of the substrate 11 and surrounds the periphery. And a partition wall 13 that rises from a predetermined position of the substrate 11 and divides the terminal plate 30.

  An opening 14 is formed in the substrate 11 over substantially the entire width, and the tip of each terminal plate 30 faces the opening 14. And the lead | read | reed (not shown) corresponding to each photovoltaic cell group is passed through the opening part 14 of the board | substrate 11, and each lead | read | reed passed is connected to the front-end | tip part of the corresponding terminal board 30 by soldering etc. . In addition, a fixing member 80 formed separately from above is assembled to the board 11 so as to cross over the terminal board 30, and the terminal board 30 is pressed against the board 11 by the fixing member 80. Fixed.

  The side plate 12 is provided with a pair of left and right cutouts 17, into which an output cable 90 for external connection is fitted from above, and a cable pressing member 20 is fitted to fix the output cable 90. The cable pressing member 20 and the side plate 12 are integrally connected. The partition wall 13 is partitioned in a manner along the outer edge of the terminal plate 30, and is assembled in a state where the terminal plate 30 is positioned by the guidance of the partition wall 13. Further, the insulating resin is filled on the terminal board 30 in the inner space partitioned by the partition wall 13 so that the amount of the insulating resin used can be reduced.

  The terminal plate 30 is formed in a substantially band shape by cutting a conductive metal plate material, and is arranged in parallel in the width direction of the substrate 11. An output cable 90 for taking out an electromotive force from each solar cell group is crimped and connected to two terminal plates 30 arranged on both ends in the arrangement direction of the terminal plates 30. A core wire 91 is exposed at the end of the output cable 90 by peeling off the covering 92, and the barrel portion 32 formed at the end of the terminal plate 30 is caulked to the core wire 91. In the present invention, the terminal plate 30 connected to the output cable 90 is referred to as a cable connection terminal 30A.

  Of the terminal plate 30, the remaining one excluding the cable connection terminal 30 </ b> A is an intermediate connection terminal 30 </ b> B having connection portions 31 with bypass diodes 50 on both side edges (both ends in the arrangement direction). Two intermediate connection terminals 30B are juxtaposed between the two cable connection terminals 30A, both of which are formed wider than the cable connection terminal 30A except for the connection region with the leads, and further, The one (hereinafter referred to as “large terminal 30L”) is formed wider than the right one (hereinafter referred to as “medium terminal 30R”).

  The bypass diode 50 is directly placed on the connection portion 31 of the intermediate connection terminal 30B and connected by soldering or the like, and corresponds to the “chip-shaped rectifier element body having a rectifying function” of the present invention; The bare chip 52 extends between the adjacent terminal plates 30 while being sandwiched between the connection portions 31 and is composed of a thin plate-like conductor piece 51 connected to the terminal plate 30 by soldering or the like. In the present embodiment, the bypass diode 50 has a configuration in which the conductor pieces 51 extend along the arrangement direction (width direction) of the terminal plates 30, so that all three bypass diodes 50 are bridged between the four terminal plates 30. It is arranged.

  In the cable connection terminal 30A, a connection protrusion 33 is formed by cutting and raising at a connection portion with the conductor piece 51. The connection protrusion 33 penetrates through a connection hole 53 formed in the conductor piece 51, and solder is formed at the root portion. As a result, the cable connection terminal 30 </ b> A is connected to the bypass diode 50. The cable connection terminal 30 </ b> A is formed with an opening portion 34 that is opened as the connection protrusion 33 is cut and raised, and this opening portion 34 prevents solder heat from diffusing to the surroundings.

  The large terminal 30L among the intermediate connection terminals 30B is provided with a connection portion 31 with the bypass diode 50 at both side edge portions. Each of the connection portions 31 is arranged so as to be shifted from a position on a straight line along the arrangement direction of the terminal boards 30. Of the two connection portions 31 in the large terminal 30L, the one located on the right side is loaded with the N-side region (cathode side) of the mesa-type bare chip 52 and connected by soldering or the like. The P-side region (anode side) of the bare chip 52 is placed and connected by soldering or the like. Therefore, when a reverse load is applied, current flows from the anode side to the cathode side (left side to right side) via the large terminal 30L, and the bare chip 52 is placed on the terminal plate 30 adjacent to the large terminal 30L. No need to connect.

  Of the intermediate connection terminals 30B, the medium-sized terminal 30R includes a connection portion 31 at a position shifted from a position on a straight line along the arrangement direction of the terminal plates 30 at both side edge portions. Of the two connection portions 31 of the medium-sized terminal 30R, the N-side region of the bare chip 52 is placed and connected by soldering or the like on the right side of the connection portion 31, and the one located on the left side extends from the large terminal 30L side. The conductor piece 51 to be mounted is placed and connected by soldering or the like. The connection portion 31 on the left side of both connection portions 31 in the medium-sized terminal 30R is in a positional relationship opposite to the connection portion 31 on the right side of both connection portions 31 in the large terminal 30L with a gap therebetween, and one bypass is provided therebetween. The diode 50 is shared.

  The intermediate connection terminal 30B is formed with a heat insulating portion 35 that is located between the connection portions 31 and divides the heat dissipation region of the bypass diode 50 into a plurality of regions. The heat insulating portion 35 is formed of a slit-like air layer that opens at one side edge of the intermediate connection terminal 30B and extends in the direction parallel to the conductor piece 51, and is provided for each of the large terminal 30L and the medium terminal 30R. It is formed one by one.

  In the large terminal 30L, the first heat insulating portion 35P is cut at a position close to the opening 14 at a depth that opens to the left edge and reaches a position near the right edge, and is far from the opening 14 In addition, the second heat insulating portion 35Q is cut substantially horizontally at a depth that opens to the right edge and reaches a position near the left edge. A region on the opening 14 side of the large terminal 30L across the first heat insulating portion 35P is partitioned as a cable-side heat dissipation region 36, and heat generated by the bypass diode 50 connected to the connection portion 31 is mainly used for cable connection. Heat is radiated to the output cable 90 via the terminal 30A. On the other hand, the region including the second heat insulating portion 35Q on the opposite side of the opening 14 side across the first heat insulating portion 35P in the large terminal 30L is partitioned as the substrate side heat radiating region 37 and is connected to the connecting portion 31 here. The heat generated by the bypass diode 50 is radiated mainly to the solar cell module side via the substrate 11.

  In the substrate side heat radiation region 37, a bypass portion 38 that meanders around the second heat insulating portion 35Q is formed from the connecting portion 31 to the terminal portion 39 (lower right end portion in the drawing). Heat generated by the bypass diode 50 connected to the connection portion 31 of the substrate side heat dissipation region 37 is efficiently radiated to the terminal portion 39 through the bypass portion 38. In addition, since the cutting directions of the first heat insulating portion 35P and the second heat insulating portion 35Q are staggered in the length direction (the direction orthogonal to the arrangement direction), a long creepage distance of the heat dissipation path is ensured and the heat dissipation characteristics are improved. Improvements are being made.

  In the middle-sized terminal 30R, the third heat insulating part 35R is cut at a position close to the opening 14 at a depth reaching the right edge and reaching the position near the left edge, and at a position far from the opening 14 Further, the fourth heat insulating portion 35S is cut substantially horizontally at a depth that opens to the left edge and reaches a position near the right edge. Each of 3rd heat insulation part 35R and 1st heat insulation part 35P is arrange | positioned on the straight line along the row direction. Each of the 4th heat insulation part 35S and the 2nd heat insulation part 35Q is also arranged on the straight line along a line direction, and is arranged in the state where each other's opening was faced.

  The region on the opening 14 side of the middle terminal 30R across the third heat insulating portion 35R is partitioned as a cable-side heat dissipation region 36, and the opening 14 side of the middle terminal 30R across the third heat insulating portion 35R. The region on the opposite side including the fourth heat insulating portion 35 </ b> S is partitioned as a substrate-side heat dissipation region 37. This is the same configuration as the large terminal 30L. However, since the connection portion 31 of the substrate-side heat dissipation region 37 in the medium-sized terminal 30R is not in direct contact with the bare chip 52 of the bypass diode 50, the bypass diode 50 (bare chip 52) compared to the substrate-side heat dissipation region 37 of the large terminal 30L. The temperature rise caused by the heat generation of) can be kept low.

  Next, the manufacturing method and effects of this embodiment will be described. First, solder is supplied to each connection portion 31 of the large terminal 30L and the middle terminal 30R, and the corresponding bare chip 52 or conductor piece 51 is placed thereon, and the solder is heated and melted through a reflow furnace (not shown). Thereafter, when the solder is cooled and solidified, the terminal unit 60 shown in FIG. 2 in which the large terminal 30L and the middle terminal 30R are integrated is formed. During reflow soldering, the large terminal 30L and the medium terminal 30R are connected by a connecting piece (not shown) for holding both at a constant interval, so that unnecessary stress is not applied to the solder connection portion. It is. The connecting piece is later cut away and separated from the large terminal 30L and the middle terminal 30R.

Before and after the above, the cable connection terminal 30A is caulked to the output cable 90, the cable connection terminal 30A with the output cable 90 is placed on the substrate 11 so as to be fitted into the partition wall 13, and the cable holding member 20 is further attached to the output cable 90. Is attached, and the output cable 90 is fixed to the substrate 11.
Subsequently, the terminal unit 60 is placed on the board 11 so as to be fitted into the partition wall 13, and the connection protrusion 33 of the cable connection terminal 30 </ b> A is passed through the connection hole 53 of the conductor piece 51 protruding left and right in accordance with the mounting operation. Then, solder is applied to the base portion of the connection protrusion 33 to connect the cable connection terminal 30 </ b> A and the terminal unit 60 via the bypass diode 50. In addition, after connecting the cable connection terminal 30 </ b> A and the terminal unit 60 via the bypass diode 50, these may be placed on the substrate 11.

  Thereafter, the box body 10 is fixed to the back surface side of the solar cell module with an adhesive, a double-sided tape, or a bolt. In the process of attachment, the lead connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead is soldered to the tip of the terminal plate 30. Then, an insulating resin such as silicon resin is filled in the inner space of the partition wall 13 in the box body 10, and a cover is put on to close the lid. Each connection portion such as a caulking connection portion and a solder connection portion is hermetically sealed by the insulating resin.

  By the way, when the bypass diode 50 (bare chip 52) in the cable side heat radiation area 36 generates heat during use, the heat is transferred to the substrate side heat radiation area 37 by the first heat insulation part 35P (third heat insulation part 35R). Instead, heat is transferred mainly to the cable connection terminal 30 </ b> A and further radiated to the output cable 90. On the other hand, when the bypass diode 50 in the board side heat dissipation area 37 generates heat during use, the heat is not largely transferred to the cable side heat dissipation area 36 by the first heat insulating portion 35P (third heat insulating portion 35R), and mainly bypasses. Heat is transferred along the portion 38 to the terminal portion 39. That is, the heat generated by the bypass diode 50 in the board-side heat dissipation region 37 is once transferred to the output cable 90 side as indicated by the arrow in FIG. 2, and then the second heat insulating portion 35Q (fourth heat insulating portion 35S). It is folded back and transferred to the terminal portion 39, while being radiated to the solar cell module side via the substrate 11.

  Thus, according to the present embodiment, the first heat insulating portion 35P (third heat insulating portion 35R) is provided between the connecting portions 31 of the intermediate connection terminal 30B (large terminal 30L or medium size terminal 30R). Since the intermediate connection terminal 30B is divided into the cable side heat radiation region 36 and the board side heat radiation region 37 by the portion 35P (third heat insulation portion 35R), the heat generated in the bypass diode 50 connected to both connection portions 31 is generated. Heat is efficiently radiated to the output cable 90 and the substrate 11 through the heat radiation paths of the heat radiation areas 36 and 37, respectively. That is, since the mutual heat interference of the bypass diode 50 is suppressed by the first heat insulating portion 35P (third heat insulating portion 35R), it is possible to prevent heat from being accumulated in the intermediate connection terminal 30B, and a stable heat dissipation effect can be obtained.

Further, the large terminal 30L among the intermediate connection terminals 30B is configured such that the N-side region of the bare chip 52 is placed and connected to one of the connection portions 31 and the P-side region of the bare chip 52 is placed and connected to the other. Since it is connectable with the two bare chips 52, it is not necessary to divide into the two terminal boards 30, and the terminal board 30 whole can be put together compactly.
Further, since each of the connection portions 31 in the intermediate connection terminal 30B is set so as to be shifted from a position on a straight line along the alignment direction, both widths of the intermediate connection terminal 30B in the alignment direction are not increased significantly. Mutual thermal interference between the bypass diodes 50 connected to the connection portion 31 can be effectively suppressed.

  Furthermore, since the bypass portion 38 is formed by the second heat insulating portion 35Q (fourth heat insulating portion 35S) in the board side heat dissipation region 37 in the intermediate connection terminal 30B, the heat generated by the bypass diode 50 passes through the bypass portion 38. The heat is efficiently radiated to the substrate 11 side during transmission.

<Embodiment 2>
FIG. 3 is a plan view of a terminal unit 60A according to the second embodiment of the present invention. Since the form of the box body 10 in which the terminal unit 60A is accommodated is substantially the same as that of the first embodiment, a duplicate description is omitted.

Unlike the first embodiment, the terminal unit 60A includes one intermediate connection terminal 30B, and the cable connection terminals 30A are arranged on both sides of the one intermediate connection terminal 30B. That is, in the third embodiment, a total of three terminal plates 30 are arranged side by side on the substrate 11.
The intermediate connection terminal 30 </ b> B includes a connection portion 31 with the bypass diode 50 at both side edge portions. Each of the connection portions 31 is arranged on a straight line along the arrangement direction of the terminal boards 30. The N-side region (cathode side) of the bare chip 52 is placed on one of the connection portions 31 and connected by soldering or the like, and the P-side region (anode side) of the bare chip 52 is placed on the other and soldered. And so on. Therefore, when a reverse load is applied, current flows from the anode side to the cathode side via the intermediate connection terminal 30B, and the two cable connection terminals 30A are short-circuited.

  The intermediate connection terminal 30B has a heat insulating portion 35 made of a slit-like air layer that opens at the lower end side edge between the connection portions 31 and extends in the length direction (direction orthogonal to the arrangement direction). The fifth heat insulating portion 35W is formed. The fifth heat insulating portion 35W is cut with a depth that vertically cuts the intermediate connection terminal 30B, leaving the upper end portion, and the intermediate connection terminal 30B is divided into left and right heat dissipation regions across the fifth heat insulating portion 35W. The bypass diodes 50 in both heat radiation areas are connected to the cable connection terminal 30A on the free end side of the conductor piece 51. Therefore, heat generated in both bypass diodes 50 is mainly radiated to the output cable 90 via the cable connection terminal 30A. It has come to be. That is, both the heat radiation areas are configured as the cable side heat radiation area 36.

  According to the second embodiment, the intermediate connection terminal 30B is divided into the two cable-side heat radiation regions 36 by the fifth heat insulating portion 35W, and the heat generated by the bypass diode 50 connected to both the connection portions 31 is the heat radiation regions 36, Since heat is radiated every 36, the mutual heat interference of the bypass diode 50 is suppressed, and a stable heat radiation effect by the intermediate connection terminal 30B can be obtained.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) According to the present invention, five or more terminal boards may be arranged side by side on a substrate, and two of them may be used as cable connection terminals, and these may be connected so as to be short-circuited by a bypass diode. .
(2) According to the present invention, the bypass diode includes a bare chip and two conductor pieces extending while sandwiching the bare chip, and both conductor pieces may be connected to the corresponding terminal plate by soldering or the like, Further, the bypass diode may be packaged by resin sealing. However, in the case where the bare chip is directly mounted and connected on the intermediate connection terminal as in the above embodiment, the temperature of the intermediate connection terminal is significantly increased due to the heat generation of the bare chip. It can be said that it is significant to divide and suppress thermal interference.

(3) According to the present invention, three or more heat insulating portions may be alternately set in the intermediate connection terminal, and divided into three or more regions by these. In this case, the creepage distance of the heat dissipation path becomes longer, so that the heat dissipation characteristics can be improved.
(4) According to the present invention, a heat insulating portion may be formed by attaching a low thermal conductive material in place of the air layer to the intermediate connection terminal.

The top view which shows the internal structure of the box main body in Embodiment 1 of this invention Plan view of terminal unit The top view of the terminal unit in Embodiment 2

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Box main body 11 ... Board | substrate 30 ... Terminal board 30A ... Cable connection terminal 30B ... Intermediate connection terminal 31 ... Connection part 35 ... Thermal insulation part 35P ... 1st thermal insulation part 36 ... Cable side thermal radiation area 37 ... Substrate side thermal radiation area 38 ... Detour 50: Bypass diode (rectifier for bypass at reverse negative load)
90 ... Output cable

Claims (6)

At least three terminal boards are arranged side by side on the substrate, and two of these terminal boards are cable connection terminals to which output cables for taking out electromotive force from the solar cell module are connected, and the remaining terminal boards are The intermediate connection terminal is connected to the two cable connection terminals via a rectifying element for bypass at the time of reverse load so that it can be short-circuited.
The intermediate connection terminal includes a connection portion with the rectifying element at both ends in the arrangement direction, and a heat insulating portion between both connection portions, and is divided into a plurality of regions by the heat insulating portion. A terminal box for solar cell modules. The intermediate connection terminal can be connected to the N side (cathode side) of a chip-like rectifier element body having a rectification function at one of the two connection portions, and to the other side at the P side of the rectifier element body. The terminal box for a solar cell module according to claim 1, wherein the terminal box is connectable to (anode side). The intermediate connection terminal is divided into a cable-side heat dissipation area in which a heat dissipation path to the adjacent cable connection terminal is established and a board-side heat dissipation area in which a heat dissipation path to the board is established, with the heat insulating portion as a boundary. The terminal box for a solar cell module according to claim 1 or 2, wherein the terminal box is for a solar cell module. 4. The solar cell module terminal box according to claim 3, wherein each of the two connection portions is set to be shifted from a position on a straight line along the arrangement direction. 5. 5. The circuit board-side heat dissipation region is provided with a bypass portion that bypasses a heat dissipation path from the connection portion to the terminal portion of the intermediate connection terminal by the heat insulating portion. The terminal box for solar cell modules as described. 6. The solar cell module terminal box according to claim 1, wherein the heat insulating portion is formed of a slit-shaped air layer that opens to a side edge of the intermediate connection terminal.

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